CN204257443U - Low-pressure injection molding proximity switch - Google Patents
Low-pressure injection molding proximity switch Download PDFInfo
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- CN204257443U CN204257443U CN201420813909.4U CN201420813909U CN204257443U CN 204257443 U CN204257443 U CN 204257443U CN 201420813909 U CN201420813909 U CN 201420813909U CN 204257443 U CN204257443 U CN 204257443U
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- encapsulate layer
- proximity switch
- pressure injection
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Abstract
The utility model relates to a kind of low-pressure injection molding proximity switch, comprise tube-like envelope and arrange coil, magnetic tank, circuit board and connector in the housing successively, the surrounding of described coil, described magnetic tank and described circuit board is enclosed with the first encapsulate layer, and the described external diameter of the first encapsulate layer around described coil and described magnetic tank and the internal diameter of described shell match; Described first encapsulate layer and be filled with the second encapsulate layer between described connector and described shell; Described first encapsulate layer and described second encapsulate layer adopt soft polyamide respectively.The utility model is provided with the first encapsulate layer and the second encapsulate layer in the shell of proximity switch, and adopt soft polyamide low pressure injection formaing, not only can effectively save material cost and process costs, shorten the delivery period of product, and substantially prolongs the useful life of product.
Description
Technical field
The utility model relates to the proximity switch in field of industrial automation control and other various equipment, specifically a kind of low-pressure injection molding proximity switch.
Background technology
Proximity switch is a kind of transducer be widely used in field of industrial automation control and other various equipment, and it is applicable to the industry spot such as elevator, automobile making.
Conventional proximity switch, the shell that its structure comprises tubulose and the magnetic tank, coil, the circuit board that are arranged in shell, the two ends of shell are also configured with cap and bonnet respectively, and cap is used for protecting the magnetic tank of sensor head, and cap generally adopts duroplasts to make.The inside of shell is filled with the epoxy resin sealed.
The manufacture craft of this conventional proximity switch is as follows: first, front cap Instant cement is added curing agent to be bonded on magnetic tank, the semi-finished product press-in shell of the circuit board of cap, magnetic tank, coil will be housed after solidification, then first time resin is poured into, resin is generally the mixture of blue glue and curing agent for the first time, then vacuumize, be cured afterwards.Curing has two kinds: spontaneous curing be heating and curing.Spontaneous curing approximately needs 12 hours, 80 degrees Centigrade solidification needs 1.5 hours.Damage can be had to the components and parts on circuit board owing to being heating and curing, adopt spontaneous curing in 12 hours so general.When after first time resin solidification, inject second time resin, second time resin is generally the mixture of white glue PUR VT 3404A and curing agent PUR VT 3404B.Then, the transparent bonnet of press-in band sealing ring, is then inverted on tool and is cured.Similarly, spontaneous curing is dried approximately needs 12 hours, 80 degrees Centigrade solidification needs 1.5 hours.Damage can be had to the components and parts on circuit board owing to being heating and curing, adopt spontaneous curing in 12 hours so general.
There is following defect in above-mentioned manufacture craft:
1, cap and magnetic is canned joins lost time, and easily damage magnetic tank, scrappage is high;
2, cap is rigid plastics part, and in protection magnetic tank, there is certain defect, in the use procedure of follow-up industry spot, under the effect of external force, sensor head is easily damaged, thus causes product nonfunctional;
3, the cost compare of infusion epoxy resin is high, and reaches 24 hours drying time, needs to move around in process, clamping, causes technical process cost too high;
4, product easily excessive glue, so each structural member needs tight cooperation, causes each structural member high cost.
Summary of the invention
The utility model, for the problems referred to above, provides a kind of rate of finished products high, not fragile and the low-pressure injection molding proximity switch that cost is low.
According to the technical solution of the utility model: a kind of low-pressure injection molding proximity switch, comprise tube-like envelope and arrange coil, magnetic tank, circuit board and connector in the housing successively, the surrounding of described coil, described magnetic tank and described circuit board is enclosed with the first encapsulate layer, and the described external diameter of the first encapsulate layer around described coil and described magnetic tank and the internal diameter of described shell match; Described first encapsulate layer and be filled with the second encapsulate layer between described connector and described shell.
Described first encapsulate layer and described second encapsulate layer adopt soft polyamide respectively.
Technique effect of the present utility model is: the utility model is provided with the first encapsulate layer and the second encapsulate layer in the shell of proximity switch, soft polyamide low pressure injection formaing can be adopted, not only can effectively save material cost and process costs, shorten the delivery period of product, and substantially prolongs the useful life of product.
Accompanying drawing explanation
Fig. 1 is the half-finished structural representation of the utility model.
Fig. 2 is the structural representation of the utility model finished product.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is further described.
In Fig. 1, Fig. 2, comprise magnetic tank 1, coil 2, circuit board 3, first encapsulate layer 4, second encapsulate layer 5, connector 6, shell 7 etc.
As shown in Figure 2, the utility model is a kind of low-pressure injection molding proximity switch, comprise tube-like envelope 7 and be arranged in coil 2, magnetic tank 1, circuit board 3 and the connector 6 in shell 7 successively, coil 2, magnetic tank 1 are enclosed with the first encapsulate layer 4 with the surrounding of circuit board 3, and the external diameter of the first encapsulate layer 4 around coil 2, magnetic tank 1 and circuit board 3 and the internal diameter of shell 7 match; First encapsulate layer 4 and be filled with the second encapsulate layer 5 between connector 6 and shell 7; First encapsulate layer 4 and the second encapsulate layer 5 adopt soft polyamide respectively.
The manufacture method of above-mentioned low-pressure injection molding proximity switch, comprises the following steps:
(1) first time encapsulate, coil, magnetic tank and circuit board are carried out first time low pressure injection formaing as a whole, form the first encapsulate layer, make it the semi-finished product of being molded as one, as shown in Figure 1;
(2) pre-assembled, above-mentioned semi-finished product are fit into shell;
(3) semi-finished product of pre-assembled are put into shell, are carried out second time low pressure injection formaing, form the second encapsulate layer by second time encapsulate.
First time, low pressure injection formaing was soft polyamide with the material that low pressure injection formaing uses for the second time, and injection time is generally 15 seconds.
The utility model has the following advantages:
1, material cost is greatly reduced.Low-pressure injection molding proximity switch in the utility model eliminates the elements such as front and back of the prior art cap and sealing ring, does not also need epoxy resin, coordinates in addition and requires greatly to reduce, thus greatly saved material cost to each structural member;
2, process costs is greatly reduced.Cap integrated molding outside magnetic tank, is shortened cap and magnetic canned man-hour of joining, injecting glue was kept to 15 seconds by 24 hours curing time, and decreases the carrying in process, decrease tool, thus greatly reduce process costs by the utility model;
3, owing to adopting soft polyamide material to wrap up magnetic tank, thus greatly protect magnetic tank, make it be not easy to damage in manufacture and transport use.In addition, coefficient of thermal expansion and contraction and the electronic devices and components of soft polyamide material are close, greatly protect electronic devices and components, add the useful life of transducer.
4, use soft polyamide material low-pressure injection molding, improve the water resistance of whole product.
Claims (2)
1. a low-pressure injection molding proximity switch, comprise tube-like envelope and arrange coil, magnetic tank, circuit board and connector in the housing successively, it is characterized in that: the surrounding of described coil, described magnetic tank and described circuit board is enclosed with the first encapsulate layer, the described external diameter of the first encapsulate layer around described coil and described magnetic tank and the internal diameter of described shell match; Described first encapsulate layer and be filled with the second encapsulate layer between described connector and described shell.
2. according to low-pressure injection molding proximity switch according to claim 1, it is characterized in that: described first encapsulate layer and described second encapsulate layer adopt soft polyamide respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420813909.4U CN204257443U (en) | 2014-12-18 | 2014-12-18 | Low-pressure injection molding proximity switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420813909.4U CN204257443U (en) | 2014-12-18 | 2014-12-18 | Low-pressure injection molding proximity switch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204257443U true CN204257443U (en) | 2015-04-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420813909.4U Active CN204257443U (en) | 2014-12-18 | 2014-12-18 | Low-pressure injection molding proximity switch |
Country Status (1)
| Country | Link |
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| CN (1) | CN204257443U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104589577A (en) * | 2014-12-18 | 2015-05-06 | 科瑞工业自动化系统（苏州）有限公司 | Low-pressure injection molding approach switch and manufacturing method thereof |
-
2014
- 2014-12-18 CN CN201420813909.4U patent/CN204257443U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104589577A (en) * | 2014-12-18 | 2015-05-06 | 科瑞工业自动化系统（苏州）有限公司 | Low-pressure injection molding approach switch and manufacturing method thereof |
| CN104589577B (en) * | 2014-12-18 | 2017-05-24 | 科瑞工业自动化系统（苏州）有限公司 | Low-pressure injection molding approach switch and manufacturing method thereof |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |