JP4874018B2

JP4874018B2 - IC package socket and IC package mounting structure using the same

Info

Publication number: JP4874018B2
Application number: JP2006186888A
Authority: JP
Inventors: 裕子大瀬; 敏弘草谷; 治大工原
Original assignee: Fujitsu Component Ltd
Current assignee: Fujitsu Component Ltd
Priority date: 2006-07-06
Filing date: 2006-07-06
Publication date: 2012-02-08
Anticipated expiration: 2026-07-06
Also published as: JP2008016343A

Description

本発明はＩＣパッケージ用ソケット及びこれを利用したＩＣパッケージの実装構造に係り、特にＬＧＡ型或いはＢＧＡ型のＩＣパッケージを回路基板上に実装するときに使用されるＩＣパッケージ用ソケットに関する。 The present invention relates to an IC package socket and an IC package mounting structure using the same, and more particularly to an IC package socket used when an LGA type or BGA type IC package is mounted on a circuit board.

ＬＧＡ型或いはＢＧＡ型のＩＣパッケージを簡単に交換が可能な状態で実装するために、ＩＣパッケージ用ソケットが使用されている。このＩＣパッケージ用ソケットについては、近年、データ伝送の大規模化や高速化とともに高信頼性が要求されている。また、製品の普及速度も速くなり、納期の短縮、低価格化も求められている。 In order to mount an LGA type or BGA type IC package in an easily replaceable state, an IC package socket is used. In recent years, the IC package socket has been required to have high reliability along with the increase in scale and speed of data transmission. In addition, the diffusion rate of products is increasing, shortening delivery times and reducing prices.

図１は従来の１例のＩＣパッケージ用ソケット１の一部を示す。このＩＣパッケージ用ソケット１は、貫通穴３が整列して形成してあるソケット本体２の貫通穴３に、コンタクト片材４が差し込んである構成である。４ａはＩＣパッケージ用接点部、４ｂは回路基板用接点部であり、共に弾性を有する。 FIG. 1 shows a part of a conventional socket 1 for an IC package. The IC package socket 1 has a configuration in which a contact piece 4 is inserted into a through hole 3 of a socket body 2 in which the through holes 3 are aligned. 4a is an IC package contact portion, and 4b is a circuit board contact portion, both of which have elasticity.

図２は従来の別の例のＩＣパッケージ用ソケット１０の一部を示す。このＩＣパッケージ用ソケット１０は、フレキシブル基板１１の一部を上方に切り起こし更に折り返すようにして形成された切り起こし片１２が整列しており、且つ、フレキシブル基板１１の下面であって、各切り起こし片１２の基部の箇所に半田ボール１３を有する構成である。切り起こし片１２が、ＩＣパッケージ用接点部を構成し、弾性を有する。
特開２００１−１４３８２９号公報 FIG. 2 shows a part of another conventional IC package socket 10. This IC package socket 10 has cut-and-raised pieces 12 formed by cutting and raising a part of the flexible substrate 11 upward and then turning back, and is arranged on the lower surface of the flexible substrate 11. In this configuration, the solder ball 13 is provided at the base portion of the raising piece 12. The cut and raised piece 12 constitutes a contact portion for IC package and has elasticity.
JP 2001-143829 A

図１に示すＩＣパッケージ用ソケット１は、必要となるコンタクト片材４の数が多くなり、また、コンタクト片材４を貫通穴３に組み込む作業に工数がかかり、コスト高となってしまう。 The IC package socket 1 shown in FIG. 1 requires a large number of contact pieces 4 and requires a lot of man-hours for assembling the contact pieces 4 into the through holes 3, resulting in high costs.

図２に示すＩＣパッケージ用ソケット１０の場合は、各切り起こし片１２毎に半田ボール１３を形成する面倒な作業が必要となり、コスト高となってしまう。また、半田ボール１３によってプリント回路基板に半田付けされることになり、プリント回路基板からの取り外しが出来なくなってしまう。 In the case of the IC package socket 10 shown in FIG. 2, the troublesome work of forming the solder ball 13 for each cut and raised piece 12 is required, resulting in high cost. Moreover, it will be soldered to a printed circuit board by the solder ball | bowl 13, and it will become impossible to remove from a printed circuit board.

本発明は、上記の点に鑑みなされたものであり、上記課題を解決したＩＣパッケージ用ソケット及びこれを利用したＩＣパッケージの実装構造を提供することを目的とする。 The present invention has been made in view of the above points, and an object thereof is to provide an IC package socket that solves the above problems and an IC package mounting structure using the socket.

本発明は、ＩＣパッケージをプリント回路基板上に実装する際に使用され、前記ＩＣパッケージの下面のコンタクトと前記プリント回路基板上のコンタクトとを電気的に接続する構成のＩＣパッケージ用ソケットにおいて、
絶縁性で板状であり、多数の貫通穴が、前記ＩＣパッケージの下面のコンタクト及び前記プリント回路基板上のコンタクトに対応して形成してあるベース板と、
前記ソケット本体の各貫通穴内に嵌合させて設けてあるコンタクト部材とよりなり、
前記コンタクト部材は、長手方向上の各端の幅方向の両端に突起部を有する帯状金属板部材を渦巻き状に成形したものであり、外側ターン部と内側ターン部とを有し、且つ、前記内側ターン部の端部に前記コンタクト部材の軸線の双方向に突き出た接点部を有し、前記外側ターン部の端部に前記コンタクト部材の軸線の双方向に突き出た接点部を有し、縮む方向に弾性変形されたときに、前記内側ターン部がその直径が拡大するように変形して前記外側ターン部と接触する構成であり、
使用状態で、前記コンタクト部材の軸線の一方に突き出た二つの接点部が前記ＩＣパッケージのコンタクトと接触し、前記軸線の一方に突き出た二つの接点部が前記プリント回路基板上のコンタクトと接触し、前記内側ターン部と前記外側ターン部と接触して信号伝送路を形成する構成としたことを特徴とする。 The present invention is an IC package socket configured to electrically connect a contact on the lower surface of the IC package and a contact on the printed circuit board, which is used when mounting the IC package on the printed circuit board.
A base plate that is insulative and plate-like and has a large number of through holes corresponding to contacts on the lower surface of the IC package and contacts on the printed circuit board;
It consists of a contact member that is fitted in each through hole of the socket body,
The contact member is formed by spirally forming a band-shaped metal plate member having protrusions at both ends in the width direction of each end in the longitudinal direction, and has an outer turn portion and an inner turn portion, and A contact portion protruding in both directions of the axis of the contact member is provided at the end of the inner turn portion, and a contact portion protruding in both directions of the axis of the contact member is provided at the end of the outer turn portion. When elastically deformed in the direction, the inner turn portion is deformed so that its diameter is expanded and is in contact with the outer turn portion,
In use, two contact portions protruding to one of the axis of the contact member are in contact with the contact of the IC package, and two contact portions protruding to one of the axis are in contact with the contact on the printed circuit board. A signal transmission path is formed in contact with the inner turn portion and the outer turn portion.

本発明になるＩＣパッケージ用ソケットによれば、プレス加工だけで製造が可能であるため、コストを安くして製造することが出来る。 Since the IC package socket according to the present invention can be manufactured only by pressing, it can be manufactured at a low cost.

次に本発明の実施の形態について説明する。 Next, an embodiment of the present invention will be described.

図３は本発明の実施例１になるＬＧＡ型ＩＣパッケージ用ソケット２０をＬＧＡ型ＩＣパッケージ６０、プリント回路基板７０及びカバー部材８０と併せて示す。図４はソケット２０の使用状態を示す。図４に示すように、ＬＧＡ型ＩＣパッケージ６０は、基板６１上にＩＣチップ６２が実装してあり、これが封止樹脂部６３でもって封止されており、基板６１の下面にコンタクト６４が整列している構成である。 FIG. 3 shows the LGA type IC package socket 20 according to the first embodiment of the present invention together with the LGA type IC package 60 , the printed circuit board 70 and the cover member 80 . FIG. 4 shows the usage state of the socket 20. As shown in FIG. 4, the LGA type IC package 60 has an IC chip 62 mounted on a substrate 61 , which is sealed with a sealing resin portion 63 , and contacts 64 are aligned on the lower surface of the substrate 61. This is the configuration.

Ｘ−Ｙはソケット２０の面であり、Ｚはソケット２０の高さ方向であり、Ｚ１は上方向、Ｚ２は下方向である。 XY is the surface of the socket 20, Z is the height direction of the socket 20, Z1 is upward, and Z2 is downward.

ソケット２０は、シート状のソケット本体２１と、このソケット本体２１の周囲の枠２５とを有する構成である。ソケット２０は、ＩＣパッケージ６０をプリント回路基板７０上に実装する際に使用され、プリント回路基板７０とＩＣパッケージ６０との間に介在して、ＩＣパッケージ６０の下面のコンタクト６４とプリント回路基板７０上のコンタクト７１とを電気的に接続する。 The socket 20 includes a sheet-like socket body 21 and a frame 25 around the socket body 21. The socket 20 is used when the IC package 60 is mounted on the printed circuit board 70, and is interposed between the printed circuit board 70 and the IC package 60, and the contacts 64 on the lower surface of the IC package 60 and the printed circuit board 70. The upper contact 71 is electrically connected.

ソケット本体２１は、図６に示すように、シート状でありプレス加工で形成されたものであり、シート部材２２にこれと一体のコンタクト片２３が規則的に並んでいる構成である。各コンタクト片２３は、プリント回路基板側リード部３０と、ＩＣパッケージ側リード部４０と、両者を繋ぐつなぎ部５０とよりなる構成であり、プリント回路基板側リード部３０の先端とＩＣパッケージ側リード部４０の先端との間が導通しており、個々のコンタクト片２３は互いに絶縁されており独立している。プリント回路基板側リード部３０とＩＣパッケージ側リード部４０とは、後述するように互いに逆方向に切り起こすことによって形成されているものであり、隣接して配置してある。２４は切り起こしによって形成されたスリットである。 As shown in FIG. 6, the socket body 21 has a sheet shape and is formed by pressing, and has a configuration in which contact pieces 23 integrated with the sheet member 22 are regularly arranged. Each contact piece 23 is composed of a printed circuit board side lead part 30, an IC package side lead part 40, and a connecting part 50 that connects the two. The tip of the printed circuit board side lead part 30 and the IC package side lead The tip 40 of the portion 40 is electrically connected, and the individual contact pieces 23 are insulated from each other and independent. As will be described later, the printed circuit board side lead portion 30 and the IC package side lead portion 40 are formed by cutting up in opposite directions, and are disposed adjacent to each other. Reference numeral 24 denotes a slit formed by cutting and raising.

ＬＧＡ型ＩＣパッケージ６０は以下のように実装される。ソケット２０をプリント回路基板７０上に置き、ＬＧＡ型ＩＣパッケージ６０を枠２５の内側に嵌合させてソケット本体２１上に載せ、カバー部材８０をＬＧＡ型ＩＣパッケージ６０上に載せ、ねじ部材９０を通し、プリント回路基板７０の下面側でナット９１に螺合することによって、全体がプリント回路基板７０上に固定されて、ＬＧＡ型ＩＣパッケージ６０は実装される。 The LGA type IC package 60 is mounted as follows. The socket 20 is placed on the printed circuit board 70, the LGA IC package 60 is fitted inside the frame 25 and placed on the socket body 21, the cover member 80 is placed on the LGA IC package 60, and the screw member 90 is attached. Through the threaded engagement with the nut 91 on the lower surface side of the printed circuit board 70, the whole is fixed on the printed circuit board 70, and the LGA IC package 60 is mounted.

図４及び図５に示すように、プリント回路基板側リード部３０は、プリント回路基板７０に押し当たって少し弾性的に撓まされた状態となって、このリード部３０の先端の接点部３１がプリント回路基板７０上のコンタクト７１にリード部３０自体の弾性力でもって押し当たった状態で接触している。ＩＣパッケージ側リード部４０は、ＬＧＡ型ＩＣパッケージ６０によって押されて少し弾性的に撓まされた状態となって、このリード部４０の先端の接点部４１がＬＧＡ型ＩＣパッケージ６０の下面のコンタクト６４にリード部４０自体の弾性力でもって押し当たった状態で接触している。よって、ＬＧＡ型ＩＣパッケージ６０は、ソケット２０内に固定されて、且つ各コンタクト６４がソケット２０の各コンタクト片２３を通してプリント回路基板７０のコンタクト７１と電気的に接続してある。 As shown in FIGS. 4 and 5, the printed circuit board-side lead portion 30 is pressed against the printed circuit board 70 and is slightly elastically bent, and the contact portion 31 at the tip of the lead portion 30. Is in contact with the contact 71 on the printed circuit board 70 with the elastic force of the lead portion 30 itself. The IC package side lead part 40 is pressed by the LGA type IC package 60 to be slightly elastically bent, and the contact part 41 at the tip of the lead part 40 is a contact on the lower surface of the LGA type IC package 60. 64 in contact with the elastic force of the lead portion 40 itself. Therefore, the LGA type IC package 60 is fixed in the socket 20, and each contact 64 is electrically connected to the contact 71 of the printed circuit board 70 through each contact piece 23 of the socket 20.

また、ねじ部材９０を外すことによって、ＬＧＡ型ＩＣパッケージ５０は交換可能となり、また、ソケット２０もプリント回路基板７０から外すことが可能となる。 Further, by removing the screw member 90, the LGA IC package 50 can be replaced, and the socket 20 can also be removed from the printed circuit board 70.

次に、ソケット本体２１の構造について説明する。 Next, the structure of the socket body 21 will be described.

図７はソケット本体２１の素材であるシート部材１００の一部を拡大して示す。図８は図７中、VIII-VIII線に沿う断面を示す図である。 FIG. 7 is an enlarged view of a part of the sheet member 100 that is a material of the socket body 21. FIG. 8 is a view showing a cross section taken along line VIII-VIII in FIG.

シート部材１００は、厚さが例えば５０μｍであるステンレス製或いは銅製のシート本体１０１が芯材であり、このシート本体１０１の上面の全面と下面の全面とにベース絶縁膜１０２、１０３を有し、且つ、上側のベース絶縁膜１０２上に、多数のコンタクトパターン１０４を整列して有し、且つ、ベース絶縁膜１０２上にコンタクトパターン１０４を覆うように形成された保護カバー絶縁膜１０５を有する構造である。保護カバー絶縁膜１０５は、後述する接点部３１，４１の部分には形成されていず、窓部１０５ａ，１０５ｂが形成してあり、接点部３１，４１は露出している。 The sheet member 100 is made of, for example, a stainless or copper sheet main body 101 having a thickness of 50 μm as a core, and has base insulating films 102 and 103 on the entire upper surface and lower surface of the sheet main body 101. In addition, the structure includes a large number of contact patterns 104 aligned on the upper base insulating film 102 and a protective cover insulating film 105 formed on the base insulating film 102 so as to cover the contact patterns 104. is there. The protective cover insulating film 105 is not formed in the contact portions 31 and 41 described later, but the windows 105a and 105b are formed, and the contact portions 31 and 41 are exposed.

ベース絶縁膜１０２、１０３及び保護カバー絶縁膜１０５は、共に、例えばポリイミド樹脂をコートし、キュアすることによって形成される。 Both the base insulating films 102 and 103 and the protective cover insulating film 105 are formed by coating and curing, for example, polyimide resin.

コンタクトパターン１０４は、ベース絶縁膜１０２上にレジスト膜を形成し、レジスト膜に所定の開口を形成し、この開口を埋めるように銅めっき、ニッケルめっき、金めっきを行うことによって形成され、銅めっき膜１１０をベースとして、この上に、ニッケルめっき膜１１１及び金めっき膜１１２が積層してある構造である。 The contact pattern 104 is formed by forming a resist film on the base insulating film 102, forming a predetermined opening in the resist film, and performing copper plating, nickel plating, and gold plating so as to fill the opening. In this structure, a nickel plating film 111 and a gold plating film 112 are laminated on a film 110 as a base.

また、このコンタクトパターン１０４は、図７に示すように、Ｕ字形状であり、第１の腕部１０４ａと、第２の腕部１０４ｂと、両者を繋ぐ繋ぎ部１０４ｃと、第１の腕部１０４ａの先端の接点部３１と、第２の腕部１０４ｂの先端の接点部４１とを有する構成である。第１の腕部１０４ａと第２の腕部１０４ｂとは、繋ぎ部１０４ｃよりＸ１方向に延在しており、平行である。 Further, as shown in FIG. 7, the contact pattern 104 is U-shaped, and includes a first arm portion 104a, a second arm portion 104b, a connecting portion 104c that connects the two, and a first arm portion. The contact portion 31 at the tip of 104a and the contact portion 41 at the tip of the second arm portion 104b are provided. The 1st arm part 104a and the 2nd arm part 104b are extended in the X1 direction from the connection part 104c, and are parallel.

このシート部材１００は、プレス機にかけられて、各コンタクトパターン１０４の箇所が切り起こされる。図７中、１０７は切り込み線である。 The sheet member 100 is applied to a press machine to cut and raise the portions of the contact patterns 104. In FIG. 7, reference numeral 107 denotes a cut line.

先ず、図９（Ａ）に示すように、第２の腕部１０４ｂの部分をＺ１方向に切り起こし、同時に、Ｌ字形状として、ＩＣパッケージ側リード部４０を形成する。ＩＣパッケージ側リード部４０のＺ１方向に立ち上がっている部分は垂直線ＶＬに対してＸ１方向に角度α１傾斜している。次いで、図９（Ｂ）に示すように、第１の腕部１０４ａの部分をＺ２方向に切り起こし、垂直線ＶＬに対してＸ１方向に角度α２傾斜した斜めの切り起こし部３０ａを形成し、次いで、図９（Ｃ）に示すように、斜めの先端の部分をＸ２の方向に折り返すように折り曲げ、プリント回路基板側リード部３０を形成する。これによって、図９（Ｃ）に示すように、コンタクト片２３が形成される。 First, as shown in FIG. 9A, the portion of the second arm portion 104b is cut and raised in the Z1 direction, and at the same time, the IC package side lead portion 40 is formed in an L shape. A portion of the IC package side lead portion 40 rising in the Z1 direction is inclined by an angle α1 in the X1 direction with respect to the vertical line VL. Next, as shown in FIG. 9B, the first arm portion 104a is cut and raised in the Z2 direction to form an oblique cut and raised portion 30a inclined at an angle α2 in the X1 direction with respect to the vertical line VL. Next, as shown in FIG. 9C, the printed circuit board side lead portion 30 is formed by bending the oblique tip portion so as to be folded back in the X2 direction. As a result, as shown in FIG. 9C, contact pieces 23 are formed.

図１０はコンタクト片２３を、拡大して、且つ膜の厚さを誇張して示す。ＩＣパッケージ側リード部４０の先端部のＺ１側の面に、接点部４１が露出している。プリント回路基板側リード部３０の先端部のＺ２側の面に、接点部３１が露出している。 FIG. 10 shows the contact piece 23 enlarged and exaggerating the thickness of the membrane. The contact portion 41 is exposed on the surface of the leading end portion of the IC package side lead portion 40 on the Z1 side. The contact portion 31 is exposed on the Z2 side surface of the tip portion of the printed circuit board side lead portion 30.

ソケット本体２１が図５に示すように上下から挟まれたときの状態について、同じく図１０を参照して、説明する。ソケット本体２１が上下から挟まれたときに、ＩＣパッケージ側リード部４０は矢印Ａで示すようにＸ１方向に倒れるように撓まされ、プリント回路基板側リード部３０は矢印Ｂで示すように同じくＸ１方向に倒れるように撓まされる。この撓みによって、シート本体１０１から切り出された短冊形状の部分１０１ａ、１０１ｂが弾性力を発生し、接点部４１にはＺ１方向の力Ｆ１が発生し、接点部３１にはＺ２方向の力Ｆ２が発生する。 The state when the socket body 21 is sandwiched from above and below as shown in FIG. 5 will be described with reference to FIG. When the socket main body 21 is sandwiched from above and below, the IC package side lead portion 40 is bent so as to fall in the X1 direction as indicated by an arrow A, and the printed circuit board side lead portion 30 is similarly bent as indicated by an arrow B. It is bent so as to fall in the X1 direction. Due to this bending, the strip-shaped portions 101a and 101b cut out from the sheet main body 101 generate elastic force, the contact portion 41 generates a force F1 in the Z1 direction, and the contact portion 31 receives a force F2 in the Z2 direction. appear.

次に、ソケット２０の使用状態、即ち、ＬＧＡ型ＩＣパッケージ６０がプリント回路基板７０上に実装されているときの状態における、ソケット本体２１のコンタクト片２３の状態について説明する。 Next, the state of the contact piece 23 of the socket body 21 when the socket 20 is used, that is, when the LGA type IC package 60 is mounted on the printed circuit board 70 will be described.

図５に示すように、プリント回路基板側リード部３０は、プリント回路基板７０に押し当たって少し弾性的に撓まされた状態となって、リード部３０自身の復元しようとする弾性力の作用で、接点部３１が力Ｆ１でプリント回路基板７０上のコンタクト７１に押し当たっている。 As shown in FIG. 5, the printed circuit board side lead part 30 is pressed against the printed circuit board 70 to be slightly elastically bent, and the action of the elastic force to be restored by the lead part 30 itself is obtained. Thus, the contact portion 31 is pressed against the contact 71 on the printed circuit board 70 with the force F1 .

ＩＣパッケージ側リード部４０は、ＬＧＡ型ＩＣパッケージ６０によって押されて少し弾性的に撓まされた状態となって、リード部４０自身の復元しようとする弾性力の作用で、接点部３１が力Ｆ２でＬＧＡ型ＩＣパッケージ６０の下面のコンタクト６４に押し当たっている。 The IC package side lead part 40 is pushed by the LGA type IC package 60 and is slightly elastically bent, and the contact part 31 is forced by the action of the elastic force to be restored by the lead part 40 itself. F2 is pressed against the contact 64 on the lower surface of the LGA type IC package 60.

次に別の実施例について説明する。以下の実施例については、ＬＧＡ型ＩＣパッケージ用ソケットのうちコンタクト片の部分を取り出して説明する。 Next, another embodiment will be described. In the following embodiments, the contact piece portion of the LGA type IC package socket will be described.

