CN201430134Y - Plastic square rectifier - Google Patents

Abstract

The utility model discloses a plastic-encapsulated square rectifier device, which comprises a chip, a lead frame and a pin integrated with the lead frame. The chip is arranged on the lead frame, and the lead frame is arranged on a heat sink. The heat sink, the lead frame, and the lead frame are connected as a whole through the epoxy plastic package, and the chip and the lead frame are plastic packaged in the epoxy plastic package. In the utility model, the heat sink with the insulating film is used as the heat dissipation insulation sheet of the rectifier bridge or the module for plastic sealing and integral molding, which has better stability and insulation and pressure resistance effects, uniform heat dissipation, better heat dissipation, and high mechanical strength. Stability and reliability are guaranteed.

Description

Plastic square rectifier

technical field

The utility model relates to a semiconductor rectifier device, in particular to a plastic-encapsulated square rectifier device of 15A to 50A, which is suitable for a rectifier bridge or a rectifier bridge module.

Background technique

Existing 15A-50A rectifier devices such as square rectifier bridges or rectifier bridge modules are generally produced individually by potting and manual operation. The shell is used to wrap the epoxy and the frame to form the finished product. The encapsulation material of the potting bridge is two different liquid epoxy materials A and B, which need to be heated and matched according to the ratio of materials A and B. The rectifier bridge or module packaged by the above method is backward in technology. The traditional pouring materials are mainly epoxy resin, filler and curing agent, which are heated and cured under normal pressure through artificial ingredients, so that the airtightness and uniformity of the product are not good. Affect the stability and reliability of the product. And the formed rectifier bridge or module has the following disadvantages: 1. The air tightness and uniformity are not good enough, so that the stability and reliability of the rectifier bridge or rectifier bridge module cannot be guaranteed. 2. Difficulty in quality control. Since traditional pouring and encapsulation is controlled by manual batching, manual pouring and other artificial control processes, product quality is closely related to employees' work experience and skill level proficiency, and quality stability will vary with different operators. Fluctuation increases the difficulty of quality control. 3. High production cost: because the pouring product is to put the sintered semi-finished product into a finished product-shaped shell for potting, and the cost of the shell accounts for 30%-40% of the entire product cost, the material cost is high. 4. Poor stability: due to the impact of the potting rectifier bridge or module by the overall structure of the bridge housing and epoxy, the insulation performance is good but the heat transfer speed is slow. With the extension of the working time of the device, the heat dissipation will be poor and the temperature rise will directly affect the internal GPP chip. When the internal temperature slowly rises to the PN junction temperature of the chip due to heat dissipation, it will directly lead to chip failure; at the same time, the performance of the high and low temperature cycle (-40 ° C ~ 175 ° C) of the potting rectifier bridge or module is poor, and the product failure rate is high. .

Due to the use of artificial watering products, the low labor productivity and high power energy consumption are in contradiction with the current national policies such as advocating mechanized automatic production and energy conservation.

Contents of the invention

The purpose of the material of the utility model is to overcome the above-mentioned problems existing in the existing rectifier bridge or module, and provide a plastic-encapsulated square rectifier device. The utility model uses the heat sink with insulating film as the heat dissipation insulation sheet of the rectifier bridge or the module for plastic sealing and integral molding, which has better stability and insulation and pressure resistance effects, uniform heat dissipation, better heat dissipation, and high mechanical strength. Stability and reliability are guaranteed.

In order to achieve the above object, the technical scheme adopted by the utility model is as follows:

A plastic-encapsulated square rectifier device, comprising a chip, a lead frame and a lead integrated with the lead frame, characterized in that: the chip is arranged on the lead frame, the lead frame is arranged on the heat sink, the surface of the heat sink is an insulating layer, and the chip The heat sink, the lead frame, and the lead frame are connected as a whole through the epoxy plastic package, and the chip and the lead frame are plastic packaged in the epoxy plastic package.

The heat sink is an aluminum sheet or a copper sheet.

The lead frame is a lead frame with electrical conductivity.

The advantage of adopting the utility model is:

1. The lead frame of the utility model and the chip plastic package on the lead frame are arranged in the epoxy plastic package body, and the plastic package is integrally formed, so that the utility model has excellent air tightness and compactness, and the insulation and voltage resistance effect is ideal , high mechanical strength, high and low temperature impact performance is more stable.

2. The heat sink, the lead frame and the chip plastic package on the lead frame of the utility model are arranged in the epoxy plastic package body, and the plastic package is integrally formed, and the forming operation is simple, and the productivity and product quality are improved.

3. The surface of the heat sink is an insulating layer, and the insulating and heat dissipation layer is uniform, which improves the heat dissipation speed and heat dissipation uniformity of the bottom heat sink, reduces the working temperature of the heat dissipation surface more quickly and effectively, and improves the reliability of a single component rectifier bridge or module. and stability, prolonging the working life of the device.

4. The surface of the heat sink is an insulating layer, which can withstand the insulation withstand voltage of 2500V, which is 20% higher than the withstand voltage of the rectifier bridge or module produced by the traditional process; and the heat dissipation efficiency is increased by 40%.

5. The utility model adopts the plastic sealing method, which saves a potting shell compared with the traditional technology, and reduces the cost by about 30-40%. The overall appearance is beautiful and advanced in the industry, and the cost of plastic sealing materials is reduced by 25%.

Description of drawings

Fig. 1 is a schematic diagram of the three-dimensional structure of the utility model

Fig. 2 is the structural representation of the utility model before plastic sealing

The marks in the figure are: 1. Chip, 2. Lead frame, 3. Pin, 4. Heat sink, 5. Epoxy plastic package.

specific embodiment

A plastic-encapsulated square rectifier device, comprising a chip 1, a lead frame 2 and a pin 3 integrated with the lead frame 2, the chip 1 is arranged on the lead frame 2, the lead frame 2 is arranged on the heat sink 4, and the surface of the heat sink 4 It is an insulating layer, and the chip 1 , heat sink 4 and lead frame 2 are connected into a whole through the epoxy plastic package 5 , and the chip 1 and the lead frame 2 are plastic-packed in the epoxy plastic package 5 .

In the utility model, the heat sink 4 is an aluminum sheet or a copper sheet, or a metal material with good heat dissipation performance. The lead frame 2 can be any metal material with electrical conductivity. The insulating layer can be a thin film made of any insulating material with insulating properties.

The utility model adopts plastic sealing integral molding, and the molding process is as follows:

Put the metal heat sink 4 with an insulating layer and the lead frame 2 in the forming mold, and use a plastic sealing press to compress and mold the epoxy molding compound at one time, so that the lead frame 2 and the chip 1 on the lead frame 2 are plastic-wrapped on the In the epoxy plastic package 5.

The lead frame 2 and the chip 1 on the lead frame 2 are wrapped in the epoxy plastic package 5, which ensures that the epoxy plastic package has uniform flatness and uniform internal density, so that the utility model has excellent airtightness and compactness. The insulation withstand voltage effect is ideal. The surface of the heat sink at the bottom adopts an insulating layer made of insulating material with insulating properties, which improves the heat dissipation performance of the bottom, reduces the surface temperature of the internal GPP chip when it is working, and prolongs the working life of the device. The utility model can withstand the insulation withstand voltage of 2500V. High and low temperature impact performance is more stable.

Obviously, those of ordinary skill in the art can also make various forms without departing from the basic technical idea of the present utility model according to the technical knowledge and conventional means they have mastered, and all the changes in these forms are included in the present utility model. within the scope of protection of the material.

Claims (3)

1. A plastic-encapsulated square rectifier device, comprising a chip (1), a lead frame (2) and a lead (3) integrated with the lead frame (2), characterized in that: the chip (1) is arranged on the lead frame (2), the lead frame (2) is arranged on the heat sink (4), the surface of the heat sink (4) is an insulating layer, the chip (1), the heat sink (4) and the lead frame (2) are encapsulated by epoxy plastic (5) connected as a whole, the chip (1) and the lead frame (2) are plastic-encapsulated and arranged in the epoxy plastic package (5). 2. The plastic-encapsulated square rectifier device according to claim 1, characterized in that: the heat sink (4) is an aluminum sheet or a copper sheet. 3. The plastic-encapsulated square rectifier device according to claim 1, characterized in that: the lead frame (2) is a lead frame with electrical conductivity.

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