CN204634170U - 一种印刷电路板沉镍银处理装置 - Google Patents
一种印刷电路板沉镍银处理装置 Download PDFInfo
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113179593A (zh) * | 2021-03-26 | 2021-07-27 | 赣州金顺科技有限公司 | 一种电路板沉铜浸酸的预浸支撑桥架及其实施工艺 |
CN113766760A (zh) * | 2021-09-29 | 2021-12-07 | 深圳市虹喜科技发展有限公司 | 印刷电路板化学镀银方法 |
CN114635124A (zh) * | 2022-03-09 | 2022-06-17 | 中国电子科技集团公司第十四研究所 | 一种铝合金小口径深腔内表面可焊性镀层的制作方法 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113179593A (zh) * | 2021-03-26 | 2021-07-27 | 赣州金顺科技有限公司 | 一种电路板沉铜浸酸的预浸支撑桥架及其实施工艺 |
CN113766760A (zh) * | 2021-09-29 | 2021-12-07 | 深圳市虹喜科技发展有限公司 | 印刷电路板化学镀银方法 |
CN114635124A (zh) * | 2022-03-09 | 2022-06-17 | 中国电子科技集团公司第十四研究所 | 一种铝合金小口径深腔内表面可焊性镀层的制作方法 |
CN114635124B (zh) * | 2022-03-09 | 2024-03-12 | 中国电子科技集团公司第十四研究所 | 一种铝合金小口径深腔内表面可焊性镀层的制作方法 |
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C14 | Grant of patent or utility model | ||
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TR01 | Transfer of patent right |
Effective date of registration: 20151203 Address after: 516081 Guangdong city of Huizhou province Dayawan economic and Technological Development Zone Xiangshui River Industrial Zone Patentee after: Jianye Technology Electronics (Huizhou) Co., Ltd. Address before: 516081 Guangdong city of Huizhou Province Petrochemical Road West Xiangshuihe Industrial Park of Dayawan economic and Technological Development Zone No. 28 Patentee before: Jianye Technology Electronics (Huizhou) Co., Ltd. Patentee before: Build industry (Huizhou) circuit version Co., Ltd |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150909 Termination date: 20210211 |