CN204360311U - A kind of CPU heat abstractor - Google Patents
A kind of CPU heat abstractor Download PDFInfo
- Publication number
- CN204360311U CN204360311U CN201520015083.1U CN201520015083U CN204360311U CN 204360311 U CN204360311 U CN 204360311U CN 201520015083 U CN201520015083 U CN 201520015083U CN 204360311 U CN204360311 U CN 204360311U
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- China
- Prior art keywords
- heat
- cpu
- foam metal
- utility
- cpu chip
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- Expired - Fee Related
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Abstract
The utility model discloses a kind of CPU efficient radiating apparatus, its structure comprises fan, foam metal heat sink material and the heat-conducting substrate composition by being connected to one; Whole heat abstractor is arranged in the top of cpu chip, and bottom the heat-conducting substrate of device, scribbles heat-conducting silicone grease and cpu chip is combined closely.The utility model adopts novel design concept, utilize the features such as foam metal Large ratio surface sum high thermal conductivity coefficient own, foam metal material is applied in the heat radiation of CPU, greatly can improves cpu chip radiating efficiency, and quality is light, noise is low, volume is little, device is easy to realize.
Description
Technical field
The utility model relates to a kind of heating radiator, particularly relates to a kind of CPU heat abstractor.
Background technology
The cpu chip of computing machine in use can the evolution of heat, and ensure that CPU normally works, the heat that just must be produced in time distributes.Otherwise under the condition that heat dispersal situations is insufficient, CPU element function will significantly decline, can not steady operation and affect reliability of operation, even cause CPU internal circuit to damage.In order to ensure that chip normally works, science, reasonable, efficient cooling measure will be adopted to chip.Therefore, the heat dissipation technology of chip is more and more subject to extensive concern.The radiating mode of cpu chip comprises wind-cooling heat dissipating, water-cooling, semiconductor heat-dissipating, heat pipe heat radiation technology, wherein the most widely used or employing forced air cooling mode, namely the effect of fan is utilized, the heat of heat radiator is dispersed in the environment of surrounding by forced convertion mode, plays radiating and cooling effect.For the air-cooled technology of forced convertion, efficient heating radiator is the vitals of chip cooling, in order to meet the needs of high efficiency and heat radiation ability, people improve heat abstractor one after another, as improved radiator fan, changing the shape of heat radiator and increasing its specific surface area, changing material category etc.
Porous foam metal is because having lighter weight, high specific surface area, good heat-conductivity conducting and be subject to the extensive concern of researcher, good for thermal conductivity metal material is made open celled foam state, greatly can increase the specific surface area of material, thus improve radiating effect, therefore with regard to electronic radiation field, especially CPU field of radiating, foam metal material has incomparable advantage.Consider effective heat dissipation technology now, it being reasonably applied in the heat radiation of CPU, is a kind of development trend of CPU heat dissipation technology.
Summary of the invention
Technical problem to be solved in the utility model is, overcomes the problem of prior art, provides a kind of CPU heat abstractor.This utility model device product theory is novel in design, and structure is simple, effectively can improve the radiating effect of computer CPU chip.
The purpose of this utility model has been come in the following manner:
A kind of CPU heat abstractor, its structure comprises fan, foam metal heat sink material and the heat-conducting substrate composition by being connected to one; Whole heat abstractor is arranged in the top of cpu chip, and bottom the heat-conducting substrate of device, scribbles heat-conducting silicone grease and cpu chip is combined closely.Several air-guiding holes are had in described foam metal heat sink material.
Relative to prior art, the utility model tool has the following advantages and beneficial effect:
The utility model adopts novel design concept, utilize the features such as foam metal material Large ratio surface sum high thermal conductivity coefficient own, foam metal material is applied in the heat radiation of CPU, greatly can improves cpu chip radiating efficiency, and quality is light, noise is low, volume is little, device is easy to realize.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model embodiment 1 device.
Fig. 2 is the heat radiation schematic diagram of the utility model embodiment 1 device.
Fig. 3 is the structural representation of the utility model embodiment 2 device.
Fig. 4 is the heat radiation schematic diagram of the utility model embodiment 2 device.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is described in further detail, but embodiment of the present utility model is not limited thereto.
Embodiment 1
A kind of CPU heat abstractor, as depicted in figs. 1 and 2, fan 1, foam metal heat sink material 2 and heat-conducting substrate 3 that its structure comprises by being connected to one form; Wherein, fan 1 is positioned at foam metal heat sink material 2 upper end; Whole heat abstractor is arranged in the top of cpu chip 5, and bottom the heat-conducting substrate 3 of device, scribbles heat-conducting silicone grease 4 combine closely with cpu chip 5.Several air-guiding holes are had in described foam metal heat sink material 2.
When CPU starts working, the heat that CPU produces is sent to heat-conducting substrate by heat-conducting silicone grease, heat-conducting substrate sends heat to foam metal heat sink material again, under the effect of fan, the heat that foam metal dispels the heat is dispersed in the environment of surrounding by forced convertion mode, plays radiating and cooling effect.
Embodiment 2
A kind of CPU heat abstractor, as shown in Figure 3 and Figure 4, fan 1, foam metal heat sink material 2 and heat-conducting substrate 3 that its structure comprises by being connected to one form; Wherein, fan 1 is positioned at foam metal heat sink material 2 side; Whole heat abstractor is arranged in the top of cpu chip 5, and 3 scribbles heat-conducting silicone grease 4 and combine closely with cpu chip 5 bottom the heat-conducting substrate of device.Several air-guiding holes are had in described foam metal heat sink material 2.
When CPU starts working, the heat that CPU produces is sent to heat-conducting substrate by heat-conducting silicone grease, heat-conducting substrate sends heat to foam metal heat sink material again, under the effect of fan, the heat of foam metal heat sink material is dispersed in the environment of surrounding by forced convertion mode, plays radiating and cooling effect.
Claims (2)
1. a CPU heat abstractor, is characterized in that:
Its structure comprises fan, foam metal heat sink material and the heat-conducting substrate composition by being connected to one; Whole heat abstractor is arranged in the top of cpu chip, and bottom the heat-conducting substrate of device, scribbles heat-conducting silicone grease and cpu chip is combined closely.
2. CPU heat abstractor according to claim 1, is characterized in that:
Several air-guiding holes are had in described foam metal heat sink material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520015083.1U CN204360311U (en) | 2015-01-11 | 2015-01-11 | A kind of CPU heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520015083.1U CN204360311U (en) | 2015-01-11 | 2015-01-11 | A kind of CPU heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204360311U true CN204360311U (en) | 2015-05-27 |
Family
ID=53261768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520015083.1U Expired - Fee Related CN204360311U (en) | 2015-01-11 | 2015-01-11 | A kind of CPU heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204360311U (en) |
-
2015
- 2015-01-11 CN CN201520015083.1U patent/CN204360311U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150527 Termination date: 20170111 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |