CN103824821B - Switch power module of a kind of plastics enclosed package and preparation method thereof - Google Patents

Switch power module of a kind of plastics enclosed package and preparation method thereof Download PDF

Info

Publication number
CN103824821B
CN103824821B CN201410086373.5A CN201410086373A CN103824821B CN 103824821 B CN103824821 B CN 103824821B CN 201410086373 A CN201410086373 A CN 201410086373A CN 103824821 B CN103824821 B CN 103824821B
Authority
CN
China
Prior art keywords
wiring board
pad
power module
switch power
plastics
Prior art date
Application number
CN201410086373.5A
Other languages
Chinese (zh)
Other versions
CN103824821A (en
Inventor
易峰
黄嵩人
Original Assignee
湖南进芯电子科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 湖南进芯电子科技有限公司 filed Critical 湖南进芯电子科技有限公司
Priority to CN201410086373.5A priority Critical patent/CN103824821B/en
Publication of CN103824821A publication Critical patent/CN103824821A/en
Application granted granted Critical
Publication of CN103824821B publication Critical patent/CN103824821B/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention discloses switch power module of a kind of plastics enclosed package and preparation method thereof, it is characterized in that, this device comprises wiring board, pad, electronic component, wire, plastic packaging body and input and output pin; Described pad is installed on two sides of wiring board; Described electronic component, wire, input and output pin are by pad and wiring board electrical communication; Described wiring board, electronic component, wire are encapsulated in plastic packaging body inside.Its preparation method is: by electronic component and wire bonds on wiring board, encapsulate by Shooting Technique again, expose the pad for connecting input and output pin of switch power module simultaneously, by all electronic component encapsulations in plastic packaging body, weld input and output pin again, form the switch power module of plastics enclosed package.Switch power module tool thermal diffusivity of the present invention is good, mechanical strength is high, assembling automaticity is high, the advantage of good operating stability.

Description

Switch power module of a kind of plastics enclosed package and preparation method thereof

Technical field

The present invention relates to field of switch power, particularly a kind of switch power module and preparation method thereof of plastics enclosed package.

Background technology

As the energy supplying device of electronic system, the stability of Switching Power Supply is most important, and the stability of Switching Power Supply comprises thermal stability, corrosion-resistant level, mechanical strength etc.Electronic component in conventional Switching Power Supply is in atmosphere exposed, and dispel the heat uneven, element is not corrosion-resistant, and mechanical strength is low.

Current many switch power modules adopt metal or plastic casing encapsulation; the Embedding Material such as space, portion resin is filled in the enclosure; only expose the input and output pin of module, shell can protect inner wiring board and electronic component effectively, improves corrosion-resistant level and mechanical strength.Meanwhile, the conductive coefficient of inner Embedding Material can adjust, according to demand to improve the capacity of heat transmission of module.But the Embedding Material due to inside is thermoplastic, and hot properties is bad, solid-state chance high temperature is easily out of shape, and even melts, and this module can not bear temperature during Reflow Soldering.

The companies such as current Linear have developed the small-power switching power-supply module of LGA encapsulation, and its wiring board is the wiring board of BT base material, and all devices are arranged on a face of wiring board, and another face of wiring board is exposed, the semiconductor packaging process of its encapsulation employing standard.Being limited in of this power module: work as complex circuit, and device many time, all devices being arranged on a face can make module volume become very large, be unfavorable for miniaturization, and heat is concentrated, heat radiation difficulty, and encapsulation is carried out for single wiring board mostly, this not only makes packaging efficiency low, also add the cost of encapsulation.

Summary of the invention

The object of this invention is to provide switch power module of a kind of plastics enclosed package and preparation method thereof, this device changes original packaged type and preparation method, wiring board both sides are made all to be fixed with electronic component and connector, not only increase the packing density of components and parts, also reduce the volume of Switching Power Supply, employing thermosetting plastic encapsulates, and substantially increases heat dispersion, thus improves useful life and the operating efficiency of switch power module.

In order to reach above object, the technical solution used in the present invention is: a kind of switch power module of plastics enclosed package, it is characterized in that, this device comprises wiring board (1), pad (2), electronic component (3), wire (4), plastic packaging body (5) and input and output pin (6), described pad (2) is installed on two sides of wiring board (1), described electronic component (3), wire (4), input and output pin (6) are by pad (2) and wiring board (1) electrical communication, described plastic packaging body (5) is made up of upper injection molding body (501) and lower injection molding body (502), wiring board (1) is arranged between injection molding body (501) and lower injection molding body (502), the pad (2) of wiring board (1) top panel, electronic component (3), wire (4) is all encapsulated in the inside of injection molding body (501), the part pad (2) of wiring board (1) lower panel, electronic component (3), wire (4) is encapsulated in the inside of lower injection molding body (502), expose the pad (2) for connecting input and output pin (6) on wiring board (1) lower panel, described input and output pin (6) is connected to the pad (2) exposed.

The edge of described electronic component, connector is no more than the edge of wiring board.

Described input/output pads surface is zinc-plated surface, or gold-plated surface, or silver-plated surface.

Described input and output pin is cuboid metal derby, or cylindrical metal, or " L " shape metal derby.

Described wiring board (1) by resin pottery or silicon make.

A preparation method for the switch power module of plastics enclosed package, is characterized in that:

Step 1: by the assembling of pad, electronic component, wire and connector in the circuit board, the pad for connecting input and output pin is installed on the two ends on the downside of single wiring board, and several wiring boards having welded electronic device line up array;

Step 2: pad wiring board being used for connect input and output pin is sticked adhesive tape, and the platform being used for the pad alignment lower mold half connecting input and output pin is fixed, install half mold after fixing, upper mold half and lower mold half mould are closed, then carries out injection moulding;

Step 3: remove mould after injection moulding completes, the method of machine cuts or laser cutting is adopted to be separated switch power module array along line of cut, be separated into single switch power module, input and output pin is connected with the pad at two ends on the downside of wiring board, namely completes the plastics enclosed package of switch power module.

Described injection mold is upper mold half and lower mold half, upper mold half is inverted u shape, lower mold half is provided with the platform for support wiring board corresponding with wiring board array quantity, and the sidewall of lower mold half is than the side thickness of upper mold half, and the sidewall ledge of lower mold half is for supporting wiring board.

Described injected plastics material is thermoset plastics.

The position of platform of described lower mold half is just to the pad for connecting input and output pin.

Beneficial effect of the present invention: (1) the present invention adopts the plastics of thermal conductivity as encapsulating material, thus improve the thermal diffusivity of switch power module, and this device adopts totally-enclosed encapsulation, good operating stability, and module mechanical strength after injection mo(u)lding is high.

(2) pcb board is maked somebody a mere figurehead in encapsulating housing by the present invention, thus the two-sided of pcb board can be made to place dissipative cell, not only can increase the packing density of components and parts, reduces volume, also advantageously in the heat dissipation design of power module, improves stability.

(3) the present invention adopts semiconductor packaging process, and temperature when making switch power module can bear Reflow Soldering, is convenient to the automatic welding of module.

(4) the present invention adopts array injection molding packaging to replace original single injection molding packaging, cuts into independent switch power module, which not only improves the production efficiency of injection molding packaging, also a saving packaging cost after injection moulding completes.

(5) lower mold half of the present invention is provided with platform, not only plays the effect supporting wiring board, also protects pad and be not packaged into inside injection molding body, and pad just can be out exposed, so that the welding of pin.

Accompanying drawing explanation

Fig. 1 is the vertical view of wiring board.

Fig. 2 is the structural representation of wiring board.

Fig. 3 is the structural representation of single power module.

Fig. 4 is the structural representation of the power module with " L " shape pin.

Fig. 5 is the structural representation of wiring board array.

Fig. 6 is the structural representation of injection mold.

Fig. 7 is the structural representation of the power module array after injection moulding completes.

Numerical reference described in Figure of description is expressed as: 1, wiring board; 2, pad; 3, electronic component; 4, wire; 5, plastic packaging body; 501, upper injection molding body; 502, lower injection molding body; 6, input and output pin; 7, upper mold half; 8, platform; 9, lower mold half; 10, line of cut.

Embodiment

In order to make those skilled in the art understand technical scheme of the present invention better, describe the present invention below in conjunction with accompanying drawing, the description of this part is only exemplary and explanatory, should not have any restriction to protection scope of the present invention.

Referring to Fig. 1, Fig. 2, Fig. 3, Fig. 4, a kind of switch power module of plastics enclosed package, this device comprises wiring board 1, pad 2, electronic component 3, wire 4, plastic packaging body 5 and input and output pin 6.Pad 2 is installed on two sides of wiring board 1, and electronic component 3, wire 4, input and output pin 6 are by pad 2 and wiring board 1 electrical communication.

Plastic packaging body 5 is made up of upper injection molding body 501 and lower injection molding body 502, wiring board 1 is arranged between injection molding body 501 and lower injection molding body 502, the pad 2 of wiring board 1 top panel, electronic component 3, wire 4 is all encapsulated in the inside of injection molding body 501, the part pad 2 of wiring board 1 lower panel, electronic component 3, wire 4 is encapsulated in the inside of lower injection molding body 502, expose the pad 2 for connecting input and output pin 6 on wiring board 1 lower panel, on the pad 2 that input and output pin 6 adopts the pin of " L " to be connected to expose, " L " shape pin has the larger advantage of bonding area, be more suitable for Surface Mount welding.

Referring to Fig. 4, Fig. 5, Fig. 6, Fig. 7, the preparation method of the switch power module of plastics enclosed package is:

Step 1: by the assembling of pad, electronic component, wire and connector in the circuit board, the pad for connecting input and output pin is installed on the two ends on the downside of single wiring board, and 4 wiring boards having welded electronic device are lined up array.

Step 2: pad wiring board being used for connect input and output pin is sticked adhesive tape, and the platform being used for the pad alignment lower mold half connecting input and output pin is fixed, half mold is installed after fixing, upper mold half and lower mold half mould are closed, then adopts thermosets to carry out injection moulding.

Step 3: remove mould after injection moulding completes, the method of machine cuts or laser cutting is adopted to be separated switch power module array along line of cut, be separated into single switch power module, input and output pin is connected with the pad at two ends on the downside of wiring board, namely completes the plastics enclosed package of switch power module.

Injection mold is upper mold half 7 and lower mold half 9, upper mold half 7 is inverted u shape, lower mold half 9 is provided with the platform 8 for support wiring board corresponding with wiring board array quantity, the sidewall of lower mold half 9 is than the side thickness of upper mold half 7, and the sidewall ledge of lower mold half 9 is for supporting wiring board.

Platform 8 position of lower mold half 9 is just to the pad for connecting input and output pin, and owing to there being platform, pad would not be packaged into inside injection molding body, and pad just can be out exposed, so that the welding of pin.

When actual design, should consider according to aspects such as wiring board size, Injection Mold Design requirement and costs, the quantity of appropriate design wiring board array midline road plate.

Apply specific case herein to set forth principle of the present invention and execution mode, the explanation of above example just understands method of the present invention and core concept thereof for helping.The above is only the preferred embodiment of the present invention, should be understood that, due to the finiteness of literal expression, and objectively there is unlimited concrete structure, for those skilled in the art, under the premise without departing from the principles of the invention, some improvement, retouching or change can also be made, also above-mentioned technical characteristic can be combined by rights; These improve retouching, change or combination, or the design of invention and technical scheme are directly applied to other occasion without improving, and all should be considered as protection scope of the present invention.

Claims (8)

1. a switch power module for plastics enclosed package, is characterized in that, this device comprises wiring board (1), pad (2), electronic component (3), wire (4), plastic packaging body (5) and input and output pin (6), described pad (2) is installed on two sides of wiring board (1), described electronic component (3), wire (4), input and output pin (6) are by pad (2) and wiring board (1) electrical communication, described plastic packaging body (5) is made up of upper injection molding body (501) and lower injection molding body (502), wiring board (1) is arranged between injection molding body (501) and lower injection molding body (502), the pad (2) of wiring board (1) top panel, electronic component (3), wire (4) is all encapsulated in the inside of injection molding body (501), the part pad (2) of wiring board (1) lower panel, electronic component (3), wire (4) is encapsulated in the inside of lower injection molding body (502), expose the pad (2) for connecting input and output pin (6) on wiring board (1) lower panel, described input and output pin (6) is connected to the pad (2) exposed,
Preparation method comprises the steps:
Step 1: by the assembling of pad, electronic component, wire and connector in the circuit board, the pad for connecting input and output pin is then installed on the two ends on the downside of single wiring board, and the wiring board several having been welded electronic device lines up array;
Step 2: pad wiring board being used for connect input and output pin is sticked adhesive tape, and the platform being used for the pad alignment lower mold half connecting input and output pin is fixed, install half mold after fixing, after upper mold half and lower mold half mould are closed, then carry out injection moulding;
Step 3: remove mould after injection moulding completes, the method of machine cuts or laser cutting is adopted to be separated switch power module array along line of cut, be separated into single switch power module, input and output pin is connected with the pad at two ends on the downside of the wiring board of single switch power module, namely completes the plastics enclosed package of switch power module.
2. the switch power module of a kind of plastics enclosed package according to claim 1, is characterized in that: the edge of described electronic component (3) is no more than the edge of wiring board (1).
3. the switch power module of a kind of plastics enclosed package according to claim 1, is characterized in that, described pad (2) surface is zinc-plated surface, or gold-plated surface, or silver-plated surface.
4. the switch power module of a kind of plastics enclosed package according to claim 1, is characterized in that, described input and output pin (6) is cuboid metal derby, or cylindrical metal, or " L " shape metal derby.
5. the switch power module of a kind of plastics enclosed package according to claim 1, is characterized in that, described wiring board (1) by resin pottery or silicon make.
6. the preparation method of the switch power module of a kind of plastics enclosed package according to claim 1, it is characterized in that, described injection mold is upper mold half and lower mold half, upper mold half is inverted u shape, lower mold half is provided with the platform for support wiring board corresponding with wiring board array quantity, the sidewall of lower mold half is than the side thickness of upper mold half, and the sidewall ledge of lower mold half is for supporting wiring board.
7. the preparation method of the switch power module of a kind of plastics enclosed package according to claim 1, is characterized in that, described injected plastics material is thermoset plastics.
8. the preparation method of the switch power module of a kind of plastics enclosed package according to claim 1, is characterized in that, the position of platform of described lower mold half is just to the pad for connecting input and output pin.
CN201410086373.5A 2014-03-11 2014-03-11 Switch power module of a kind of plastics enclosed package and preparation method thereof CN103824821B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410086373.5A CN103824821B (en) 2014-03-11 2014-03-11 Switch power module of a kind of plastics enclosed package and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410086373.5A CN103824821B (en) 2014-03-11 2014-03-11 Switch power module of a kind of plastics enclosed package and preparation method thereof

Publications (2)

Publication Number Publication Date
CN103824821A CN103824821A (en) 2014-05-28
CN103824821B true CN103824821B (en) 2016-04-06

Family

ID=50759804

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410086373.5A CN103824821B (en) 2014-03-11 2014-03-11 Switch power module of a kind of plastics enclosed package and preparation method thereof

Country Status (1)

Country Link
CN (1) CN103824821B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6249892B2 (en) * 2014-06-27 2017-12-20 三菱電機株式会社 Manufacturing method of semiconductor device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6031292A (en) * 1995-07-18 2000-02-29 Hitachi Cable, Ltd. Semiconductor device, interposer for semiconductor device
US6072122A (en) * 1995-05-31 2000-06-06 Nec Corporation Multi-chip packaging structure having chips sealably mounted on opposing surfaces of substrates
CN1442902A (en) * 2002-03-01 2003-09-17 株式会社日立制作所 Semiconductor device and its manufacturing method
CN1914727A (en) * 2004-02-13 2007-02-14 株式会社村田制作所 Electronic component and method for manufacturing the same
CN101416305A (en) * 2006-04-06 2009-04-22 飞思卡尔半导体公司 Over-molded semiconductor package with integrated through hole technology(THT) heat spreader pin(s)
JP4417096B2 (en) * 2003-12-24 2010-02-17 Necエレクトロニクス株式会社 Resin sealing method and resin sealing device
CN203733775U (en) * 2014-03-11 2014-07-23 湖南进芯电子科技有限公司 Plastic enclosed packaging switch power supply module

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3866178B2 (en) * 2002-10-08 2007-01-10 株式会社ルネサステクノロジ IC card
US20050000726A1 (en) * 2003-06-06 2005-01-06 Honda Motor Co., Ltd. Resin encapsulated electronic component unit and method of manufacturing the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6072122A (en) * 1995-05-31 2000-06-06 Nec Corporation Multi-chip packaging structure having chips sealably mounted on opposing surfaces of substrates
US6031292A (en) * 1995-07-18 2000-02-29 Hitachi Cable, Ltd. Semiconductor device, interposer for semiconductor device
CN1442902A (en) * 2002-03-01 2003-09-17 株式会社日立制作所 Semiconductor device and its manufacturing method
JP4417096B2 (en) * 2003-12-24 2010-02-17 Necエレクトロニクス株式会社 Resin sealing method and resin sealing device
CN1914727A (en) * 2004-02-13 2007-02-14 株式会社村田制作所 Electronic component and method for manufacturing the same
CN101416305A (en) * 2006-04-06 2009-04-22 飞思卡尔半导体公司 Over-molded semiconductor package with integrated through hole technology(THT) heat spreader pin(s)
CN203733775U (en) * 2014-03-11 2014-07-23 湖南进芯电子科技有限公司 Plastic enclosed packaging switch power supply module

Also Published As

Publication number Publication date
CN103824821A (en) 2014-05-28

Similar Documents

Publication Publication Date Title
US7799615B2 (en) Power converter package and thermal management
US9854708B2 (en) Unit for semiconductor device
DE10221891C5 (en) Power semiconductor device
CN100568539C (en) Connection device having a diode for connecting an electrical conductor to a connecting lead and manufacturing method thereof
US20020089832A1 (en) Semiconductor package with flash-proof device
US3706840A (en) Semiconductor device packaging
US7877868B2 (en) Method of fabricating circuit configuration member
JP3910497B2 (en) Power circuit waterproofing method and power module having power circuit
JP5350804B2 (en) Power semiconductor device
JP5060786B2 (en) Connector for solar cell module
JP3293334B2 (en) Semiconductor device and manufacturing method thereof
US20100133667A1 (en) Power semiconductor module
CN1132236C (en) Semiconductor devices and method of making devices
CN103811430B (en) Package-on-package structure including a thermal isolation material and method of forming the same
JP2010129868A (en) Semiconductor module for power and method of manufacturing the same
EP1900022B1 (en) Complete power management system implemented in a single surface mount package
JP2010129550A (en) Power semiconductor module
CN1773698A (en) Die down ball grid array packages and method for making same
JP5036563B2 (en) Semiconductor device and manufacturing method thereof
EP2143147B1 (en) Receptacles
JP4022758B2 (en) Semiconductor device
TWI404177B (en) Electric power semiconductor circuit device and method for making same
DE102008012703B4 (en) Semiconductor device and method of making the same
DE102009040444A1 (en) power module
JPH10116962A (en) Semiconductor device and manufacturing method thereof

Legal Events

Date Code Title Description
PB01 Publication
C06 Publication
SE01 Entry into force of request for substantive examination
C10 Entry into substantive examination
GR01 Patent grant
C14 Grant of patent or utility model