CN109586164A - The cooling system and its control method of high power semiconductor lasers - Google Patents
The cooling system and its control method of high power semiconductor lasers Download PDFInfo
- Publication number
- CN109586164A CN109586164A CN201811582848.4A CN201811582848A CN109586164A CN 109586164 A CN109586164 A CN 109586164A CN 201811582848 A CN201811582848 A CN 201811582848A CN 109586164 A CN109586164 A CN 109586164A
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- liquid
- radiating block
- high power
- power semiconductor
- semiconductor lasers
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses the cooling systems of high power semiconductor lasers, including liquid reserve tank, liquid metal is stored in liquid reserve tank, one end of liquid reserve tank is connected with liquid suction pipe, the other end of liquid reserve tank is connected with liquid metal electromagnetic pump and liquid pushing tube in turn, it is connected between liquid suction pipe and liquid pushing tube by radiator, is provided with liquid suction pipe cooling fin on liquid suction pipe, liquid reserve tank cooling fin is provided on liquid reserve tank.High power semiconductor lasers cooling system of the present invention can not only realize temperature with high efficiency to high power semiconductor lasers, while replace traditional mechanical pump to provide cooling power source to high power semiconductor lasers by electromagnetic pump using liquid metal；Of simple structure and low cost, the abrasion small and operational safety, stabilization of liquid metal electromagnetic pump.
Description
Technical field
The invention belongs to technical field of heat dissipation, and in particular to the cooling system of high power semiconductor lasers, the present invention is also
It is related to the control method of cooling system.
Background technique
For semiconductor laser as a kind of solid-state laser, application field is that comparison is extensive.But semiconductor laser
Amount of heat can be also generated while generating laser, the radiator of existing semiconductor laser mostly uses greatly a kind of mode
It radiates, i.e., is radiated by cooling fin, but the heat radiation density of cooling fin is small, and has a large amount of heat to be discharged into air
In, increase the temperature around semiconductor laser sharply；When especially with high power semiconductor lasers, because its power compared with
Greatly, the heat of generation is more, and cooling fin is difficult continued down；In order to reduce temperature, may be selected to increase fan on a heat sink；But
The working environment of semiconductor laser is closed, although the wind of radiator fan blowout can take away heat immediately, but with
Temperature in confined space increases, and the heat dissipation dynamics of radiator fan is also smaller and smaller.
And by semiconductor laser in conjunction with water-cooling structure, although can cool down, there is also following problems: (1) water cooling
Structure need to mechanical pump cooperating, but with the accumulation of time, mechanical pump can because wear it is very fast due to cause total to be paralysed；
(2) density of high power semiconductor lasers is big, and heat dissipation dynamics is also strong, with the accumulation of time, when temperature reaches the boiling point of water
When can directly result in the damage of entire radiator structure and semiconductor laser.
Therefore, the radiator of existing semiconductor laser also needs further to improve.
Summary of the invention
The object of the present invention is to provide a kind of cooling systems of high power semiconductor lasers, solve high power semi-conductor
The problem of laser is difficult continued down in use and heat dissipation is relatively slow and mechanical pump serious wear.
It is the cooling system of high power semiconductor lasers that the present invention, which uses a kind of technical solution, including liquid reserve tank,
Liquid metal is stored in liquid reserve tank, one end of liquid reserve tank is connected with liquid suction pipe, and the other end of liquid reserve tank is connected with liquid in turn
Metal electromagnetic pump and liquid pushing tube are connected between liquid suction pipe and liquid pushing tube by radiator, and liquid suction pipe is provided on liquid suction pipe and is dissipated
Backing is provided with liquid reserve tank cooling fin on liquid reserve tank.
The features of the present invention also characterized in that:
Radiator includes radiating block a, is provided with cavity in radiating block a, the both ends of radiating block a respectively with liquid suction pipe and give
Liquid pipe connection, the upper surface of radiating block a are provided at least two cooling fin a, and the lower surface of radiating block a is provided with semiconductor refrigerating
Piece a.
Radiator further includes the radiating block b being oppositely arranged with radiating block a, and cavity, radiating block b are provided in radiating block b
Both ends connect respectively with liquid suction pipe and liquid pushing tube, the lower surface of radiating block b is provided at least two cooling fin b, radiating block b's
Upper surface is provided with semiconductor chilling plate b, and semiconductor chilling plate a is correspondingly arranged with semiconductor chilling plate b.
The both ends of radiating block a and radiating block b are respectively arranged with the pipeline intake of U-shaped liquor charging branch pipe and U-shaped drawing liquid branch pipe,
It is provided with the pipeline intake of liquid pushing tube on U-shaped liquor charging branch pipe, the pipeline intake of liquid suction pipe is provided on U-shaped drawing liquid branch pipe,
The ipsilateral of radiating block a and radiating block b is connected between liquid pushing tube by U-shaped liquor charging branch pipe, and radiating block a and radiating block b's is another
It is ipsilateral to be connected between liquid suction pipe by U-shaped drawing liquid branch pipe.
Liquid metal electromagnetic pump includes inner tube, and the outer sheath of inner tube is equipped with outer tube, and the lower outside of outer tube is arranged with electromagnetism
Coil block, electromagnetic coil assembly are connected with AC power source by transformer, and the bottom of outer tube is connected with heater holder, heater
Be provided with electrical bar slot in seat, be provided with electrical bar in electrical bar slot, electrical bar is connected with controller, heater holder it is outer
Side is arranged with outer cover, and outer cover is connected with the bottom of electromagnetic coil assembly.
Electromagnetic coil assembly includes coil rack, and coil rack is set in the outside of outer tube, is wound with electricity on coil rack
Magnetic coil.
The both ends of inner tube communicate, and the top of inner tube extends to the top end of outer tube, and the top of inner tube is the pump of trumpet type
Outlet, outer tube are disposed radially dilatation chamber close to the position at top, and pump intake is arranged in the side of dilatation chamber.
Another technical solution adopted in the present invention is that the controlling party of the cooling system of high power semiconductor lasers
Method, which is characterized in that be specifically implemented according to the following steps:
High power semiconductor lasers are placed between semiconductor chilling plate a and semiconductor chilling plate b by step 1, then
It is separately turned on AC power source and controller；
After step 2, energization, the liquid metal in liquid reserve tank is pumped into liquid pushing tube by liquid metal electromagnetic pump 3, liquid metal
Followed by U-shaped liquor charging branch pipe, radiating block a and radiating block b, U-shaped drawing liquid branch pipe and liquid suction pipe, liquid reserve tank is finally flowed back into；
Step 3 repeats step 2, until high power semiconductor lasers are cooled to required temperature.
The features of the present invention also characterized in that:
In step 3, if the temperature of high power semiconductor lasers is lower than required temperature, controller starts electrical bar to liquid
State metal is preheated, until getting warm again after a cold spell high power semiconductor lasers to required temperature, controller disconnection electrical bar.
The cooling system of high power semiconductor lasers of the present invention has at least the following advantages:
(1), semiconductor chilling plate a is used for the refrigeration cool-down of high power semiconductor lasers upper surface, and radiating block a is for half
The conduction of conductor cooling piece a heat distributes；Refrigeration of the semiconductor chilling plate b for high power semiconductor lasers lower surface drops
Temperature, conduction of the radiating block b for semiconductor chilling plate b heat distribute；The synergistic effect of radiating block and semiconductor chilling plate is effective
Reduce the temperature of high power semiconductor lasers；
(2), cooling system of the invention is jointly real by U-shaped liquor charging branch pipe, liquid pushing tube, U-shaped drawing liquid branch pipe and liquid suction pipe
Liquid metal circulation in existing radiating block a and radiating block b enhances to take away the heat of radiating block a and radiating block b to big function
The heat spreading function of rate semiconductor laser；
(3), the electromagnetic coil assembly in the present invention in liquid metal electromagnetic pump and alternating-current power supply are connected directly；In electromagnetism
After coil block is powered, magnetic field can be formed in inner and outer tubes respectively, liquid metal is driven to enter inner tube by the entrance of electromagnetic pump,
It is finally pumped out straight up by the outlet of electromagnetic pump, and then realizes that the liquid metal between liquid pushing tube and liquid suction pipe recycles, thus
Reduce the temperature of high power semiconductor lasers；The outer tube of liquid metal electromagnetic pump is made of un-conducted magnetic material, and inner tube is by magnetic conduction
Material is made, of simple structure and low cost, abrasion small and operational safety, stabilization；And liquid metal is not also deposited at normal temperature
In the risk of boiling.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the cooling system of high power semiconductor lasers of the present invention；
Fig. 2 is the structural schematic diagram of electromagnetic pump of the invention；
Fig. 3 is the working principle diagram of electromagnetic pump of the invention.
In figure, 1. liquid reserve tanks, 2. liquid reserve tank cooling fins, 3. liquid metal electromagnetic pumps, 4. liquid pushing tubes, 5.U type liquor charging branch pipe,
6. radiating block a, 7. cooling fin a, 8. semiconductor chilling plate a, 9. radiating block b, 10. cooling fin b, 11. semiconductor chilling plate b, 12.
Liquid suction pipe, 13.U type drawing liquid branch pipe, 14. liquid suction pipe cooling fins, 15. high power semiconductor lasers；
301. inner tubes, 302. outer tubes, 303. electromagnetic coils, 304. electrical bars, 305. electrical bar slots, 306. heaters
Seat, 307. outer covers, 308. coil racks, 309. electromagnetic coil assemblies, 310. dilatation chambers.
Specific embodiment
The following describes the present invention in detail with reference to the accompanying drawings and specific embodiments.
The cooling system of high power semiconductor lasers of the present invention, structure is as shown in Figure 1, include liquid reserve tank 1, liquid reserve tank 1
Inside store liquid metal, liquid metal is gallium or gallium alloy, and one end of liquid reserve tank 1 is connected with liquid suction pipe 12, liquid reserve tank 1 it is another
One end is connected with liquid metal electromagnetic pump 3 and liquid pushing tube 4 in turn, is connected between liquid suction pipe 12 and liquid pushing tube 4 by radiator.
Radiator includes radiating block a6, is provided with cavity in radiating block a6, the both ends of radiating block a6 respectively with liquid suction pipe
12 and liquid pushing tube 4 connect, the upper surface of radiating block a6 is provided at least two cooling fin a7, and the lower surface of radiating block a6 is provided with
Semiconductor chilling plate a8；Radiator further includes the radiating block b9 being oppositely arranged with radiating block a6, and setting is free in radiating block b9
Chamber, the both ends of radiating block b9 are connect with liquid suction pipe 12 and liquid pushing tube 4 respectively, and the lower surface of radiating block b9 is provided at least two and dissipates
Backing b10, the upper surface of radiating block b9 are provided with semiconductor chilling plate b11, semiconductor chilling plate a8 and semiconductor chilling plate b11
It is correspondingly arranged, high power semiconductor lasers 15 is placed between semiconductor chilling plate a8 and semiconductor chilling plate b11；Semiconductor system
Cold a8 is used for the refrigeration cool-down of 15 upper surface of high power semiconductor lasers, and radiating block a6 is used for semiconductor chilling plate a8 heat
Conduction distribute；Semiconductor chilling plate b11 is used for the refrigeration cool-down of 15 lower surface of high power semiconductor lasers, and radiating block b9 is used
It is distributed in the conduction of semiconductor chilling plate b11 heat；
The both ends of radiating block a6 and radiating block b9 are respectively arranged with U-shaped liquor charging branch pipe 5 and the pipeline of U-shaped drawing liquid branch pipe 13 draws
Entrance is provided with the pipeline intake of liquid pushing tube 4 on U-shaped liquor charging branch pipe 5, is provided with liquid suction pipe 12 on U-shaped drawing liquid branch pipe 13
It is connected between the ipsilateral and liquid pushing tube 4 of pipeline intake, radiating block a6 and radiating block b9 by U-shaped liquor charging branch pipe 5, radiating block a6
And radiating block b9's is another ipsilateral connected by U-shaped drawing liquid branch pipe 13 between liquid suction pipe 12；Drawing liquid is provided on liquid suction pipe 12
Pipe cooling fin 14, liquid suction pipe cooling fin 14 cool down for liquid suction pipe 12；Liquid reserve tank cooling fin 2, liquid reserve tank are provided on liquid reserve tank 1
Cooling fin 2 is used for the cooling of liquid reserve tank 1；Liquor charging branch pipe 5, liquid pushing tube 4, drawing liquid branch pipe 13 and liquid suction pipe 12 realize heat dissipation jointly
Liquid metal circulation in block a6 and radiating block b9 enhances to take away the heat of radiating block a6 and radiating block b9 to high-power
The heat spreading function of semiconductor laser 15；
As shown in Fig. 2, liquid metal electromagnetic pump 3 includes inner tube 301, the outer sheath of inner tube 301 is equipped with outer tube 302, inner tube
Gap between 301 and outer tube 302 is not more than 10mm, and the lower outside of outer tube 302 is arranged with electromagnetic coil assembly 309, electromagnetism
Coil block 309 includes coil rack 308, and coil rack 308 is set in the outside of outer tube 302, is wound on coil rack 308
Electromagnetic coil 303, electromagnetic coil 303 are connected with AC power source by transformer, and the voltage of AC power source is not more than 36V, outer tube
302 bottom is connected with heater holder 306, and electrical bar slot 305 is provided in heater holder 306, is set in electrical bar slot 305
Be equipped with electrical bar 304, electrical bar 304 is connected with controller, and the outer sheath of heater holder 306 is equipped with outer cover 307, outer cover 307 with
The bottom of electromagnetic coil assembly 309 is connected；The both ends of inner tube 301 communicate, and the top of inner tube 301 extends to the top of outer tube 302
It is pump discharge at top, the top of inner tube 301 is horn mouth, and outer tube 302 is disposed radially dilatation chamber close to the position at top
310, pump intake is arranged in the side of dilatation chamber 310；The working principle of liquid metal electromagnetic pump 3 is as shown in figure 3, electromagnetic coil assembly
309 are connected directly with AC power source, after the energization of electromagnetic coil assembly 309, can form magnetic in inner tube 301 and outer tube 302 respectively
, and then drive liquid metal by entering inner tube 301 after the entering of liquid metal electromagnetic pump 3, finally by liquid metal electromagnetic pump 3
Outlet pumps out straight up, and the liquid metal between liquid pushing tube 4 and liquid suction pipe 12 is pushed to recycle；Wherein, electrical bar 304 is for adding
Hot liquid metal, it is ensured that liquid metal temperature in entire circulation is constant.
The invention also discloses the control methods of the cooling system of above-mentioned high power semiconductor lasers, specifically according to following
Step is implemented:
High power semiconductor lasers (15) are placed into semiconductor chilling plate a (8) and semiconductor chilling plate b by step 1
(11) between, AC power source and controller are then separately turned on；
After step 2, energization, the liquid metal in liquid reserve tank (1) is pumped into liquid pushing tube (4) by liquid metal electromagnetic pump 3, liquid
State metal is followed by U-shaped liquor charging branch pipe (5), radiating block a (6) and radiating block b (9), U-shaped drawing liquid branch pipe (13) and liquid suction pipe
(12), liquid reserve tank (1) is finally flowed back into；
Its principle is that can form magnetic field in inner tube 301 and outer tube 302 respectively, and then drive after electromagnetic coil assembly 309 is powered
Dynamic liquid metal enters inner tube 301 from the entrance of liquid metal electromagnetic pump 3, then is pumped into and send from the outlet of liquid metal electromagnetic pump 3
Liquid pipe 4, liquid metal flow separately through radiating block a6 and radiating block b9 by U-shaped liquor charging branch pipe 5, semiconductor chilling plate a8 with partly lead
Body cooling piece b11 carries out refrigeration cool-down to the upper and lower surface of high power semiconductor lasers 15 simultaneously, and dissipating on radiating block a6
Backing a7 takes away the heat on semiconductor chilling plate a8 with the flowing of liquid metal, the cooling fin b10 on radiating block b9 with
The heat on semiconductor chilling plate b11 is taken away in the flowing of liquid metal, and then liquid metal is again successively from U-shaped 13 He of drawing liquid branch pipe
Liquid suction pipe 12 flows back in liquid reserve tank 1；
Step 3 repeats step 2, until high power semiconductor lasers (15) are cooled to required temperature；
Wherein, if the temperature of high power semiconductor lasers (15) is lower than required temperature, controller starts electrical bar
(304) liquid metal is preheated, arrives required temperature until high power semiconductor lasers (15) are got warm again after a cold spell, controller disconnects
Electrical bar (304).
Claims (9)
1. the cooling system of high power semiconductor lasers, which is characterized in that including liquid reserve tank (1), storage in the liquid reserve tank (1)
There is liquid metal, one end of the liquid reserve tank (1) is connected with liquid suction pipe (12), and the other end of the liquid reserve tank (1) successively connects
It is connected to liquid metal electromagnetic pump (3) and liquid pushing tube (4), is connected between the liquid suction pipe (12) and liquid pushing tube (4) by radiator
It connects, is provided with liquid suction pipe cooling fin (14) on the liquid suction pipe (12), be provided with liquid reserve tank cooling fin on the liquid reserve tank (1)
(2)。
2. the cooling system of high power semiconductor lasers as described in claim 1, which is characterized in that the radiator packet
Include radiating block a (6), be provided with cavity in the radiating block a (6), the both ends of the radiating block a (6) respectively with liquid suction pipe (12)
It is connected with liquid pushing tube (4), the upper surface of the radiating block a (6) is provided at least two cooling fin a (7), the radiating block a (6)
Lower surface be provided with semiconductor chilling plate a (8).
3. the cooling system of high power semiconductor lasers as claimed in claim 2, which is characterized in that the radiator is also
Including the radiating block b (9) being oppositely arranged with radiating block a (6), cavity, the radiating block b are provided in the radiating block b (9)
(9) both ends are connect with liquid suction pipe (12) and liquid pushing tube (4) respectively, and the lower surface of the radiating block b (9) is provided at least two
The upper surface of cooling fin b (10), the radiating block b (9) are provided with semiconductor chilling plate b (11), the semiconductor chilling plate a
(8) it is correspondingly arranged with semiconductor chilling plate b (11).
4. the cooling system of high power semiconductor lasers as claimed in claim 3, which is characterized in that the radiating block a (6)
The pipeline intake of U-shaped liquor charging branch pipe (5) and U-shaped drawing liquid branch pipe (13), the U are respectively arranged with the both ends of radiating block b (9)
It is provided with the pipeline intake of liquid pushing tube (4) on type liquor charging branch pipe (5), is provided with liquid suction pipe on the U-shaped drawing liquid branch pipe (13)
(12) pipeline intake passes through U-shaped liquor charging branch between the radiating block a (6) and the ipsilateral and liquid pushing tube (4) of radiating block b (9)
(5) are managed to be connected, the radiating block a (6) and radiating block b (9) it is another it is ipsilateral between liquid suction pipe (12) by U-shaped drawing liquid branch pipe
(13) it is connected.
5. the cooling system of high power semiconductor lasers as described in claim 1, which is characterized in that the liquid metal electricity
Magnetic pumping (3) includes inner tube (301), and the outer sheath of said inner tube (301) is equipped with outer tube (302), outside the lower part of the outer tube (302)
Side is arranged with electromagnetic coil assembly (309), and the electromagnetic coil assembly (309) is connected with AC power source by transformer, described
The bottom of outer tube (302) is connected with heater holder (306), is provided with electrical bar slot (305) in the heater holder (306),
It is provided with electrical bar (304) in the electrical bar slot (305), the electrical bar (304) is connected with controller, the heater
The outer sheath of seat (306) is equipped with outer cover (307), and the outer cover (307) is connected with the bottom of electromagnetic coil assembly (309).
6. the cooling system of high power semiconductor lasers as claimed in claim 5, which is characterized in that the electromagnetic coil group
Part (309) includes coil rack (308), and the coil rack (308) is set in the outside of outer tube (302), the coil rack
(308) electromagnetic coil (303) are wound on.
7. the cooling system of high power semiconductor lasers as claimed in claim 5, which is characterized in that said inner tube (301)
Both ends communicate, the top of said inner tube (301) extends to the top end of outer tube (302), and the top of said inner tube (301) is
The pump discharge of trumpet type, the outer tube (302) are disposed radially dilatation chamber (310) close to the position at top, the dilatation chamber
(310) pump intake is arranged in side.
8. the control method of the cooling system of the high power semiconductor lasers as described in claim 1~7 any one, special
Sign is, is specifically implemented according to the following steps:
Step 1, high power semiconductor lasers (15) are placed into semiconductor chilling plate a (8) and semiconductor chilling plate b (11) it
Between, then it is separately turned on AC power source and controller；
After step 2, energization, the liquid metal in liquid reserve tank (1) is pumped into liquid pushing tube (4) by liquid metal electromagnetic pump 3, liquid gold
Belong to followed by U-shaped liquor charging branch pipe (5), radiating block a (6) and radiating block b (9), U-shaped drawing liquid branch pipe (13) and liquid suction pipe
(12), liquid reserve tank (1) is finally flowed back into；
Step 3 repeats step 2, until high power semiconductor lasers (15) are cooled to required temperature.
9. the control method of the cooling system of high power semiconductor lasers as claimed in claim 8, which is characterized in that described
In step 3, if the temperature of high power semiconductor lasers (15) is lower than required temperature, it is right that controller starts electrical bar (304)
Liquid metal is preheated, and arrives required temperature until high power semiconductor lasers (15) are got warm again after a cold spell, controller disconnects electrical bar
(304)。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811582848.4A CN109586164A (en) | 2018-12-24 | 2018-12-24 | The cooling system and its control method of high power semiconductor lasers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811582848.4A CN109586164A (en) | 2018-12-24 | 2018-12-24 | The cooling system and its control method of high power semiconductor lasers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109586164A true CN109586164A (en) | 2019-04-05 |
Family
ID=65930923
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|---|---|---|---|
| CN201811582848.4A Pending CN109586164A (en) | 2018-12-24 | 2018-12-24 | The cooling system and its control method of high power semiconductor lasers |
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| CN108666855A (en) * | 2018-07-24 | 2018-10-16 | 核工业理化工程研究院 | Laser crystal bilateral temperature regulating device |
| CN109026731A (en) * | 2018-07-27 | 2018-12-18 | 西安工程大学 | A kind of liquid metal electromagnetic pump drive system |
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2018
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2922219Y (en) * | 2006-06-22 | 2007-07-11 | 广州工业发展集团有限公司 | Cooling temperature controlling device for solid laser device |
| CN204230628U (en) * | 2014-09-19 | 2015-03-25 | 伊欧激光科技（苏州）有限公司 | A kind of compound laser cooling device |
| CN104795726A (en) * | 2015-05-05 | 2015-07-22 | 中国科学院武汉物理与数学研究所 | Semiconductor laser device capable of being operated below zero DEG C by integral refrigeration |
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| CN108666855A (en) * | 2018-07-24 | 2018-10-16 | 核工业理化工程研究院 | Laser crystal bilateral temperature regulating device |
| CN109026731A (en) * | 2018-07-27 | 2018-12-18 | 西安工程大学 | A kind of liquid metal electromagnetic pump drive system |
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