CN204568091U - A kind of electronic delay element packaging system - Google Patents
A kind of electronic delay element packaging system Download PDFInfo
- Publication number
- CN204568091U CN204568091U CN201420862542.5U CN201420862542U CN204568091U CN 204568091 U CN204568091 U CN 204568091U CN 201420862542 U CN201420862542 U CN 201420862542U CN 204568091 U CN204568091 U CN 204568091U
- Authority
- CN
- China
- Prior art keywords
- delay element
- electronic delay
- packaging system
- glue
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
Abstract
The utility model discloses a kind of electronic delay element packaging system, wherein, described packaging system comprises: glue-injection machine and encapsulating mould, described encapsulating mould comprises mold and bed die, described mold coordinates formation one for placing the confined space of electronic delay element with bed die, described mold is provided with one and enters glue mouth, described glue-injection machine with enter glue mouth and be connected.Coordinated by glue-injection machine and encapsulating mould, make that electronic delay is external can wrap up one deck plastic casing, realize the excellent sealing effect of electronic delay element, the mode of above-mentioned employing mould avoids manual operation, improves production efficiency and package quality further.
Description
Technical field
The utility model relates to electronic delay element encapsulation field, particularly relates to a kind of electronic delay element packaging system.
Background technology
Existing electronic delay element is dust-proof for realizing, moistureproof, the effect of electrostatic prevention in handling process, generally needs to adopt Single Electron delay element manually to overlap the heat shrinkable sleeve, encapsulates, to ensure above-mentioned effect to electronic delay element heat-shrinkable T bush.
But above-mentioned electronic delay element packaged type needs full manual operation, specifically comprises and cuts heat-shrinkable T bush, cover heat-shrinkable T bush, by steps such as heat gun sizings, takes time and effort.In addition, owing to taking single-shot delay element to overlap the heat shrinkable sleeve, this just requires follow-uply to dip in medicine head technique, and weldering buttock line technique also can only operate by single-shot delay element, reduces production efficiency, cannot reach production requirement.And have some limitations due to heat-shrinkable T bush material, cannot be attached to completely on PCB and electronic devices and components, not have good sealing function, dust-proof, moisture effect is not obvious.Above-mentioned complete manually-operated mode, also can make electronic delay element need repeatedly to carry, cause anti-static effect not good.
Therefore, prior art has yet to be improved and developed.
Utility model content
In view of above-mentioned the deficiencies in the prior art, the purpose of this utility model is to provide electronic delay element packaging system, is intended to solve the problem that existing heat-shrinkable T bush encapsulation production efficiency is low, dust-proof, moistureproof, anti-static effect is not good.
The technical solution of the utility model is as follows:
A kind of electronic delay element packaging system, wherein, described packaging system comprises: glue-injection machine and encapsulating mould, described encapsulating mould comprises mold and bed die, described mold coordinates formation one for placing the confined space of electronic delay element with bed die, described mold is provided with one and enters glue mouth, described glue-injection machine with enter glue mouth and be connected.
Described electronic delay element packaging system, wherein, described bed die is provided with multiple depression for placing electronic delay element, coordinates form confined space with mold.
Described electronic delay element packaging system, wherein, the plastic cement injection pressure of described packaging system is 1.5 to 40bar.
Described electronic delay element packaging system, wherein, described glue-injection machine comprises colloidal sol glue cylinder and low-pressure injection molding machine.
Described electronic delay element packaging system, wherein, the encapsulation plastic cement of described packaging system is fast curing-formed plastic cement.
Described electronic delay element packaging system, wherein, described bed die is provided with 10 for placing the depression of electronic delay element.
Described electronic delay element packaging system, wherein, described depression is set to semi-circular recesses, and the diameter of described semi-circular recesses is greater than the width of electronic delay element.
Beneficial effect: the electronic delay element packaging system that the utility model provides, coordinated by glue-injection machine and encapsulating mould, make that electronic delay is external can wrap up one deck plastic casing, realize the excellent sealing effect of electronic delay element, the mode of above-mentioned employing mould avoids manual operation, improves production efficiency and package quality further.
Accompanying drawing explanation
Fig. 1 is the structural representation of the specific embodiment of electronic delay element packaging system of the present utility model.