図１１は本発明の実施例２になるＬＧＡ型ＩＣパッケージ用ソケットのコンタクト片２３Ａを示す。コンタクト片２３Ａは、プリント回路基板側リード部３０Ａと、ＩＣパッケージ側リード部４０Ａと、繋ぎ部５０Ａとよりなる構成である。コンタクト片２３Ａは、図８に示す前記のシート部材１００を図１２（Ａ）に示すように、表裏逆にした向とし、最初に、図１２（Ｂ）に示すようにＺ２方向に切り起こしてプリント回路基板側リード部３０Ａを形成し、次いで、図１２（Ｃ）に示すように、Ｚ１方向に切り起こして斜めのリード部４０Ａ−１を形成する。次いで、図１２（Ｄ）に示すように、斜めのリード部４０Ａ−１の先端部をＸ２方向に曲げて、水平のリード部４０Ａ−２を形成し、次いで、図１２（Ｅ）に示すように先端部をＺ１方向に曲げ、最後に図１２（Ｆ）に示すように先端部をＸ１方向に曲げることによって形成される。ＩＣパッケージ側リード部４０Ａは、Ｘ方向に延在している部分４０Ａ−３が撓むことによって、接点部４１がＺ２方向へ弾性的に変位できる寸法は、前記の図１０に示すＩＣパッケージ側リード部４０の場合に比較して長くなる。 FIG. 11 shows a contact piece 23A of an LGA type IC package socket according to the second embodiment of the present invention. The contact piece 23A is configured by a printed circuit board side lead portion 30A, an IC package side lead portion 40A, and a connecting portion 50A. The contact piece 23A has the above-mentioned sheet member 100 shown in FIG. 8 turned upside down as shown in FIG. 12A, and first cut and raised in the Z2 direction as shown in FIG. 12B. The printed circuit board side lead portion 30A is formed, and then, as shown in FIG. 12C, the oblique lead portion 40A-1 is formed by cutting and raising in the Z1 direction. Next, as shown in FIG. 12 (D), the tip of the oblique lead part 40A-1 is bent in the X2 direction to form a horizontal lead part 40A-2 , and then as shown in FIG. 12 (E). The tip is bent in the Z1 direction, and finally the tip is bent in the X1 direction as shown in FIG. The IC package-side lead portion 40A is dimensioned so that the contact portion 41 can be elastically displaced in the Z2 direction by bending the portion 40A-3 extending in the X direction. Compared to the case of the lead part 40, it becomes longer.

図１３は、コンタクト片２３Ａのプリント回路基板側リード部３０Ａの接点部３１がコンタクト７１に押し当たっており、ＩＣパッケージ側リード部４０Ａの接点部４１がコンタクト６４に押し当たっている状態を示す。 FIG. 13 shows a state where the contact portion 31 of the printed circuit board side lead portion 30A of the contact piece 23A is pressed against the contact 71, and the contact portion 41 of the IC package side lead portion 40A is pressed against the contact 64.

図１４は本発明の実施例３になるＬＧＡ型ＩＣパッケージ用ソケットのコンタクト片２３Ｂを示す。コンタクト片２３Ｂは、プリント回路基板側リード部３０Ｂと、ＩＣパッケージ側リード部４０Ｂと、繋ぎ部５０Ｂとよりなる構成である。 FIG. 14 shows a contact piece 23B of an LGA type IC package socket according to the third embodiment of the present invention. The contact piece 23B includes a printed circuit board side lead portion 30B, an IC package side lead portion 40B, and a connecting portion 50B.

図１５（Ａ），（Ｂ）はシート部材１００Ｂに形成してあるコンタクトパターン１０４Ｂを示す。コンタクトパターン１０４Ｂは、第１の腕部１０４Ｂａと、第２の腕部１０４Ｂｂと、両者を繋ぐ繋ぎ部１０４Ｂｃと、第１の腕部１０４Ｂａの先端の接点部３１Ｂと、第２の腕部１０４Ｂｂの先端側の接点部４１Ｂとを有する構成である。第１の腕部１０４Ｂａと、第２の腕部１０４Ｂｂと、繋ぐ繋ぎ部１０４Ｂｃと、接点部４１Ｂとは、シート部材１００Ｂの上面１００Ｂａに形成してある。接点部３１Ｂは、シート部材１００Ｂの下面１００Ｂｂに形成してあり、周囲を絶縁されたスルーホール１２０でもって、第１の腕部１０４Ｂａの先端と接続してある。接点部３１Ｂから接点部４１Ｂまでの部分をみると、コンタクトパターン１０４Ａはシート部材１００Ｂの上面１００Ｂａと下面１００Ｂｂとにまたがって形成してある。 15A and 15B show a contact pattern 104B formed on the sheet member 100B. The contact pattern 104B includes a first arm portion 104Ba, a second arm portion 104Bb, a connecting portion 104Bc that connects the two, a contact portion 31B at the tip of the first arm portion 104Ba, and a second arm portion 104Bb. It is the structure which has the contact part 41B of the front end side. The first arm portion 104Ba, the second arm portion 104Bb, the connecting portion 104Bc, and the contact portion 41B are formed on the upper surface 100Ba of the sheet member 100B. The contact portion 31B is formed on the lower surface 100Bb of the sheet member 100B, and is connected to the tip of the first arm portion 104Ba with a through hole 120 insulated around the contact portion 31B. Looking at the portion from the contact portion 31B to the contact portion 41B, the contact pattern 104A is formed across the upper surface 100Ba and the lower surface 100Bb of the sheet member 100B.

このシート部材１００Ｂを切り込み線１０７Ｂに沿って上下に切り起こすことによって、図１４に示すコンタクト片２３Ｂが製造される。 By cutting and raising the sheet member 100B up and down along the cut line 107B, the contact piece 23B shown in FIG. 14 is manufactured.

同じく、図１５に示すように、リード部３０Ｂ、４０Ｂが弾性的に撓まされた状態で、接点部３１Ｂがコンタクト７１に押し当たり、接点部４１Ｂがコンタクト６４に押し当たった状態となる。 Similarly, as shown in FIG. 15, in a state where the lead portions 30 B and 40 B are elastically bent, the contact portion 31 B presses against the contact 71 and the contact portion 41 B presses against the contact 64.

図１６は本発明の実施例４になるＬＧＡ型ＩＣパッケージ用ソケットのコンタクト片２３Ｃを示す。コンタクト片２３Ｃは、プリント回路基板側リード部３０Ｃと、ＩＣパッケージ側リード部４０Ｃと、繋ぎ部５０Ｃとよりなる構成である。 FIG. 16 shows a contact piece 23C of an LGA type IC package socket according to the fourth embodiment of the present invention. The contact piece 23C is configured by a printed circuit board side lead portion 30C, an IC package side lead portion 40C, and a connecting portion 50C.

図１７（Ａ），（Ｂ）はシート部材１００Ｃに形成してあるコンタクトパターン１０４Ｃを示す。コンタクトパターン１０４Ｃは、第１の腕部１０４Ｃａと、第２の腕部１０４Ｃｂと、両者を繋ぐ繋ぎ部１０４Ｃｃと、第１の腕部１０４Ｃａの先端の接点部３１Ｃと、第２の腕部１０４Ｃｂの先端の接点部４１Ｃとを有する構成である。第１の腕部１０４Ｃａと、繋ぎ部１０４Ｃｃと、接点部４１Ｃとは、シート部材１００Ｃの上面１００Ｃａに形成してある。第２の腕部１０４Ｃｂ及び接点部４１Ｃは、シート部材１００Ｃの下面１００Ｃｂに形成してある。第２の腕部１０４Ｃｂの基部は、周囲を絶縁されたスルーホール１２１でもって、繋ぎ部１０４Ｃｃと接続してある。接点部３１Ｃから接点部４１Ｃまでの部分をみると、コンタクトパターン１０４Ｃはシート部材１００Ｃの上面１００Ｃａと下面１００Ｃｂとにまたがって形成してある。 17A and 17B show a contact pattern 104C formed on the sheet member 100C. The contact pattern 104C includes a first arm portion 104Ca, a second arm portion 104Cb, a connecting portion 104Cc that connects the two, a contact portion 31C at the tip of the first arm portion 104Ca, and a second arm portion 104Cb. It is the structure which has the contact part 41C of the front-end | tip. The first arm portion 104Ca, the connecting portion 104Cc, and the contact portion 41C are formed on the upper surface 100Ca of the sheet member 100C. The second arm portion 104Cb and the contact portion 41C are formed on the lower surface 100Cb of the sheet member 100C. The base portion of the second arm portion 104Cb is connected to the connecting portion 104Cc through a through hole 121 whose periphery is insulated. Looking at the portion from the contact portion 31C to the contact portion 41C, the contact pattern 104C is formed across the upper surface 100Ca and the lower surface 100Cb of the sheet member 100C.

このシート部材１００Ｃを切り込み線１０７Ｃに沿って上下に切り起こすことによって、図１６に示すコンタクト片２３Ｂが製造される。 By cutting and raising the sheet member 100C up and down along the cut line 107C, the contact piece 23B shown in FIG. 16 is manufactured.

同じく、図１６に示すように、リード部３０Ｃ、４０Ｃが弾性的に撓まされた状態で、接点部３１Ｃがコンタクト７１に押し当たり、接点部４１Ｃがコンタクト６４に押し当たった状態となる。 Similarly, as shown in FIG. 16, in a state where the lead portions 30 C and 40 C are elastically bent, the contact portion 31 C presses against the contact 71 and the contact portion 41 C presses against the contact 64.

図１８は本発明の実施例５になるＬＧＡ型ＩＣパッケージ用ソケット２０ＤをＬＧＡ型ＩＣパッケージ６０及びプリント回路基板７０と併せて示す。 18 shows an LGA type IC package socket 20D according to a fifth embodiment of the present invention, together with an LGA type IC package 60 and a printed circuit board 70. FIG.

ソケット２０Ｄは、コンタクト片２３Ａ−１を有するシート状のソケット本体２１Ａ−１と、コンタクト片２３Ａ−２を有するシート状のソケット本体２１Ａ−２とが、重ね合わせてある構成である。コンタクト片２３Ａ−１、２３Ａ−２は、共に、図１１に示すコンタクト片２３Ａと同じである。 The socket 20D has a configuration in which a sheet-like socket body 21A-1 having contact pieces 23A-1 and a sheet-like socket body 21A-2 having contact pieces 23A-2 are overlapped. The contact pieces 23A-1 and 23A-2 are both the same as the contact pieces 23A shown in FIG.

図１１に示すコンタクト片２３Ａ−１を有するシート状のソケット本体２１Ａ−１と、同じく図１１に示すコンタクト片２３Ａ−２を有するシート状のソケット本体２１Ａ−２とが、重ね合わせてある構成である。ソケット本体２１Ａ−１のＩＣパッケージ側リード部４０Ａ−１が、ソケット本体２１Ａ−２のスリット２４Ａ−２に嵌合してＺ１方向に突き出ており、ソケット本体２１Ａ−２のプリント回路基板側リード部３０Ａ−２が、ソケット本体２１Ａ−２のスリット２４Ａ−１に嵌合してＺ２方向に突き出ている。 The sheet-like socket body 21A-1 having the contact piece 23A-1 shown in FIG. 11 and the sheet-like socket body 21A-2 having the contact piece 23A-2 also shown in FIG. is there. The IC package side lead portion 40A-1 of the socket body 21A-1 is fitted in the slit 24A-2 of the socket body 21A-2 and protrudes in the Z1 direction, and the printed circuit board side lead portion of the socket body 21A-2. 30A-2 fits into the slit 24A-1 of the socket body 21A-2 and protrudes in the Z2 direction.

ソケット本体２１−１のコンタクト片２３Ａ−１とソケット本体２１Ａ−２のコンタクト片２３Ａ−２とが交互に並んでいる。よって、ソケット本体２１Ａ−１のコンタクト片２３Ａ−１のピッチｐ１０及びソケット本体２１Ａ−２のコンタクト片２３Ａ−２のピッチｐ１０は、前記各実施例の場合のピッチｐ１の二倍となり、製造がし易い。 The contact pieces 23A-1 of the socket body 21-1 and the contact pieces 23A-2 of the socket body 21A-2 are alternately arranged. Therefore, the pitch p10 of the contact piece 23A-1 of the socket main body 21A-1 and the pitch p10 of the contact piece 23A-2 of the socket main body 21A-2 are twice the pitch p1 in each of the above embodiments. easy.

また、ソケット本体２１Ａ−１及び２１Ａ−２を前記実施例２と同様に製造した場合には、コンタクト片２３Ａ−１とコンタクト片２３Ａ−２とのピッチを前記実施例２の場合よりも狭くすることが可能となる。 When the socket main bodies 21A-1 and 21A-2 are manufactured in the same manner as in the second embodiment, the pitch between the contact piece 23A-1 and the contact piece 23A-2 is narrower than that in the second embodiment. It becomes possible.

