CN204168685U - The cooling system of electronic component - Google Patents
The cooling system of electronic component Download PDFInfo
- Publication number
- CN204168685U CN204168685U CN201420495805.3U CN201420495805U CN204168685U CN 204168685 U CN204168685 U CN 204168685U CN 201420495805 U CN201420495805 U CN 201420495805U CN 204168685 U CN204168685 U CN 204168685U
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- heat
- lid
- electronic component
- heat pipe
- cooling system
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a kind of cooling system of electronic component, is to provide a structure and combines easy, has proofing dust and protecting, stops electromagnetic interference and improve the effects such as radiating efficiency.This cooling system comprises a heat-conducting unit, be configured at produce used heat for a moment electronic component (being defined as thermal source element) on; One lid and a secondary lid coated thermal source element and electronic component respectively.Lid has an opening, allows this heat-conducting unit at least regional area protrusion; One heat pipe including cooling fluid is arranged through lid and secondary lid; And heat pipe combination has at least one metal level.Therefore, the heat energy of this thermal source element can be directly transferred to this heat pipe and metal level or lid through heat-conducting unit, secondary lid exports; In order to set up the position of a foundation electronic component or thermal source element, arrange lid, metal level and heat pipe path, to set up a minimizing thermal resistance, to increase the effect of area of dissipation.
Description
Technical field
The utility model relates to a kind of structural design of the cooling system for electronic component; Refer to that a kind of heat-conducting unit of applying is given prominence to lid and heat pipe path and coordinated in conjunction with the layout of metal level especially, increase the novel of the area of dissipation of an electronic component and the heat expulsion efficiency of auxiliary raising one electronic component.
Background technology
Applying fin or the fin tissue of a plurality of arrangement, the used heat produced when discharging those electronic components or computer cpu work, to keep their operating efficiency or to avoid causing the situation when machine, is be existing skill.Existing skill has disclosed the fin that a kind of integrated aluminium extruded type cuts off processing, or radiation panel and radiating fin is separated and manufacture, in the means of interlocking assembling or the tissue that is welded into a whole.Such as, TaiWan, China No. 86116954 " heat abstractor fin assemble method and goods thereof " Patent Case is provide a typical embodiment.The people haveing the knack of this skill just as those known, this skill is cumbersome in manufacture, processing operation and difficulty.
Existing skill has also disclosed and a kind of on fin or fin, has arranged axis hole, combined axis or pipe through this axis hole, to be assembled the means of tissue in aggregates.Such as, TaiWan, China No. 91209087 " combined structure of fin " or TaiWan, China No. 94205324 " radiating fin improved structure " Patent Case etc. are provide typical embodiment.
Existing skill has also disclosed a kind of at fin or fin side or upper and lower end arranges groove or slot, multiple rank protuberance or fastener correspondence fasten, to be assembled the means concept of tissue in aggregates.Such as, No. 92211053rd, TaiWan, China " Structure of radiating fin ", No. 91213373rd, TaiWan, China " blood culture bottle improvement ", No. 86221373rd, TaiWan, China " Assembled radiator structure ", TaiWan, China No. 93218949 " groups of fins fastening structure " or TaiWan, China No. 91208823 " combining structure of radiating fin " Patent Case etc., also provided feasible embodiment.
Representational, these references show the structure skill being configured at electronic building brick aspect about applying radiator structure.Existing fin or fin structure often tend to apply the more complicated textural association such as axle or pipe, slot, multiple rank protuberance or fastener correspondence fastening.If this cooling system of overline design consideration, makes it construct and be different from those existing, its use form can be changed, and be different from old law.Such as, make its structural design meet one and simplify and be convenient to the condition combined, application heat-conducting unit gives prominence to lid, in conjunction with heat pipe, metal level, and/or has the effect such as proofing dust and protecting, prevention electromagnetic interference; Or according to the position of each electronic component, arrange the path of this cooling system, increase the area of dissipation of electronic component and improve the means such as radiating efficiency; And these problems are all not revealed in above-mentioned reference.
Utility model content
Whence is that namely main purpose of the present utility model is the cooling system providing a kind of electronic component, and being provides a structure and combine easy, has proofing dust and protecting, stops electromagnetic interference and improve the effects such as radiating efficiency.
For achieving the above object, the technical solution adopted in the utility model is:
A cooling system for electronic component, is characterized in that, comprising:
Heat-conducting unit, is configured at and produces on the thermal source element of used heat for a moment;
Lid and secondary lid have a rigid walls respectively, define lid and secondary lid and form the box body structure that has inner space;
Lid has an opening, allows this heat-conducting unit at least regional area protrusion; And lid and secondary lid can not produce the electronic component of used heat respectively with the coated thermal source element of box body structure and other;
Include the heat pipe of cooling fluid, it at least adheres on the region of this heat-conducting unit protrusion and secondary lid in local; And, make the heat energy of this thermal source element be directly transferred to this heat pipe through this heat-conducting unit; And
This heat pipe is also fitted with at least one metal level.
In the cooling system of described electronic component: the rigid walls of this secondary lid has upper wall surface and sidewall; And
This heat pipe also connects the upper wall surface of this secondary lid and one of them of sidewall.
In the cooling system of described electronic component: this heat pipe has one first limit, a Second Edge and at least one side;
First limit of heat pipe is connected this heat-conducting unit with one of them of side;
The Second Edge of heat pipe arranges this metal level of combination; And
Metal level is set as one of them of film and flake structure.
In the cooling system of described electronic component: this heat pipe has one first limit, a Second Edge and at least one side;
First limit of heat pipe is connected this secondary lid with one of them of side; And
Metal level is set as one of them of film and flake structure.
In the cooling system of described electronic component: this heat-conducting unit is the block structure making a geometric form profile with the material that can conduct heat energy, and it has a first end and one second end; This first end is stacked and placed on this thermal source element;
Lid rigid walls has a upper wall surface, and this opening is formed in upper wall surface; And
Second end of heat-conducting unit protrudes this opening, engages this heat pipe.
In the cooling system of described electronic component: this heat-conducting unit first end and the second end are formed with a plane respectively; And
This heat pipe of the plane engagement of the second end.
In the cooling system of described electronic component: one of them of the local of this metal level and Zone Full arranges the coating that a thermal-radiating material is formed.
In the cooling system of described electronic component: the area of this metal level is greater than the area of lid.
In the cooling system of described electronic component: one of them of the welding of this heat pipe and bonding is arranged on heat-conducting unit.
In the cooling system of described electronic component: one of them of the welding of this heat pipe and bonding is arranged on secondary lid.
In the cooling system of described electronic component: this thermal source element and electronic component are arranged on a circuit board.
Compared with prior art, the advantage adopting the utility model of technique scheme to have is:
1. the heat energy of this thermal source element can be directly transferred to this heat pipe and metal level or lid through heat-conducting unit, secondary lid exports; In order to set up the position of a foundation electronic component or thermal source element, arrange lid, metal level and heat pipe path, to set up a minimizing thermal resistance, to increase the effect of area of dissipation.
2. the structure kenel of conduction unit protrusion opening connection heat pipe obviously can reduce thermal resistance, makes the heat energy of this electronic component be directly transferred to heat pipe through heat-conducting unit, is transmitted to metal level fast exports through heat pipe.
3. this metal level is set as film or flake structure, amasss or area of dissipation, coordinate heat pipe heat energy or heat are delivered to other regions and discharge fast, prevent hot concentration phenomenon in order to form comparatively large contact surface with the external world.
Accompanying drawing explanation
Fig. 1 is example structure of the present utility model combination schematic diagram;
Fig. 2 is the STRUCTURE DECOMPOSITION schematic diagram of Fig. 1; Show the configuration scenario of the parts such as electronic component, thermal source element, heat-conducting unit, lid, secondary lid, heat pipe and metal level;
Fig. 3 is textural association cross-sectional schematic of the present utility model; The syntagmatic of the parts such as this electronic component, thermal source element, heat-conducting unit, lid, secondary lid, heat pipe and metal level is depicted in figure;
Fig. 4 is another example structure of the present utility model combination schematic diagram; Depict the cooperation situation of heat pipe path and lid, secondary lid.
Description of reference numerals: 10-heat-conducting unit; 11-first end; 12-second end; 13,14-plane; 20-thermal source element; 25-electronic component; 30-lid; 31,36-rigid walls; 32,37-inner space; 33,38-upper wall surface; 34-opening; The secondary lid of 35-; 40-circuit board; 50-heat pipe; 51-first limit; 52-Second Edge; 53-side; 55-cooling fluid; 60-metal level.
Embodiment
Refer to Fig. 1, Fig. 2 and Fig. 3, the cooling system of the utility model electronic component comprises a heat-conducting unit 10, can produce on the electronic component of used heat when being configured at a job; In adopted embodiment, this electronic component that can produce used heat is defined as thermal source element 20.Substantially, this thermal source element 20 and other electronic components 25 that can not produce used heat are arranged on a circuit board 40.
In adopted embodiment, this heat-conducting unit 10 selects the material that can conduct heat energy to make the block structure of a geometric form profile, and has first end 11 and one second end 12; This first end 11 and the second end 12 are formed with the structure kenel of a plane 13,14 respectively, and this first end 11 (or plane 13) is stacked and placed on this thermal source element 20, the used heat (or heat energy) produced when working with conduction heat sources element 20.
Show this cooling system in figure and also include lid 30 and a secondary lid 35, lid 30 combines with this heat-conducting unit 10.Specifically, this lid 30 and secondary lid 35 have a rigid walls 31,36 respectively, define lid 30 and secondary lid 35 forms box body (or plate body) structure that has inner space 32,37.Lid and secondary lid can not produce the electronic component of used heat respectively with the coated thermal source element of box body structure and other; In adopted embodiment, lid 30 (or rigid walls 31) has a upper wall surface 33 and and is formed in opening 34 on upper wall surface 33.And the second end 12 of heat-conducting unit 10 protrudes this opening 34, engages a heat pipe 50.What must be illustrated is, heat-conducting unit 10 protrudes the structural design that opening 34 directly engages heat pipe 50, the kenel that the used heat (or heat energy) produced when electronic component 20 can be worked by heat-conducting unit 10 is directly delivered to heat pipe 50 and exports fast, obviously can obtain the effect reducing thermal resistance.
Apprehensible, the textural association kenel of this heat-conducting unit 10 and lid 30 significantly increases the area of dissipation of this thermal source element 20; Further, this lid 30 and secondary lid 35 also provide ground connection to thermal source element 20 and electronic component 25 and produce proofing dust and protecting, magnetic conduction or stop the effects such as electromagnetic interference.
Fig. 1, Fig. 2 and Fig. 3 show this cooling system and also comprise this heat pipe 50; Heat pipe 50 is combined on this lid 30 and secondary lid 35, includes cooling fluid 55.Specifically, heat pipe 50 has one first limit 51, Second Edge 52 and at least one side 53, adopts welding or bonding operation, is combined in the second end 12 (or plane 14) of this heat-conducting unit 10 and the rigid walls 36 of secondary lid 35; In this embodiment, the first limit 51 (or side 53) of heat pipe 50 is bonded on a upper wall surface 38 of secondary lid 35.
Therefore, the used heat that the work of this thermal source element 20 produces or heat energy can be directly transferred to this lid 30 and heat pipe 50 (or secondary lid 35) through heat-conducting unit 10, and cool exchange through heat pipe 50, export.That is, heat pipe 50 can be guided heat energy fast and be left heat source region and guiding heat energy to other comparatively low-temperature regions, prevents hot concentration phenomenon.
Second Edge 52 laminating that also show heat pipe 50 in figure is provided with the metal level 60 of a geometric form profile.Show metal level 60 in figure and be set as film or flake structure, the area of metal level 60 is obviously greater than the area of lid 30 or secondary lid 35, in order to form larger contact area or area of dissipation with the external world, coordinate the quick conduction of heat pipe 50, above-mentioned heat energy or heat are discharged fast.
In an embodiment revised, the local of this metal level 60 or Zone Full can arrange the coating (figure does not show) that a thermal radiation material is formed, to set up the effect of a radial-type heat dissipating.
What must be illustrated is, this lid 30 (and/or secondary lid 35) and heat pipe 50 path, metal level 60 arrange according to the position of thermal source element 20 (and/or electronic component 25), the used heat that thermal source element 20 is produced or heat energy can be directly transferred to this heat pipe 50, metal level 60 or lid 30, secondary lid 35 through heat-conducting unit 10, and coordinate heat pipe 50 paths arrangement, output used heat, reduce the area of dissipation of thermal resistance and this cooling system of increase.That is, the heat-conducting unit 10 of used heat (or heat energy) not only through connecting it that this thermal source element 20 produces is directly transferred to heat pipe 50 and exports; Also comprise heat pipe 50 Lu ?arrange connect metal level 60, lid 30, secondary lid 35.Therefore, the area of dissipation of this cooling system is obviously increased.
Please refer to Fig. 4, depict an embodiment revised.The deposition path showing heat pipe 50 in figure is the rigid walls 36 engaging secondary lid 35 with side 53; In the embodiment shown, heat pipe side 53 is the sidewall areas being bonded on secondary lid rigid walls 36.
Representational, the cooling system of this electronic component, under the condition having proofing dust and protecting and prevention electromagnetic interference, compared to old law, has following consideration condition and advantage:
1. this cooling system and associated component structure, operation use situation etc., are considered by overline design, and are different from those existing; Further, change its use kenel, and be different from old law.Such as, this thermal source element 20 is made to coordinate heat-conducting unit 10, lid 30, or this heat-conducting unit 10 comprises first end 11 and the second end 12, coordinate lid 30 that opening 34 is set, heat-conducting unit second end 12 is allowed to protrude lid 30, the structural design of combination heat pipe 50 and metal level 60, and the structure organization forming the part such as contact kenel, minimizing thermal resistance of larger area are the heat radiation or the used heat discharge effect that improve it.
2. this lid 30 (and/or secondary lid 35), metal level 60 and heat pipe 50 path are arranged according to the position of thermal source element 20 (and/or electronic component 25), the used heat that thermal source element 20 is produced or heat energy or can be connected the part such as lid 30, secondary lid 35 and discharge through heat-conducting unit 10 and heat pipe 50 paths arrangement metal level 60, and the area of dissipation of this cooling system is obviously increased.
3. this heat-conducting unit 10 coordinates lid 30, the second end 12 is made to protrude opening 34, the structural design of combination heat pipe 50 paths arrangement metal level 60 or secondary lid 35, has removed existing radiator structure and has tended to apply the more complicated textural association such as axle or pipe, slot, multiple rank protuberance or fastener correspondence fastening.Clearly provide one and to simplify and be convenient to the structural design combined than existing skill.
More than illustrate the utility model just illustrative; and nonrestrictive, those of ordinary skill in the art understand, when not departing from the spirit and scope that claim limits; many amendments, change or equivalence can be made, but all will fall within protection range of the present utility model.
Claims (11)
1. a cooling system for electronic component, is characterized in that, comprising:
Heat-conducting unit, is configured at and produces on the thermal source element of used heat for a moment;
Lid and secondary lid have a rigid walls respectively, define lid and secondary lid and form the box body structure that has inner space;
Lid has an opening, allows this heat-conducting unit at least regional area protrusion; And lid and secondary lid can not produce the electronic component of used heat respectively with the coated thermal source element of box body structure and other;
Include the heat pipe of cooling fluid, it at least adheres on the region of this heat-conducting unit protrusion and secondary lid in local; And, make the heat energy of this thermal source element be directly transferred to this heat pipe through this heat-conducting unit; And
This heat pipe is also fitted with at least one metal level.
2. the cooling system of electronic component according to claim 1, is characterized in that: the rigid walls of this secondary lid has upper wall surface and sidewall; And
This heat pipe also connects the upper wall surface of this secondary lid and one of them of sidewall.
3. the cooling system of electronic component according to claim 1, is characterized in that: this heat pipe has one first limit, a Second Edge and at least one side;
First limit of heat pipe is connected this heat-conducting unit with one of them of side;
The Second Edge of heat pipe arranges this metal level of combination; And
Metal level is set as one of them of film and flake structure.
4. the cooling system of electronic component according to claim 2, is characterized in that: this heat pipe has one first limit, a Second Edge and at least one side;
First limit of heat pipe is connected this secondary lid with one of them of side; And
Metal level is set as one of them of film and flake structure.
5. the cooling system of the electronic component according to claim 1 or 2 or 3 or 4, is characterized in that: this heat-conducting unit is the block structure making a geometric form profile with the material that can conduct heat energy, and it has a first end and one second end; This first end is stacked and placed on this thermal source element;
Lid rigid walls has a upper wall surface, and this opening is formed in upper wall surface; And
Second end of heat-conducting unit protrudes this opening, engages this heat pipe.
6. the cooling system of electronic component according to claim 5, is characterized in that: this heat-conducting unit first end and the second end are formed with a plane respectively; And
This heat pipe of the plane engagement of the second end.
7. the cooling system of electronic component according to claim 5, is characterized in that: one of them of the local of this metal level and Zone Full arranges the coating that a thermal-radiating material is formed.
8. the cooling system of electronic component according to claim 5, is characterized in that: the area of this metal level is greater than the area of lid.
9. the cooling system of electronic component according to claim 3, is characterized in that: one of them of the welding of this heat pipe and bonding is arranged on heat-conducting unit.
10. the cooling system of electronic component according to claim 4, is characterized in that: one of them of the welding of this heat pipe and bonding is arranged on secondary lid.
The cooling system of 11. electronic components according to claim 5, is characterized in that: this thermal source element and electronic component are arranged on a circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420495805.3U CN204168685U (en) | 2014-08-29 | 2014-08-29 | The cooling system of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420495805.3U CN204168685U (en) | 2014-08-29 | 2014-08-29 | The cooling system of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204168685U true CN204168685U (en) | 2015-02-18 |
Family
ID=52542327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420495805.3U Expired - Fee Related CN204168685U (en) | 2014-08-29 | 2014-08-29 | The cooling system of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204168685U (en) |
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2014
- 2014-08-29 CN CN201420495805.3U patent/CN204168685U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150218 Termination date: 20160829 |
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| CF01 | Termination of patent right due to non-payment of annual fee |