CN204230628U - A kind of compound laser cooling device - Google Patents
A kind of compound laser cooling device Download PDFInfo
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- CN204230628U CN204230628U CN201420538970.2U CN201420538970U CN204230628U CN 204230628 U CN204230628 U CN 204230628U CN 201420538970 U CN201420538970 U CN 201420538970U CN 204230628 U CN204230628 U CN 204230628U
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Abstract
The utility model discloses a kind of compound laser cooling device, comprise the hot transfer equipment of laser diode, be located at the thermo-electric cooling device of hot transfer equipment side, described thermo-electric cooling device is made up of some thermoelectric elements, complete heat in transfer equipment to be shifted to hot plate by cold drawing, thermo-electric cooling device side is provided with Control device of liquid cooling, described Control device of liquid cooling comprises the casing of hollow structure, the cooling bag of the static cooling fluid of the built-in storage of casing, the passage for flowing coolant flow is also provided with in cooling bag, to complete cooling fluid and the exchange heat between cooling fluid that flows in cooling bag.It is poor that this device overcomes conventional thermoelectric cooling device cooling-down effect, and Control device of liquid cooling complex structure and easy leakage problem, and structure is simple, good cooling effect, use procedure safety.
Description
Technical field
The utility model relates to a kind of laser cooling device, in particular, relates to the laser cooling device of a kind of compound thermoelectric-cooled and liquid cools.
Background technology
Semiconductor laser after a period of operation, laser diode can produce a large amount of heats, if heat distributes not in time, the work that high temperature can affect laser after accumulation after a while even or damage element, therefore laser usually and cooling device support the use.In prior art, the conventional type of cooling utilizes the airborne temperature of ventilating fan forced air supply, utilize the cooling of flowing cooling fluid heat exchange method, or after utilizing thermo-electric cooling device to derive heat, air natural cools, but efficiency that employing air draft is lowered the temperature is low, effect is poor, adopt the mode of working fluid heat-shift effective, but its apparatus structure is complicated, and easily there is leakage dangerous problem, it is better to hot plate one end effect by transfer of heat to adopt thermo-electric cooling device, but later use air natural cools, during long-time use, its cooling-down effect is also not obvious.
Summary of the invention
The utility model object is: the laser cooling device providing a kind of compound thermal electric cooling device and Control device of liquid cooling, it is poor that this device overcomes conventional thermoelectric cooling device cooling-down effect, and Control device of liquid cooling complex structure and easy leakage problem, structure is simple, good cooling effect, use procedure safety.
The technical solution of the utility model is:
A kind of compound laser cooling device, comprise the hot transfer equipment 322 being fixed on laser starting drive 310 side, also comprise the thermo-electric cooling device 323 being located at hot transfer equipment 322 side, described thermo-electric cooling device 323 is made up of some thermoelectric elements, described thermoelectric element comprises the cold drawing 101 contacted with described hot transfer equipment 322, the hot plate 107 be arranged in parallel with cold drawing 101, and the some semiconductors being positioned at connect cold drawing 101 and hot plate 107 between the two; Hot plate 107 side of described thermoelectric element is provided with Control device of liquid cooling 330, described Control device of liquid cooling 330 comprises the casing 331 of hollow and the lid 332 in order to cover casing 331 hollow space, the cooling bag 340 of the static cooling fluid of the built-in storage of hollow space of described casing 331, be provided with the passage for flowing coolant flow in described cooling bag 340, described passage two ends are respectively equipped with the flowing cooling liquid inlet 342a and outlet 342b that extend to described casing 331 outside.
Further, described thermo-electric cooling device 323 comprises 3 ~ 5 groups of thermoelectric elements.
Further, described thermoelectric element also comprises power supply 109, and described cold drawing 101 and hot plate 107 are alternately connected by 2 groups of N type semiconductors 103 and 2 groups of P type semiconductors 105 and formed electric loop, and under power supply 109 acts on, heat is shifted to hot plate by cold drawing.
Further, preferably, the cold drawing 101 of described thermoelectric element and hot plate 107 are by copper flat board.
