CN204651347U - Multivoltage selects the LED ceramics bracket driven - Google Patents
Multivoltage selects the LED ceramics bracket driven Download PDFInfo
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- CN204651347U CN204651347U CN201520293851.XU CN201520293851U CN204651347U CN 204651347 U CN204651347 U CN 204651347U CN 201520293851 U CN201520293851 U CN 201520293851U CN 204651347 U CN204651347 U CN 204651347U
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- leg
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- bond plate
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Abstract
The utility model discloses the LED ceramics bracket that a kind of multivoltage is selected to drive, include ceramic body, this ceramic body is provided with the first die bond plate, the second die bond plate, the 3rd die bond plate, the 4th die bond plate, the first pad, the second pad, the first leg, the second leg, the 3rd leg, the 4th leg and the 5th leg; This first leg, the second leg, the 3rd leg, the 4th leg and the 5th leg are all positioned at the bottom of ceramic body.By this, by being provided with multiple leg, and coordinate leg to connect with corresponding die bond plate or corresponding pad conducting, can select corresponding leg place in circuit as required during use, achieve and 6V or 12V voltage can be adopted to carry out the object driven, user can select driving voltage as required, thus improve the flexibility of product use, bring convenience to the use of user, also improve competitiveness of product in market degree simultaneously, for manufacturing enterprise brings more benefit.
Description
Technical field
The utility model relates to LED ceramics bracket art, refers in particular to the LED ceramics bracket that a kind of multivoltage is selected to drive.
Background technology
LED support is a kind of base electronic component, is one of critical elements of LED encapsulation, is mainly LED chip and phase interconnection line provides machinery carrying, supports, air-tightness protection and promote the functions such as LED device heat radiation.In recent years, along with perfect, the luminous flux of semi-conducting material and packaging technology and the raising of light extraction efficiency, power-type LED is applied in special lighting fields such as urban look, traffic sign, LCD backlight, automotive lighting, billboards, and strides forward to general illumination market.But, along with improving constantly of LED chip input power, the large caloric value that large dissipation power is brought and require that high light extraction efficiency proposes renewal, higher requirement to LED support.To high-capacity LED product, its chip set requires the thermal coefficient of expansion (CTE), planarization and the higher intensity that have high electrical insulating properties, high stability, high-termal conductivity and mate with chip.
Ceramic material has the features such as high conductive coefficient, the thermal coefficient of expansion close with LED chip, high heat-resisting and anti-ultraviolet radiation, effectively can solve the crooked and yellow problem of heat, be applied to LED support and have competitiveness.But, current LED ceramics bracket can only drive by univoltage, namely it only can adopt 6V or 12V voltage to drive, driving voltage can not be selected according to the demand of user, product is caused to use flexibility lower, make troubles to the use of user, also reduce competitiveness of product in market degree simultaneously, it is unfavorable to cause manufacturing enterprise.
Utility model content
In view of this, the utility model is for the disappearance of prior art existence, and its main purpose is to provide the LED ceramics bracket that a kind of multivoltage is selected to drive, and it effectively can solve existing LED ceramics bracket and univoltage can only be adopted to carry out the problem driven.
For achieving the above object, the utility model adopts following technical scheme:
A kind of multivoltage selects the LED ceramics bracket driven, include ceramic body, this ceramic body is provided with the first die bond plate, the second die bond plate, the 3rd die bond plate, the 4th die bond plate, the first pad, the second pad, the first leg, the second leg, the 3rd leg, the 4th leg and the 5th leg; This first leg, the second leg, the 3rd leg, the 4th leg and the 5th leg are all positioned at the bottom of ceramic body, and this first die bond plate is positioned at the top of the first leg and the 3rd leg, and the first die bond plate is connected with the first leg conducting; This second die bond plate is positioned at the top of the 3rd leg, and the second die bond plate is connected with the 3rd leg conducting; 3rd die bond plate is positioned at the top of the second leg and the 3rd leg, and the 3rd die bond plate is connected with the second leg conducting; 4th die bond plate is positioned at the top of the 3rd leg, and the 4th die bond plate is connected with the 3rd leg conducting; This first pad is positioned at the top of the 4th leg, and the first pad is connected with the 4th leg conducting; This second pad is positioned at the top of the 5th leg, and the second pad is connected with the 5th leg conducting.
As a kind of preferred version, described first die bond plate connects the first leg by the first via conducting, 3rd die bond plate connects the second leg by the second via conducting, this first pad connects the 4th leg by the 3rd via conducting, and this second pad connects the 5th leg by the 4th via conducting.
As a kind of preferred version, described first die bond plate is provided with the first wafer, the second die bond plate is provided with the second wafer, the 3rd die bond plate is provided with wafer, the 4th die bond plate is provided with the 4th wafer.
As a kind of preferred version, described first wafer, second wafer, wafer and the 4th wafer are the wafer of vertical electrode structure, first wafer is connected with the first die bond plate conducting, and the first wafer connects the second die bond plate by gold thread conducting, this second wafer is connected with the second die bond plate conducting, and the second wafer is connected with the first pad conducting by gold thread, this wafer is connected with the 3rd die bond plate conducting, and wafer is connected with the 4th die bond plate conducting by gold thread, 4th wafer is connected with the 4th die bond plate conducting, and the 4th wafer is connected with the second pad conducting by gold thread.
As a kind of preferred version, described first wafer, the second wafer, wafer and the 4th wafer are the wafer of horizontal electrode structure, this first wafer and the second wafer are connected in series by gold thread, this first wafer is connected with the first die bond plate conducting by gold thread, second wafer is connected with the first pad conducting by gold thread, this wafer and the 4th wafer are connected in series by gold thread, wafer is connected with the 3rd die bond plate conducting by gold thread, and the 4th wafer is connected with the second pad conducting by gold thread.
As a kind of preferred version, described first leg and the second leg lay respectively at the both sides, front of the 3rd leg, and the 4th leg and the 5th leg lay respectively at the both sides, rear of the 3rd leg.
The utility model compared with prior art has obvious advantage and beneficial effect, specifically, as shown from the above technical solution:
By being provided with multiple leg, and coordinate leg to connect with corresponding die bond plate or corresponding pad conducting, corresponding leg place in circuit can be selected as required during use, achieve and 6V or 12V voltage can be adopted to carry out the object driven, user can select driving voltage as required, thus improves the flexibility of product use, brings convenience to the use of user, also improve competitiveness of product in market degree, for manufacturing enterprise brings more benefit simultaneously.
For more clearly setting forth architectural feature of the present utility model and effect, below in conjunction with accompanying drawing and specific embodiment, the utility model is described in detail.
Accompanying drawing explanation
Fig. 1 is the vertical view of the preferred embodiment of the utility model;
Fig. 2 is the upward view of the preferred embodiment of the utility model;
Fig. 3 is the vertical view of the first wafer package of preferred embodiment of the utility model;
Fig. 4 is the vertical view of preferred embodiment the second wafer package of the utility model.
Accompanying drawing identifier declaration:
10, ceramic body 101, first via
102, the second via 103, the 3rd via
104, the 4th via 21, first die bond plate
22, the second die bond plate 23, the 3rd die bond plate
24, the 4th die bond plate 25, first pad
26, the second pad 31, first leg
32, the second leg 33, the 3rd leg
34, the 4th leg 35, the 5th leg
41, the first wafer 42, second wafer
43, wafer 44, the 4th wafer.
Embodiment
Please refer to shown in Fig. 1 to Fig. 4, that show the concrete structure of the preferred embodiment of the utility model, include ceramic body 10.
This ceramic body 10 is provided with the first die bond plate 21, second die bond plate 22, the 3rd die bond plate 23, the 4th die bond plate 24, first pad 25, second pad 26, first leg 31, second leg 32, the 3rd leg 33, the 4th leg 34 and the 5th leg 35; This first leg 31, second leg 32, the 3rd leg 33, the 4th leg 34 and the 5th leg 35 are all positioned at the bottom of ceramic body 10, this first leg 31 and the second leg 32 lay respectively at the both sides, front of the 3rd leg 33, and the 4th leg 34 and the 5th leg 35 lay respectively at the both sides, rear of the 3rd leg 33; This first die bond plate 21 is positioned at the top of the first leg 31 and the 3rd leg 33, and the first die bond plate 21 is connected with the first leg 31 conducting, and in the present embodiment, the first die bond plate 21 connects the first leg 31 by the first via 101 conducting; This second die bond plate 22 is positioned at the top of the 3rd leg 33, and the second die bond plate 22 is connected with the 3rd leg 33 conducting; 3rd die bond plate 23 is positioned at the top of the second leg 32 and the 3rd leg 33, and the 3rd die bond plate 23 is connected with the second leg 32 conducting, and in the present embodiment, the 3rd die bond plate 23 connects the second leg 32 by the second via 102 conducting; 4th die bond plate 24 is positioned at the top of the 3rd leg 33, and the 4th die bond plate 24 is connected with the 3rd leg 33 conducting; This first pad 25 is positioned at the top of the 4th leg 34, and the first pad 25 is connected with the 4th leg 34 conducting, and in the present embodiment, this first pad 25 connects the 4th leg 34 by the 3rd via 103 conducting; This second pad 26 is positioned at the top of the 5th leg 35, and the second pad 26 is connected with the 5th leg 35 conducting, and in the present embodiment, this second pad 26 connects the 5th leg 35 by the 4th via 104 conducting.
And, this first die bond plate 21 is provided with the first wafer 41, second die bond plate 22 is provided with on the second wafer the 42, three die bond plate 23 and is provided with wafer 43, the 4th die bond plate 24 is provided with the 4th wafer 44.
As shown in Figure 3, this first wafer 41, second wafer 42, wafer 43 and the 4th wafer 44 are the wafer of vertical electrode structure, first wafer 41 is connected with the first die bond plate 21 conducting, and the first wafer 41 connects the second die bond plate 22 by gold thread conducting, this second wafer 42 is connected with the second die bond plate 22 conducting, and the second wafer 42 is connected with the first pad 25 conducting by gold thread, this wafer 43 is connected with the 3rd die bond plate 23 conducting, and wafer 43 is connected with the 4th die bond plate 24 conducting by gold thread, 4th wafer 44 is connected with the 4th die bond plate 24 conducting, and the 4th wafer 44 is connected with the second pad 26 conducting by gold thread.During practical application, the first leg 31 and the second leg 32 and the 3rd leg 33 and the 4th leg 34 is connected when separately each, connecting of wafer first wafer 41 and the second wafer 42 and wafer 43 and the 4th wafer 44 can be realized, namely achieve two and the mode of two strings, this kind of mode can by 6V voltage driven.And when the second leg 32, the 4th leg 34 and the 5th leg 35 weld together, the first wafer 41, second wafer 42, wafer 43 and the 4th wafer 44 can be realized connect, this kind of mode can access power supply, by 12V voltage driven at the first leg 31 and the 5th leg 35.
As shown in Figure 4, this the first wafer 41, second wafer 42, wafer 43 and the 4th wafer 44 are the wafer of horizontal electrode structure, this first wafer 41 and the second wafer 42 are connected in series by gold thread, this first wafer 41 is connected with the first die bond plate 41 conducting by gold thread, second wafer 42 is connected with the first pad 25 conducting by gold thread, this wafer 43 and the 4th wafer 44 are connected in series by gold thread, wafer 43 is connected with the 3rd die bond plate 23 conducting by gold thread, and the 4th wafer 44 is connected with the second pad 26 conducting by gold thread.During practical application, the first leg 31 and the second leg 32 and the 3rd leg 33 and the 4th leg 34 is connected when separately each, connecting of wafer first wafer 41 and the second wafer 42 and wafer 43 and the 4th wafer 44 can be realized, namely achieve two and the mode of two strings, this kind of mode can by 6V voltage driven.And when the second leg 32, the 4th leg 34 and the 5th leg 35 weld together, the first wafer 41, second wafer 42, wafer 43 and the 4th wafer 44 can be realized connect, this kind of mode can access power supply, by 12V voltage driven at the first leg 31 and the 5th leg 35.
Design focal point of the present utility model is: by being provided with multiple leg, and coordinate leg to connect with corresponding die bond plate or corresponding pad conducting, corresponding leg place in circuit can be selected as required during use, achieve and 6V or 12V voltage can be adopted to carry out the object driven, user can select driving voltage as required, thus improves the flexibility of product use, brings convenience to the use of user, also improve competitiveness of product in market degree, for manufacturing enterprise brings more benefit simultaneously.
The above, it is only preferred embodiment of the present utility model, not technical scope of the present utility model is imposed any restrictions, therefore every above embodiment is done according to technical spirit of the present utility model any trickle amendment, equivalent variations and modification, all still belong in the scope of technical solutions of the utility model.
Claims (6)
1. the LED ceramics bracket of a multivoltage selection driving, it is characterized in that: include ceramic body, this ceramic body is provided with the first die bond plate, the second die bond plate, the 3rd die bond plate, the 4th die bond plate, the first pad, the second pad, the first leg, the second leg, the 3rd leg, the 4th leg and the 5th leg; This first leg, the second leg, the 3rd leg, the 4th leg and the 5th leg are all positioned at the bottom of ceramic body, and this first die bond plate is positioned at the top of the first leg and the 3rd leg, and the first die bond plate is connected with the first leg conducting; This second die bond plate is positioned at the top of the 3rd leg, and the second die bond plate is connected with the 3rd leg conducting; 3rd die bond plate is positioned at the top of the second leg and the 3rd leg, and the 3rd die bond plate is connected with the second leg conducting; 4th die bond plate is positioned at the top of the 3rd leg, and the 4th die bond plate is connected with the 3rd leg conducting; This first pad is positioned at the top of the 4th leg, and the first pad is connected with the 4th leg conducting; This second pad is positioned at the top of the 5th leg, and the second pad is connected with the 5th leg conducting.
2. multivoltage according to claim 1 selects the LED ceramics bracket of driving, it is characterized in that: described first die bond plate connects the first leg by the first via conducting, 3rd die bond plate connects the second leg by the second via conducting, this first pad connects the 4th leg by the 3rd via conducting, and this second pad connects the 5th leg by the 4th via conducting.
3. multivoltage according to claim 1 selects the LED ceramics bracket of driving, it is characterized in that: described first die bond plate is provided with the first wafer, second die bond plate is provided with the second wafer, the 3rd die bond plate is provided with wafer, the 4th die bond plate is provided with the 4th wafer.
4. multivoltage according to claim 3 selects the LED ceramics bracket of driving, it is characterized in that: described first wafer, second wafer, wafer and the 4th wafer are the wafer of vertical electrode structure, first wafer is connected with the first die bond plate conducting, and the first wafer connects the second die bond plate by gold thread conducting, this second wafer is connected with the second die bond plate conducting, and the second wafer is connected with the first pad conducting by gold thread, this wafer is connected with the 3rd die bond plate conducting, and wafer is connected with the 4th die bond plate conducting by gold thread, 4th wafer is connected with the 4th die bond plate conducting, and the 4th wafer is connected with the second pad conducting by gold thread.
5. multivoltage according to claim 3 selects the LED ceramics bracket of driving, it is characterized in that: described first wafer, second wafer, wafer and the 4th wafer are the wafer of horizontal electrode structure, this first wafer and the second wafer are connected in series by gold thread, this first wafer is connected with the first die bond plate conducting by gold thread, second wafer is connected with the first pad conducting by gold thread, this wafer and the 4th wafer are connected in series by gold thread, wafer is connected with the 3rd die bond plate conducting by gold thread, 4th wafer is connected with the second pad conducting by gold thread.
6. multivoltage according to claim 1 selects the LED ceramics bracket of driving, and it is characterized in that: described first leg and the second leg lay respectively at the both sides, front of the 3rd leg, the 4th leg and the 5th leg lay respectively at the both sides, rear of the 3rd leg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520293851.XU CN204651347U (en) | 2015-05-08 | 2015-05-08 | Multivoltage selects the LED ceramics bracket driven |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520293851.XU CN204651347U (en) | 2015-05-08 | 2015-05-08 | Multivoltage selects the LED ceramics bracket driven |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204651347U true CN204651347U (en) | 2015-09-16 |
Family
ID=54104061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520293851.XU Expired - Fee Related CN204651347U (en) | 2015-05-08 | 2015-05-08 | Multivoltage selects the LED ceramics bracket driven |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204651347U (en) |
-
2015
- 2015-05-08 CN CN201520293851.XU patent/CN204651347U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150916 Termination date: 20190508 |