CN204178646U - SMD LED nixie display - Google Patents
SMD LED nixie display Download PDFInfo
- Publication number
- CN204178646U CN204178646U CN201420559951.8U CN201420559951U CN204178646U CN 204178646 U CN204178646 U CN 204178646U CN 201420559951 U CN201420559951 U CN 201420559951U CN 204178646 U CN204178646 U CN 204178646U
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- CN
- China
- Prior art keywords
- shell
- bonding wire
- die bond
- wire plate
- bond bonding
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Abstract
The utility model relates to SMD LED nixie display, and it is for being welded on control panel, comprises shell, die bond bonding wire plate and terminal block; The side of shell is provided with opening; Die bond bonding wire plate front has luminescence chip and the back side has the circuit solder joint group be electrically connected with luminescence chip, and die bond bonding wire plate seals in the enclosure by sealing mode; Terminal block makes die bond bonding wire plate and control panel connect, one end of terminal block is welded in circuit solder joint group, the other end stretches out through outward opening and makes it can be welded on control panel, the side that shell is provided with opening is also provided with glue receiving room, when the sealing of die bond bonding wire plate is in shell, the glue overflowed in shell flows to glue receiving room through opening.The utility model has the advantage of that glue can not flow to light-emitting diode display enclosure when the sealing of die bond bonding wire plate is in light-emitting diode display shell, improve the outward appearance of product and properties of product, and correspondingly improve product yield rate, reduce rework rate.
Description
(1) technical field
The utility model relates to SMD LED nixie display.
(2) background technology
Chinese patent CN201320640155.2 discloses, and " a kind of LED nixie display of Novel patch formula " can directly amplexiform on control panel by Reflow Soldering to solve, and realizes structure simple, the object that during cost low and application, production efficiency is high.
But, in process of production, particularly when the sealing of die bond bonding wire plate is in light-emitting diode display shell, the glue overflowed in described light-emitting diode display shell flows to light-emitting diode display enclosure through described opening, during cooling, affects the outward appearance of product and affects properties of product, although in process of production, the injection rate IR that strictly can control glue makes glue be unlikely to overflow in described light-emitting diode display shell, but the reason such as inertia of glue when the transmission of product and injecting glue, still there are the problems referred to above.
Therefore, there is the necessity improved in the structure of above-mentioned patent.
(3) summary of the invention
The purpose of this utility model is to provide SMD LED nixie display, make it when the sealing of die bond bonding wire plate is in light-emitting diode display shell, glue can not flow to light-emitting diode display enclosure, improve the outward appearance of product and properties of product, and correspondingly improve product yield rate, reduce rework rate.
For achieving the above object, the utility model is by the following technical solutions:
SMD LED nixie display, for being welded on control panel, comprises shell, die bond bonding wire plate and terminal block; The side of described shell is provided with opening; Described die bond bonding wire plate front has luminescence chip and the back side has the circuit solder joint group be electrically connected with described luminescence chip, and described die bond bonding wire plate is sealed in described shell by sealing mode; Described terminal block makes die bond bonding wire plate and control panel connect, one end of described terminal block is welded in circuit solder joint group, the other end stretches out through described outward opening and makes it can be welded on control panel, it is characterized in that: the side that described shell is provided with opening is also provided with glue receiving room, when the sealing of die bond bonding wire plate is in shell, the glue overflowed in described shell flows to described glue receiving room through described opening.
The utility model improves by following scheme:
Described SMD LED nixie display, is characterized in that: described opening is arranged on the relative dual-side of described shell.
Described SMD LED nixie display, is characterized in that: have the first gap between its one or two end face of the opening that wherein one or two end face of its non-solder end of terminal block is corresponding with it.
Described SMD LED nixie display, is characterized in that: the upper surface of described glue receiving room outer wall and its surface be welded in circuit solder joint group of described terminal block have the second gap.
The advantage of the SMD LED nixie display of the utility model is when the sealing of die bond bonding wire plate is in light-emitting diode display shell, glue can not flow to light-emitting diode display enclosure, improve the outward appearance of product and properties of product, and correspondingly improve product yield rate, reduce rework rate.
(4) accompanying drawing explanation
Fig. 1 is rear view of the present utility model;
Fig. 2 is the A-A cross-sectional schematic in Fig. 1;
Fig. 3 is the three-dimensional state schematic diagram of shell.
(5) embodiment
SMD LED nixie display as depicted in figs. 1 and 2, for being welded on control panel, comprises shell 1, die bond bonding wire plate 2 and terminal block 3;
Shown in Fig. 3, the side of described shell 1 is provided with opening 11; Described opening 11 has two to be arranged at respectively on the relative dual-side of described shell 1.The side that described shell 1 is provided with opening 11 is also provided with glue receiving room 12.
Described die bond bonding wire plate 2 front has luminescence chip and the back side has the circuit solder joint group be electrically connected with described luminescence chip, and described die bond bonding wire plate 2 is sealed in described shell 1 by sealing mode; Described terminal block 3 makes die bond bonding wire plate 2 and control panel connect, and one end 31 of described terminal block 3 is welded in circuit solder joint group, and the other end 32 makes it can be welded on control panel through described opening 11 is protruding.
When the sealing of die bond bonding wire plate 2 is in shell 1, the glue overflowed in described shell 1 flows to described glue receiving room 12 through described opening 11.
Between its one or two end face of the opening 11 that wherein one or two end face of its non-solder end 33 of terminal block 3 is corresponding with it, there is the first gap L, for the glue overflowed in described shell 1 described in during assembling by terminal block 3 stop and smooth and easyly flow to described glue receiving room 12.
The upper surface 12-1 of described glue receiving room 12 outer wall and its surface 34 be welded in circuit solder joint group of described terminal block 3 have the second gap H.When avoiding assembling, its surface 34 be welded in circuit solder joint group of terminal block 3 is subject to withstanding and causing die bond bonding wire plate 2 can not correctly be positioned in shell 1 of the upper surface 12-1 of glue receiving room 12 outer wall.
Above-described embodiment is better embodiment of the present utility model; but embodiment of the present utility model is not limited thereto; other are any do not deviate from Spirit Essence of the present utility model and principle under do change, modification, substitute, combine, simplify; be the substitute mode of equivalence, be included within protection domain of the present utility model.
Claims (4)
1. SMD LED nixie display, for being welded on control panel, comprises shell, die bond bonding wire plate and terminal block; The side of described shell is provided with opening; Described die bond bonding wire plate front has luminescence chip and the back side has the circuit solder joint group be electrically connected with described luminescence chip, and described die bond bonding wire plate is sealed in described shell by sealing mode; Described terminal block makes die bond bonding wire plate and control panel connect, one end of described terminal block is welded in circuit solder joint group, the other end stretches out through described outward opening and makes it can be welded on control panel, it is characterized in that: the side that described shell is provided with opening is also provided with glue receiving room, when the sealing of die bond bonding wire plate is in shell, the glue overflowed in described shell flows to described glue receiving room through described opening.
2. SMD LED nixie display according to claim 1, is characterized in that: described opening is arranged on the relative dual-side of described shell.
3. according to the arbitrary described SMD LED nixie display of claim 1 or 2, it is characterized in that: between its one or two end face of the opening that wherein one or two end face of its non-solder end of terminal block is corresponding with it, there is the first gap.
4. SMD LED nixie display according to claim 3, is characterized in that: the upper surface of described glue receiving room outer wall and its surface be welded in circuit solder joint group of described terminal block have the second gap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420559951.8U CN204178646U (en) | 2014-09-26 | 2014-09-26 | SMD LED nixie display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420559951.8U CN204178646U (en) | 2014-09-26 | 2014-09-26 | SMD LED nixie display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204178646U true CN204178646U (en) | 2015-02-25 |
Family
ID=52567434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420559951.8U Expired - Fee Related CN204178646U (en) | 2014-09-26 | 2014-09-26 | SMD LED nixie display |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204178646U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104867415A (en) * | 2015-05-30 | 2015-08-26 | 中山市晶艺光电科技有限公司 | Shell with touch induction structure and LED digital displayer |
-
2014
- 2014-09-26 CN CN201420559951.8U patent/CN204178646U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104867415A (en) * | 2015-05-30 | 2015-08-26 | 中山市晶艺光电科技有限公司 | Shell with touch induction structure and LED digital displayer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150225 Termination date: 20180926 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |