CN204230293U - A kind of high grey sub-light SMD LED - Google Patents
A kind of high grey sub-light SMD LED Download PDFInfo
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- CN204230293U CN204230293U CN201420685020.2U CN201420685020U CN204230293U CN 204230293 U CN204230293 U CN 204230293U CN 201420685020 U CN201420685020 U CN 201420685020U CN 204230293 U CN204230293 U CN 204230293U
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- smd led
- shaped groove
- bowl cup
- low reflective
- colloid layer
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Abstract
The utility model discloses a kind of high grey sub-light SMD LED.It comprises support, and described rack upper surface is provided with recessed bowl cup-shaped groove, and the bottom of described bowl cup-shaped groove is provided with SMD LED chip, is provided with low reflective colloid layer in described bowl cup-shaped groove, and the upper surface of described low reflective colloid layer is rough matsurface.The utility model can reduce the reflective of SMD LED, thus improves gray scale and the contrast of SMD LED.
Description
Technical field
The utility model relates to LED technology field, particularly relates to a kind of high grey sub-light SMD LED.
Background technology
Traditional SMD LED is mainly by all adopting black material by inner to the surface of support, side and reflector PPA or only realize the high-contrast requirement of SMD LED at rack surface silk-screen black ink, but the packaging plastic due to SMD LED is transparent or white, therefore above-mentioned two kinds of modes improving SMD LED contrast are all halfway.
Summary of the invention
The purpose of this utility model overcomes existing SMD LED to exist larger reflective, have impact on the technical problem of SMD LED contrast, provide a kind of high grey sub-light SMD LED, it can reduce the reflective of SMD LED, thus improves gray scale and the contrast of SMD LED.
In order to solve the problem, the utility model is achieved by the following technical solutions:
A kind of high grey sub-light SMD LED of the present utility model, comprise support, described rack upper surface is provided with recessed bowl cup-shaped groove, the bottom of described bowl cup-shaped groove is provided with SMD LED chip, be provided with low reflective colloid layer in described bowl cup-shaped groove, the upper surface of described low reflective colloid layer is rough matsurface.
In the technical program, SMD LED chip is connected with the both positive and negative polarity of support by metal lead wire.Low reflective colloid layer is formed by grey packaging plastic or black encapsulation glue point glue, the upper surface of low reflective colloid layer is rough matsurface, reduce the reflection of light, thus reach low reflective colloid layer surface low reflective or the sub-light of no-reflection, unglazed visual effect, improve gray scale and the contrast of SMD LED.The utility model reduce packaging plastic tonal gradation, add its surface roughness, by adopting high brightness SMD LED patch chip, full-color SMD LED display can be made to have, and bright dipping is soft, color blending effect good, contrast advantages of higher.
As preferably, the upper surface undulate of described low reflective colloid layer.The light reflection of the low reflective colloid layer upper surface of further reduction.
As preferably, the inner surface of described bowl cup-shaped groove is provided with and can produces elastically-deformable elastic layer.Can generate heat during the work of SMD LED chip, low reflective colloid layer is because of the inner generation stress that expands with heat and contract with cold, elastic layer effectively can discharge the stress of low reflective colloid layer, avoids stress to produce impact because can not effectively discharge to metal wire or metal solder joint, breaks metal wire or metal solder joint.
As preferably, described rack surface is provided with black ink layer.Improve the contrast of SMD LED.
As preferably, described support is made up of black material.Improve the contrast of SMD LED.
As preferably, described bowl cupule trench bottom is provided with the through hole running through support, is provided with cooling mechanism in described through hole, and the upper surface of described cooling mechanism contacts with SMD LED chip.Cooling mechanism strengthens the heat radiation of SMD LED chip, reduces low reflective colloid layer thermal stress to the impact of SMD LED.
As preferably, described cooling mechanism comprises the first fin of horizontally set and several are longitudinally arranged on the second fin of the first fin lower surface.First fin contacts with SMD LED chip, and the heat conduction sent by SMD LED chip is to the second fin, and the contact area of the second fin and air is large, strengthens radiating effect.
The beneficial effects of the utility model are: (1) can reduce the reflective of SMD LED, thus improve gray scale and the contrast of SMD LED.(2) low reflective colloid layer thermal stress is reduced on the impact of SMD LED by elastic layer and cooling mechanism.
Accompanying drawing explanation
Fig. 1 is a kind of structural representation of the present utility model.
In figure: 1, support, 2, bowl cup-shaped groove, 3, SMD LED chip, 4, low reflective colloid layer, 5, elastic layer, 6, cooling mechanism.
Embodiment
Below by embodiment, and by reference to the accompanying drawings, the technical solution of the utility model is described in further detail.
Embodiment: the high grey sub-light SMD LED of one of the present embodiment, as shown in Figure 1, comprise support 1, support 1 upper surface is provided with recessed bowl cup-shaped groove 2, the bottom of bowl cup-shaped groove 2 is provided with SMD LED chip 3, be provided with low reflective colloid layer 4 in bowl cup-shaped groove 2, the upper surface of low reflective colloid layer 4 is rough matsurface.
SMD LED chip 3 is connected by the both positive and negative polarity of metal lead wire with support 1.Low reflective colloid layer 4 is formed by grey packaging plastic or black encapsulation glue point glue, the upper surface of low reflective colloid layer 4 is rough matsurface, reduce the reflection of light, thus reach low reflective colloid layer 4 surface low reflective or the sub-light of no-reflection, unglazed visual effect, improve gray scale and the contrast of SMD LED.The present embodiment reduce packaging plastic tonal gradation, add its surface roughness, by adopting high brightness SMD LED chip 3, full-color SMD LED display can be made to have, and bright dipping is soft, color blending effect good, contrast advantages of higher.
The upper surface undulate of low reflective colloid layer 4, the light reflection of low reflective colloid layer 4 upper surface of further reduction, the inner surface of bowl cup-shaped groove 2 is provided with and can produces elastically-deformable elastic layer 5, can generate heat when SMD LED chip 3 works, low reflective colloid layer 4 is because of the inner generation stress that expands with heat and contract with cold, elastic layer 5 effectively can discharge the stress of low reflective colloid layer 4, avoids stress to produce impact because can not effectively discharge to metal wire or metal solder joint, breaks metal wire or metal solder joint.Support 1 is made up of black material, improves the contrast of SMD LED.
Be provided with the through hole running through support 1 bottom bowl cup-shaped groove 2, be provided with cooling mechanism 6 in through hole, the upper surface of cooling mechanism 6 contacts with SMD LED chip 3.Cooling mechanism 6 strengthens the heat radiation of SMD LED chip 3, reduces low reflective colloid layer 4 thermal stress to the impact of SMD LED.Cooling mechanism 6 comprises the first fin and several longitudinal second fin being arranged on the first fin lower surface of horizontally set, first fin contacts with SMD LED chip 3, the heat conduction sent by SMD LED chip 3 is to the second fin, the contact area of the second fin and air is large, strengthens radiating effect.
Claims (7)
1. a high ash sub-light SMD LED, it is characterized in that: comprise support (1), described support (1) upper surface is provided with recessed bowl cup-shaped groove (2), the bottom of described bowl cup-shaped groove (2) is provided with SMD LED chip (3), be provided with low reflective colloid layer (4) in described bowl cup-shaped groove (2), the upper surface of described low reflective colloid layer (4) is rough matsurface.
2. a kind of high grey sub-light SMD LED according to claim 1, is characterized in that: the upper surface undulate of described low reflective colloid layer (4).
3. a kind of high grey sub-light SMD LED according to claim 1, is characterized in that: the inner surface of described bowl cup-shaped groove (2) is provided with and can produces elastically-deformable elastic layer (5).
4. the high grey sub-light SMD LED of the one according to claim 1 or 2 or 3, is characterized in that: described support (1) surface is provided with black ink layer.
5. the high grey sub-light SMD LED of the one according to claim 1 or 2 or 3, is characterized in that: described support (1) is made up of black material.
6. the high grey sub-light SMD LED of the one according to claim 1 or 2 or 3, it is characterized in that: described bowl cup-shaped groove (2) bottom is provided with the through hole running through support (1), be provided with cooling mechanism (6) in described through hole, the upper surface of described cooling mechanism (6) contacts with SMD LED chip (3).
7. a kind of high grey sub-light SMD LED according to claim 6, is characterized in that: described cooling mechanism (6) comprises the first fin and several longitudinal second fin being arranged on the first fin lower surface of horizontally set.
Priority Applications (1)
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CN201420685020.2U CN204230293U (en) | 2014-11-17 | 2014-11-17 | A kind of high grey sub-light SMD LED |
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CN201420685020.2U CN204230293U (en) | 2014-11-17 | 2014-11-17 | A kind of high grey sub-light SMD LED |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106206914A (en) * | 2016-08-22 | 2016-12-07 | 成都众乐泰科技有限公司 | A kind of LED light emitting diode |
CN110534635A (en) * | 2019-08-23 | 2019-12-03 | 深圳市海讯高科技术有限公司 | A kind of high contrast high light-emitting rate COB display panel |
-
2014
- 2014-11-17 CN CN201420685020.2U patent/CN204230293U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106206914A (en) * | 2016-08-22 | 2016-12-07 | 成都众乐泰科技有限公司 | A kind of LED light emitting diode |
CN110534635A (en) * | 2019-08-23 | 2019-12-03 | 深圳市海讯高科技术有限公司 | A kind of high contrast high light-emitting rate COB display panel |
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