CN109732677A - A kind of drilling holes on circuit board upper cover plate and its manufacturing method, application method - Google Patents
A kind of drilling holes on circuit board upper cover plate and its manufacturing method, application method Download PDFInfo
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- CN109732677A CN109732677A CN201910039905.2A CN201910039905A CN109732677A CN 109732677 A CN109732677 A CN 109732677A CN 201910039905 A CN201910039905 A CN 201910039905A CN 109732677 A CN109732677 A CN 109732677A
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- lubricant coating
- upper cover
- circuit board
- cover plate
- protective layer
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Abstract
A kind of drilling holes on circuit board upper cover plate and its manufacturing method, application method, including aluminum base layer, the aluminum base layer upper surface is equipped with the lubricant coating being made of water-soluble resin, the lubricant coating is equipped with cleaning protective layer, in the circuit board by upper cover plate paving, drilling is successively from cleaning protective layer, lubricant coating and aluminum base layer, which pass through, drills to wiring board, bit bore finishes the glue for returning up and adhering to lubricant coating, it is obstructed when drill bit is stretched out from cleaning protective layer by cleaning protective layer, the glue adhered on drill bit outer wall wall is struck off, to reduce the glue adhered on drill bit.The present invention solves the technical problem that coating is difficult to thicken, not only cooling and lubricating effect is more abundant, can excessively be sticked on drill bit with shielding water-soluble resin, improve the utilization efficiency of drill bit, the purpose of moisture-proof anti-scratch can be played by cleaning protective layer simultaneously, and borehole accuracy can be improved.
Description
Technical field
The invention belongs to wiring board processing technique field, specifically a kind of upper cover plate used for drilling printed circuit boards and its
Manufacturing method, application method.
Background technique
PCB manufacture becomes increasingly complex, i.e. line width line-spacing is more and more finer and closely woven, and aperture is smaller and smaller, especially with 5G technology
Arrival, the extensive application of high frequency plate, ceramic particle filler is widely used, and proposes new challenge to drilling technique.In order to
Meet numerous PCB producer to the high-quality pursuit of bore process, the hope that is efficient and reducing cost of processing efficiency, more the father-in-law
Department develops multifunctional hole-drilling upper cover plate, spreads cover board in the circuit board, drill bit drills downwards from upper cover plate.Current more function
Energy upper cover plate applies one layer of water-soluble coating in conventional aluminum on piece, has lubrication effect.Experiment and batch production are repeatedly
It proves, through upper cover plate towards drilling holes on circuit board, drill bit can be cooled down drill bit by water-soluble coating, and multifunctional hole-drilling upper cover plate can be significant
Improve hole wall quality, raising aperture bore position precision, reduction burr, cancellation slab substep bore, substantially reduce bit wear, subtract
Few broken drill probability can promote drilling life of bit and reduce bit change-over number, can suitably increase lamination quantity.
But the coating of overlay film Aluminum cover is generally 75 microns currently on the market, and when more than 80 microns, water-soluble resin
It can largely be adhered on the chip space of drill bit, cause high-speed rotating drill bit to polarize, influence borehole accuracy, have an effect on returning for drill bit
Mill uses, in some instances it may even be possible to broken end be caused to fracture.
When coating layer thickness is lower than 80 microns, then coating lubrication effect is insufficient, when drill spindle revolving speed is more than 200,000
Rpm when, Hole Wall Roughness be possible to be more than quality control range.
Overlay film aluminium flake coating belongs to water-soluble resin, is easy the moisture absorption in air, influences coating adhesion, meanwhile, surface
It is easily scratched after softening, influences borehole accuracy.
Summary of the invention
In order to solve the above technical problems, the present invention provides a kind of upper cover plate used for drilling printed circuit boards and its manufactures
Method, application method, shielding water-soluble resin excessively stick on drill bit, improve the utilization efficiency of drill bit, while cleaning anti-
Sheath can play the purpose of moisture-proof anti-scratch, and borehole accuracy can be improved.
In order to solve the above-mentioned technical problem, the present invention takes following technical scheme:
A kind of drilling holes on circuit board upper cover plate, including aluminum base layer, the aluminum base layer upper surface are equipped with and are made of water-soluble resin
Lubricant coating, the lubricant coating are equipped with cleaning protective layer.
The cleaning protective layer is aluminium flake, the cleaning protective layer with a thickness of 50-200 micron, surface can be more than or equal to 72
Dynes per centimeter, hardness H18.
The lubricant coating with a thickness of 80-120 microns.
The moisture content of the lubricant coating controls between 3%-6%.
Adhesive layer is additionally provided between the lubricant coating and cleaning protective layer, adhesive layer adheres to lubricant coating and cleaning is anti-
Sheath.
The adhesive layer with a thickness of 1-3 microns.
A kind of manufacturing method of drilling holes on circuit board upper cover plate, comprising the following steps:
It is coated with water-soluble resin in aluminum base layer, forms the lubricious coating with a thickness of 80-120 microns, the lubricant coating after dry
Water content control between 3%-6%；
The aluminium flake or alloy aluminium flake with a thickness of 50-200 microns, hardness for H18 are selected, the aluminium flake or alloy aluminium flake are carried out pre-
Processing, which is thermal-flame baking processing, electrochemical deoiling handles or physics sandblasting roughening treatment, then will be water-soluble
Resin is coated in aluminium flake or alloy aluminum on piece, 3-5 minutes dry using 120 degree of temperature, obtains aluminium base lubricant coating；
It is formed between cleaning protective layer and the lubricant coating using plate gravure coating method coating glutinous rice glue with a thickness of 1-3 microns
Adhesive layer, the adhesive layer are coated on lubricant coating upper surface or cleaning protective layer lower surface, and glutinous rice glue and water are dilute according to 1:1
It releases.
Using compounding machine cleaning protective layer, adhesive layer, lubricant coating, metal aluminum base layer compound, the temperature of recombination process
Be maintained at 110-130 DEG C, pressure be 3-5KG/ square centimeters, speed is 10-15 ms/min；
It after the completion of compound, then places maturation process 72 hours or more, cuts to obtain pre-set dimension, obtain drilling holes on circuit board upper cover
Board finished product.
A kind of application method of drilling holes on circuit board upper cover plate, specifically: in the circuit board by upper cover plate paving, drilling is successively
It passes through from cleaning protective layer, lubricant coating and aluminum base layer and drills to wiring board, bit bore, which finishes, to be returned up and can adhere to
The glue of lubricant coating, obstructed when drill bit is stretched out from cleaning protective layer by cleaning protective layer, by what is adhered on drill bit outer wall wall
Glue strikes off, to reduce the glue adhered on drill bit.
The present invention solves the technical problem that coating is difficult to thicken, and not only cooling and lubricating effect is more abundant, can also obstruct
Shielding water-soluble resin excessively sticks on drill bit, improves the utilization efficiency of drill bit, at the same clean protective layer can play it is moisture-proof anti-
The purpose of scuffing, can be improved borehole accuracy.
Detailed description of the invention
Attached drawing 1 is the schematic diagram of the section structure of upper cover plate of the present invention.
Specific embodiment
To further understand the features of the present invention, technological means and specific purposes achieved, function, below with reference to
Present invention is further described in detail with specific embodiment for attached drawing.
As shown in Fig. 1, present invention discloses a kind of drilling holes on circuit board upper cover plate, including aluminum base layer 1, the aluminum base layers
1 upper surface is equipped with the lubricant coating 2 being made of water-soluble resin, which is equipped with cleaning protective layer 3.The cleaning is anti-
The glass transition temperature or fusing point of sheath 3 are not less than 150 DEG C, melt so as to avoid by the temperature of drill bit.It is protected using cleaning
Layer, avoids the direct knocking of lubricant coating in air, is not easy the moisture absorption, it is ensured that adhesive force.Clean protective layer can for release paper,
Release film, metal foil etc..
The cleaning protective layer be aluminium flake, alloy card or copper sheet, the cleaning protective layer with a thickness of 50-200 microns,
Surface can be more than or equal to 72 dynes per centimeters, and hardness H18 has enough hardness, it is ensured that by can be effective when bit contact
Wipe the glue adhered on drill bit side wall off.
The lubricant coating with a thickness of 80-120 microns.It is obtained through experimental analysis, when the thickness of lubricant coating is lower than 80
Micron, coating are insufficient to the cooling of high-speed rotating bit lubrication, when drill spindle revolving speed is more than 200,000 rpms, hole wall
Roughness is possible to be more than quality control range；When thickness is more than 120 microns, coating is dry difficult, at high cost.And this programme
In be limited to 80-120 microns, be a preferable thickness section.
The moisture content of the lubricant coating controls between 3%-6%.By experiment obtain, when moisture content be lower than 3%,
Then film is partially crisp, easy to crack；When moisture content is more than 6%, then the adhesive force of film is insufficient, is easily peeled off and falls off.Therefore, this Shen
Please in moisture content control amount, be one preferably selection.
Adhesive layer 4 is additionally provided between the lubricant coating 2 and cleaning protective layer 3, and adhesive layer 4 adheres to lubricant coating and clear
Clean protective layer.Adhesive layer with a thickness of 1-3 microns.
In addition, present invention further teaches a kind of manufacturing methods of drilling holes on circuit board upper cover plate, comprising the following steps:
It is coated with water-soluble resin in aluminum base layer, forms the lubricious coating with a thickness of 80-120 microns, the lubricant coating after dry
3-5 minutes dry using 120 degree of temperature, moisture content controls between 3%-6%.The water-soluble glue of water-soluble resin modulation, can
With primary, can also be coated in aluminum base layer several times, can be extrusion coated using blade coating, roller coating, showering, item seam, also
Electrostatic applications can be used, according to actual environment flexible choice coating method.Drying mode can be heated-air drying or other are dry
Dry mode, this will not be detailed here.
Select the aluminium flake or alloy aluminium flake with a thickness of 50-200 microns, hardness for H18, to the aluminium flake or alloy aluminium flake into
Row pretreatment, which is thermal-flame baking processing, electrochemical deoiling processing or physics sandblasting roughening treatment, then by water
Soluble resin is coated in aluminium flake or alloy aluminum on piece, 3-5 minutes dry using 120 degree of temperature, obtains aluminium base lubricant coating.
By the pretreatment to aluminium flake or alloy aluminium flake, the adhesive force of aluminium flake and coating is effectively improved, it is ensured that metal aluminum base layer and profit
The viscose glue of sliding coating is more firm.
It is micro- with a thickness of 1-3 using plate gravure coating method coating glutinous rice glue formation between cleaning protective layer and the lubricant coating
The adhesive layer of rice, the adhesive layer are coated on lubricant coating upper surface or cleaning protective layer lower surface, and glutinous rice glue and water are according to 1:1
Dilution.If glutinous rice glue and the dilution ratio of water are greater than 1:1, the adhesive force of cleaning protective layer and lubricant coating will affect.
After completing adhesive layer coating, at once using compounding machine cleaning protective layer, adhesive layer, lubricant coating, metal aluminium base
Layer is compound, obtains multi-functional composite decking.The temperature of recombination process be maintained at 110-130 DEG C, pressure be 3-5KG/ square centimeters,
Speed is 10-15 ms/min；
It after the completion of compound, then places maturation process 72 hours or more, cuts to obtain pre-set dimension, obtain drilling holes on circuit board upper cover
Board finished product.By maturation process, the bonding stability of cleaning protective layer is further promoted, it is not easy to fall off.
A kind of application method of drilling holes on circuit board upper cover plate, specifically: in the circuit board by upper cover plate paving, drilling is successively
It passes through from cleaning protective layer, lubricant coating and metal aluminum base layer and drills to wiring board, bit bore finishes the meeting of returning up
The glue for adhering to lubricant coating is obstructed when drill bit is stretched out from cleaning protective layer by cleaning protective layer, will be glued on drill bit outer wall wall
Attached glue strikes off, to reduce the glue adhered on drill bit.The drill bit of drilling device drills to wiring board across upper cover plate, bores
Hole high speed rotation can generate heat, when by lubricant coating, i.e., play lubricating action, while the heat meeting of drill bit to drill bit
Melt the glue of lubricant coating, so that the gluing of lubricant coating is attached on drill bit outer wall, when drill bit goes out from cleaning protective layer
When coming, is obstructed by cleaning protective layer, wipe the glue of drill bit side wall off a part, so that it is guaranteed that the glue on drill bit side wall will not adhere to
Excessively, guarantee that drilling each time all has preferable quality, promote borehole accuracy.
It should be noted that these are only the preferred embodiment of the present invention, it is not intended to restrict the invention, although ginseng
According to embodiment, invention is explained in detail, for those skilled in the art, still can be to aforementioned reality
Technical solution documented by example is applied to modify or equivalent replacement of some of the technical features, but it is all in this hair
Within bright spirit and principle, any modification, equivalent replacement, improvement and so on should be included in protection scope of the present invention
Within.
Claims (9)
1. a kind of drilling holes on circuit board upper cover plate, including aluminum base layer, which is characterized in that the aluminum base layer upper surface is equipped with by water-soluble
Property resin constitute lubricant coating, the lubricant coating be equipped with cleaning protective layer.
2. drilling holes on circuit board upper cover plate according to claim 1, which is characterized in that the aluminum base layer is metal aluminium flake,
The aluminum base layer with a thickness of 50-200 microns, surface can be more than or equal to 72 dynes per centimeters, hardness H18.
3. drilling holes on circuit board upper cover plate according to claim 2, which is characterized in that the lubricant coating with a thickness of
80-120 microns.
4. drilling holes on circuit board upper cover plate according to claim 3, which is characterized in that the lubricant coating is water-soluble tree
Rouge, moisture content control is between 3%-6% after drying.
5. drilling holes on circuit board upper cover plate according to claim 4, which is characterized in that the lubricant coating and cleaning are protected
Adhesive layer is additionally provided between layer, adhesive layer adheres to lubricant coating and cleaning protective layer.
6. drilling holes on circuit board upper cover plate according to claim 5, which is characterized in that the adhesive layer with a thickness of 1-3
Micron.
