CN204497269U - A kind of large power white light LED - Google Patents
A kind of large power white light LED Download PDFInfo
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- CN204497269U CN204497269U CN201420793117.5U CN201420793117U CN204497269U CN 204497269 U CN204497269 U CN 204497269U CN 201420793117 U CN201420793117 U CN 201420793117U CN 204497269 U CN204497269 U CN 204497269U
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- chip module
- light led
- cover plate
- white light
- transparent ceramic
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Abstract
The utility model provides a kind of large power white light LED, comprises COB chip module, transparent ceramic fluorescence cover plate, high transparency filled media and reflector; Described COB chip module is the circuit base plate being packaged with many blue-light LED chips; Described COB chip module is positioned at the bottom of reflector; Described transparent ceramic fluorescence cover plate to be positioned at above chip module and to be fixed on reflector by sealing viscose glue, and this transparent ceramic fluorescence cover plate is the cover plate that the fluorescent transparent ceramic material fired after obtaining rear-earth-doped YAG presoma by chemical liquid phase reaction or fluorescent transparent glass ceramic material obtain; Described high transparency filled media fills up the cavity between transparent ceramic fluorescence cover plate and chip module; The both positive and negative polarity of described COB chip module is electrically connected with external positive and negative electrode respectively.The utility model solves the defect brought because using fluorescent material in prior art, can not only realize high power white light, and can realize high-luminous-efficiency and high integration.
Description
Technical field
The utility model relates to a kind of LED light source, a kind of especially large power white light LED.
Background technology
Since Edison invented incandescent lamp in 1882, mankind's lighting source experienced by three phases: incandescent lamp, neon light, gaseous discharge lamp.As the real revolution of lighting technology, white light LEDs is described as forth generation lighting source.Compared to traditional lighting, its significant difference is, white light LEDs utilizes semi-conducting material that electric energy is converted into light, and light does not produce heat simultaneously, and has the feature such as long-life, energy-saving and environmental protection.
Body fluorescence conversion technology is still the mainstream technology manufacturing white light LEDs at present both at home and abroad.Traditional body fluorescence conversion technology is by applying yellow fluorescent powder on blue-light LED chip, and when fluorescent material sends sodium yellow after blue-light excited, blue light and yellow light mix form white light; This technology has that coated technique is simple, blue-light LED chip and yellow fluorescent powder preparation is comparatively ripe, YAG:Ce
3+the excitation spectrum of fluorescent material and the advantage such as InGaN or GaN blue chip luminescent spectrum comparatively mates manufacture white light LEDs method the most ripe at present.But also there are the following problems:
1, the fluorescent powder grain uniformity of disperseing in organic material is poor, so that affects the optical homogeneity of white light LED part;
2, there is comparatively serious light scattering in phosphor surface, has considerable influence to luminous efficiency;
3, mixing organic gel material thermal stability is not high, exists aging and degenerates;
4, the heat conduction of fluorescent coating, heat dispersion are poor, easily cause fluorescent material occurrence temperature cancellation, aging, cause luminous efficiency to reduce;
5, because being coated on chip surface time, coating layer thickness is difficult to control, and causes white light correlated colour temperature angular distribution uneven, causes producing the phenomenons such as yellow circle around ejecting white light light source.
On the other hand, white light LEDs is popularized in illumination still exists the lower key issue of luminous flux with application aspect, namely as lighting source, must send more light as far as possible, must have higher energy utilization efficiency.And single-chip power cannot meet lighting field to high brightness, high-power requirement, if realize great power LED with multiple blue-light LED chip applies yellow fluorescent powder, its above-mentioned 5 defects are just obvious all the more, differ greatly with the large power white light LED in ideal.
Summary of the invention
The technical problems to be solved in the utility model, is to provide a kind of large power white light LED, solving the defect brought because using fluorescent material in prior art, can not only realize high power white light, and can realize high-luminous-efficiency and high integration.
The technical problems to be solved in the utility model is achieved in that a kind of large power white light LED, comprises COB chip module, transparent ceramic fluorescence cover plate, high transparency filled media and reflector; Described COB chip module is the circuit base plate being packaged with many blue-light LED chips; Described COB chip module is positioned at the bottom of reflector; Described transparent ceramic fluorescence cover plate to be positioned at above chip module and to be fixed on reflector by sealing viscose glue, and this transparent ceramic fluorescence cover plate is the cover plate that the fluorescent transparent ceramic material fired after obtaining rear-earth-doped YAG presoma by chemical liquid phase reaction or fluorescent transparent glass ceramic material obtain; Described high transparency filled media fills up the cavity between transparent ceramic fluorescence cover plate and chip module; The both positive and negative polarity of described COB chip module is electrically connected with external positive and negative electrode respectively.
Further, the end face radius of described transparent ceramic fluorescence cover plate is less than bottom surface radius, and side is arcwall face.
Further, the circuit base plate of described COB chip module is Al
2o
3jewel substrate, SiC substrate or Si substrate; Described blue-light LED chip is grown directly upon described Al
2o
3on jewel substrate, SiC substrate or Si substrate, or any one in above-mentioned three kinds of substrates is transferred the blue chip of encapsulation after growth.
Further, the blue-light LED chip that described COB chip module encapsulates arranges by array structure, and is connected by series, parallel or series-parallel connection, and the spacing of adjacent blue-light LED chip is 3.0 ~ 5.0mm.
Further, the circuit base plate in described COB chip module is square, oval or circular.
Further, described high transparency filled media is high transparency silicone-based materials, and its refractive index is 1.5 ~ 1.7.
Further, the blue-light LED chip in described COB chip module is fixed on circuit base plate by crystal-bonding adhesive or eutectic welding manner bonding.
The utility model tool has the following advantages:
1, the transparent ceramic fluorescence cover plate that the utility model is fired after adopting COB chip module to obtain rear-earth-doped YAG presoma with employing by chemical liquid phase reaction combines, without the need to using fluorescent material, to solve in prior art the defect brought because using fluorescent material, the scattering loss that conventional fluorescent powder cladding process exists as can be effectively solved, luminous efficiency Yin Wendu raise and decline, painted light decay, the problem such as spectrum stability is not enough caused of material aging;
2, COB chip module of the present utility model adopts upper multiple blue-light LED chip, high-power to realize;
3, described in transparent ceramic fluorescence cover plate of the present utility model, the end face radius of transparent ceramic fluorescence cover plate is less than bottom surface radius, and side is arcwall face, makes the congregational rate of light better;
4, high power, the small size of integrated optical source module can be realized, be applicable to manufacture low-cost high-efficiency large power white light LED.
Accompanying drawing explanation
The utility model is further described with reference to the accompanying drawings in conjunction with the embodiments.
Fig. 1 is the structural representation of the utility model large power white light LED embodiment;
Fig. 2 is the structural representation of the COB chip module of the utility model embodiment;
Fig. 3 is the structural representation of the transparent ceramic fluorescence cover plate of the utility model embodiment;
Fig. 4 is the finished product spectrogram of the utility model embodiment.
Embodiment
As shown in Figure 1 to Figure 3, large power white light LED of the present utility model, comprises COB chip module 1, transparent ceramic fluorescence cover plate 2, high transparency filled media 3 and reflector 4; The transparent ceramic fluorescence cover plate 2 fired after adopting COB chip module 1 to obtain rear-earth-doped YAG presoma with employing by chemical liquid phase reaction combines, without the need to using fluorescent material, to solve in prior art the defect brought because using fluorescent material, the scattering loss that conventional fluorescent powder cladding process exists as can be effectively solved, luminous efficiency Yin Wendu raise and decline, painted light decay, the problem such as spectrum stability is not enough caused of material aging.
As depicted in figs. 1 and 2, described COB chip module 1 is the circuit base plate 12 being packaged with many blue-light LED chips 11; Wherein, blue-light LED chip 11 of the present utility model can reach more than 100, can realize real high-power; Described COB chip module 1 is positioned at the bottom of reflector 4; The both positive and negative polarity 13 of described COB chip module 1 is electrically connected with external positive and negative electrode respectively.In a preferred embodiment, the circuit base plate 12 of described COB chip module 1 is Al
2o
3jewel substrate, SiC substrate or Si substrate; Described blue-light LED chip 11 is grown directly upon described Al
2o
3on jewel substrate, SiC substrate or Si substrate, or any one in above-mentioned three kinds of substrates is transferred the blue-light LED chip 11 of encapsulation after growth.On described COB chip module 1, the blue-light LED chip 11 of encapsulation presses array structure arrangement, and is connected by series, parallel or series-parallel connection; And the spacing of adjacent blue-light LED chip 11 is 3.0 ~ 5.0mm.Circuit base plate 12 in described COB chip module 1 is square, oval or circular.
As shown in Figure 1 to Figure 3, described transparent ceramic fluorescence cover plate 2 to be positioned at above COB chip module and to be fixed on reflector 4 by sealing viscose glue 5, and this transparent ceramic fluorescence cover plate 2 be the cover plate that the fluorescent transparent ceramic material fired after obtaining rear-earth-doped YAG presoma by chemical liquid phase reaction or fluorescent transparent glass ceramic material obtain; End face 21 radius of described transparent ceramic fluorescence cover plate 2 is less than bottom surface 22 radius, and side 23 is arcwall face, and the congregational rate of light can be made so better.
Described high transparency filled media 3 fills up the cavity between transparent ceramic fluorescence cover plate 2 and COB chip module 1.Described high transparency filled media 3 is high transparency silicone-based materials, and its refractive index is 1.5 ~ 1.7.End face 21 radius of described transparent ceramic fluorescence cover plate 2 is less than bottom surface 22 radius, and side 23 is arcwall face.Described high transparency filled media 3 is high transparency silicone-based materials, and its refractive index is 1.5 ~ 1.7.Blue-light LED chip 11 in described COB chip module 1 can be fixed on circuit base plate 12 by crystal-bonding adhesive or eutectic welding manner bonding in the mode of formal dress or upside-down mounting, the high power of integrated optical source module, small size can be realized, be applicable to manufacture low-cost high-efficiency large power white light LED.
As shown in Figure 4, the Exemplary parameter values table of a kind of large power white light LED of the utility model is as shown in the table:
| Parameter name | Exemplary parameter values | Parameter name | Exemplary parameter values |
| Dominant wavelength (nm) | 556.4 | Luminous flux (Φ v/lm) | 7836.047 |
| Peak wavelength (nm) | 449.0 | Optical efficiency (lm/W) | 121.621 |
| Color rendering index (Ra) | 64.4 | Forward voltage (Vf/V) | 30.69 |
| Bandwidth (nm) | 21.3 | Forward current (If/mA) | 2099.400 |
| Colour temperature Tc(K) | 5384 | Leakage current (uA) | 0.0 |
| Colorimetric purity | 0.212 | Spectral energy (%) | 63 |
| Chromaticity coordinate (x, y) | 0.3363,0.4004 | The time of integration (mS) | 5 |
| Chromaticity coordinate (u, v) | 0.1886,0.3368 | Luminous power | 24459.35 |
As can be seen from the spectral distribution curve figure of the utility model large power white light LED in Fig. 4: made large power white light LED achieves high light flux and specular removal, and its light efficiency value is greater than 120lm/W, and luminous flux is greater than 7800lm.
Although the foregoing describe embodiment of the present utility model; but be familiar with those skilled in the art to be to be understood that; specific embodiment described by us is illustrative; instead of for the restriction to scope of the present utility model; those of ordinary skill in the art, in the modification of the equivalence done according to spirit of the present utility model and change, should be encompassed in scope that claim of the present utility model protects.
Claims (7)
1. a large power white light LED, is characterized in that: comprise COB chip module, transparent ceramic fluorescence cover plate, high transparency filled media and reflector; Described COB chip module is the circuit base plate being packaged with many blue-light LED chips; Described COB chip module is positioned at the bottom of reflector; Described transparent ceramic fluorescence cover plate to be positioned at above COB chip module and to be fixed on reflector by sealing viscose glue, and this transparent ceramic fluorescence cover plate is the cover plate that the fluorescent transparent ceramic material fired after obtaining rear-earth-doped YAG presoma by chemical liquid phase reaction or fluorescent transparent glass ceramic material obtain; Described high transparency filled media fills up the cavity between transparent ceramic fluorescence cover plate and COB chip module; The both positive and negative polarity of described COB chip module is electrically connected with external positive and negative electrode respectively.
2. a kind of large power white light LED according to claim 1, is characterized in that: the end face radius of described transparent ceramic fluorescence cover plate is less than bottom surface radius, and side is arcwall face.
3. a kind of large power white light LED according to claim 1, is characterized in that: the circuit base plate of described COB chip module is Al
2o
3jewel substrate, SiC substrate or Si substrate; Described blue-light LED chip is grown directly upon described Al
2o
3on jewel substrate, SiC substrate or Si substrate, or any one in above-mentioned three kinds of substrates is transferred the blue chip of encapsulation after growth.
4. a kind of large power white light LED according to claim 1 or 3, it is characterized in that: the blue-light LED chip that described COB chip module encapsulates arranges by array structure, and connected by series, parallel or series-parallel connection, the spacing of adjacent blue-light LED chip is 3.0 ~ 5.0mm.
5. a kind of large power white light LED according to claim 4, is characterized in that: the circuit base plate in described COB chip module is square, oval or circular.
6. a kind of large power white light LED according to claim 1, is characterized in that: described high transparency filled media is high transparency silicone-based materials, and its refractive index is 1.5 ~ 1.7.
7. a kind of large power white light LED according to claim 1, is characterized in that: the blue-light LED chip in described COB chip module is fixed on circuit base plate by crystal-bonding adhesive or eutectic welding manner bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420793117.5U CN204497269U (en) | 2014-12-16 | 2014-12-16 | A kind of large power white light LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420793117.5U CN204497269U (en) | 2014-12-16 | 2014-12-16 | A kind of large power white light LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204497269U true CN204497269U (en) | 2015-07-22 |
Family
ID=53576560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420793117.5U Active CN204497269U (en) | 2014-12-16 | 2014-12-16 | A kind of large power white light LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204497269U (en) |
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2014
- 2014-12-16 CN CN201420793117.5U patent/CN204497269U/en active Active
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| GR01 | Patent grant |