Further, preferably, the cold drawing 101 of described thermoelectric element and hot plate 107 surface-coated heat conductive silica gel.
Further, preferably, the cold drawing 101 of described thermoelectric element and hot plate 107 surface paste one deck indium foil.
Further, preferably, described casing 331 and lid 332 made of aluminum.
Further, preferably, the casing 331 of described hot transfer equipment 322, Control device of liquid cooling 330 and lid 332 run through fixing by screw.
The utility model has the advantages that:
Compound laser cooling device of the present utility model, make use of the heat that heat conductivility good thermo-electric cooling device transfer laser diode produces, simultaneously under heat cooling device, be provided with the effective Control device of liquid cooling of transfer of heat, avoid conventional thermoelectric cooling device later use air natural and to cool the drawback of mode; The cooling bag that Control device of liquid cooling is arranged receives noncurrent cooling fluid, introducing flowing cooling fluid and carries out heat exchange, being not easy to occur leakage problem by being arranged on flowing cooling liquid inlet outside device, outlet and passage.Composite cooling apparatus structure is simple, good cooling results, use safety.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further described:
Fig. 1 is the compound cooling device structure chart of embodiment;
Fig. 2 is thermoelectric element structure chart in embodiment;
Fig. 3 is the decomposition chart of Control device of liquid cooling in embodiment;
Wherein: the common box 332a of 101-cold drawing 103-N type semiconductor 105-P type semiconductor 107-hot plate 109-power supply 310-laser starting drive 322-hot transfer equipment 323-thermo-electric cooling device 324-screw 330-Control device of liquid cooling 331-casing 332-lid 331a-, 332b, 332c, 332d, 333a, 333b, 333c, 333d, 334a, 334b-through hole 340-cooling bag 342a-cooling liquid inlet 342b-cooling liquid outlet.
Embodiment
Embodiment:
A kind of compound laser cooling device, its structure as shown in Figure 1, laser starting drive 310 is built-in with pyrotoxin laser diode, laser starting drive 310 is the fixing hot transfer equipment 322 producing heat in order to shift laser diode below, also comprise the thermo-electric cooling device 323 be positioned on the downside of hot transfer equipment 322, described thermo-electric cooling device 323 is by four groups of thermoelectric element 332a, 332b, 332c, 332d forms, described thermoelectric element comprises the cold drawing 101 and hot plate 107 that are arranged in parallel, and 4 semiconductors be positioned between the two, cold drawing 101 and hot plate 107 are made of copper flat structure, surface-coated one deck heat conductive silica gel, to make plate face uniform heat distribution, 4 semiconductors are 2 groups of N type semiconductors 103 and 2 groups of P type semiconductors 105, semiconductor is parallel to be evenly arranged between cold drawing 101 and hot plate 107, alternately series connection forms electric loop, access power supply 109, the heat made is shifted to hot plate 107 by cold drawing 101.Thermoelectric element structure as shown in Figure 2, in described thermo-electric cooling device 323, the cold drawing 101 of four groups of thermoelectric elements contacts with the hot transfer equipment 322 of above-mentioned laser diode, with the heat on heat of transfer transfer equipment 322 to hot plate 107, Control device of liquid cooling 330 is provided with on the downside of the hot plate 107 of described four groups of thermoelectric elements, described Control device of liquid cooling 330 comprises the casing 331 of aluminum hollow structure and the lid 332 for covering casing 331, the middle rectangular hollow structure of casing 331 is common box 331a, the built-in cooling bag 340 of common box 331a, cooling bag 340 is in order to seal static cooling fluid, cooling fluid is via the heat on hot plate 107 in casing 331 and lid 332 heat of transfer electric cooling device 323, cooling bag 340 inside is provided with passage, and passage two ends are provided with cooling liquid inlet 342a and outlet 342b, cooling liquid inlet 342a and outlet 342b by two through hole 334a on casing 331, and 334b extends to outside casing 331, described casing 331 and lid 332 are respectively equipped with four through hole 333a, 333b, 333c, 333d and 332a, 332b, 332c, 332d, the casing 331 of above-mentioned hot transfer equipment 322, Control device of liquid cooling 330 and lid 332 run through fixing by the screw 324 being positioned at corner by through hole, flowing cooling fluid enters the passage in cooling bag 340 via cooling liquid inlet 342a under external hydraulic pump effect, and flowed out by cooling liquid inlet 342b, complete exchange heat between flowing cooling fluid and cooling bag 340 interior static cooling fluid of receiving, heat shifts from cooling device the most at last, realizes cooling.
Certain above-described embodiment, only for technical conceive of the present utility model and feature are described, its object is to person skilled in the art can be understood content of the present utility model and implement according to this, can not limit protection range of the present utility model with this.All modifications done according to the Spirit Essence of the utility model main technical schemes, all should be encompassed within protection range of the present utility model.
Claims (8)
1. a compound laser cooling device, comprise the hot transfer equipment (322) being fixed on laser starting drive (310) side, it is characterized in that, also comprise the thermo-electric cooling device (323) being located at hot transfer equipment (322) side, described thermo-electric cooling device (323) is made up of some thermoelectric elements, described thermoelectric element comprises the cold drawing (101) contacted with described hot transfer equipment (322), the hot plate (107) be arranged in parallel with cold drawing (101), and be positioned at some semiconductors of cold drawing of connecting (101) and hot plate (107) between the two, hot plate (107) side of described thermoelectric element is provided with Control device of liquid cooling (330), described Control device of liquid cooling (330) comprises the casing (331) of hollow and the lid (332) in order to cover casing (331) hollow space, the cooling bag (340) of the static cooling fluid of the built-in storage of hollow space of described casing (331), the passage for flowing coolant flow is provided with in described cooling bag (340), described passage two ends are respectively equipped with and extend to the outside flowing cooling liquid inlet (342a) of described casing (331) and outlet (342b).
2. the compound laser cooling device of one according to claim 1, is characterized in that, described thermo-electric cooling device (323) comprises 3 ~ 5 groups of thermoelectric elements.
3. the compound laser cooling device of one according to claim 1, it is characterized in that, described thermoelectric element also comprises power supply (109), described cold drawing (101) and hot plate (107) are alternately connected by 2 groups of N type semiconductors (103) and 2 groups of P type semiconductors (105) and are formed electric loop, under power supply (109) effect, heat is shifted to hot plate by cold drawing.
4. the compound laser cooling device of one according to claim 1, is characterized in that, cold drawing (101) and the hot plate (107) of described thermoelectric element are by copper flat board.
5. the compound laser cooling device of one according to claim 1,2 or 3 any one, is characterized in that, the cold drawing (101) of described thermoelectric element and hot plate (107) surface-coated heat conductive silica gel.
6. the compound laser cooling device of one according to claim 1,2 or 3 any one, is characterized in that, cold drawing (101) and hot plate (107) surface of described thermoelectric element paste one deck indium foil.
7. the compound laser cooling device of one according to claim 1, is characterized in that, described casing (331) and lid (332) made of aluminum.
8. the compound laser cooling device of one according to claim 1, it is characterized in that, casing (331) and the lid (332) of described hot transfer equipment (322), Control device of liquid cooling (330) run through fixing by screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420538970.2U CN204230628U (en) | 2014-09-19 | 2014-09-19 | A kind of compound laser cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420538970.2U CN204230628U (en) | 2014-09-19 | 2014-09-19 | A kind of compound laser cooling device |
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| Publication Number | Publication Date |
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| CN204230628U true CN204230628U (en) | 2015-03-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420538970.2U Active CN204230628U (en) | 2014-09-19 | 2014-09-19 | A kind of compound laser cooling device |
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| CN (1) | CN204230628U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109586164A (en) * | 2018-12-24 | 2019-04-05 | 西安工程大学 | The cooling system and its control method of high power semiconductor lasers |
-
2014
- 2014-09-19 CN CN201420538970.2U patent/CN204230628U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109586164A (en) * | 2018-12-24 | 2019-04-05 | 西安工程大学 | The cooling system and its control method of high power semiconductor lasers |
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