CN204322635U - A kind of copper-clad plate with high flatness structure - Google Patents
A kind of copper-clad plate with high flatness structure Download PDFInfo
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- CN204322635U CN204322635U CN201420671456.6U CN201420671456U CN204322635U CN 204322635 U CN204322635 U CN 204322635U CN 201420671456 U CN201420671456 U CN 201420671456U CN 204322635 U CN204322635 U CN 204322635U
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- clad plate
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- high flatness
- copper foil
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Abstract
The utility model relates to a kind of copper-clad plate with high flatness structure, belongs to the circuit board material technical field of electronic technology.This copper-clad plate by Copper Foil (11) and prepreg (12) superimposed hot-forming, described prepreg (12) is made up of epoxy resin-base (13) and some layers of electronic-grade glass fiber cloth, and described some layers of electronic-grade glass fiber cloth are distributed in epoxy resin-base (13) and form sheet ductile layers structure; Copper Foil (11) and prepreg (12) is superimposed is hot pressed into integrative-structure, forms the copper-clad plate with high flatness structure.The utility model has good toughness and intensity, avoids warpage and the out-of-flatness of copper-clad plate, improves processing and the dependability of PCB.
Description
Technical field
The utility model relates to a kind of copper-clad plate with high flatness structure, belongs to the circuit board material technical field of electronic technology.
Background technology
PCB is most important element inside all electronic systems, all IC elements all must be placed on above PCB, and along with electronic product is to light, thin, short and smallization development, packing density and the integrated level of electronic devices and components are more and more higher, and its installation trend is in particular in: 1, by the transformation of via Program instrumentation (THT) to surface mounting technique (SMT); 2, by the transformation of surface mounting technique (SMT) to wafer-level package (CSP).
The installation requirement of electronic devices and components also improves constantly the angularity of PCB and the requirement of flatness thereupon, be in particular in: 1, PCB surface treatment weldering (connection) dish coplanarity adds sternly gradually, the angularity of PCB requires from 1% to 0.7% again to 0.5%, even tighter; Surface smoothness is more strict, as size is less than 150*150mm
2the plate face irregularity degree of high density interconnect substrate require from 30 μm to 10 μm again to 5 μm.
Except PCB processing technology, can say that the warpage of PCB and flatness are determined by PCB copper-clad plate quality.Because copper-clad plate is composited by Copper Foil and prepreg, therefore, the structure of prepreg and quality directly affect the quality of copper-clad plate.The prepreg of prior art due to its unreasonable structure, therefore cause the flatness of copper-clad plate and that resist warping ability inadequate, have impact on processing and the dependability of PCB.
In prior art, the conventional method improving copper-clad plate planarization improves formula or processing technology, as added the less filler of the coefficients of expansion such as silica to reduce the generation of internal stress in formula, or by internal stress that repeatedly hot-pressing processing technique elimination part has produced.If add too much silica, product hardness increases, and increases PCB and adds the wearing and tearing of man-hour to drill bit, and while difficulty of processing increases, processing cost also obviously promotes; And hot-pressing processing repeatedly also can make the manufacturing cost of copper-clad plate significantly promote.
Utility model content
The purpose of this utility model is to provide a kind of copper-clad plate with high flatness structure, the toughness that tool is good and intensity, not easily warpage, smooth performance strong feature.
The purpose of this utility model can be achieved through the following technical solutions:
A kind of copper-clad plate with high flatness structure, by Copper Foil and prepreg superimposed hot-forming, described prepreg is made up of epoxy resin-base and some layers of electronic-grade glass fiber cloth, and described some layers of electronic-grade glass fiber cloth are distributed in epoxy resin-base and form sheet ductile layers structure; Copper Foil and prepreg is superimposed is hot pressed into integrative-structure, forms the copper-clad plate with high flatness structure.
The purpose of this utility model can also be achieved through the following technical solutions:
Further, mix ball shaped nano resin particle in epoxy resin-base, described ball shaped nano resin particle is evenly distributed in sheet ductile layers structure, forms that resist warping ductile structure.
Further, described Copper Foil and prepreg respectively have multilayer, and both interleaved are superimposed hot-forming, form the copper-clad plate that multilayer fabric has high flatness structure.
Further, after described prepreg applies the epoxy-resin systems of equally distributed nano spherical particle by electronic-grade glass fiber cloth, toast at 170 DEG C of-220 DEG C of temperature and obtain for 2-5 minute.
Further, described nano spherical particle is made up of preparing spherical SiO 2 nano particle or spherical alumina aluminum nanoparticles.
Further, the addition of described nano spherical particle is the 1%-5% of epoxy resin-base in mass.
Further, the one side of described prepreg arranges Copper Foil, forms the copper-clad plate that one side Copper Foil formula has high flatness structure; Or two of prepreg arrange Copper Foil, form the copper-clad plate that double-side copper foil has high flatness structure.
The utility model has following outstanding advantage and beneficial effect:
1, the prepreg that the utility model relates to is made up of epoxy resin-base and some layers of electronic-grade glass fiber cloth, and described some layers of electronic-grade glass fiber cloth are distributed in epoxy resin-base and form sheet ductile layers structure; Copper Foil and prepreg is superimposed is hot pressed into integrative-structure, therefore can improve toughness and the intensity of copper-clad plate, avoid warpage and the out-of-flatness of copper-clad plate, improve processing and the dependability of PCB.
