CN204614781U - Module type film top LED encapsulation structure - Google Patents
Module type film top LED encapsulation structure Download PDFInfo
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- CN204614781U CN204614781U CN201520256478.0U CN201520256478U CN204614781U CN 204614781 U CN204614781 U CN 204614781U CN 201520256478 U CN201520256478 U CN 201520256478U CN 204614781 U CN204614781 U CN 204614781U
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- led chip
- colloid
- encapsulation structure
- led
- film top
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Abstract
The utility model belongs to LED technical field, aim to provide the module type film top LED encapsulation structure that a kind of LED encapsulation structure within 30W uses, comprise substrate, by the LED chip assembly of at least one LED chip array arrangement and the framework that is fixed on the upper surface of substrate.The utility model, adopt module type packaged type, by the spacing between LED chip adjacent on silver coating is arranged within the scope of 0.80 ~ 1.20mm, the LED chip in LED encapsulation structure unit are is made to be distributed in a rational spacing range, guarantee in use procedure after packaging, the junction temperature of light source controls in rational scope; By fluorescent glue by LED chip component package in slotted eye, by film top silica gel, LED chip assembly is thoroughly encapsulated in vallecular cavity again, significantly improve out the deficiencies such as dazzle in photoreduction process, hot spot and uneven color, assembling rapid and convenient, and effectively save production cost.
Description
Technical field
The utility model belongs to LED technical field, relates to a kind of encapsulating structure of LED light source, particularly relates to a kind of module type film top LED encapsulation structure.
Background technology
In the encapsulating structure of LED, light-focusing type light source is tired out for film top, generally use powerful discrete LED light source component at present, and usually, adopting the indoor light-focusing type light fixture of this kind of LED mode there is the deficiencies such as dazzle, hot spot and uneven color when bright dipping in it, and the assembly technology of its whole lamp is also more numerous and diverse, the production cost of whole light fixture can be caused to a certain extent to remain high.
Utility model content
The purpose of this utility model is to provide a kind of module type film top LED encapsulation structure, there is the deficiencies such as dazzle, hot spot and uneven color during in order to solve existing high-power discrete LED light source component bright dipping, and the assembly technology of whole light fixture is more loaded down with trivial details, cause the technical problem that its production cost is high to a certain extent.
For solving the problems of the technologies described above, the technical solution adopted in the utility model is: provide a kind of module type film top LED encapsulation structure, and this module type film top LED encapsulation structure comprises substrate, the framework be fixed on the upper surface of described substrate, be fixed at positive terminal port on described substrate and negative terminal port;
Also comprise by the LED chip assembly of at least one LED chip array arrangement, described LED chip assembly is contained in the vallecular cavity of described framework, and be fixed in described vallecular cavity by the first colloid, the outside of described first colloid is packaged with the second colloid, and described second colloid is fixed in described vallecular cavity;
By described substrate, one end of described LED chip assembly is electrically connected on described positive terminal port, and the other end is electrically connected on described negative Wiring port; Spacing between adjacent described LED chip is 0.80 ~ 1.2mm.
Further, the slotted eye that described vallecular cavity comprises the first cavity and communicates with described first cavity, described slotted eye is enclosed by the madial wall of the fixed part of described upper surface and described framework and forms, described first cavity is enclosed by the madial wall of the upper end of described framework and forms, and described fixed part is also extended downwards to the inside by described upper end; The groove bottom of described slotted eye is provided with silver coating; Each described LED chip is located on described silver coating by described first colloid, and the bottom of described second colloid is connected to described first colloid, and top protrudes from outside described first cavity.
Further, described first cavity is cylindrical shape, and described groove bottom is rectangle plane.
Further, described first colloid is fluorescent glue, and described second colloid is film top silica gel.
Further, described framework adopts resistant to elevated temperatures PPA injection molding adhesion on described substrate.
Further, described framework offers first to dodge hole and second and dodge hole, described positive terminal port projection and be coated on described first and dodge hole to be fixed on described substrate, described negative terminal port projection and be coated on described second and dodge hole to be fixed on described substrate.
Further, each described LED chip uniform array arrangement, is often arranged between adjacent described LED chip and is connected by wired in series, and be electrically connected on described positive terminal port and described negative terminal port by described substrate.
Compared with prior art, the beneficial effect of the module type film top LED encapsulation structure that the utility model provides is: for the LED encapsulation structure within 30W, adopt module type packaged type, by the spacing between LED chip adjacent on silver coating is arranged within the scope of 0.80 ~ 1.20mm, the LED chip in LED encapsulation structure unit are is made to be distributed in a rational spacing range, guarantee that use procedure after packaging looks for that, the junction temperature of light source controls in rational scope.Simultaneously, compare now widely used high-power discrete LED light source component, this module type film top LED encapsulation structure by the first colloid (as fluorescent glue) by LED chip component package in slotted eye, by film top silica gel, LED chip assembly is thoroughly encapsulated in vallecular cavity again, significantly improve out the bad phenomenon such as dazzle in photoreduction process, hot spot and uneven color, assembling rapid and convenient, and effectively saved production cost.
Accompanying drawing explanation
Fig. 1 is the perspective view of module type film top LED encapsulation structure in the utility model embodiment;
Fig. 2 is the cutaway view at the A-A place of module type film top LED encapsulation structure in figure;
Fig. 3 is the partial enlarged drawing at the B place of module type film top LED encapsulation structure in Fig. 2;
Fig. 4 is the front view assembled between the substrate of module type film top LED encapsulation structure in the utility model embodiment and framework.
Label in accompanying drawing is as follows:
1 substrate, 2 frameworks, 21 vallecular cavities, 211 first cavitys, 212 slotted eyes, 22 fixed parts, 23 upper ends, 24 first are dodged hole, 25 second and are dodged hole;
3 positive terminal ports, 4 negative terminal ports, 5LED chip assembly, 51LED chip, 6 first colloids, 7 second colloids, 8 silver coatings, 9 wires.
Embodiment
In order to make technical problem to be solved of the present utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Below in conjunction with concrete accompanying drawing, realization of the present utility model is described in detail.
It should be noted that, when parts are called as " being fixed on " or " being arranged at " another parts, it can directly on another parts or may there are parts placed in the middle simultaneously.When parts are known as " being connected to " another parts, it can be directly connected to another parts or may there are parts placed in the middle simultaneously.
Also it should be noted that, the corresponding same or analogous parts of same or analogous label in the accompanying drawing of the utility model embodiment, in description of the present utility model, it will be appreciated that, if have term " on ", D score, " left side ", orientation or the position relationship of the instruction such as " right side " are based on orientation shown in the drawings or position relationship, only the utility model and simplified characterization for convenience of description, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore, the term of position relationship is described only for exemplary illustration in accompanying drawing, the restriction to this patent can not be interpreted as, for the ordinary skill in the art, the concrete meaning of above-mentioned term can be understood as the case may be.
As shown in Figures 1 to 4, be a kind of module type film top LED encapsulation structure that the utility model one preferred embodiment provides.
As shown in Figures 1 to 4, this module type film top LED encapsulation structure, LED encapsulation structure mainly for below 30W uses, comprise substrate 1, framework 2, be fixed at the positive terminal port 3 on substrate 1 and negative terminal port 4, also comprise LED chip assembly 5, wherein, this framework 2 is fixed on the upper surface of substrate 1, main in order to improve the emissivity of LED encapsulation structure, and for ease of wiring, and guarantee that there is Low ESR, high conduction ability, in the present embodiment, positive terminal port 3 and negative terminal port 4 all adopt the conductor material of high-quality to make, and be located at the two ends, back and forth or left and right of substrate 1 respectively.
As shown in Figures 1 to 4, in photoreduction process to occur dazzle for ease of improving, occurring the bad phenomenon such as hot spot or uneven color, LED chip assembly 5 is contained in the vallecular cavity 21 of framework 2, and be fixed in vallecular cavity 21 by the first colloid 6, for ease of encapsulating this LED chip assembly 5 better, also be packaged with the second colloid 7 in the outside of the first colloid 6, obviously, this second colloid 7 is fixed in vallecular cavity 21.
Connect for ease of forming complete circuit, by substrate 1, one end of LED chip assembly 5 is electrically connected on positive terminal port 3, and the other end is electrically connected on negative terminal port 4.In addition, it should be noted that, as shown in Figure 1, LED chip assembly 5 is formed by least one LED chip 51 array arrangement, wherein, for guaranteeing in the use procedure of light fixture, between adjacent LED chip 51, there is enough spacing, so that can fully heat conduction, and then ensure that LED junction temperature controls in rational scope, LED prodigiosin is worked under normal serviceability temperature, and the spacing between adjacent LED chip 51 is 0.80 ~ 1.2mm.
Further, in the preferred embodiment that the utility model provides, as shown in Figures 2 to 4, going out in photoreduction process dazzle occurs for effectively improving LED lamp, there is the bad phenomenon such as hot spot or uneven color, the slotted eye 212 that vallecular cavity 21 comprises the first cavity 211 and communicates with the first cavity 211, as shown in Figure 2, framework 2 has fixed part 22 and upper end 23, wherein, fixed part 22 is also extended downwards to the inside by upper end 23, also be, in hierarchic structure between fixed part 22 and upper end 23, and the openend of the first cavity 211 is greater than the openend of slotted eye 212.Again as shown in Figure 2, this slotted eye 212 is enclosed by the madial wall of the fixed part 22 of upper surface and framework 2 and forms, and the first cavity 211 is enclosed by the madial wall of the upper end 23 of framework 2 and forms.
In addition, for ease of LED chip assembly 5 is fixedly located in slotted eye 212, the groove bottom of slotted eye 212 is provided with silver coating 8, in fact, in the present embodiment, by electroplating technology by the plating of silver slurry on substrate 1, it can improve the emissivity of LED chip assembly 5 to this silver coating 8 widely, and the bottom of this LED chip assembly 5 is fixed on by elargol (not shown) connection silver coating 8 realized between silver coating 8.Concrete this elargol have employed current state-of-the-art high heat conduction elargol, and after overbaking, LED chip assembly 5 is fixed on silver coating 8 in the present embodiment, plays effect of bonding and heat conduction.
It should be noted that, for ease of LED chip assembly 5 is encapsulated in slotted eye 212, each LED chip 51 is also located on silver coating 8 by the first colloid 6, also be, the first colloid 6 is poured into a mould to be encapsulated in the periphery of LED chip assembly 5, then, for ease of more firmly LED component being encapsulated, also on the basis of the first colloid 6, the second colloid 7 can be poured into a mould in the first cavity 211, also be, the bottom of the second colloid 7 is connected to the first colloid 6, but it is outer to form film top that its top protrudes from the first cavity 211, in other words, in second colloid 7 projection and the first cavity 211.
Further, in the preferred embodiment that the utility model provides, as shown in Figures 1 to 4, the first cavity 211 is in cylindrical shape, and groove bottom is rectangle plane.
Further, in the preferred embodiment that the utility model provides, framework 2 adopts resistant to elevated temperatures PPA injection molding adhesion on substrate 1, it should be noted that, this framework 2 adopts plastic-injection to form, it has the characteristics such as high temperature resistant, toughness is strong and air-tightness is good, is mainly used to the first colloid 6 and the second colloid 7 when shaping encapsulation.
Further, in the preferred embodiment provided at the utility model, preferably, the first colloid 6 is fluorescent glue, and the second colloid 7 is film top silica gel.
Further, in the preferred embodiment that the utility model provides, for ease of positive terminal port 3 and negative terminal port 4 are fixedly established on substrate 1, framework 2 offers first to dodge hole 24 and second and dodge hole 25, wherein, positive terminal port 3 is convexly equipped in first and dodges in hole 24, and the periphery of this positive terminal port 3 is coated on the first hole of dodging hole 24 along to be fixed on substrate 1, in like manner, negative terminal port 4 is convexly equipped in second and dodges in hole 25, and the periphery of this negative terminal port 4 is coated on the second hole of dodging hole 25 along to be fixed on substrate 1.
Further, in the preferred embodiment that the utility model provides, each LED chip 51 uniform array arrangement, the rectangular array-like of whole LED chip assembly 5, is often arranged between adjacent LED chip 51 and is connected in series by wire 9, and preferably, this wire 9 is gold thread.It is concrete that adjacent LED chip 51 is coupled together by automatic wire bonding machine by this gold thread, is electrically connected on positive terminal port 3 and negative terminal port 4 by substrate 1 in the present embodiment, and in final access circuit of light sources, thus form complete path.Also, namely, when positive terminal port 3 and negative terminal port 4 connect external power supply, electricity can be passed to the energising that LED chip assembly 5 realizes light source by circuit step-down.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model.For a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within right of the present utility model.
Claims (7)
1. module type film top LED encapsulation structure, comprise substrate, the framework be fixed on the upper surface of described substrate, be fixed at positive terminal port on described substrate and negative terminal port, it is characterized in that: also comprise by the LED chip assembly of at least one LED chip array arrangement, described LED chip assembly is contained in the vallecular cavity of described framework, and be fixed in described vallecular cavity by the first colloid, the outside of described first colloid is packaged with the second colloid, and described second colloid is fixed in described vallecular cavity;
By described substrate, one end of described LED chip assembly is electrically connected on described positive terminal port, and the other end is electrically connected on described negative Wiring port; Spacing between adjacent described LED chip is 0.80 ~ 1.2mm.
2. module type film top as claimed in claim 1 LED encapsulation structure, it is characterized in that: the slotted eye that described vallecular cavity comprises the first cavity and communicates with described first cavity, described slotted eye is enclosed by the madial wall of the fixed part of described upper surface and described framework and forms, described first cavity is enclosed by the madial wall of the upper end of described framework and forms, and described fixed part is also extended downwards to the inside by described upper end; The groove bottom of described slotted eye is provided with silver coating; Each described LED chip is located on described silver coating by described first colloid, and the bottom of described second colloid is connected to described first colloid, and top protrudes from outside described first cavity.
3. module type film top as claimed in claim 2 LED encapsulation structure, it is characterized in that: described first cavity is cylindrical shape, described groove bottom is rectangle plane.
4. module type film top as claimed in claim 3 LED encapsulation structure, it is characterized in that: described first colloid is fluorescent glue, described second colloid is film top silica gel.
5. module type film top as claimed in claim 1 LED encapsulation structure, is characterized in that: described framework adopts resistant to elevated temperatures PPA injection molding adhesion on described substrate.
6. module type film top as claimed in claim 1 LED encapsulation structure, it is characterized in that: described framework offers first and dodge hole and second and dodge hole, described positive terminal port projection and be coated on described first and dodge hole to be fixed on described substrate, described negative terminal port projection and be coated on described second and dodge hole to be fixed on described substrate.
7. module type film top as claimed in claim 1 LED encapsulation structure, it is characterized in that: each described LED chip uniform array arrangement, often arrange between adjacent described LED chip and connected by wired in series, and be electrically connected on described positive terminal port and described negative terminal port by described substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520256478.0U CN204614781U (en) | 2015-04-24 | 2015-04-24 | Module type film top LED encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520256478.0U CN204614781U (en) | 2015-04-24 | 2015-04-24 | Module type film top LED encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204614781U true CN204614781U (en) | 2015-09-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520256478.0U Active CN204614781U (en) | 2015-04-24 | 2015-04-24 | Module type film top LED encapsulation structure |
Country Status (1)
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|---|---|
| CN (1) | CN204614781U (en) |
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2015
- 2015-04-24 CN CN201520256478.0U patent/CN204614781U/en active Active
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Sunshine Industrial Park A1 building 7th floor 2-3 No. 518000 Guangdong city of Shenzhen province Baoan District Xixiang Hezhou Industrial Zone South Patentee after: Xuyu Optoelectronics (Shenzhen) Limited by Share Ltd Address before: Sunshine Industrial Park A1 building 7th floor 2-3 No. 518000 Guangdong city of Shenzhen province Baoan District Xixiang Hezhou Industrial Zone South Patentee before: SHENZHEN XUYU OPTOELECTRONICS CO., LTD. |
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| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Guangdong Xuyu optoelectronics Co. Ltd. Assignor: Xuyu Optoelectronics (Shenzhen) Limited by Share Ltd Contract record no.: 2018440020041 Denomination of utility model: Module formula membrane top LED packaging structure Granted publication date: 20150902 License type: Common License Record date: 20180419 |
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| EE01 | Entry into force of recordation of patent licensing contract |