7. a kind of manufacturing method of drilling holes on circuit board upper cover plate according to claim 1 to 6, including it is following
Step:
It is coated with water-soluble resin in aluminum base layer, forms the lubricious coating with a thickness of 80-120 microns, the lubricant coating after dry
Water content control between 3%-6%；
The aluminium flake or alloy aluminium flake with a thickness of 50-200 microns, hardness for H18 are selected, the aluminium flake or alloy aluminium flake are carried out pre-
Processing, which is thermal-flame baking processing, electrochemical deoiling handles or physics sandblasting roughening treatment, then will be water-soluble
Resin is coated in aluminium flake or alloy aluminum on piece, 3-5 minutes dry using 120 degree of temperature, obtains aluminium base lubricant coating；
It is using compounding machine that cleaning protective layer, lubricant coating, aluminum base layer is compound, the temperature of recombination process be maintained at 110-130 DEG C,
Pressure is 3-5KG/ square centimeters, speed is 10-15 ms/min；
It after the completion of compound, then places maturation process 72 hours or more, cuts to obtain pre-set dimension, obtain drilling holes on circuit board upper cover
Board finished product.
8. the manufacturing method of drilling holes on circuit board upper cover plate according to claim 7, which is characterized in that the cleaning protection
The adhesive layer with a thickness of 1-3 microns, the adhesive layer are formed using plate gravure coating method coating glutinous rice glue between layer and lubricant coating
It is coated on lubricant coating upper surface or cleaning protective layer lower surface, glutinous rice glue and water are diluted according to 1:1.
9. a kind of application method of drilling holes on circuit board upper cover plate according to claim 1 to 6, specifically:
In the circuit board by upper cover plate paving, drilling successively from cleaning protective layer, lubricant coating and aluminum base layer pass through to wiring board into
Row drilling, bit bore finish the glue for returning up and adhering to lubricant coating, clear when drill bit is stretched out from cleaning protective layer
Clean protective layer barrier, the glue adhered on drill bit outer wall wall is struck off, to reduce the glue adhered on drill bit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910039905.2A CN109732677B (en) | 2019-01-16 | 2019-01-16 | Upper cover plate for drilling circuit board and manufacturing method and using method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910039905.2A CN109732677B (en) | 2019-01-16 | 2019-01-16 | Upper cover plate for drilling circuit board and manufacturing method and using method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109732677A true CN109732677A (en) | 2019-05-10 |
| CN109732677B CN109732677B (en) | 2020-12-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910039905.2A Active CN109732677B (en) | 2019-01-16 | 2019-01-16 | Upper cover plate for drilling circuit board and manufacturing method and using method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112873404A (en) * | 2021-01-12 | 2021-06-01 | 深圳市宏宇辉科技有限公司 | Lubricating cold punching plate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63251107A (en) * | 1987-04-01 | 1988-10-18 | Hitachi Chem Co Ltd | Method for boring printed circuit board |
| CN204505411U (en) * | 2015-03-03 | 2015-07-29 | 唐渊渊 | A kind of Drilling operation cover plate |
| CN206123803U (en) * | 2016-10-11 | 2017-04-26 | 深圳市柳鑫实业股份有限公司 | PCB machine drilling is with apron |
| CN106891586A (en) * | 2017-04-01 | 2017-06-27 | 松扬电子材料(昆山)有限公司 | Aluminum foil substrate suitable for FPC and preparation method thereof |
-
2019
- 2019-01-16 CN CN201910039905.2A patent/CN109732677B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63251107A (en) * | 1987-04-01 | 1988-10-18 | Hitachi Chem Co Ltd | Method for boring printed circuit board |
| CN204505411U (en) * | 2015-03-03 | 2015-07-29 | 唐渊渊 | A kind of Drilling operation cover plate |
| CN206123803U (en) * | 2016-10-11 | 2017-04-26 | 深圳市柳鑫实业股份有限公司 | PCB machine drilling is with apron |
| CN106891586A (en) * | 2017-04-01 | 2017-06-27 | 松扬电子材料(昆山)有限公司 | Aluminum foil substrate suitable for FPC and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112873404A (en) * | 2021-01-12 | 2021-06-01 | 深圳市宏宇辉科技有限公司 | Lubricating cold punching plate |
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| Publication number | Publication date |
|---|---|
| CN109732677B (en) | 2020-12-08 |
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Effective date of registration: 20220113 Address after: Room 101, No.260, Dongcheng section, GuanChang Road, Dongcheng Street, Dongguan City, Guangdong Province, 523000 Patentee after: Dongguan fengdahong New Material Co.,Ltd. Address before: 523000 first floor, building C, shangshanmen Industrial Zone, Niushan, Dongcheng District, Dongguan City, Guangdong Province Patentee before: DONGGUAN SHENGCHUAN NEW MATERIAL TECHNOLOGY Co.,Ltd. |