Detailed description of the invention
The utility model provides the packaging system of electronic delay element, for making the purpose of this utility model, technical scheme and effect clearly, clearly, further describes below to the utility model.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
As shown in Figure 1, be the specific embodiment of electronic delay element packaging system of the present utility model.Described packaging system comprises: glue-injection machine 100 and encapsulating mould.Described encapsulating mould comprises mold (not shown) and bed die 200.
Described mold coordinates formation one for placing the confined space of electronic delay element with bed die, described mold is provided with one and enters glue mouth 300, described glue-injection machine with enter glue mouth and be connected.
The concrete use procedure of described packaging system is: electronic delay element is put into bed die, upper/lower die matched moulds, and after glue-injection machine passes through to inject melting into glue mouth, be in liquid plastic cement, plastic cement is full of the space between described confined space and electronic delay element.Fix until liquid plastic cement, shaping after, open upper/lower die, finally in electronic delay element outer wrapping, cover the plastic layer of last layer good seal, achieve the encapsulation of electronic delay element, achieve the excellent sealing effect of electronic delay element.
Concrete, according to required for actual conditions, multiple depression for placing electronic delay element can being provided with in described bed die, coordinating with mold and forming confined space.Adopt above-mentioned setting that multiple electronic delay element can be made to complete encapsulation simultaneously, and the output of many running fires in a row.Medicine head technique is dipped in the follow-up of electronic delay element after the encapsulation of above-mentioned many running fires in a row, the mode that laser beam welding buttock line technique also can adopt multiple electronic delay element to carry out simultaneously simultaneously, thus is conducive to the use of equipment further, enhances productivity.
It is preferred that the plastic cement injection pressure of described packaging system is 1.5 to 40bar, to guarantee the integraty of the electronic components such as PCB circuit in electronic delay element, avoid damaging electronic delay element in encapsulation process.
More specifically, described glue-injection machine comprises colloidal sol glue cylinder and low-pressure injection molding machine.Regrinding-material after packaging is accomplished again can drop in colloidal sol glue cylinder and recycle, and improves the degree of utilization of encapsulation plastic cement further.
It is preferred that the encapsulation plastic cement of described packaging system is fast curing-formed plastic cement, cure time at about 30s, thus shortens the packaging time of electronic delay element greatly, enhances productivity further.
Consider cost, die quality, the factors such as general mould and mechanical size restriction, it is preferred that be provided with 10 for placing the depression of electronic delay element in described bed die, once realize the encapsulation of 10 electronic delay elements.
Concrete, described depression is set to semi-circular recesses, and the diameter of described semi-circular recesses is greater than the width of electronic delay element.The diameter of described semi-circular recesses can be determined by actual conditions, larger diameter can make the plastic casing of formation thicker, and less diameter can make the space between mould and electronic delay element less, may cannot be good under low injection pressure the whole electronic delay element of the covering making melt plastic cement complete.
In sum, the electronic delay element packaging system that the utility model provides, is coordinated by glue-injection machine and encapsulating mould, makes that electronic delay is external can wrap up one deck plastic casing, realizes the excellent sealing effect of electronic delay element.And by the setting of mould, can once can complete the encapsulation of multiple electronic delay element, the mode of above-mentioned employing mould avoids manual operation, is conducive to the carrying out of electronic delay element subsequent process steps, improves production efficiency and package quality further.
Should be understood that; application of the present utility model is not limited to above-mentioned citing; for those of ordinary skills, can be improved according to the above description or convert, all these improve and convert the protection domain that all should belong to the utility model claims.
Claims (7)
1. an electronic delay element packaging system, it is characterized in that, described packaging system comprises: glue-injection machine and encapsulating mould, described encapsulating mould comprises mold and bed die, described mold coordinates formation one for placing the confined space of electronic delay element with bed die, described mold is provided with one and enters glue mouth, described glue-injection machine with enter glue mouth and be connected.
2. electronic delay element packaging system according to claim 1, is characterized in that, described bed die is provided with multiple depression for placing electronic delay element, coordinates form confined space with mold.
3. electronic delay element packaging system according to claim 1, is characterized in that, the plastic cement injection pressure of described packaging system is 1.5 to 40bar.
4. electronic delay element packaging system according to claim 1, is characterized in that, described glue-injection machine comprises colloidal sol glue cylinder and low-pressure injection molding machine.
5. electronic delay element packaging system according to claim 1, is characterized in that, the encapsulation plastic cement of described packaging system is fast curing-formed plastic cement.
6. electronic delay element packaging system according to claim 1, is characterized in that, described bed die is provided with 10 for placing the depression of electronic delay element.
7. electronic delay element packaging system according to claim 2, is characterized in that, described depression is set to semi-circular recesses, and the diameter of described semi-circular recesses is greater than the width of electronic delay element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420862542.5U CN204568091U (en) | 2014-12-31 | 2014-12-31 | A kind of electronic delay element packaging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420862542.5U CN204568091U (en) | 2014-12-31 | 2014-12-31 | A kind of electronic delay element packaging system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204568091U true CN204568091U (en) | 2015-08-19 |
Family
ID=53860765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420862542.5U Active CN204568091U (en) | 2014-12-31 | 2014-12-31 | A kind of electronic delay element packaging system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204568091U (en) |
-
2014
- 2014-12-31 CN CN201420862542.5U patent/CN204568091U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103943764A (en) | Mold and method for forming mold-pressing integrally-packaged LED light source | |
| CN102924199B (en) | Slapper detonator with injection-molding structure | |
| CN108398063B (en) | A kind of electric detonator chip and its packaging method | |
| CN204568091U (en) | A kind of electronic delay element packaging system | |
| CN105489509A (en) | Optical sensing chip package method for optimizing coating process by applying metal stencil printing technology | |
| CN101630587A (en) | Technique for producing transformer | |
| CN202159749U (en) | Packaging mold of lithium battery | |
| CN205564410U (en) | Insulator | |
| CN203839411U (en) | Molding die for carrying out die pressing and integrated packaging on LED light source | |
| CN205454319U (en) | Waterproof power supply box | |
| CN204688474U (en) | A kind of non-bituminous reactive polymer adhesive waterproof coil packing device | |
| CN204130728U (en) | Wire and cable connector | |
| CN204019874U (en) | For the jig structure of LED filament mold pressing encapsulation | |
| CN207651475U (en) | A kind of chip encapsulation assembly | |
| CN203536226U (en) | Device for sealing aluminum-case capacitor with wire-type lead-out terminals | |
| CN103367529A (en) | Overflow-glue sealing manufacturing method for photovoltaic assembly | |
| CN209561110U (en) | A kind of explosion-proof thermal resistor | |
| CN209455360U (en) | A kind of structure for refractory products packaging | |
| CN204257443U (en) | Low-pressure injection molding proximity switch | |
| CN205770470U (en) | A kind of wallpaper packer | |
| CN205668668U (en) | A kind of filter A-frame packaging error prevention device | |
| CN108943563A (en) | A kind of production method of tamper evident seal bottle cap | |
| CN108216769B (en) | Soft package cigarette facing slip pastes diaphragm capsule | |
| CN204632757U (en) | Improve the encapsulating structure of optocoupler reliability | |
| CN204167082U (en) | A kind of transformer casing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Device for electron is postponed to personally experience sth. part of body and is encapsulated Effective date of registration: 20160627 Granted publication date: 20150819 Pledgee: Xinjiang energy (Group) industrial chain Co., Ltd. Pledgor: Shenzhen great achievement wound Anda electronics technology Development Co., Ltd Registration number: 2016440020004 |
|
| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20170401 Granted publication date: 20150819 Pledgee: Xinjiang energy (Group) industrial chain Co., Ltd. Pledgor: Shenzhen great achievement wound Anda electronics technology Development Co., Ltd Registration number: 2016440020004 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Device for electron is postponed to personally experience sth. part of body and is encapsulated Effective date of registration: 20170401 Granted publication date: 20150819 Pledgee: Xinjiang Yongxiang Sheng energy Limited by Share Ltd Pledgor: Shenzhen great achievement wound Anda electronics technology Development Co., Ltd Registration number: 2017440020009 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |