CN204760408U - RENA wet etching equipment - Google Patents
RENA wet etching equipment Download PDFInfo
- Publication number
- CN204760408U CN204760408U CN201520419173.7U CN201520419173U CN204760408U CN 204760408 U CN204760408 U CN 204760408U CN 201520419173 U CN201520419173 U CN 201520419173U CN 204760408 U CN204760408 U CN 204760408U
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- Prior art keywords
- rena
- wet
- cover plate
- etching equipment
- heater
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The application discloses RENA wet etching equipment is including setting up in the heating device on RENA wet etching apron upper portion. The application provides a RENA wet etching equipment can heat the apron, and can improve the temperature of the steam between liquid level and the apron to reduce the difference in temperature between steam and the apron, consequently can prevent steam in apron department's condensation and the dropping liquid phenomenon appears, thereby reduce the silicon chip and do over again, promotion sculpture yield.
Description
Technical field
The utility model relates to technical field of solar cell manufacturing, more particularly, relates to a kind of RENA wet-method etching equipment.
Background technology
Crystal silicon solar energy battery conventional production process generally comprises following steps: cleaning, making herbs into wool, diffusion, etch, remove PSG, PECVD, silk screen printing and sintering.Wherein etching is one of them important step, its objective is the PN junction removing silicon chip back side and silicon chip surrounding, front and back is insulated.At present, the equipment of " RENAin-line " formula structure is a kind of conventional wet-method etching equipment, its principle is: in HF/HNO3 system, utilizes the effect of surface tension and hair suction to remove the PN junction at edge and the back side, and can not affect the process structure of solar cell.This equipment comprises: etching groove, Water spray groove, alkali groove, Water spray groove, remove PSG groove, Water spray groove and blow-dry device.
But, RENA wet-method etching equipment is utilized to carry out in the process of producing at present, there are the following problems: the phenomenon of condensation vapor often appears in its etching slot cover plate, the drop of condensation can be dropped on the silicon chip that circulating, there is corrosion reaction in silicon chip, even PN junction is destroyed to cause the bad order of silicon chip, and silicon chip is done over again, and this just causes the waste of cost.
Utility model content
For solving the problems of the technologies described above, the utility model provides a kind of RENA wet-method etching equipment, can prevent cover plate condensation dropping liquid, thus minimizing silicon chip is done over again, and promotes etching yield.
A kind of RENA wet-method etching equipment that the utility model provides, comprises the heater being arranged at RENA wet etching cover plate top.
Preferably, in above-mentioned RENA wet-method etching equipment, described heater is super bath lamp.
Preferably, in above-mentioned RENA wet-method etching equipment, described heater to be power bracket the be heater of 1 kilowatt to 20 kilowatts, for being heated to the temperature range of 20 DEG C to 80 DEG C by described RENA wet etching cover plate.
Preferably, in above-mentioned RENA wet-method etching equipment, the scope of the distance between described heater and described RENA wet etching cover plate is 10mm to 50mm.
Preferably, in above-mentioned RENA wet-method etching equipment, the quantity of described heater is four, and four described heater equidistant settings above described wet etching cover plate.
Preferably, in above-mentioned RENA wet-method etching equipment, also comprise the multiple attached heater being arranged at described wet etching cover plate sidepiece.
Preferably, in above-mentioned RENA wet-method etching equipment, the quantity of described attached heater is four, and is arranged at four side edge of described RENA wet-method etching equipment cover plate respectively.
Preferably, in above-mentioned RENA wet-method etching equipment, described heater is arranged in transparent anticorrosion cover.
As can be seen from technique scheme, a kind of RENA wet-method etching equipment provided by the utility model, cover plate can be heated, and the temperature of the steam between liquid level and cover plate can be improved, to reduce the temperature difference between steam and cover plate, therefore, it is possible to prevent steam from occurring dropping liquid phenomenon in the condensation of cover plate place, thus minimizing silicon chip is done over again, and promotes etching yield.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiment of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to the accompanying drawing provided.
The schematic diagram of a kind of RENA wet-method etching equipment that Fig. 1 provides for the embodiment of the present application.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
A kind of RENA wet-method etching equipment that the embodiment of the present application provides as shown in Figure 1, the schematic diagram of a kind of RENA wet-method etching equipment that Fig. 1 provides for the embodiment of the present application.This equipment comprises the heater 2 being arranged at RENA wet etching cover plate 1 top.
The steam that RENA wet etching cover plate condenses is mainly derived from the Water spray groove after etching groove, water can form a large amount of steam in spray process, especially in the summer that temperature is higher, the temperature of water is higher, often be higher than the temperature of workshop, the vapor partial pressure of water is also larger, a large amount of water vapours can enter into etching groove, and the temperature of RENA wet etching cover plate is temperature controlled by workshop, can lower than the temperature of the steam entered in cell body, just condense when steam runs into the lower RENA wet etching cover plate of temperature.
A kind of RENA wet-method etching equipment that the embodiment of the present application provides, cover plate 1 can be heated, and the temperature of the steam between liquid level and cover plate 1 can be improved, to reduce the temperature difference between steam and cover plate 1, therefore, it is possible to prevent steam from occurring dropping liquid phenomenon in cover plate 1 place's condensation, thus minimizing silicon chip is done over again, promote etching yield.
In above-mentioned RENA wet-method etching equipment, described heater can be preferably super bath lamp.This super bath lamp is comparatively common, is easy to obtain, and the scope that its heat distributes can cover the surface of cover plate substantially, thus makes heating effect better.
In above-mentioned RENA wet-method etching equipment, described heater to be power bracket the be heater of 1 kilowatt to 20 kilowatts, for being heated to the temperature range of 20 DEG C to 80 DEG C by described RENA wet etching cover plate.In this power bracket, effectively can either reduce the temperature difference between cover plate and steam, be unlikely to again to cause adverse effect to the environment of etching.
In above-mentioned RENA wet-method etching equipment, the scope of the distance between described heater and described RENA wet etching cover plate is 10mm to 50mm.It is enough good that this preferred distance range can ensure the heating effect of cover plate, nor cause adverse effect as etching environment.
In above-mentioned RENA wet-method etching equipment, the quantity of described heater can be preferably four, and four described heater equidistant settings above described wet etching cover plate.Can make the heating of cover plate more even like this, make the preventing effectiveness of water droplet better.
In above-mentioned RENA wet-method etching equipment, also comprise the multiple attached heater being arranged at described wet etching cover plate sidepiece.This preferred version can make heat enter from the side of cover plate, can strengthen heating effect, and the omnibearing steam that prevents is in the condensation of cover plate place.
Further, the quantity of described attached heater is four, and is arranged at four side edge of described RENA wet-method etching equipment cover plate respectively.
In above-mentioned RENA wet-method etching equipment, described heater is arranged in transparent anticorrosion cover.Such etching liquid used that can prevent spills and causes corrosion to heater, thus improves the useful life of heater.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the utility model.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein when not departing from spirit or scope of the present utility model, can realize in other embodiments.Therefore, the utility model can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (7)
1. a RENA wet-method etching equipment, is characterized in that, comprises the heater being arranged at RENA wet etching cover plate top, and described heater is super bath lamp.
2. RENA wet-method etching equipment according to claim 1, is characterized in that, described heater to be power bracket the be heater of 1 kilowatt to 20 kilowatts, for being heated to the temperature range of 20 DEG C to 80 DEG C by described RENA wet etching cover plate.
3. RENA wet-method etching equipment according to claim 1, is characterized in that, the scope of the distance between described heater and described RENA wet etching cover plate is 10mm to 50mm.
4. RENA wet-method etching equipment according to claim 1, is characterized in that, the quantity of described heater is four, and four described heater equidistant settings above described wet etching cover plate.
5. the RENA wet-method etching equipment according to any one of claim 1-4, is characterized in that, also comprises the multiple attached heater being arranged at described wet etching cover plate sidepiece.
6. RENA wet-method etching equipment according to claim 5, is characterized in that, the quantity of described attached heater is four, and is arranged at four side edge of described RENA wet-method etching equipment cover plate respectively.
7. the RENA wet-method etching equipment according to any one of claim 1-4, is characterized in that, described heater is arranged in transparent anticorrosion cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520419173.7U CN204760408U (en) | 2015-06-17 | 2015-06-17 | RENA wet etching equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520419173.7U CN204760408U (en) | 2015-06-17 | 2015-06-17 | RENA wet etching equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204760408U true CN204760408U (en) | 2015-11-11 |
Family
ID=54475088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520419173.7U Active CN204760408U (en) | 2015-06-17 | 2015-06-17 | RENA wet etching equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204760408U (en) |
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2015
- 2015-06-17 CN CN201520419173.7U patent/CN204760408U/en active Active
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|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |