CN105355608A - High-precision temperature control device for laser - Google Patents
High-precision temperature control device for laser Download PDFInfo
- Publication number
- CN105355608A CN105355608A CN201510923694.0A CN201510923694A CN105355608A CN 105355608 A CN105355608 A CN 105355608A CN 201510923694 A CN201510923694 A CN 201510923694A CN 105355608 A CN105355608 A CN 105355608A
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- temperature
- thermoelectric module
- radiating fin
- uniforming plate
- laser
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
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- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Lasers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a technical scheme of a high-precision temperature control device for a laser. According to the scheme, the device comprises a thermoelectric refrigeration sheet, a temperature equilibrium plate, a thermocouple, a heat-radiation fin and an axial fan; and a cold face of the thermoelectric refrigeration sheet is attached to a heat sink, a hot end of the thermoelectric refrigeration sheet is attached to one face of the temperature equilibrium plate, the temperature equilibrium plate is attached to the bottom face, close to the thermoelectric refrigeration sheet, of the temperature equilibrium plate, and the other face of the temperature equilibrium plate is provided with the heat-radiation fin and the axial fan. According to the scheme, the device has the advantages of high temperature control precision, high environment adaptability and the compact size, and the device is suitable for multiple mobile platforms and can be suitable for different heat sources.
Description
Technical field
What the present invention relates to is laser technique application, the accurate attemperating unit of especially a kind of laser.
Background technology
With the lifting of laser performance, the applied environment also wide spread of laser, increasing motor platform, comprises aircraft, automobile, steamer etc. and proposes equipped demand to laser.The operation platform strong in these independence, use flexibility ratio is high, applied environment is comparatively harsh, the volume of laser, weight, power consumption are subject to very strict restriction, meanwhile, what the temperature fluctuation of laser pumping module can directly affect laser goes out light quality, and being applicable to the accurate temperature control technology of multi-platform laser becomes one of key factor of restriction laser serviceability lifting.
Air blast cooling cooling technology, particularly the air-cooled cooling technology of the plate-fin of board fin is due to its compact conformation, easy to use, be widely deployed in the cooling of avionic device, in general, the electronic devices and components that fan-cooled radiator is little for some dissipation powers, density of heat flow rate is less, can meet cooling requirements under being no more than the condition of about 40 DEG C in cooling-air temperature rise.And for the heat radiation of high heat flux, ideally adopt the mode of liquid cools to carry out, but in avionic device, often do not possess the condition using liquid cools, the such as baby plane such as fighter plane, helicopter, because it is to the restriction of volume and weight, there is provided the condition of liquid cooling more difficult, air-cooled mode can only be adopted to dispel the heat.
Semiconductor refrigerating is also called thermoelectric cooling (Thermoelectriccooler), thermoelectric cooling is used as power with electric energy, to moor the conversion process of energy based on your note effect, semiconductor refrigeration system structure is simple, without the need to cold-producing medium, pollution-free, start fast, control flexibly, control precision is high, all can work under weightlessness and overweight state, and refrigeration heating can switch flexibly.
Temperature-uniforming plate is a kind of heat-transferring assembly of efficient high heat flux, and temperature-uniforming plate is a plate-like structure, and shell encloses porous material, and certain working medium is filled in the inside.Heat in temperature-uniforming plate bottom center, larger density of heat flow rate can be diffused into the surface of whole temperature-uniforming plate by the evaporation of working medium and condensation, realize diminishing of density of heat flow rate, because its flow direction is all dimensions in space, therefore temperature-uniforming plate is more excellent than the performance of general heat pipe.
Summary of the invention
Object of the present invention, be exactly for the deficiency existing for prior art, and the technical scheme of the accurate attemperating unit of a kind of laser is provided, program volume compact, accuracy of temperature control be high, be applicable to multiple motor platform, be applicable to the laser of different heat load, extensibility is good, under varying environment and condition, laser cooling requirements can both be met.
This programme is achieved by the following technical measures:
The accurate attemperating unit of a kind of laser, comprises thermoelectric module, temperature-uniforming plate, thermocouple, radiating fin and aerofoil fan; Thermoelectric module huyashi-chuuka (cold chinese-style noodles) is fitted by heat conduction elargol and heat sink surface; Thermoelectric module hot side is by fitting with temperature-uniforming plate lower surface metalization; Thermocouple is fitted by tin lead welding and temperature-uniforming plate lower surface; Radiating fin and temperature-uniforming plate upper surface are fitted by the mode of tin lead welding; Axial flow blower is communicated with radiating fin by installing firm banking on radiating fin.
Preferred as this programme: thermoelectric module huyashi-chuuka (cold chinese-style noodles) refrigeration work consumption is according to formula Q
c=Q
rcalculate, wherein Q
cfor thermoelectric module huyashi-chuuka (cold chinese-style noodles) refrigeration work consumption, Q
rfor heat sink heating power, huyashi-chuuka (cold chinese-style noodles) surface heat conduction elargol thermal conductivity is 3w/m ﹒ K ~ 5w/m ﹒ K.
Preferred as this programme: thermoelectric module hot side heating power is according to formula Q
h=Q
c+ VI calculates, wherein Q
hfor thermoelectric module hot side heating power, Q
cfor thermoelectric module huyashi-chuuka (cold chinese-style noodles) refrigeration work consumption, V is thermoelectric module voltage, and I is thermoelectric module electric current, and thermoelectric module hot side is fitted with temperature-uniforming plate lower surface by argentalium weldering metallization, layer thickness is 0.5mm, and temperature-uniforming plate thermal conductivity is 18000w/m ﹒ K ~ 20000w/m ﹒ K.
Preferred as this programme: temperature-uniforming plate housing adopts aluminium design, and upper-lower casing is welded by ultrasonic waves, and inner capillary structure adopts sintering, and internal working fluid filling methyl alcohol, power density is greater than 20W/cm
2.
Preferred as this programme: temperature transducer sensitivity is 1 μ A/K, and between thermocouple and temperature-uniforming plate, the solder thickness of tin lead welding is 0.3mm.
Preferred as this programme: radiating fin area of dissipation demand is according to formula
calculate, wherein Q
hfor thermoelectric module hot side heating power, σ is air blast cooling cooling fin surfaces thermal transmission coefficient, t
1for the mean temperature of radiating fin, t
2for ambient temperature, between radiating fin and temperature-uniforming plate, tin lead welding solder thickness is 0.2mm, and the concrete shape of radiating fin can adjust flexibly according to the actual enveloping space of attemperating unit.
Preferred as this programme: aerofoil fan air quantity demand is according to formula
calculate, wherein Q
hfor thermoelectric module hot side heating power, ρ is atmospheric density, C
pfor heat capacity of air, Δ T is turnover radiating fin Air Temperature Difference.
The beneficial effect of this programme can be learnt according to describing of such scheme, and due to the accurate Temp. control method of laser in this scenario, carry out temperature control to heat sink after utilizing thermoelectric module to be energized, temperature-controlled precision is high; Temperature-uniforming plate is utilized to reduce thermoelectric module density of heat flow rate; Thermocouple is utilized to monitor thermoelectric module end face temperature; Radiating fin is coordinated to dispel the heat to temperature-uniforming plate by axial flow blower, volume compact; Improve heat radiation power by the area of dissipation increasing radiating fin, the laser of applicable different heat load, extensibility is good.
As can be seen here, the present invention compared with prior art, has substantive distinguishing features and progress, and its beneficial effect implemented also is apparent.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
In figure, 1 is thermoelectric module, and 2 is temperature-uniforming plate, and 3 is radiating fin, and 4 is axial flow blower, and 5 is thermocouple.
Embodiment
All features disclosed in this specification, or the step in disclosed all methods or process, except mutually exclusive feature and/or step, all can combine by any way.
Arbitrary feature disclosed in this specification (comprising any accessory claim, summary and accompanying drawing), unless specifically stated otherwise, all can be replaced by other equivalences or the alternative features with similar object.That is, unless specifically stated otherwise, each feature is an example in a series of equivalence or similar characteristics.
Embodiment 1
Select laser, heat load 40W, under ambient temperature 60 DEG C of conditions, require to control heat sink temperature 25 DEG C ~ 30 DEG C, temperature-controlled precision ± 0.5 DEG C.Select high-power thermoelectric module, overall dimension is 55mm × 55mm × 3.5mm, temperature difference t when being 60 DEG C, and refrigerating capacity is 50W, and be ensure refrigerating capacity, now thermoelectric module hot-side temperature should control below 85 DEG C, and calculating required radiating fin area of dissipation is 0.2m
2, Air Quantity Required is 62.64m
3/ h (37CFM), adopt fin thickness 0.2mm, wing spacing is the radiator of 1mm, adopt aviation-grade LMB (Air France) blower fan OPTIFAN44 model, rotating speed 32.000rpm, adopt temperature-uniforming plate to be of a size of 145mm × 65mm × 5mm, adopt temperature transducer model to be AD590, temperature control system overall dimensions is 145mm × 65mm × 50mm.
Start laser works simultaneously, thermoelectric module energising carries out refrigeration temperature control to heat sink, temperature transducer Real-Time Monitoring thermoelectric module hot-side temperature, when thermoelectric module hot-side temperature is close to 85 DEG C, start blower fan, air blast cooling is carried out to fin, makes thermoelectric module maintain 85 DEG C ~ 87 DEG C.
Through the present embodiment operation, under ambient temperature 60 DEG C of conditions, laser can non-stop run continuously, laser thermal sediment surface temperature control scope 25 DEG C ~ 30 DEG C, temperature-controlled precision ± 0.5 DEG C.
Embodiment 2
Select laser, heat load 40W, under ambient temperature-45 DEG C of conditions, require to control heat sink temperature 25 DEG C ~ 30 DEG C, temperature-controlled precision ± 0.5 DEG C.Select the attemperating unit identical with example 1.
Before starting laser works, lead to the electric current contrary with example 1 to thermoelectric module, now the cold and hot end switch of thermoelectric module, the former cold junction to heat sink refrigerating becomes heat sink heating, and make heat sink rapid temperature increases, meanwhile, normally working for maintaining thermoelectric module, starting blower fan and temperature control is carried out to thermoelectric module, when heat sink temperature rises to 25 DEG C, laser is started working, and adjustment thermoelectric module electric current, makes whole system be in thermal equilibrium state.
Through the present embodiment operation, under ambient temperature-45 DEG C of conditions, laser machine can non-stop run continuously, laser thermal sediment surface temperature control scope 23 DEG C ~ 25 DEG C, temperature-controlled precision ± 0.3 DEG C.The present invention is not limited to aforesaid embodiment.The present invention expands to any new feature of disclosing in this manual or any combination newly, and the step of the arbitrary new method disclosed or process or any combination newly.
Claims (7)
1. the accurate attemperating unit of laser, is characterized in that: comprise thermoelectric module, temperature-uniforming plate, thermocouple, radiating fin and aerofoil fan; Described thermoelectric module huyashi-chuuka (cold chinese-style noodles) is fitted by heat conduction elargol and heat sink surface; Described thermoelectric module hot side is by fitting with temperature-uniforming plate lower surface metalization; Described thermocouple is fitted by tin lead welding and temperature-uniforming plate lower surface; Described radiating fin and temperature-uniforming plate upper surface are fitted by the mode of tin lead welding; Described axial flow blower is communicated with radiating fin by installing firm banking on radiating fin.
2. the accurate attemperating unit of a kind of laser according to claim 1, is characterized in that: described thermoelectric module huyashi-chuuka (cold chinese-style noodles) refrigeration work consumption is according to formula Q
c=Q
rcalculate, wherein Q
cfor thermoelectric module huyashi-chuuka (cold chinese-style noodles) refrigeration work consumption, Q
rfor heat sink heating power, huyashi-chuuka (cold chinese-style noodles) surface heat conduction elargol thermal conductivity is 3w/m ﹒ K ~ 5w/m ﹒ K.
3. the accurate attemperating unit of a kind of laser according to claim 1, is characterized in that: described thermoelectric module hot side heating power is according to formula Q
h=Q
c+ VI calculates, wherein Q
hfor thermoelectric module hot side heating power, Q
cfor thermoelectric module huyashi-chuuka (cold chinese-style noodles) refrigeration work consumption, V is thermoelectric module voltage, and I is thermoelectric module electric current, and thermoelectric module hot side is fitted with temperature-uniforming plate lower surface by argentalium weldering metallization, layer thickness is 0.5mm, and temperature-uniforming plate thermal conductivity is 18000w/m ﹒ K ~ 20000w/m ﹒ K.
4. the accurate attemperating unit of a kind of laser according to claim 1, it is characterized in that: described temperature-uniforming plate housing adopts aluminium design, and upper-lower casing is welded by ultrasonic waves, and inner capillary structure adopts sintering, internal working fluid filling methyl alcohol, power density is greater than 20W/cm
2.
5. the accurate attemperating unit of a kind of laser according to claim 1, it is characterized in that: described temperature transducer sensitivity is 1 μ A/K, between thermocouple and temperature-uniforming plate, the solder thickness of tin lead welding is 0.3mm.
6. the accurate attemperating unit of a kind of laser according to claim 1, is characterized in that: described radiating fin area of dissipation demand is according to formula
calculate, wherein Q
hfor thermoelectric module hot side heating power, σ is air blast cooling cooling fin surfaces thermal transmission coefficient, t
1for the mean temperature of radiating fin, t
2for ambient temperature, between radiating fin and temperature-uniforming plate, tin lead welding solder thickness is 0.2mm, and the shape of radiating fin can adjust flexibly according to the actual enveloping space of attemperating unit.
7. the accurate attemperating unit of a kind of laser according to claim 1, is characterized in that: described aerofoil fan air quantity demand is according to formula
calculate, wherein Q
hfor thermoelectric module hot side heating power, ρ is atmospheric density, C
pfor heat capacity of air, Δ T is turnover radiating fin Air Temperature Difference.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510923694.0A CN105355608A (en) | 2015-12-14 | 2015-12-14 | High-precision temperature control device for laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510923694.0A CN105355608A (en) | 2015-12-14 | 2015-12-14 | High-precision temperature control device for laser |
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| Publication Number | Publication Date |
|---|---|
| CN105355608A true CN105355608A (en) | 2016-02-24 |
Family
ID=55331547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510923694.0A Pending CN105355608A (en) | 2015-12-14 | 2015-12-14 | High-precision temperature control device for laser |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108346965A (en) * | 2018-04-08 | 2018-07-31 | 北京华宇德信光电技术有限公司 | A kind of semiconductor refrigerating chip temperature control device for laser |
| CN108879313A (en) * | 2018-08-10 | 2018-11-23 | 北京工业大学 | A kind of pump unit and radiator |
| CN109374257A (en) * | 2018-11-16 | 2019-02-22 | 苏州伊欧陆系统集成有限公司 | A kind of edge-emitting laser test high/low temperature and constant temperature use chucking appliance system |
| CN113764963A (en) * | 2021-07-19 | 2021-12-07 | 中国兵器装备研究院 | Fiber laser device thermal control management device and fiber laser |
Citations (5)
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| US20030183839A1 (en) * | 2002-03-26 | 2003-10-02 | Masayoshi Yamashita | Thermoelectric module |
| CN1953219A (en) * | 2005-10-21 | 2007-04-25 | 贸达世生医科技股份有限公司 | Light source generator of medical device |
| CN101532657A (en) * | 2008-03-13 | 2009-09-16 | 富士迈半导体精密工业（上海）有限公司 | Illuminating apparatus |
| CN202888236U (en) * | 2012-10-22 | 2013-04-17 | 厦门乾球光电科技有限公司 | High-efficiency radiating high-power light-emitting diode (LED) |
| CN205319145U (en) * | 2015-12-14 | 2016-06-15 | 中国工程物理研究院应用电子学研究所 | Accurate temperature control device of laser instrument |
-
2015
- 2015-12-14 CN CN201510923694.0A patent/CN105355608A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030183839A1 (en) * | 2002-03-26 | 2003-10-02 | Masayoshi Yamashita | Thermoelectric module |
| CN1953219A (en) * | 2005-10-21 | 2007-04-25 | 贸达世生医科技股份有限公司 | Light source generator of medical device |
| CN101532657A (en) * | 2008-03-13 | 2009-09-16 | 富士迈半导体精密工业（上海）有限公司 | Illuminating apparatus |
| CN202888236U (en) * | 2012-10-22 | 2013-04-17 | 厦门乾球光电科技有限公司 | High-efficiency radiating high-power light-emitting diode (LED) |
| CN205319145U (en) * | 2015-12-14 | 2016-06-15 | 中国工程物理研究院应用电子学研究所 | Accurate temperature control device of laser instrument |
Non-Patent Citations (1)
| Title |
|---|
| 马广青: "基于热管散热器的半导体制冷箱冷热端传热特性研究", 《中国优秀硕士学位论文全文数据库》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108346965A (en) * | 2018-04-08 | 2018-07-31 | 北京华宇德信光电技术有限公司 | A kind of semiconductor refrigerating chip temperature control device for laser |
| CN108879313A (en) * | 2018-08-10 | 2018-11-23 | 北京工业大学 | A kind of pump unit and radiator |
| CN109374257A (en) * | 2018-11-16 | 2019-02-22 | 苏州伊欧陆系统集成有限公司 | A kind of edge-emitting laser test high/low temperature and constant temperature use chucking appliance system |
| CN113764963A (en) * | 2021-07-19 | 2021-12-07 | 中国兵器装备研究院 | Fiber laser device thermal control management device and fiber laser |
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Application publication date: 20160224 |
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