CN204505411U - A kind of Drilling operation cover plate - Google Patents
A kind of Drilling operation cover plate Download PDFInfo
- Publication number
- CN204505411U CN204505411U CN201520123412.4U CN201520123412U CN204505411U CN 204505411 U CN204505411 U CN 204505411U CN 201520123412 U CN201520123412 U CN 201520123412U CN 204505411 U CN204505411 U CN 204505411U
- Authority
- CN
- China
- Prior art keywords
- resin layer
- high heat
- cover plate
- metal level
- drilling operation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005553 drilling Methods 0.000 title claims abstract description 35
- 229920006015 heat resistant resin Polymers 0.000 claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 239000005030 aluminium foil Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 6
- 238000010257 thawing Methods 0.000 abstract description 5
- 238000004140 cleaning Methods 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 238000012423 maintenance Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004939 coking Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
Abstract
The utility model discloses a kind of Drilling operation cover plate, comprise metal level, the surface of described metal level is fixedly installed high heat-resistant resin layer, and described high heat-resistant resin layer is that the surperficial Post RDBMS being coated on described metal level by resin material that is high temperature resistant, non-thermofusible is formed.The layer on surface of metal of Drilling operation cover plate of the present utility model is provided with the high heat-resistant resin layer that the surperficial Post RDBMS that is coated on metal level by resin material that is high temperature resistant, non-thermofusible is formed, this high heat-resistant resin layer has feature that is high temperature resistant, non-thermofusible, make can not affect boring location and pollute hole wall, the cleaning of maintenance borehole environment while the precision of lifting hole position because cutting high temperature makes coating material produce thawing in printed circuit board drilling process.
Description
Technical field
The utility model relates to a kind of cover plate for auxiliary printing circuit board Drilling operation.
Background technology
Along with the electronic equipments such as mobile phone, panel computer, Intelligent worn device are fast-developing to the direction such as more intelligent, lightening, circuit board requirement on machining accuracy is also improved day by day.The high-end applications such as base plate for packaging are also more and more higher to high density very low pore size Drilling operation level requirement, need effectively to be ensured in position, hole precision and wall quality.When printed circuit board (PCB) is holed, covering plated film aluminium flake is on a printed circuit the important means effectively promoting boring hole when position precision, but there is serious hole internal contamination problem when being applied to printed circuit board drilling in current plated film aluminium flake, this is because the coated material of traditional plated film aluminium flake is low-melting-point resin material (namely about 30 DEG C can melt), in drilling process, high cutting heat is enough to low-melting-point resin material is melted instantaneously, even coking.The resin material melted is attached on the tip of drill bit, and drilled headband enters in printed circuit board (PCB) sheet material hole, and the resin material of thawing can be attached on hole wall, and cause hole and pollute and be difficult to remove, rear extended meeting causes the serious problems such as short circuit and circuit bad connection.Meanwhile, resin material reduces the guide effect to drill bit to a certain extent after melting, thus reduces position, hole precision.
Utility model content
The technical problem that the utility model mainly solves is to provide a kind of Drilling operation cover plate, the layer on surface of metal of described Drilling operation cover plate is provided with the high heat-resistant resin layer that the surperficial Post RDBMS that is coated on metal level by resin material that is high temperature resistant, non-thermofusible is formed, this high heat-resistant resin layer has feature that is high temperature resistant, non-thermofusible, make can not affect boring location and pollute hole wall, the cleaning of maintenance borehole environment while the precision of lifting hole position because cutting high temperature makes coating material produce thawing in printed circuit board drilling process.
For solving the problems of the technologies described above, the technical solution adopted in the utility model is: provide a kind of Drilling operation cover plate, comprise metal level, the surface of described metal level is fixedly installed high heat-resistant resin layer, and described high heat-resistant resin layer is that the surperficial Post RDBMS being coated on described metal level by resin material that is high temperature resistant, non-thermofusible is formed.High heat-resistant resin layer has feature that is high temperature resistant, non-thermofusible, makes will coating material be made because of cutting high temperature to produce thawing in printed circuit board drilling process and affect boring location and pollute hole wall.
Further, described Drilling operation cover plate also comprises color layers, and described color layers is arranged on described high heat-resistant resin layer.Color layers is set and can solves high heat-resistant resin layer problem transparent and not easy to identify, conveniently printed circuit board drilling is being added to man-hour by coloured for cover plate one facing to drill bit.
Further, described Drilling operation cover plate, also comprises antistatic layer, and described antistatic backing is arranged on described high heat-resistant resin layer.The attachment of the fine dust that antistatic backing can prevent electrostatic from causing is set, reduces the pollution to hole wall further.
Further, the thickness of described high heat-resistant resin layer is 60 ~ 150 microns.If the thickness of high heat-resistant resin layer is too thin, the effect of absorbing vibration can not be given full play to when Drilling operation and get rid of the effect of cutting chip, on the contrary, if thickness is too thick, the precision deterioration of Drilling operation position or drill bit just may be caused to lose.
Further, the thickness of described metal level is 50 ~ 200 microns.
Further, the metal level of described Drilling operation cover plate is aluminium flake or aluminium foil.Metal level is aluminium flake or the aluminium foil of aluminium, not only can dispel the heat, and cost is lower.
The beneficial effects of the utility model are: the coated material being different from existing plated film aluminium flake melts the tip that is attached on drill bit instantaneously and to bring in printed circuit board (PCB) sheet material hole and to be attached on the situation that hole wall pollutes hole and reduce position, hole precision in printed circuit board drilling process, the layer on surface of metal of Drilling operation cover plate of the present utility model is provided with by high temperature resistant, the resin material of non-thermofusible is coated on the high heat-resistant resin layer of the surperficial Post RDBMS formation of metal level, this high heat-resistant resin layer has high temperature resistant, the feature of non-thermofusible, make can not affect boring location and pollute hole wall because cutting high temperature makes coating material produce thawing in printed circuit board drilling process, while the precision of lifting hole position, keep the cleaning of borehole environment.
Accompanying drawing explanation
The Drilling operation covering plate structure schematic diagram that Fig. 1 provides for the utility model embodiment 1;
The Drilling operation covering plate structure schematic diagram that Fig. 2 provides for the utility model embodiment 2;
The Drilling operation covering plate structure schematic diagram that Fig. 3 provides for the utility model embodiment 3.
Detailed description of the invention
Below in conjunction with drawings and Examples, the utility model is described in detail.
Embodiment 1
Refer to Fig. 1, Drilling operation cover plate comprises high heat-resistant resin layer 1 and metal level 2, and the surface of metal level 2 is fixedly installed high heat-resistant resin layer 1.The aluminium flake that metal level 2 is aluminum profile extrusion, thickness is 50 microns; The surperficial Post RDBMS that high heat-resistant resin layer 1 is coated on metal level 2 by resin material that is high temperature resistant, non-thermofusible is formed, and thickness is 60 microns.The hardness of high heat-resistant resin layer 1 is lower than aluminium flake, and aluminium flake hardness is lower than printed circuit board (PCB) sheet material, and high heat-resistant resin layer 1 has feature that is high temperature resistant, non-thermofusible, be heated and can not soften and melt, can not apex point be attached to, pollute hole wall, ensure that cleaning and the quality of hole wall; Meanwhile, high heat-resistant resin layer 1 pair of drill bit plays the effect of auxiliary positioning, improves position, hole precision, reduces beat during drilling bit high-speed rotary, avoids breaking.
Embodiment 2
Refer to Fig. 2, as different from Example 1, the thickness of high heat-resistant resin layer 1 is 150 microns, and the thickness of metal level 2 is 200 microns; In addition, high heat-resistant resin layer 1 is also provided with color layers 3, and other structure is identical with embodiment 1.Color layers 3 can solve high heat-resistant resin layer problem transparent and not easy to identify, conveniently printed circuit board drilling is being added to man-hour by coloured for cover plate one facing to drill bit.
Embodiment 3
Refer to Fig. 3, as different from Example 1, the thickness of high heat-resistant resin layer 1 is 100 microns, and the thickness of metal level 2 is 120 microns; In addition, high heat-resistant resin layer 1 is also provided with antistatic backing 4, and other structure is identical with embodiment 1.The attachment of the fine dust that antistatic backing 4 can prevent electrostatic from causing, reduces the pollution to hole wall further.
Those skilled in the art do not depart from essence of the present utility model and spirit, various deformation scheme can be had to realize the utility model, the foregoing is only the better feasible embodiment of the utility model, not thereby interest field of the present utility model is limited to, the equivalent structure change that all utilization the utility model descriptions and accompanying drawing content are done, is all contained within interest field of the present utility model.
Claims (6)
1. a Drilling operation cover plate, comprise metal level, it is characterized in that, the surface of described metal level is fixedly installed high heat-resistant resin layer, and described high heat-resistant resin layer is the coat that high temperature resistant, that non-thermofusible resin material is coated on described metal level surperficial Post RDBMS is formed.
2. Drilling operation cover plate according to claim 1, is characterized in that, also comprise color layers, and described color layers is arranged on described high heat-resistant resin layer.
3. Drilling operation cover plate according to claim 1, is characterized in that, also comprise antistatic backing, and described antistatic backing is arranged on described high heat-resistant resin layer.
4. Drilling operation cover plate according to claim 1, is characterized in that, the thickness of described high heat-resistant resin layer is 60 ~ 150 microns.
5. Drilling operation cover plate according to claim 1, is characterized in that, the thickness of described metal level is 50 ~ 200 microns.
6. the Drilling operation cover plate according to any one of Claims 1 to 5, is characterized in that, described metal level is aluminium flake or aluminium foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520123412.4U CN204505411U (en) | 2015-03-03 | 2015-03-03 | A kind of Drilling operation cover plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520123412.4U CN204505411U (en) | 2015-03-03 | 2015-03-03 | A kind of Drilling operation cover plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204505411U true CN204505411U (en) | 2015-07-29 |
Family
ID=53703414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520123412.4U Expired - Fee Related CN204505411U (en) | 2015-03-03 | 2015-03-03 | A kind of Drilling operation cover plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204505411U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105505137A (en) * | 2016-01-13 | 2016-04-20 | 烟台柳鑫新材料科技有限公司 | Cover plate for drilling PCB and preparation method of cover plate |
| CN108700918A (en) * | 2016-04-06 | 2018-10-23 | 惠普发展公司，有限责任合伙企业 | Lid for equipment |
| CN109732677A (en) * | 2019-01-16 | 2019-05-10 | 东莞市盛川新材料科技有限公司 | A kind of drilling holes on circuit board upper cover plate and its manufacturing method, application method |
-
2015
- 2015-03-03 CN CN201520123412.4U patent/CN204505411U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105505137A (en) * | 2016-01-13 | 2016-04-20 | 烟台柳鑫新材料科技有限公司 | Cover plate for drilling PCB and preparation method of cover plate |
| CN108700918A (en) * | 2016-04-06 | 2018-10-23 | 惠普发展公司，有限责任合伙企业 | Lid for equipment |
| CN109732677A (en) * | 2019-01-16 | 2019-05-10 | 东莞市盛川新材料科技有限公司 | A kind of drilling holes on circuit board upper cover plate and its manufacturing method, application method |
| CN109732677B (en) * | 2019-01-16 | 2020-12-08 | 东莞市盛川新材料科技有限公司 | Upper cover plate for drilling circuit board and manufacturing method and using method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170519 Address after: Seven road 516000 in Guangdong province Huizhou City Zhongkai high tech Zone Huifeng No. 7 One Park Plaza Guangdong Huizhou students in business incubator 1007, room 1008 Patentee after: HUIZHOU DAIERMENGDE TECHNOLOGY CO.,LTD. Address before: Nanyang City, Henan province 474150 Dengzhou Island Jiayuan No. 17 Building 2 unit 501 Patentee before: Tang Yuanyuan |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150729 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |