CN201315693Y - Novel encapsulation structure for electronic ballast - Google Patents

Abstract

The utility model relates to an encapsulation technology, and particularly relates to a novel encapsulation structure for electronic ballast, which can realize reliable sealing performance and simple and rapid encapsulation process. The novel encapsulation structure comprises a casing for containing the electronic ballast and seal caps arranged at two side ends of the casing, wherein the seal caps and the casing are bonded with encapsulation carbon black-extended compound, and a wire inlet/outgoing hole is formed in the position corresponding to the casing and the seal caps. A piece of adaptive insulation paper is laid on the bottom surface of the casing, a layer of encapsulation carbon black-extended compound is laid on the insulation paper, the electronic ballast encapsulated with a plastic housing is put into the casing and the encapsulation carbon black-extended compound is filled into the casing, an inlet/outgoing wire passes out from the two side ends of the plastic housing and the ballast casing, and the two ends of the interior of the casing are filled up with the encapsulation carbon black-extended compound. In the novel encapsulation structure, the casing and the seal caps are bonded with encapsulation carbon black-extended compound, so as to overcome the shortcomings of the conventional mechanical connection and remarkably improve the sealing performance. The novel encapsulation structure is suitable for being used in damp conditions, even a water environment.

Description

Novel electron ballast encapsulating structure

Technical field

The utility model relates to a kind of encapsulation technology, relates in particular to a kind of electric ballast encapsulating structure of specific (special) requirements.

Background technology

Electric ballast is a kind of application electronic product very widely, when extraordinary occasion is used because of often placing it in the wet environment even in the environment of water, so sealing property is to weigh an important indicator of its quality, present ballast generally adopts the cooperation of upper and lower covers to realize sealing, and the connected mode of upper and lower covers generally adopts clamping, snapping, mode such as be threaded, closed performance is not too desirable, and in ballast housing, pour into the important measures that filler also is the realization sealing property, present filler mostly is an epoxy resin, unsaturated-resin, but there is big defective in it, embody in the following areas: 1) embedding complexity, cycle is long, solidifying generally needs 2-24 hour, also needs heating cure sometimes, is not suitable for industrial production in enormous quantities.(2) heat dispersion is relatively poor, and the user must add quartz sand voluntarily in addition, and this has not only increased the complexity of pouring, and because quartz sand size can destroy insulating barrier when expanding with heat and contract with cold greatly.(3) curing reaction is irreversible, expands with heat and contract with cold and components and parts do not match, and produces stress, thereby can cause that solder joint disconnects, and insulating varnish comes off.Unsaturated-resin is aging cracked easily.(4), therefore serious public hazards are arranged because diluent has severe toxicity.Can not repair, substandard product can only be scrapped.(5) cost an arm and a leg, cause production cost higher.(6) and its general softening temperature lower, the components and parts adstante febre may cause its softening loss, influences sealing property.(7) generally filler directly is potted in the surface of components and parts during embedding, influences that it is attractive in appearance, and embedding temperature control words improperly, the damage of components and parts caused easily.

The utility model content

The utility model is at above-mentioned defective, purpose is to provide a kind of can realize that sealing property is reliable, dosing technology simply, electric ballast encapsulating structure efficiently.

The technical solution of the utility model is: the utility model comprises the shell of placing electric ballast and is arranged on the capping of shell two side ends, capping and black gluing the connecing of shell employing embedding, and the input-output line hole is established in the position of shell and capping correspondence.

The adaptive insulating paper of shell bottom surface tiling, the black glue of tiling one deck embedding on the insulating paper, to keep flat in the housing and inject the black glue of embedding with the packaged town's electron stream device of plastic jacket, input-output line passes from plastic jacket, ballast housing two side ends, and glue is deceived in the two ends full irrigation potting of enclosure.

The utility model shell adopts the black glue of embedding to be connected with capping, has overcome traditional mechanical connection manner, has strengthened sealing property greatly, and it can be applicable in humidity even the water environment.The preferential selected black glue of embedding of the utility model has following advantage: (1) dosing technology is simple, and mobile fabulous, natural cooling solidifies in a few minutes, is particularly suitable for industrial production in enormous quantities.(2) added the superfine heat radiation material of granularity in the black matrix inserts, heat dispersion is very good, and temperature rise generally can reduce 10-20 ℃.(3) have fabulous matching,, thereby provide enough expansion spaces, never damage components and parts, be difficult for aging because of black glue soften with heat.(5) owing to pour temperature than low, the higher boiling point noxious substance in the black glue can not overflowed, and does not therefore almost pollute.(6) cheap, be about 1/3rd to 1/4th of epoxy price.(7) during embedding, components and parts are encapsulated in the plastic jacket, have kept performance attractive in appearance, and electronic devices and components have been avoided the pollution of the black glue of embedding simultaneously, have improved useful life.

Description of drawings

Fig. 1 is a structural representation of the present utility model

Among the figure 1 for the black glue, 2 of embedding be insulating paper.

Embodiment

Embodiment 1

The utility model comprises the shell of placing electric ballast and the capping that is arranged on the shell two side ends, and capping and the black glue 1 of shell employing embedding are bonding, and the input-output line hole is established in the position of shell and capping correspondence.

The adaptive insulating paper 2 of shell bottom surface tiling, the black glue 1 of tiling one deck embedding on the insulating paper 2, to keep flat in the housing and inject the black glue 1 of embedding with the packaged electric ballast of plastic jacket, input-output line passes from plastic jacket, ballast housing two side ends, and glue 1 is deceived in the two ends full irrigation potting of enclosure.

Black glue 1 its embedding temperature of selected embedding is 130 ℃-140 ℃, when treating that it is cooled to 90 ℃-100 ℃ the electric ballast that installs is put into.

Claims (2)

1, novel electron ballast encapsulating structure is characterized in that, comprises the shell of placing electric ballast and the capping that is arranged on the shell two side ends, capping and black gluing the connecing of shell employing embedding, and the input-output line hole is established in the position of shell and capping correspondence.

2, novel electron ballast encapsulating structure according to claim 1, it is characterized in that, the adaptive insulating paper of shell bottom surface tiling, the black glue of tiling one deck embedding on the insulating paper, to keep flat into housing and inject the black glue of embedding with the packaged electric ballast of plastic jacket, input-output line passes from plastic jacket, ballast housing two side ends, and glue is deceived in the two ends full irrigation potting of enclosure.

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