なお、図６に示すコンタクト片２３を有するシート部材２２を二枚上下に重ねた構成、図１４に示すコンタクト片２３Ｂを有するシート本体を二枚上下に重ねた構成、及び図１６に示すコンタクト片２３Ｃを有するシート本体を二枚上下に重ねた構成とすることも可能である。 In addition, the structure which laminated | stacked the sheet member 22 which has the contact piece 23 shown in FIG. 6 up and down two times, the structure which piled up the sheet | seat main body which has the contact piece 23B shown in FIG. 14, and the contact piece shown in FIG. It is also possible to have a structure in which two sheet bodies having 23C are stacked one above the other.

図１９は本発明の実施例６になるＬＧＡ型ＩＣパッケージ用ソケット２０ＥをＬＧＡ型ＩＣパッケージ６０、プリント回路基板７０及びカバー部材８０と併せて示す。図２０はソケット２０Ｅの使用状態を示す。 FIG. 19 shows an LGA IC package socket 20E according to a sixth embodiment of the present invention, together with an LGA IC package 60 , a printed circuit board 70, and a cover member 80 . FIG. 20 shows the usage state of the socket 20E.

ソケット２０Ｅは、貫通穴２０１が整列して形成してある絶縁性のベース板２００と、このベース板２００の周囲の枠２１０と、各貫通穴２０１内に収まっているコンタクト部材２２０とよりなる構成である。
［コンタクト部材２２０の構成］
図２１（Ｂ）、（Ｃ），（Ｄ）はコンタクト部材２２０を示す。図２１（Ａ）はコンタクト部材２２０の素材であり、りん青銅或いはステンレス製であり、Ｘ１−Ｘ２方向に長い帯状部材２３０であり、長さがＬで幅がＷである。コンタクト部材２２０は、帯状部材２３０が角度αで螺旋状に例えば略１．５ターン巻かれているものであり、内周側のターン部２２１と外周側のターン部２２２とよりなる。２２５はコンタクト部材２２０の軸線である。内周側ターン部２２１と外周側ターン部２２２との間には隙間２２３が存在している。帯状部材２３０は、Ｘ２側の端に、Ｚ１方向へ突き出た略三角形の突起部２３１を有し、反対端に、Ｘ１側の端に、Ｚ２方向へ突き出た略三角形の突起部２３２を有する形状である。突起部２３１及び突起部２３２は、帯状部材２３０の一つの対角線２３３の両端部に位置している。帯状部材２３０が上記のように螺旋状及び渦巻き状とされた状態で、図２１（Ｂ）、（Ｃ），（Ｄ）に示すように、突起部２３１はＺ１方向に突き出て第１の接点部２２６を形成し、突起部２３２はＺ２方向に突き出て第２の接点部２２７を形成する。 The socket 20 E includes an insulating base plate 200 in which the through holes 201 are formed in alignment, a frame 210 around the base plate 200, and a contact member 220 that is accommodated in each through hole 201. It is.
[Configuration of Contact Member 220]
21B, 21C, and 21D show the contact member 220. FIG. FIG. 21A shows a material of the contact member 220, which is made of phosphor bronze or stainless steel, and is a strip-like member 230 that is long in the X1-X2 direction, having a length L and a width W. The contact member 220 is formed by spirally winding the band-shaped member 230 at an angle α, for example, approximately 1.5 turns, and includes an inner peripheral turn portion 221 and an outer peripheral turn portion 222. Reference numeral 225 denotes an axis of the contact member 220. There is a gap 223 between the inner turn portion 221 and the outer turn portion 222. The band-shaped member 230 has a substantially triangular protrusion 231 protruding in the Z1 direction at the end of the X2 side, and a substantially triangular protrusion 232 protruding in the Z2 direction at the end of the X1 side at the opposite end. It is. The protruding portion 231 and the protruding portion 232 are located at both ends of one diagonal line 233 of the belt-like member 230. In the state where the belt-like member 230 is formed in a spiral shape and a spiral shape as described above, as shown in FIGS. 21 (B), (C), and (D), the protruding portion 231 protrudes in the Z1 direction and is the first contact point. The portion 226 is formed, and the protruding portion 232 protrudes in the Z2 direction to form a second contact portion 227.

このコンタクト部材２２０は、周囲を例えばリング等で囲んで拡がらないように拘束し、且つ、突起部２３２を支えた状態で、突起部２３１をＺ２方向に変位させたときに、螺旋状の帯状部材２３０が捩れるように弾性的に撓まされて、軸線２２５の方向に図２１（Ｆ）に符号Ｆで示すばね力が発生する。 The contact member 220 is constrained so as not to expand by being surrounded by, for example, a ring or the like, and when the protrusion 231 is displaced in the Z2 direction while the protrusion 232 is supported, the contact member 220 has a spiral band shape. The member 230 is elastically bent so as to be twisted, and a spring force indicated by a symbol F in FIG. 21F is generated in the direction of the axis 225.

なお、図２１（Ａ）及び図２１（Ｇ）に示すように、帯状部材２３０には、Ｘ１−Ｘ２方向に長い導体のパターン２３７が複数本形成してある。この導体パターン２３７は図２１（Ｈ）に示すように、外周側ターン部２２２のうち内周側ターン部２２１に対向する面に凸条部を形成する。
［コンタクト部材２２０の製造方法］
また、上記のコンタクト部材２２０は、先ず、図２２（Ａ）、（Ｂ）に示す半完成体２２０Ａを形成し、次いで、この半完成体２２０Ａに加工を加えて変形させることによって、図２２（Ｃ）、（Ｄ）に示すようにして製造される。先ず、帯状部材２３０のＸ１側の部分２３５を固定しここを基部としてＸ２側の部分２３６を水平面内で円形に引き回して塑性変形させ、渦巻き状に、略１．５ターンさせて、図２２（Ａ）、（Ｂ）に示す半完成体２２０Ａを形成する。図２２（Ｂ）に示すように、引き回されて形成された内周側ターン部２２１は、と固定してある側である外周側ターン部２２２と接触した状態となっている。 As shown in FIGS. 21A and 21G, the strip-shaped member 230 has a plurality of conductor patterns 237 that are long in the X1-X2 direction. As shown in FIG. 21 (H), the conductor pattern 237 forms a ridge portion on the surface of the outer peripheral side turn portion 222 that faces the inner peripheral side turn portion 221.
[Method for Manufacturing Contact Member 220]
Further, the contact member 220 first forms a semi-finished product 220A shown in FIGS. 22A and 22B, and then deforms the semi-finished product 220A by applying processing to FIG. C), manufactured as shown in (D). First, the X1 side portion 235 of the belt-like member 230 is fixed, and the X2 side portion 236 is drawn circularly in a horizontal plane and plastically deformed by using this as a base, and is spirally made approximately 1.5 turns. A semi-finished product 220A shown in A) and (B) is formed. As shown in FIG. 22 (B), the inner periphery side turn portion 221 formed by being routed is in contact with the outer periphery side turn portion 222 which is a fixed side.

次いで、突起部２３１と突起部２３２とを掴んで、突起部２３１をＺ１方向に引き出して塑性変形させ、螺旋状として、図２２（Ｃ）、（Ｄ）に示すコンタクト部材２２０が完成する。突起部２３１をＺ１方向に引き出すことによって、図２２（Ｄ）に示すように、内周側ターン部２２１のＺ１方向からみた直径がＤ１からＤ２となって縮まり、内周側ターン部２２１が外周側ターン部２２２から離れて、内周側ターン部２２１と外周側ターン部２２２との間に隙間２２３が形成される。 Next, the projecting portion 231 and the projecting portion 232 are grasped, and the projecting portion 231 is pulled out in the Z1 direction to be plastically deformed, so that the contact member 220 shown in FIGS. 22C and 22D is completed. By pulling out the protruding portion 231 in the Z1 direction, as shown in FIG. 22D, the diameter of the inner peripheral turn portion 221 viewed from the Z1 direction is reduced from D1 to D2, and the inner peripheral turn portion 221 is reduced to the outer periphery. A gap 223 is formed between the inner peripheral turn portion 221 and the outer peripheral turn portion 222 apart from the side turn portion 222.

よって、コンタクト部材２２０の第１の接点部２２６をＺ２方向に押し込むと、コンタクト部材２２０は、内周側ターン部２２１及び外周側ターン部２２２が弾性的に撓んでばね力を発生させつつＺ方向に圧縮される。このときに、内周側ターン部２２１は図２２（Ｃ）、（Ｄ）に示す状態から図２１（Ｅ）、（Ｆ）に示す状態になる方向に向かって撓み、その直径がＤ２からＤ１に大きくなるように変形されて、内周側ターン部２２１が外周側ターン部２２２と接触する
［ＬＧＡ型ＩＣパッケージ６０の実装］
ＬＧＡ型ＩＣパッケージ６０は図２３（Ａ）に示すようにして実装される。即ち、ソケット２０Ａをプリント回路基板７０上に置き、ＬＧＡ型ＩＣパッケージ６０を枠２１０の内側に嵌合させてベース板２００上に載せ、カバー部材８０をＬＧＡ型ＩＣパッケージ６０上に載せ、ねじ部材９０を通し、プリント回路基板７０の下面側でナット９１に螺合することによって、全体がプリント回路基板７０上に固定されて、ＬＧＡ型ＩＣパッケージ６０は実装される。 Therefore, when the first contact portion 226 of the contact member 220 is pushed in the Z2 direction, the inner turn portion 221 and the outer turn portion 222 of the contact member 220 are elastically bent to generate a spring force and generate a spring force. Is compressed. At this time, the inner peripheral side turn portions 221 Figure 22 (C), FIG. 21 from the state shown in (D) (E), the deflection in the direction of the state shown in (F), from the diameter D2 D1 The inner peripheral turn portion 221 contacts the outer peripheral turn portion 222 [Mounting of LGA type IC package 60].
The LGA type IC package 60 is mounted as shown in FIG. That is, the socket 20A is placed on the printed circuit board 70, the LGA IC package 60 is fitted inside the frame 210 and placed on the base plate 200, the cover member 80 is placed on the LGA IC package 60, and the screw member Through 90, the whole surface is fixed on the printed circuit board 70 by screwing onto the nut 91 on the lower surface side of the printed circuit board 70, and the LGA type IC package 60 is mounted.

図２３（Ａ）に示すようにソケット２０Ａをプリント回路基板７０上に置いた状態では、各コンタクト部材２２０は、図２３（Ｃ）に示すように、第２の接点部２２７がプリント回路基板７０上の対応するコンタクト７１に接触した状態にある。図２３（Ｂ）に示すように、内周側のターン部２２１と外周側のターン部２２２との間には隙間２２３が存在している。 In the state where the socket 20A is placed on the printed circuit board 70 as shown in FIG. 23 (A), each contact member 220 has the second contact portion 227 as shown in FIG. 23 (C). It is in a state of being in contact with the corresponding contact 71 above . As shown in FIG. 23B, a gap 223 exists between the inner peripheral turn portion 221 and the outer peripheral turn portion 222.

ＬＧＡ型ＩＣパッケージ６０が枠２１０の内側に嵌合されて置かれると、コンタクト６４が対応するコンタクト部材２２０の第１の接点部２２６と接触する。ＬＧＡ型ＩＣパッケージ６０が押し付けられると、図２０（Ｂ）、（Ｃ）に示すようになる。即ち、図２０（Ｃ）に示すように、コンタクト部材２２０が軸線方向であるＺ方向に縮められて、発生したばね力Ｆによって、第１の接点部２２６がコンタクト６４に押し付けられ、第２の接点部２２７がコンタクト７１に押し付けられた状態となる。また、図２０（Ｂ）に示すように、内周側ターン部２２１がその径が大きくなるように変形されて、内周側ターン部２２１が外周側ターン部２２２と接触した状態となる。 When the LGA type IC package 60 is fitted and placed inside the frame 210, the contact 64 comes into contact with the first contact portion 226 of the corresponding contact member 220. When the LGA type IC package 60 is pressed, it becomes as shown in FIGS. That is, as shown in FIG. 20C, the contact member 220 is contracted in the Z direction, which is the axial direction, and the first contact portion 226 is pressed against the contact 64 by the generated spring force F, so that the second The contact portion 227 is pressed against the contact 71. Further, as shown in FIG. 20B, the inner peripheral turn portion 221 is deformed to have a larger diameter, and the inner peripheral turn portion 221 comes into contact with the outer peripheral turn portion 222.

よって、ＬＧＡ型ＩＣパッケージ６０は、ソケット２０内に固定されて、且つ各コンタクト６４がソケット２０Ａの各コンタクト部材２２０を通してプリント回路基板７０のコンタクト７１と電気的に接続された状態となる。ここで、各コンタクト部材２２０は、内周側ターン部２２１と外周側ターン部２２２とが接触した状態となっているため、各コンタクト部材２２０の信号が伝播する経路は、螺旋に沿う経路ではなく、Ｚ方向に延在する最短の経路となる。即ち、コンタクト部材２２０の信号が伝播する経路の長さは、帯状部材２３０の幅Ｗに対応する長さとなって、短い。よって、上記のＬＧＡ型ＩＣパッケージ６０は、コンタクト部材がその信号が伝播する経路が螺旋に沿う構成であるものに比較して、より高速の信号に対応が可能である。 Therefore, the LGA IC package 60 is fixed in the socket 20 and the contacts 64 are electrically connected to the contacts 71 of the printed circuit board 70 through the contact members 220 of the socket 20A. Here, since each contact member 220 is in a state where the inner peripheral turn portion 221 and the outer peripheral turn portion 222 are in contact with each other, the path through which the signal of each contact member 220 propagates is not a path along the spiral. , The shortest path extending in the Z direction. That is, the length of the path through which the signal of the contact member 220 propagates is a length corresponding to the width W of the belt-like member 230 and is short. Therefore, the LGA type IC package 60 described above can cope with higher-speed signals as compared with a structure in which the contact member has a path along which the signal propagates along the spiral.

ここで、図２０（Ｄ）に示すように、内周側ターン部２２１は外周側ターン部２２２の内周面に形成してある導体パターン２３７に接触し、接触が線接触的となり、内周側ターン部２２１と外周側ターン部２２２との電気的接触は上記の導体パターン２３７が形成されていない場合に比較して確実に且つ安定になされる。よって、コンタクト部材２２０には、信号が伝播するＺ方向に延在する最短の経路が、確実に且つ安定に形成される。 Here, as shown in FIG. 20D, the inner peripheral side turn part 221 contacts the conductor pattern 237 formed on the inner peripheral surface of the outer peripheral side turn part 222, and the contact becomes a line contact. The electrical contact between the side turn part 221 and the outer peripheral side turn part 222 is reliably and stably compared to the case where the conductor pattern 237 is not formed. Therefore, the shortest path extending in the Z direction in which the signal propagates is reliably and stably formed in the contact member 220.

なお、上記の導体パターン２３７が、内周側ターン部２２１の外周面に形成されている構成とすることも出来、更には、導体パターン２３７が、外周側ターン部２２２の内周面と内周側ターン部２２１の外周面との両方に形成されている構成とすることも出来る。この場合にも、内周側ターン部２２１と外周側ターン部２２２との電気的接触は良好となる。 The conductor pattern 237 may be formed on the outer peripheral surface of the inner peripheral turn portion 221. Further, the conductor pattern 237 may be configured so that the inner peripheral surface and the inner peripheral surface of the outer peripheral turn portion 222 are formed. It can also be set as the structure currently formed in both the outer peripheral surfaces of the side turn part 221. FIG. Also in this case, the electrical contact between the inner peripheral turn portion 221 and the outer peripheral turn portion 222 is good.

また、コンタクト６４、７１には夫々第１、第２の接点部２２６、２２７が押し付けられ、接触圧が高く、よって、コンタクト部材２２０とコンタクト６４、７１との電気的接続の信頼性は高い。 Further, the first and second contact portions 226 and 227 are pressed against the contacts 64 and 71, respectively, and the contact pressure is high. Therefore, the reliability of electrical connection between the contact member 220 and the contacts 64 and 71 is high.

なお、コンタクト部材２２０の素材として、図２４（Ａ）に示すスリット２３５が形成してある帯状部材２３０Ａ、或いは図２４（Ｂ）に示す穴２３６を形成してある帯状部材２３０Ｂを使用することによって、ばね力を適宜変えたコンタクト部材が製造される。 Note that, as the material of the contact member 220, by using the belt-like member 230A in which the slit 235 shown in FIG. 24A is formed or the belt-like member 230B in which the hole 236 shown in FIG. Then, a contact member in which the spring force is appropriately changed is manufactured.

図２４（Ｃ）の帯状部材２３０Ｃは、縦向きの直線状の導体パターン２３８が形成してある構成である。図２４（Ｄ）の帯状部材２３０Ｄは、縦向きの破線状の導体パターン２３９が形成してある構成である。各導体パターン２３８、２３９は、内周側ターン部２２１と外周側ターン部２２２との電気的接触を確実且つ安定なものとする。 A belt-like member 230C in FIG. 24C has a structure in which a longitudinal linear conductor pattern 238 is formed. A band-shaped member 230D in FIG. 24D has a structure in which a vertically-oriented broken-line conductor pattern 239 is formed. Each of the conductor patterns 238 and 239 ensures reliable and stable electrical contact between the inner peripheral turn portion 221 and the outer peripheral turn portion 222.

また、上記コンタクト部材２２０を上記とは上下逆向きの姿勢でベース板２００の貫通穴２０１に嵌合させた構成でもよい。この場合には、第１の接点部２２６がＺ２側、第２の接点部２２７がＺ１側に突き出し、第１の接点部２２６がプリント回路基板７０上のコンタクト７１に接触し、第２の接点部２２７がＬＧＡ型ＩＣパッケージ６０上のコンタクト６４に接触する。
［コンタクト部材２００の変形例］
［第１の変形例になるコンタクト部材２００Ａ］
図２５（Ａ），（Ｂ），（Ｃ）は第１の変形例になるコンタクト部材２２０Ａを示す。このコンタクト部材２２０Ａは、前記のコンタクト部材２２０に代えて、ベース板２００の貫通穴２０１に嵌合させて組み込まれる。 Further, the contact member 220 may be fitted in the through hole 201 of the base plate 200 in an upside down posture. In this case, the first contact portion 226 protrudes toward the Z2 side, the second contact portion 227 protrudes toward the Z1 side, the first contact portion 226 contacts the contact 71 on the printed circuit board 70, and the second contact point The part 227 contacts the contact 64 on the LGA type IC package 60.
[Modification of Contact Member 200]
[Contact Member 200A as First Modification]
FIGS. 25A, 25B, and 25C show a contact member 220A according to a first modification. The contact member 220 A is incorporated in the through hole 201 of the base plate 200 in place of the contact member 220.

このコンタクト部材２２０Ａは、金属の帯状部材を、図２５（Ｄ）に示すように、傾斜角度αで螺旋状に且つ略円形に形成し、且つ、両端を円の中心側に折り曲げて形成したものであり、略円形部２４０と、折り曲げ部２４１，２４２とを有する。 As shown in FIG. 25 (D), the contact member 220A is formed by forming a spiral and substantially circular shape with an inclination angle α, and bending both ends toward the center of the circle, as shown in FIG. 25 (D). And has a substantially circular portion 240 and bent portions 241 and 242.

このコンタクト部材２２０Ａは、図２５（Ａ），（Ｂ）に示すように、少しすぼめた状態でベース板２００の貫通穴２０１内に押し込められており、折り曲げ部２４１，２４２の対向する面同士が接触してあり、且つ、折り曲げ部２４１，２４２が軸線方向であるＺ方向に寸法Ｓずれた状態にある。この状態で、折り曲げ部２４１，２４２が同じ高さとなるように変位されるときに、略円形部２４０が弾性的に捩じり変形されて軸線方向にばね力を発生する。 As shown in FIGS. 25A and 25B, the contact member 220A is pushed into the through hole 201 of the base plate 200 in a slightly depressed state, and the opposing surfaces of the bent portions 241 and 242 are opposed to each other. The bent portions 241 and 242 are in contact with each other and are in a state where the dimension S is shifted in the Z direction which is the axial direction. In this state, when the bent portions 241 and 242 are displaced so as to have the same height, the substantially circular portion 240 is elastically twisted to generate a spring force in the axial direction.

コンタクト部材２２０Ａの折り曲げ部２４２のＺ２側の端部２４２ａがプリント回路基板７０のコンタクト７１に当たり、ＬＧＡ型ＩＣパッケージ６０のコンタクト６４が折り曲げ部２４１のＺ１側の端部２４１ａに当たり、上記寸法Ｓが短くなる方向に略円形部２４０が捩じられるように撓まされ、このときに弾性力が発生する。この弾性力によって、折り曲げ部２４２のＺ２側の端部２４２ａがプリント回路基板７０のコンタクト７１に押し当たり、折り曲げ部２４１のＺ２側の端部２４１ａがＬＧＡ型ＩＣパッケージ６０のコンタクト６４に押し当たる。また、折り曲げ部２４１，２４２は対向する面同士が接触した状態にあり、信号が伝播する通路はＺ方向に短い距離で形成される。これによって、ＬＧＡ型ＩＣパッケージ６０のコンタクト６４とプリント回路基板７０のコンタクト７１とが、コンタクト部材２２０ＡをＺ方向に通って電気的に接続される。 The end 242a on the Z2 side of the bent part 242 of the contact member 220A hits the contact 71 of the printed circuit board 70, the contact 64 of the LGA IC package 60 hits the end 241a on the Z1 side of the bent part 241, and the dimension S is short. In this direction, the substantially circular portion 240 is bent so as to be twisted, and at this time, an elastic force is generated. Due to this elastic force, the end portion 242 a on the Z2 side of the bent portion 242 presses against the contact 71 of the printed circuit board 70, and the end portion 241 a on the Z2 side of the bent portion 241 presses against the contact 64 of the LGA type IC package 60. In addition, the bent portions 241 and 242 are in a state where the opposing surfaces are in contact with each other, and a path through which a signal propagates is formed at a short distance in the Z direction. As a result, the contact 64 of the LGA IC package 60 and the contact 71 of the printed circuit board 70 are electrically connected through the contact member 220A in the Z direction.

なお、前記と同じく、帯状部材にスリット或いは穴を適宜形成することによって、コンタクト部材２２０Ａが発生するばね力を適宜変えることが可能である。
［第２の変形例になるコンタクト部材２２０Ｅ］
図２６（Ｂ），（Ｃ），（Ｄ）は第２の変形例になるコンタクト部材２２０Ｅを示す。コンタクト部材２２０Ｅは、図２６（Ａ）に示す帯状部材２３０Ｅを、前記の帯状部材２３０の場合と同様に、角度αで螺旋状に例えば略１．５ターン巻いたものであり、内周側のターン部２２１Ｅと外周側のターン部２２２Ｅとよりなる。２２５Ｅはコンタクト部材２２０Ｅの軸線である。内周側ターン部２２１Ｅと外周側ターン部２２２Ｅとの間には隙間２２３Ｅが存在している。 As described above, the spring force generated by the contact member 220A can be appropriately changed by appropriately forming slits or holes in the belt-like member.
[Contact Member 220E as Second Modification]
FIGS. 26B, 26C, and 26D show a contact member 220E according to a second modification. The contact member 220E is obtained by winding the belt-like member 230E shown in FIG. 26A spirally at an angle α, for example, approximately 1.5 turns, as in the case of the belt-like member 230 described above. It comprises a turn part 221E and an outer turn part 222E. 225E is an axis of the contact member 220E. A gap 223E exists between the inner peripheral turn portion 221E and the outer peripheral turn portion 222E.

帯状部材２３０Ｅは、Ｘ２側の端に、Ｚ１方向へ突き出た略三角形の突起部２３１Ｅ１及びＺ２方向へ突き出た略三角形の突起部２３１Ｅ２を有し、Ｘ２側の端に、同じく、Ｚ１及びＺ２方向へ突き出た略三角形の突起部２３２Ｅ１、２３２Ｅ２を有する構成である。即ち、帯状金属板部材２３０Ｅは、突起部を、長さ方向上の各端の幅方向の両端に有する構成である。 The belt-like member 230E has a substantially triangular projection 231E1 projecting in the Z1 direction and an approximately triangular projection 231E2 projecting in the Z2 direction at the end on the X2 side, and similarly in the Z1 and Z2 directions on the X2 side end. It is the structure which has the substantially triangular protrusion part 232E1 and 232E2 which protruded into the side. That is, the strip-shaped metal plate member 230E has a configuration in which the protruding portions are provided at both ends in the width direction of each end in the length direction.

帯状部材２３０Ｅが螺旋状及び渦巻き状とされた状態で、突起部２３１Ｅ１、２３２Ｅ１は夫々Ｚ１方向に突き出たＺ１側の接点部２２６Ｅ１、２２８Ｅ１を形成し、突起部２３１Ｅ２、２３２Ｅ２は夫々Ｚ２方向に突き出たＺ２側の接点部２２７Ｅ２、２２９Ｅ２を形成する。 In a state where the belt-like member 230E is spiral and spiral, the protrusions 231E1 and 232E1 form contact points 226E1 and 228E1 on the Z1 side protruding in the Z1 direction, respectively, and the protrusions 231E2 and 232E2 protrude in the Z2 direction, respectively. Further, contact portions 227E2 and 229E2 on the Z2 side are formed.

コンタクト部材２２０Ｅは、ベース板２００の貫通穴２０１に嵌合されて使用状態とされ（図１９参照）、Ｚ方向に縮められると、図２６（Ｅ）、（Ｆ）に示すようになる。即ち、図２６（Ｆ）に示すように、発生したばね力Ｆによって、コンタクト６４には二つの接点部２２６Ｅ１、２２８Ｅ１が押し付けられ、コンタクト７１にも二つの接点部２２７Ｅ２、２２９Ｅ２が押し付けられた状態となる。また、図２６（Ｅ）に示すように、内周側ターン部２２１Ｅがその径が大きくなるように変形されて、内周側ターン部２２１Ｅが外周側ターン部２２２Ｅと接触した状態となる。 When the contact member 220E is fitted into the through hole 201 of the base plate 200 to be used (see FIG. 19) and contracted in the Z direction, the contact member 220E is as shown in FIGS. That is, as shown in FIG. 26 (F), two contact portions 226E1, 228E1 are pressed against the contact 64 by the generated spring force F, and the two contact portions 227E2, 229E2 are also pressed against the contact 71. It becomes. Further, as shown in FIG. 26E, the inner peripheral turn portion 221E is deformed so that its diameter is increased, and the inner peripheral turn portion 221E comes into contact with the outer peripheral turn portion 222E.

コンタクト部材２２０Ｅは、プリント回路基板７０のコンタクト７１及びＬＧＡ型ＩＣパッケージ６０のコンタクト６４の両方について、夫々二箇所で接続されるため、ＬＧＡ型ＩＣパッケージ６０とプリント回路基板７０との電気的接続の信頼性は高い。
［第３の変形例になるコンタクト部材２２０Ｆ］
図２７（Ｂ）は第３の変形例になるコンタクト部材２２０Ｆを示す。コンタクト部材２２０Ｆは、図２７（Ａ）に示す帯状部材２３０Ｆを、前記の帯状部材２３０の場合と同様に、螺旋状に例えば略１．５ターン巻いたものであり、内周側のターン部２２１Ｆと外周側のターン部２２２Ｆとよりなる。２２５Ｆはコンタクト部材２２０Ｆの軸線である。内周側ターン部２２１Ｆと外周側ターン部２２２Ｆとの間には隙間が存在している。 Since the contact member 220E is connected to both the contact 71 of the printed circuit board 70 and the contact 64 of the LGA type IC package 60 at two locations, the electrical connection between the LGA type IC package 60 and the printed circuit board 70 is achieved. Reliability is high.
[Contact Member 220F as Third Modification]
FIG. 27B shows a contact member 220F according to a third modification. The contact member 220F is obtained by winding the belt-like member 230F shown in FIG. 27A in a spiral shape, for example, approximately 1.5 turns, as in the case of the belt-like member 230, and the turn portion 221F on the inner peripheral side. And a turn portion 222F on the outer peripheral side. 225F is the axis of the contact member 220F. There is a gap between the inner peripheral turn portion 221F and the outer peripheral turn portion 222F.

帯状部材２３０Ｆは、Ｘ２側の端に、Ｚ１方向へ突き出た突起群２５０を有し、Ｘ１側の端に、Ｚ２方向へ突き出た突起群２６０を有する。突起群２５０は並んだ三つの突起２５１，２５２，２５３よりなり、突起群２６０は並んだ三つの突起２６１，２６２，２６３よりなる。 The band-shaped member 230F has a protrusion group 250 protruding in the Z1 direction at the end on the X2 side, and a protrusion group 260 protruding in the Z2 direction at the end on the X1 side. The projection group 250 includes three projections 251, 252, and 253 that are arranged, and the projection group 260 includes three projections 261, 262, and 263 that are arranged.

帯状部材２３０Ｆが螺旋状及び渦巻き状とされた状態で、突起２５１，２５２，２５３は夫々Ｚ１方向に突き出たＺ１側の接点部２７１，２７２，２７３を形成し、突起２６１，２６２，２６３は夫々Ｚ２方向に突き出たＺ２側の接点部２８１，２８２，２８３を形成する。 In a state where the belt-like member 230F is spiral and spiral, the protrusions 251, 252, and 253 form contact portions 271, 272, and 273 on the Z1 side that protrude in the Z1 direction, and the protrusions 261, 262, and 263, respectively. Z2 side contact portions 281, 282, and 283 projecting in the Z2 direction are formed.

コンタクト部材２２０Ｆは、ベース板２００の貫通穴２０１に嵌合されて使用状態とされ（図１９参照）、Ｚ方向に縮められると、接点部２７１，２７２，２７３がＬＧＡ型ＩＣパッケージのコンタクトと接触し、接点部２８１，２８２，２８３がプリント回路基板のコンタクトと接触し、且つ、内周側ターン部２２１Ｆが外周側ターン部２２２Ｆと接触した状態となる。 The contact member 220F is fitted into the through hole 201 of the base plate 200 to be used (see FIG. 19), and when contracted in the Z direction, the contact portions 271, 272, and 273 are in contact with the contacts of the LGA IC package. Then, the contact portions 281, 282, and 283 are in contact with the contacts of the printed circuit board, and the inner peripheral turn portion 221F is in contact with the outer peripheral turn portion 222F.

コンタクト部材２２０Ｆは、プリント回路基板のコンタクト及びＬＧＡ型ＩＣパッケージのコンタクトの両方について、夫々二箇所で接続されるため、ＬＧＡ型ＩＣパッケージとプリント回路基板との電気的接続の信頼性は高い。
［第４の変形例になるコンタクト部材２２０Ｇ］
図２８（Ｅ）は第４の変形例になるコンタクト部材２２０Ｇを示す。コンタクト部材２２０Ｇは、図２８（Ｂ）に示す第１のコンタクト部材３００と図２８（Ｄ）に示す第２のコンタクト部材３１０との組み合わせであり、第２のコンタクト部材３１０が、第１のコンタクト部材３００の中央に、抜け出ない状態で嵌合してある二重構造の構成である。 Since the contact member 220F is connected at two positions for both the contact of the printed circuit board and the contact of the LGA IC package, the reliability of the electrical connection between the LGA IC package and the printed circuit board is high.
[Contact Member 220G as Fourth Modification]
FIG. 28E shows a contact member 220G according to a fourth modification. The contact member 220G is a combination of the first contact member 300 shown in FIG. 28B and the second contact member 310 shown in FIG. 28D, and the second contact member 310 is the first contact. It is the structure of the double structure fitted in the center of the member 300 in the state which does not come out.

第１のコンタクト部材３００は、図２８（Ａ）に示す帯状部材２３０Ｇ１を螺旋状に例えば略１．５ターン巻いてなる構成であり、内周側ターン部３０１と、内周側ターン部３０１との間に隙間３０２をおいて内周側ターン部３０１と対向している外周側ターン部３０３とよりなり、内周側ターン部３０１の端に、Ｚ１方向へ突き出ている接点部３０４を有し、外周側ターン部３０３の端に、Ｚ２方向へ突き出ている接点部３０５を有する構成である。 The first contact member 300 has a configuration in which a belt-like member 230G1 shown in FIG. 28A is spirally wound, for example, approximately 1.5 turns, and includes an inner peripheral turn portion 301, an inner peripheral turn portion 301, and the like. And a contact portion 304 protruding in the Z1 direction at the end of the inner turn portion 301. The outer turn portion 303 faces the inner turn portion 301 with a gap 302 therebetween. The contact portion 305 protrudes in the Z2 direction at the end of the outer peripheral side turn portion 303.

第２のコンタクト部材３１０は、図２８（Ｃ）に示す帯状部材２３０Ｇ１を螺旋状に例えば略１．５ターン巻いてなる構成であり、径が第１のコンタクト部材３００の中心に嵌合できる寸法としてあり、内周側ターン部３１１と、内周側ターン部３１１との間に隙間３１２をおいて内周側ターン部３１１と対向している外周側ターン部３１３とよりなり、内周側ターン部３１１の端に、Ｚ１方向へ突き出ている接点部３１４を有し、外周側ターン部３１３の端に、Ｚ２方向へ突き出ている接点部３１５を有する構成である。 The second contact member 310 has a configuration in which the belt-like member 230G1 shown in FIG. 28C is spirally wound, for example, approximately 1.5 turns, and has a diameter that can be fitted to the center of the first contact member 300. And comprises an inner periphery side turn portion 311 and an outer periphery side turn portion 313 facing the inner periphery side turn portion 311 with a gap 312 between the inner periphery side turn portion 311. The contact portion 314 protrudes in the Z1 direction at the end of the portion 311, and the contact portion 315 protrudes in the Z2 direction at the end of the outer peripheral side turn portion 313.

コンタクト部材２２０Ｇは、接点部３０４と接点部３１４とがＺ１方向に突き出ており、接点部３０５と接点部３１５とがＺ２方向に突き出ている構成である。 The contact member 220G has a configuration in which the contact portion 304 and the contact portion 314 protrude in the Z1 direction, and the contact portion 305 and the contact portion 315 protrude in the Z2 direction.

コンタクト部材２２０Ｇは、ベース板２００の貫通穴２０１に嵌合されて使用状態とされ（図１９参照）、Ｚ方向に縮められると、接点部３０４，３１４がＬＧＡ型ＩＣパッケージのコンタクトと接触し、接点部３０５，３１５がプリント回路基板のコンタクトと接触し、且つ、内周側ターン部３０１が外周側ターン部３０３と接触し、且つ、内周側ターン部３１１が外周側ターン部３１３と接触した状態となる。 The contact member 220G is fitted into the through hole 201 of the base plate 200 to be used (see FIG. 19). When the contact member 220G is contracted in the Z direction, the contact portions 304 and 314 come into contact with the contacts of the LGA IC package, The contact portions 305 and 315 are in contact with the contacts of the printed circuit board, the inner peripheral turn portion 301 is in contact with the outer peripheral turn portion 303, and the inner peripheral turn portion 311 is in contact with the outer peripheral turn portion 313. It becomes a state.

コンタクト部材２２０Ｇは、プリント回路基板のコンタクト及びＬＧＡ型ＩＣパッケージのコンタクトの両方について、夫々二箇所で接続されるため、ＬＧＡ型ＩＣパッケージとプリント回路基板との電気的接続の信頼性は高い。また、Ｚ方向に延在する信号伝播経路が、第１のコンタクト部材３００と第２のコンタクト部材３１０との両方に形成される。よって、コンタクト部材２２０Ｇの信号伝播の信頼性は高い。
［第５の変形例になるコンタクト部材２２０Ｈ］
図２９（Ｄ）は第５の変形例になるコンタクト部材２２０Ｈを示す。コンタクト部材２２０Ｈは、図２９（Ｃ）に示す帯状部材組立体３２０を螺旋状に例えば略１．５ターン巻いてなる構成である。帯状部材組立体３２０は、図２９（Ａ）に示す帯状部材２３０Ｈ１と図２９（Ｂ）に示す帯状部材２３０Ｈ２とをその長手方向（Ｘ方向）に少しずらした状態で重ね、接着したものである。３２１は接着部分である。 Since the contact member 220G is connected at two locations for both the contact of the printed circuit board and the contact of the LGA IC package, the reliability of the electrical connection between the LGA IC package and the printed circuit board is high. A signal propagation path extending in the Z direction is formed in both the first contact member 300 and the second contact member 310. Therefore, the signal propagation reliability of the contact member 220G is high.
[Contact Member 220H as a Fifth Modification]
FIG. 29D shows a contact member 220H according to a fifth modification. The contact member 220H has a configuration in which the belt-like member assembly 320 shown in FIG. 29C is spirally wound, for example, approximately 1.5 turns. The band-shaped member assembly 320 is formed by stacking and bonding the band-shaped member 230H1 shown in FIG. 29A and the band-shaped member 230H2 shown in FIG. 29B while being slightly shifted in the longitudinal direction (X direction). . Reference numeral 321 denotes an adhesive portion.

コンタクト部材２２０Ｈは、内周側ターン部３３１と、内周側ターン部３３１との間に隙間３１２をおいて内周側ターン部３３１と対向している外周側ターン部３３３とよりなり、内周側ターン部３３１の端に、Ｚ１方向へ突き出ている二つの接点部３３５，３３６を有し、外周側ターン部３３３の端に、Ｚ２方向へ突き出ている二つの接点部３３７，３３８を有する構成である。 The contact member 220H is composed of an inner peripheral turn portion 331 and an outer peripheral turn portion 333 facing the inner peripheral turn portion 331 with a gap 312 between the inner peripheral turn portion 331. A configuration having two contact portions 335 and 336 protruding in the Z1 direction at the end of the side turn portion 331 and two contact portions 337 and 338 protruding in the Z2 direction at the end of the outer peripheral turn portion 333 It is.

コンタクト部材２２０Ｈは、ベース板２００の貫通穴２０１に嵌合されて使用状態とされ（図１９参照）、Ｚ方向に縮められると、接点部３３５，３３６がＬＧＡ型ＩＣパッケージのコンタクトと接触し、接点部３３７，３３８がプリント回路基板のコンタクトと接触し、且つ、内周側ターン部３３１が外周側ターン部３３３と接触した状態となる。 The contact member 220H is fitted into the through hole 201 of the base plate 200 to be used (see FIG. 19). When the contact member 220H is contracted in the Z direction, the contact portions 335 and 336 come into contact with the contacts of the LGA IC package, The contact portions 337 and 338 are in contact with the contacts of the printed circuit board, and the inner peripheral turn portion 331 is in contact with the outer peripheral turn portion 333.

コンタクト部材２２０Ｈは、プリント回路基板のコンタクト及びＬＧＡ型ＩＣパッケージのコンタクトの両方について、夫々二箇所で接続されるため、ＬＧＡ型ＩＣパッケージとプリント回路基板との電気的接続の信頼性は高い。また、Ｚ方向に延在する信号伝播経路が、帯状部材２３０Ｈ１と帯状部材２３０Ｈ２との両方に形成される。よって、コンタクト部材２２０Ｈの信号伝播の信頼性は高い。
［第６の変形例になるコンタクト部材２２０Ｊ］
図３０（Ｂ）は第６の変形例になるコンタクト部材２２０Ｊを示す。コンタクト部材２２０Ｊは、図３０（Ａ）に示す帯状部材２３０Ｊを螺旋状に例えば略１．５ターン巻いてなる構成であり、内周側ターン部３４１と、内周側ターン部３４１との間に隙間３４２をおいて内周側ターン部３４１と対向している外周側ターン部３４３とよりなり、内周側ターン部３４１の端に、Ｚ１方向へ突き出ている接点部３４４を有し、外周側ターン部３０３の端に、Ｚ２方向へ突き出ている接点部３４５を有する構成である。 Since the contact member 220H is connected at two locations for both the contact of the printed circuit board and the contact of the LGA type IC package, the reliability of electrical connection between the LGA type IC package and the printed circuit board is high. Further, a signal propagation path extending in the Z direction is formed in both the belt-like member 230H1 and the belt-like member 230H2. Therefore, the signal propagation reliability of the contact member 220H is high.
[Contact Member 220J According to Sixth Modification]
FIG. 30B shows a contact member 220J according to a sixth modification. The contact member 220J is configured by spirally winding the belt-like member 230J shown in FIG. 30A, for example, approximately 1.5 turns, and between the inner peripheral turn portion 341 and the inner peripheral turn portion 341. It has an outer periphery side turn portion 343 facing the inner periphery side turn portion 341 with a gap 342, and has a contact portion 344 protruding in the Z1 direction at the end of the inner periphery side turn portion 341. The contact portion 345 protrudes in the Z2 direction at the end of the turn portion 303.

また、帯状部材２３０Ｊは中央にスリット３５０を有する。このスリット３５０によって、コンタクト部材２２０Ｊの外周側ターン部３４３には開口窓３５１が形成してある。 Further, the belt-like member 230J has a slit 350 at the center. By the slit 350, an opening window 351 is formed in the outer peripheral side turn portion 343 of the contact member 220J.

図３０（Ｃ）に示すように、ベース板２００Ｊの全部の貫通穴２０１Ｊは、その内周に突起３６０が突き出ている構成である。よって、全部のコンタクト部材２２０Ｊは、貫通穴２０１Ｊ内において、その開口窓３５１が突起３６０と係合してＺ方向の位置を決められた状態で組み込んである。全部のコンタクト部材２２０Ｊについて、接点部３４４のベース板２００Ｊの上面よりの突き出し寸法ａと、接点部３４５のベース板２００Ｊの下面よりの突き出し寸法ｂとは等しくなっている。 As shown in FIG. 30C, all the through holes 201J of the base plate 200J have a configuration in which the protrusions 360 protrude from the inner periphery thereof. Therefore, all the contact members 220J are assembled in a state where the opening window 351 is engaged with the protrusion 360 and the position in the Z direction is determined in the through hole 201J. For all the contact members 220J, the protruding dimension a of the contact portion 344 from the upper surface of the base plate 200J is equal to the protruding dimension b of the contact portion 345 from the lower surface of the base plate 200J.

コンタクト部材２２０Ｊは、使用状態において、Ｚ方向に縮められると、接点部３４４がＬＧＡ型ＩＣパッケージのコンタクトと接触し、接点部３４５がプリント回路基板のコンタクトと接触し、且つ、内周側ターン部３４１が外周側ターン部３４３と接触した状態となる。 When the contact member 220J is contracted in the Z direction in use, the contact portion 344 contacts the contact of the LGA IC package, the contact portion 345 contacts the contact of the printed circuit board, and the inner peripheral side turn portion 341 comes into contact with the outer peripheral turn portion 343.

ここで、ベース板２００Ｊに並んでいる全部のコンタクト部材２２０Ｊについて、接点部３４４のベース板２００Ｊの上面よりの突き出し寸法ａと、接点部３４５のベース板２００Ｊの下面よりの突き出し寸法ｂとは等しくなっているため、全部のコンタクト部材２２０Ｊについて、接点部３４４のＬＧＡ型ＩＣパッケージのコンタクトとの接触、及び接点部３４５のプリント回路基板のコンタクトと接触が安定になされる。 Here, for all the contact members 220J arranged in the base plate 200J, the protruding dimension a of the contact portion 344 from the upper surface of the base plate 200J is equal to the protruding dimension b of the contact portion 345 from the lower surface of the base plate 200J. Therefore, contact of all the contact members 220J with the contacts of the LGA type IC package of the contact portion 344 and the contact of the printed circuit board of the contact portion 345 is made stable.

なお、この開口窓３５１が突起３６０と係合して位置決めされる構成は、図１９乃至図２９に示すコンタクト部材２２０、２２０Ａ，２２０Ｅ、２２０Ｆ、２２０Ｇ、２２０Ｈにも適用が可能である。 The configuration in which the opening window 351 is positioned by engaging with the protrusion 360 can be applied to the contact members 220, 220A, 220E, 220F, 220G, and 220H shown in FIGS.

なお、上記の各コンタクト部材２２０、２２０Ａ，２２０Ｅ、２２０Ｆ、２２０Ｇ、２２０Ｈ、２２０Ｊは、上記とは上下逆の向きで、ベース板２００の貫通穴２０１に組み込んでもよい。この場合には、内周側ターン部の端の接点部がプリント回路基板のコンタクトと接触し、外周側ターン部の端の接点部がＬＧＡ型ＩＣパッケージのコンタクトと接触する。 Each of the contact members 220, 220A, 220E, 220F, 220G, 220H, and 220J may be incorporated into the through hole 201 of the base plate 200 in an upside down direction. In this case, the contact portion at the end of the inner turn side is in contact with the contact of the printed circuit board, and the contact portion at the end of the outer turn side is in contact with the contact of the LGA IC package.

なお、上記のＩＣパッケージ用ソケット２０、２０Ｄは、ＬＧＡ型ＩＣパッケージに限らず、ＢＧＡ型ＩＣパッケージ、即ち、下面に電極が並んでいる構成のＩＣパッケージに適用が可能である。 The IC package sockets 20 and 20D are not limited to the LGA type IC package, but can be applied to a BGA type IC package, that is, an IC package having electrodes arranged on the lower surface.

以上、本発明の好ましい実施の形態について詳述したが、本発明はかかる特定の実施の形態に限定されるものではなく、特許請求の範囲内に記載された本発明の要旨の範囲内において、種々の変形・変更が可能である。 The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to such specific embodiments, and within the scope of the present invention described in the claims, Various modifications and changes are possible.

従来の１例のソケットの一部を拡大して示す図である。It is a figure which expands and shows a part of conventional 1 example socket. 従来の別の例のソケットの一部を拡大して示す図である。It is a figure which expands and shows a part of socket of another conventional example. 本発明の実施例１になるＬＧＡ型ＩＣパッケージ用ソケットをＬＧＡ型ＩＣパッケージ、プリント回路基板及びカバー部材と併せて示す斜視図である。It is a perspective view which shows the socket for LGA type | mold IC packages which become Example 1 of this invention with the LGA type | mold IC package, the printed circuit board, and the cover member. 図３のソケットの使用状態を示す図である。It is a figure which shows the use condition of the socket of FIG. 図３中、ソケットがＩＣパッケージとプリント回路基板との間には挟まれている状態を拡大して示す図である。FIG. 4 is an enlarged view showing a state in which the socket is sandwiched between the IC package and the printed circuit board in FIG. 3. ソケット本体の一部を拡大して示す図である。It is a figure which expands and shows a part of socket main body. ソケット本体の素材の一部を拡大して示す図である。It is a figure which expands and shows a part of raw material of a socket main body. 図７中、VIII-VIII線に沿う断面を示す図である。It is a figure which shows the cross section which follows the VIII-VIII line in FIG. コンタクト片の製造工程を示す図である。It is a figure which shows the manufacturing process of a contact piece. コンタクト片を拡大して示す図である。It is a figure which expands and shows a contact piece. 本発明の実施例２になるＬＧＡ型ＩＣパッケージ用ソケットのコンタクト片を示す図である。It is a figure which shows the contact piece of the socket for LGA type | mold IC packages which become Example 2 of this invention. 本発明の実施例３になるＬＧＡ型ＩＣパッケージ用ソケットのコンタクト片を示す図である。It is a figure which shows the contact piece of the socket for LGA type | mold IC packages which become Example 3 of this invention. コンタクト片の製造工程を示す図である。It is a figure which shows the manufacturing process of a contact piece. ソケットがＩＣパッケージとプリント回路基板との間には挟まれている状態を拡大して示す図である。It is a figure which expands and shows the state in which the socket is pinched | interposed between IC package and a printed circuit board. 本発明の実施例４になるＬＧＡ型ＩＣパッケージ用ソケットのコンタクト片を示す図である。It is a figure which shows the contact piece of the socket for LGA type | mold IC packages which become Example 4 of this invention. 本発明の実施例４になるＬＧＡ型ＩＣパッケージ用ソケットのコンタクト片を示す図である。It is a figure which shows the contact piece of the socket for LGA type | mold IC packages which become Example 4 of this invention. ソケット本体の素材の一部を拡大して示す図である。It is a figure which expands and shows a part of raw material of a socket main body. 本発明の実施例５になるＬＧＡ型ＩＣパッケージ用ソケットをＬＧＡ型ＩＣパッケージ及びプリント回路基板と併せて示す斜視図である。It is a perspective view which shows the socket for LGA type | mold IC packages which become Example 5 of this invention together with a LGA type | mold IC package and a printed circuit board. 本発明の実施例６になるＬＧＡ型ＩＣパッケージ用ソケットをＬＧＡ型ＩＣパッケージ及びプリント回路基板と併せて示す斜視図である。It is a perspective view which shows the socket for LGA type IC packages which becomes Example 6 of this invention with the LGA type IC package and the printed circuit board. 図１９のソケットの使用状態を示す図である。It is a figure which shows the use condition of the socket of FIG. コンタクト部材を示す図である。It is a figure which shows a contact member. コンタクト部材の製造を説明するための図である。It is a figure for demonstrating manufacture of a contact member. 図１９のソケットを使用してＬＧＡ型ＩＣパッケージを実装することを説明するための図である。It is a figure for demonstrating mounting an LGA type | mold IC package using the socket of FIG. 帯状部材の変形例を示す図である。It is a figure which shows the modification of a strip | belt-shaped member. 第１の変形例になるコンタクト部材を示す図である。It is a figure which shows the contact member used as the 1st modification. 第２の変形例になるコンタクト部材を示す図である。It is a figure which shows the contact member used as the 2nd modification. 第３の変形例になるコンタクト部材を示す図である。It is a figure which shows the contact member used as the 3rd modification. 第４の変形例になるコンタクト部材を示す図である。It is a figure which shows the contact member used as the 4th modification. 第５の変形例になるコンタクト部材を示す図である。It is a figure which shows the contact member used as the 5th modification. 第６の変形例になるコンタクト部材を示す図である。It is a figure which shows the contact member used as the 6th modification.

Explanation of symbols

２０，２０Ａ、２０Ｄ、２０ＥＬＧＡ型ＩＣパッケージ用ソケット
２１、２１−１、２１−２ソケット本体
２２シート部材
２３，２３Ａ〜２３Ｄコンタクト片
２５枠
３０、３０Ａ、３０Ｂ，３０Ｃプリント回路基板側リード部
３１接点部
４０、４０Ａ、４０Ｂ、４０ＣＩＣパッケージ側リード部
４１接点部
６０ＬＧＡ型ＩＣパッケージ
６１基板
６２ＩＣチップ
６３封止樹脂部
６４コンタクト
７０プリント回路基板
８０カバー部材
９０ねじ部材
９１ナット
１００シート部材
１０１シート本体
１０２，１０３ベース絶縁膜
１０４、１０４Ｃ，１０４Ｄコンタクトパターン
１０４ａ第１の腕部
１０４ｂ第２の腕部
１０４ｃ繋ぎ部
１０５保護カバー絶縁膜
１０５ａ，１０５ｂ窓部
１０７切り込み線
１１０銅めっき膜
１１１ニッケルめっき膜
１１２金めっき膜
１２０，１２１スルーホール
２００ベース板
２０１貫通穴
２２０，２２０Ａ、２２０Ｅ、２２０Ｆ、２２０Ｇ、２２０Ｈ、２２０Ｊコンタクト部材
２２１内周側ターン部
２２２外周側ターン部
２２６，２２７、２２６Ｅ１、２２８Ｅ１、２２７Ｅ２、２２９Ｅ２、２７１，２７２，２７３、２８１，２８２，２８３、３０４、３０５、３１４，３１５、３３５，３３６、３３７，３３８、３４４、３４５接点部
２３０、２３０Ａ，２３０Ｂ、２３０Ｅ、２３０Ｆ、２３０Ｇ１、２３０Ｇ２、２３０Ｈ１、２３０Ｈ２、２３０Ｊ帯状部材
２３１，２３２突起部
２３７、２３８、２３９導体パターン
２４０略円形部
２４１，２４２折り曲げ部
３２０帯状部材組立体
３５１開口窓
３６０突起 20, 20A, 20D, 20E LGA type IC package socket 21, 21-1, 21-2 Socket body 22 Sheet member 23, 23A-23D Contact piece 25 Frame 30, 30A, 30B, 30C Print circuit board side lead part 31 Contact part 40, 40A, 40B, 40C IC package side lead part 41 Contact part 60 LGA type IC package 61 Substrate 62 IC chip 63 Sealing resin part 64 Contact 70 Printed circuit board 80 Cover member 90 Screw member 91 Nut 100 Sheet member 101 Sheet body 102, 103 Base insulating film 104, 104C, 104D Contact pattern 104a First arm part 104b Second arm part 104c Connecting part 105 Protective cover insulating film 105a, 105b Window part 107 Cut line 110 Copper plating film 111 Nicke Plating film 112 Gold plating film 120, 121 Through hole 200 Base plate 201 Through hole 220, 220A, 220E, 220F, 220G, 220H, 220J Contact member 221 Inner peripheral side turn part 222 Outer peripheral side turn part 226, 227, 226E1, 228E1 227E2, 229E2, 271, 272, 273, 281, 282, 283, 304, 305, 314, 315, 335, 336, 337, 338, 344, 345 Contact 230, 230A, 230B, 230E, 230F, 230G1, 230G2, 230H1, 230H2, 230J Strip members 231 and 232 Protrusions 237, 238, and 239 Conductor pattern 240 Substantially circular portions 241 and 242 Bending portions 320 Strip member assembly 351 Opening window 360 Protrusion

Claims

In an IC package socket configured to electrically connect a contact on the lower surface of the IC package and a contact on the printed circuit board, which is used when mounting the IC package on the printed circuit board.
A base plate that is insulative and plate-like and has a large number of through holes corresponding to contacts on the lower surface of the IC package and contacts on the printed circuit board;
It consists of a contact member that is fitted in each through hole of the socket body,
The contact member is formed by spirally forming a band-shaped metal plate member having protrusions at both ends in the width direction of each end in the longitudinal direction, and has an outer turn portion and an inner turn portion, and A contact portion protruding in both directions of the axis of the contact member is provided at the end of the inner turn portion, and a contact portion protruding in both directions of the axis of the contact member is provided at the end of the outer turn portion. When elastically deformed in the direction, the inner turn portion is deformed so that its diameter is expanded and is in contact with the outer turn portion,
In use, two contact portions protruding to one of the axis of the contact member are in contact with the contact of the IC package, and two contact portions protruding to one of the axis are in contact with the contact on the printed circuit board. A socket for an IC package, characterized in that a signal transmission path is formed in contact with the inner turn part and the outer turn part.

In an IC package socket configured to electrically connect a contact on the lower surface of the IC package and a contact on the printed circuit board, which is used when mounting the IC package on the printed circuit board.
A base plate that is insulative and plate-like and has a large number of through holes corresponding to contacts on the lower surface of the IC package and contacts on the printed circuit board;
It consists of a contact member that is fitted in each through hole of the socket body,
The contact member is a combination of a first contact member and a second contact member fitted in the center of the first contact member;
Both the first and second contact members are formed by spirally forming a band-shaped metal plate member, and have an outer turn part and an inner turn part, and the end part of the inner turn part has the above-mentioned A first contact portion projecting in one direction of the axis of the contact member; a second contact portion projecting in the other direction of the axis of the contact member at the end of the outer turn portion; When elastically deformed in the direction, the inner turn portion is deformed so that its diameter is expanded and is in contact with the outer turn portion,
In use, the first contact portion of the first and second contact members is in contact with either the contact of the IC package or the contact on the printed circuit board, and the first and second contacts. The second contact portion of the member is in contact with the other, and the inner turn portion of each of the first and second contact members is in contact with the outer turn portion to form a signal transmission path. IC package socket.

In an IC package socket configured to electrically connect a contact on the lower surface of the IC package and a contact on the printed circuit board, which is used when mounting the IC package on the printed circuit board.
A base plate that is insulative and plate-like and has a large number of through holes corresponding to contacts on the lower surface of the IC package and contacts on the printed circuit board;
It consists of a contact member that is fitted in each through hole of the socket body,
The contact member is formed by spirally forming a band-shaped metal plate member assembly in which two band-shaped metal plate members having protrusions at the ends are overlapped and fixed in a state of being shifted in the longitudinal direction. A first contact portion projecting in one direction of an axis of the contact member at an end portion of the inner turn portion; and an end portion of the outer turn portion. A second contact portion projecting in the other direction of the axis of the contact member, and when the inner turn portion is elastically deformed in a contracting direction, the inner turn portion is deformed so that its diameter is enlarged, and the outer turn portion is A configuration in contact with
In use, the first contact portion of the contact member contacts one of the contact of the IC package and the contact on the printed circuit board, the second contact portion contacts the other, A socket for an IC package, characterized in that a signal transmission path is formed in contact with an inner turn portion and the outer turn portion.

In the socket for IC packages according to any one of claims 1 to 3 ,
The IC package socket according to claim 1, wherein the contact member has a conductor pattern on at least one of an outer peripheral surface of the inner turn portion and an inner peripheral surface of the outer turn portion.

In the socket for IC packages according to any one of claims 1 to 4 ,
The contact member is configured to have an opening window in the outer turn part,
The base plate has a protrusion on the inner periphery of the through hole,
The IC package socket, wherein the contact member is configured to fit into the through hole in a state where the opening window is engaged with the protrusion.

Using the IC package socket according to any one of claims 1 to 5 , the terminal on the lower surface of the IC package and the terminal on the printed circuit board are electrically connected through the contact member. An IC package mounting structure, wherein the IC package is mounted on the printed circuit board.