2, in epoxy resin-base, ball shaped nano resin particle is mixed in preferred version of the present utility model, described ball shaped nano resin particle is evenly distributed in sheet ductile layers structure, form that resist warping ductile structure, nano spherical particle relies on its high specific area and epoxy resin to form strong physical bond power on the one hand, reduce the breathing of epoxy resin, thus reduce the generation of the stress between epoxy resin and glass fabric and Copper Foil; Simultaneously due to the spherical structure of itself, be conducive to absorption and the release of stress.Thus improve warpage and the out-of-flatness of copper-clad plate, improve processing and the dependability of PCB.This copper-clad plate simultaneously also possesses good toughness and intensity, shows excellent machining property.
Accompanying drawing explanation
Fig. 1 is embodiment one structural representation of the present utility model.
Fig. 2 is embodiment two structural representation of the present utility model.
Detailed description of the invention
Below in conjunction with accompanying drawing, the utility model is described in further detail.
Embodiment one
A kind of copper-clad plate with high flatness structure as shown in Figure 1, by Copper Foil 11 and prepreg 12 superimposed hot-forming, described prepreg 12 is made up of epoxy resin-base 13 and some layers of electronic-grade glass fiber cloth, and described some layers of electronic-grade glass fiber cloth are distributed in epoxy resin-base 13 and form sheet ductile layers structure; Copper Foil 11 and prepreg 12 is superimposed is hot pressed into integrative-structure, forms the copper-clad plate with high flatness structure.
In embodiment, the one side of described prepreg 12 arranges Copper Foil 11, forms the copper-clad plate that one side Copper Foil formula has high flatness structure; In epoxy resin-base 13, mix ball shaped nano resin particle 14, described ball shaped nano resin particle 14 is evenly distributed in sheet ductile layers structure, forms that resist warping ductile structure.Described nano spherical particle is made up of preparing spherical SiO 2 nano particle or spherical alumina aluminum nanoparticles.During making, the addition of nano spherical particle is the 1%-5% of epoxy resin-base in mass.Described prepreg 12 is applied the epoxy-resin systems of equally distributed nano spherical particle by electronic-grade glass fiber cloth after, can be 10-50kgf/cm at pressure
2, temperature is toast at 170 DEG C-220 DEG C to obtain for 2-5 minute.This obtained copper-clad plate has high flatness, improves processing and the dependability of PCB.This copper-clad plate simultaneously possesses good toughness and intensity, shows excellent machining property.
Embodiment two
The toughness copper-clad plate that a kind of height is as shown in Figure 2 smooth, described Copper Foil 11 and prepreg 12 respectively have multilayer, and both interleaved are superimposed hot-forming, form the copper-clad plate that multilayer fabric has high flatness structure.Specifically can be, two of prepreg 12 arrange Copper Foil 11, form the copper-clad plate that double-side copper foil has high flatness structure, and described copper foil layer 11 respectively hot pressing, at prepreg 12 upper surface and lower surface, forms one with prepreg 12.Described ball shaped nano resin particle dense distribution is full in the resin of sheet ductile layers.All the other the same embodiments.
Above embodiment is that preferred embodiment illustrates, can select Copper Foil and the prepreg of different-thickness and type as required.
Claims (3)
1. one kind has the copper-clad plate of high flatness structure, it is characterized in that: by Copper Foil (11) and prepreg (12) superimposed hot-forming, described prepreg (12) is made up of epoxy resin-base (13) and some layers of electronic-grade glass fiber cloth, and described some layers of electronic-grade glass fiber cloth are distributed in epoxy resin-base (13) and form sheet ductile layers structure; Copper Foil (11) and prepreg (12) is superimposed is hot pressed into integrative-structure, forms the copper-clad plate with high flatness structure.
2. a kind of copper-clad plate with high flatness structure according to claim 1, it is characterized in that: described Copper Foil (11) and prepreg (12) respectively have multilayer, both interleaved are superimposed hot-forming, form the copper-clad plate that multilayer fabric has high flatness structure.
3. a kind of copper-clad plate with high flatness structure according to claim 1, is characterized in that: the one side of described prepreg (12) arranges Copper Foil (11), forms the copper-clad plate that one side Copper Foil formula has high flatness structure; Or two of prepreg (12) arrange Copper Foil (11), form the copper-clad plate that double-side copper foil has high flatness structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420671456.6U CN204322635U (en) | 2014-11-11 | 2014-11-11 | A kind of copper-clad plate with high flatness structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420671456.6U CN204322635U (en) | 2014-11-11 | 2014-11-11 | A kind of copper-clad plate with high flatness structure |
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| Publication Number | Publication Date |
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| CN204322635U true CN204322635U (en) | 2015-05-13 |
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| CN201420671456.6U Active CN204322635U (en) | 2014-11-11 | 2014-11-11 | A kind of copper-clad plate with high flatness structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113635649A (en) * | 2021-08-17 | 2021-11-12 | 天长市京发铝业有限公司 | Copper-clad plate pressing method |
-
2014
- 2014-11-11 CN CN201420671456.6U patent/CN204322635U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113635649A (en) * | 2021-08-17 | 2021-11-12 | 天长市京发铝业有限公司 | Copper-clad plate pressing method |
| CN113635649B (en) * | 2021-08-17 | 2023-09-22 | 天长市京发铝业有限公司 | Copper-clad plate pressing method |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
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Address after: 526000 High-tech Industrial Park, Hengshan Town, Guangning County, Zhaoqing City, Guangdong Province (Workshop 1) Patentee after: Guangdong Yufeng Weihe New Materials Technology Co., Ltd. Address before: 526344 First Floor, Dongxiang Cement Co., Ltd., Nanjie Town, Guangning County, Zhaoqing City, Guangdong Province Patentee before: GUANGDONG HARVEST ELECTRONIC TECHNOLOGY CO., LTD. |