CN109732677B - Upper cover plate for drilling circuit board and manufacturing method and using method thereof - Google Patents
Upper cover plate for drilling circuit board and manufacturing method and using method thereof Download PDFInfo
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- CN109732677B CN109732677B CN201910039905.2A CN201910039905A CN109732677B CN 109732677 B CN109732677 B CN 109732677B CN 201910039905 A CN201910039905 A CN 201910039905A CN 109732677 B CN109732677 B CN 109732677B
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Abstract
The upper cover plate for drilling the circuit board comprises an aluminum base layer, wherein a lubricating coating formed by water-soluble resin is arranged on the upper surface of the aluminum base layer, a cleaning protective layer is arranged on the lubricating coating, the upper cover plate is laid on the circuit board, a drill hole penetrates through the cleaning protective layer, the lubricating coating and the aluminum base layer in sequence to drill the circuit board, the drill bit returns upwards after drilling, glue adhered to the lubricating coating is adhered to the drill bit, and when the drill bit extends out of the cleaning protective layer, the drill bit is separated by the cleaning protective layer, the glue adhered to the outer wall of the drill bit is scraped, so that the glue adhered to the drill bit is reduced. The invention solves the technical problem that the coating is difficult to thicken, not only has more sufficient cooling and lubricating effects, but also can prevent and shield excessive water-soluble resin from adhering to the drill bit, improves the utilization efficiency of the drill bit, simultaneously can clean the protective layer to play the aims of moisture prevention and scratch prevention, and can improve the drilling precision.
Description
Technical Field
The invention belongs to the technical field of circuit board processing, and particularly relates to an upper cover plate for drilling a printed circuit board, and a manufacturing method and a using method thereof.
Background
The PCB is more and more complex to manufacture, namely the line width and the line distance are more and more compact, the aperture is smaller and smaller, and particularly along with the arrival of 5G technology, the mass application of high-frequency plates and the wide use of ceramic particle fillers present new challenges to the drilling technology. In order to meet the requirements of broad PCB manufacturers on high quality pursuit of a drilling process, high efficiency of processing efficiency and cost reduction, a plurality of companies develop a multifunctional drilling upper cover plate, the upper cover plate is paved on a circuit board, and a drill bit drills downwards from the upper cover plate. The existing multifunctional upper cover plate is coated with a layer of water-soluble coating on the traditional aluminum sheet, and has the function of lubricating and cooling. Experiments and batch production repeatedly prove that the drill bit drills towards the circuit board through the upper cover plate, the drill bit can be cooled by the water-soluble coating, the multifunctional drilling upper cover plate can obviously improve the hole wall quality, improve the precision of the hole drilling position of a small hole, reduce burrs, cancel thick plate step drilling, obviously reduce the abrasion of the drill bit, reduce the breakage probability of the drill bit, prolong the service life of the drill bit, reduce the replacement times of the drill bit and properly increase the number of stacked plates.
However, the coating of the coated aluminum cover plate on the market is generally 75 microns, and when the coating exceeds 80 microns, a large amount of water-soluble resin can be adhered to the chip grooves of the drill bit, so that the polarization of the drill bit rotating at high speed is caused, the drilling precision is influenced, the return grinding use of the drill bit is also influenced, and even broken ends can be broken.
When the thickness of the coating is lower than 80 microns, the lubricating and cooling effects of the coating are insufficient, and when the rotating speed of a main shaft of a drilling machine exceeds 20 ten thousand revolutions per minute, the roughness of the hole wall possibly exceeds the quality control range.
The coated aluminum sheet coating belongs to water-soluble resin, is easy to absorb moisture in air, influences the adhesive force of the coating, and is easy to scratch after the surface is softened, and influences the drilling precision.
Disclosure of Invention
In order to solve the technical problems, the invention provides the upper cover plate for drilling the printed circuit board, and the manufacturing method and the using method thereof, which can prevent and shield excessive water-soluble resin from adhering to a drill bit, improve the utilization efficiency of the drill bit, simultaneously clean the protective layer, achieve the aims of preventing moisture and scratches and improve the drilling precision.
In order to solve the technical problems, the invention adopts the following technical scheme:
the upper cover plate for drilling the circuit board comprises an aluminum base layer, wherein a lubricating coating formed by water-soluble resin is arranged on the upper surface of the aluminum base layer, and a cleaning protective layer is arranged on the lubricating coating.
The cleaning protective layer is an aluminum sheet, the thickness of the cleaning protective layer is 50-200 microns, the surface energy is greater than or equal to 72 dyne/cm, and the hardness is H18.
The lubricating coating has a thickness of 80-120 microns.
The moisture content of the lubricating coating is controlled to be between 3% and 6%.
An adhesive layer is further arranged between the lubricating coating and the cleaning protective layer and is adhered to the lubricating coating and the cleaning protective layer.
The thickness of the adhesive layer is 1-3 microns.
A manufacturing method of an upper cover plate for drilling a circuit board comprises the following steps:
coating water-soluble resin on the aluminum base layer, and drying to form a lubricating coating with the thickness of 80-120 microns, wherein the water content of the lubricating coating is controlled between 3% and 6%;
selecting an aluminum sheet or an alloy aluminum sheet with the thickness of 50-200 microns and the hardness of H18, pretreating the aluminum sheet or the alloy aluminum sheet, wherein the pretreatment is high-temperature flame baking treatment, chemical oil removal treatment or physical sand blasting coarsening treatment, then coating water-soluble resin on the aluminum sheet or the alloy aluminum sheet, and drying for 3-5 minutes at 120 ℃ to obtain an aluminum-based lubricating coating;
coating sticky rice glue between clean inoxidizing coating and the lubricating coating adopts the gravure coating mode coating sticky rice glue to form the adhesive layer that thickness is 1-3 microns, and this adhesive layer coating is at lubricating coating upper surface or clean inoxidizing coating lower surface, and sticky rice glue and water are according to 1: and (1) diluting.
Compounding the clean protective layer, the adhesive layer, the lubricating coating and the metal aluminum base layer by adopting a compounding machine, wherein the temperature in the compounding process is kept at 110-130 ℃, the pressure is 3-5 KG/square centimeter, and the speed is 10-15 m/min;
and after the compounding is finished, the upper cover plate is placed for curing for more than 72 hours, and is cut to obtain a preset size, so that a finished product of the upper cover plate for drilling the circuit board is obtained.
A use method of an upper cover plate for drilling a circuit board specifically comprises the following steps: the upper cover plate is laid on the circuit board, the drill hole penetrates through the circuit board from the clean protective layer, the lubricating coating and the aluminum base layer in sequence to drill the circuit board, the drill bit returns upwards after drilling, glue capable of adhering to the lubricating coating is adhered to the drill bit, the drill bit is separated by the clean protective layer when extending out of the clean protective layer, the glue adhered to the outer wall of the drill bit is scraped, and therefore the glue adhered to the drill bit is reduced.
The invention solves the technical problem that the coating is difficult to thicken, not only has more sufficient cooling and lubricating effects, but also can prevent and shield excessive water-soluble resin from adhering to the drill bit, improves the utilization efficiency of the drill bit, simultaneously can clean the protective layer to play the aims of moisture prevention and scratch prevention, and can improve the drilling precision.
Drawings
FIG. 1 is a schematic cross-sectional view of an upper cover plate according to the present invention.
Detailed Description
For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
As shown in the attached drawing 1, the invention discloses an upper cover plate for drilling a circuit board, which comprises an aluminum base layer 1, wherein a lubricating coating 2 made of water-soluble resin is arranged on the upper surface of the aluminum base layer 1, and a cleaning protective layer 3 is arranged on the lubricating coating 2. The glass transition temperature or melting point of the cleaning protective layer 3 is not lower than 150 ℃, so that the cleaning protective layer is prevented from being melted by the temperature of the drill bit. By utilizing the clean protective layer, the lubricating coating is prevented from being directly exposed in the air, moisture absorption is not easy, and the adhesive force is ensured. The cleaning protective layer can be release paper, release film, metal foil and the like.
The cleaning protective layer is an aluminum sheet, an alloy name card or a copper sheet, the thickness of the cleaning protective layer is 50-200 microns, the surface energy is more than or equal to 72 dyne/cm, the hardness is H18, and the cleaning protective layer has enough hardness and can effectively scrape off glue adhered to the side wall of the drill bit when the cleaning protective layer is contacted by the drill bit.
The lubricating coating has a thickness of 80-120 microns. The experimental analysis shows that when the thickness of the lubricating coating is lower than 80 microns, the coating can not sufficiently lubricate and cool the drill bit rotating at high speed, and when the rotating speed of a main shaft of the drilling machine exceeds 20 ten thousand revolutions per minute, the roughness of the hole wall can possibly exceed the quality control range; when the thickness exceeds 120. mu.m, the coating is difficult to dry and costly. The thickness of the material is limited to 80-120 microns, which is a preferable thickness interval.
The moisture content of the lubricating coating is controlled to be between 3% and 6%. The moisture content is lower than 3%, so that the coating is brittle and easy to crack; when the water content exceeds 6%, the adhesion of the coating film is insufficient and peeling-off is easy. Therefore, the amount of moisture control in this application is a preferred choice.
An adhesive layer 4 is further arranged between the lubricating coating 2 and the cleaning protective layer 3, and the lubricating coating and the cleaning protective layer are adhered to the adhesive layer 4. The thickness of the adhesive layer is 1-3 microns.
In addition, the invention also discloses a manufacturing method of the upper cover plate for drilling the circuit board, which comprises the following steps:
water-soluble resin is coated on the aluminum base layer, a lubricating coating with the thickness of 80-120 microns is formed after drying, the lubricating coating is dried for 3-5 minutes at the temperature of 120 ℃, and the moisture content is controlled between 3% and 6%. The water-soluble glue prepared by the water-soluble resin can be coated on the aluminum base layer once or for multiple times, can be coated by adopting a scraper, a roller, a curtain coating and a slit extrusion coating, can also be coated by using static electricity, and can flexibly select a coating mode according to the actual environment. The drying mode can be hot air drying or other drying modes, and the drying mode is not detailed here.
Selecting an aluminum sheet or an alloy aluminum sheet with the thickness of 50-200 microns and the hardness of H18, pretreating the aluminum sheet or the alloy aluminum sheet, wherein the pretreatment is high-temperature flame baking treatment, chemical oil removal treatment or physical sand blasting coarsening treatment, then coating water-soluble resin on the aluminum sheet or the alloy aluminum sheet, and drying at 120 ℃ for 3-5 minutes to obtain the aluminum-based lubricating coating. Through the pretreatment of the aluminum sheet or the alloy aluminum sheet, the adhesive force between the aluminum sheet and the coating is effectively improved, and the firm adhesion between the metal aluminum base layer and the lubricating coating is ensured.
Coating sticky rice glue between clean inoxidizing coating and the lubricating coating adopts the gravure coating mode coating sticky rice glue to form the adhesive layer that thickness is 1-3 microns, and this adhesive layer coating is at lubricating coating upper surface or clean inoxidizing coating lower surface, and sticky rice glue and water are according to 1: and (1) diluting. If the dilution ratio of the glutinous rice glue to water is more than 1: 1, the adhesion between the cleaning protective layer and the lubricating coating is affected.
And after the adhesive layer is coated, immediately compounding the clean protective layer, the adhesive layer, the lubricating coating and the metal aluminum base layer by adopting a compounding machine to obtain the multifunctional composite cover plate. The temperature in the compounding process is kept at 110-130 ℃, the pressure is 3-5 KG/square centimeter, and the speed is 10-15 m/min;
and after the compounding is finished, the upper cover plate is placed for curing for more than 72 hours, and is cut to obtain a preset size, so that a finished product of the upper cover plate for drilling the circuit board is obtained. Through curing treatment, the bonding stability of the cleaning protective layer is further improved, and the cleaning protective layer is not easy to fall off.
A use method of an upper cover plate for drilling a circuit board specifically comprises the following steps: the upper cover plate is laid on the circuit board, the drill hole penetrates through the circuit board from the clean protective layer, the lubricating coating and the metal aluminum base layer in sequence to drill the circuit board, the drill bit returns upwards after drilling, glue capable of adhering to the lubricating coating is adhered to the drill bit, the drill bit is separated by the clean protective layer when extending out of the clean protective layer, the glue adhered to the outer wall of the drill bit is scraped, and therefore the glue adhered to the drill bit is reduced. The drill bit of drilling equipment is separated the upper cover plate and is drilled the circuit board, the high-speed rotation of drilling can produce the heat, in the time of lubricated coating, play the lubrication action to the drill bit promptly, the heat of drill bit can make the gluey melting of lubricated coating simultaneously, thereby make lubricated coating's adhesion on the drill bit outer wall, when the drill bit comes out from clean inoxidizing coating, by clean inoxidizing coating separation, scrape partly with the glue of drill bit lateral wall, thereby it can not the adhesion too much to ensure the glue on the drill bit lateral wall, guarantee that drilling each time all has better quality, promote the drilling precision.
Although the present invention has been described in detail with reference to the embodiments, it will be apparent to those skilled in the art that modifications, equivalents, improvements, and the like can be made in the technical solutions of the foregoing embodiments or in some of the technical features of the foregoing embodiments, but those modifications, equivalents, improvements, and the like are all within the spirit and principle of the present invention.
Claims (2)
1. A manufacturing method of an upper cover plate for drilling a circuit board comprises the following steps:
coating water-soluble resin on the aluminum base layer, and drying to form a lubricating coating with the thickness of 80-120 microns, wherein the water content of the lubricating coating is controlled between 3% and 6%;
selecting an aluminum sheet or an alloy aluminum sheet with the thickness of 50-200 microns and the hardness of H18, pretreating the aluminum sheet or the alloy aluminum sheet, wherein the pretreatment is high-temperature flame baking treatment, chemical oil removal treatment or physical sand blasting coarsening treatment, then coating water-soluble resin on the aluminum sheet or the alloy aluminum sheet, and drying for 3-5 minutes at 120 ℃ to obtain an aluminum-based lubricating coating;
compounding the clean protective layer, the lubricating coating and the aluminum base layer by adopting a compounding machine, wherein the temperature in the compounding process is kept at 110-130 ℃, the pressure is 3-5 KG/square centimeter, and the speed is 10-15 m/min;
and after the compounding is finished, the upper cover plate is placed for curing for more than 72 hours, and is cut to obtain a preset size, so that a finished product of the upper cover plate for drilling the circuit board is obtained.
2. The method for manufacturing the upper cover plate for drilling the circuit board according to claim 1, wherein a sticky layer with a thickness of 1-3 microns is formed by coating sticky rice glue between the cleaning protective layer and the lubricating coating in a gravure coating mode, the sticky layer is coated on the upper surface of the lubricating coating or the lower surface of the cleaning protective layer, and the sticky rice glue and water are mixed according to a ratio of 1: and (1) diluting.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910039905.2A CN109732677B (en) | 2019-01-16 | 2019-01-16 | Upper cover plate for drilling circuit board and manufacturing method and using method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910039905.2A CN109732677B (en) | 2019-01-16 | 2019-01-16 | Upper cover plate for drilling circuit board and manufacturing method and using method thereof |
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| CN109732677A CN109732677A (en) | 2019-05-10 |
| CN109732677B true CN109732677B (en) | 2020-12-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN112873404A (en) * | 2021-01-12 | 2021-06-01 | 深圳市宏宇辉科技有限公司 | Lubricating cold punching plate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63251107A (en) * | 1987-04-01 | 1988-10-18 | Hitachi Chem Co Ltd | Method for boring printed circuit board |
| CN204505411U (en) * | 2015-03-03 | 2015-07-29 | 唐渊渊 | A kind of Drilling operation cover plate |
| CN206123803U (en) * | 2016-10-11 | 2017-04-26 | 深圳市柳鑫实业股份有限公司 | PCB machine drilling is with apron |
| CN106891586A (en) * | 2017-04-01 | 2017-06-27 | 松扬电子材料(昆山)有限公司 | Aluminum foil substrate suitable for FPC and preparation method thereof |
-
2019
- 2019-01-16 CN CN201910039905.2A patent/CN109732677B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63251107A (en) * | 1987-04-01 | 1988-10-18 | Hitachi Chem Co Ltd | Method for boring printed circuit board |
| CN204505411U (en) * | 2015-03-03 | 2015-07-29 | 唐渊渊 | A kind of Drilling operation cover plate |
| CN206123803U (en) * | 2016-10-11 | 2017-04-26 | 深圳市柳鑫实业股份有限公司 | PCB machine drilling is with apron |
| CN106891586A (en) * | 2017-04-01 | 2017-06-27 | 松扬电子材料(昆山)有限公司 | Aluminum foil substrate suitable for FPC and preparation method thereof |
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Effective date of registration: 20220113 Address after: Room 101, No.260, Dongcheng section, GuanChang Road, Dongcheng Street, Dongguan City, Guangdong Province, 523000 Patentee after: Dongguan fengdahong New Material Co.,Ltd. Address before: 523000 first floor, building C, shangshanmen Industrial Zone, Niushan, Dongcheng District, Dongguan City, Guangdong Province Patentee before: DONGGUAN SHENGCHUAN NEW MATERIAL TECHNOLOGY Co.,Ltd. |