CN204810791U - heat conducting structure of electronic element - Google Patents
heat conducting structure of electronic element Download PDFInfo
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- CN204810791U CN204810791U CN201520464552.8U CN201520464552U CN204810791U CN 204810791 U CN204810791 U CN 204810791U CN 201520464552 U CN201520464552 U CN 201520464552U CN 204810791 U CN204810791 U CN 204810791U
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 166
- 239000002184 metal Substances 0.000 claims abstract description 166
- 239000011888 foil Substances 0.000 claims abstract description 163
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims abstract description 6
- 230000005855 radiation Effects 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 15
- 238000000576 coating method Methods 0.000 claims description 15
- 238000012546 transfer Methods 0.000 claims description 6
- 239000012809 cooling fluid Substances 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 3
- 239000012530 fluid Substances 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000013461 design Methods 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 238000000354 decomposition reaction Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 230000002277 temperature effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 2
- 241001269238 Data Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000009640 blood culture Methods 0.000 description 1
- 239000002772 conduction electron Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses an electronic component's heat conduction structure, its structure, combination are simple and convenient, have can satisfy the cost condition, improve heat conduction efficiency, improve radiating efficiency and reach advantages such as samming. The heat conducting structure of the electronic element comprises a heat conducting unit which is configured on the electronic element; a cover body with an opening for covering the electronic element, wherein the heat conducting unit is positioned in the cover body, and at least a partial area of the heat conducting unit protrudes out of the opening; the heat conducting unit is jointed with a heat conducting foil layer. The heat dissipation efficiency of the heat conduction foil layer is more than or equal to that of copper; and a heat pipe containing heat exchange fluid and a metal layer which are arranged on the cover body or the heat-conducting foil layer together. Therefore, the heat energy of the electronic element can be conducted to the heat-conducting foil layer and the cover body through the heat-conducting unit and can be rapidly diffused and output through the heat pipe and the metal layer.
Description
Technical field
The utility model relates to a kind of heat conduction/radiator structure for electronic component; Refer to a kind of application heat-conducting unit, heat conduction layers of foil, lid, heat pipe and metal level especially, discharge the conductive structure of heat with auxiliary electronic element.
Background technology
Applying the used heat produced when the fin of multiple arrangement or fin tissue discharge electronic component or central processing unit (CPU) work, to keep their operating efficiency or to avoid the machine of delaying, has been a kind of common technology.There is the fin that a kind of integrated aluminium extruded type cuts off processing in existing product, or radiation panel and radiating fin are separated manufacture, in interlocking assembling or the means that are welded into a whole.Such as, TaiWan, China No. 86116954 " heat abstractor fin assemble method and goods thereof " Patent Case provides a typical embodiment.Just as well-known to those skilled in the art, this technological means is cumbersome in manufacture, processing operation and difficulty.
Also exist in prior art and a kind of axis hole be set on fin or fin, combined axis or pipe through this axis hole, to be assembled the means of tissue in aggregates.Such as, TaiWan, China No. 91209087 " combined structure of fin " or No. 94205324 " radiating fin improved structure " Patent Case etc. provide typical embodiment.
Also exist a kind of at fin or fin side or upper and lower end arranges groove or slot, multiple rank protuberance or fastener correspondence fasten, to be assembled the technological means of tissue in aggregates in prior art.Such as, No. 91213373rd, TaiWan, China " blood culture bottle improvement ", No. 86221373 " Assembled radiator structure ", No. 93218949 " groups of fins fastening structure " or No. 91208823 " combining structure of radiating fin " Patent Case etc. provided feasible embodiment.
Representational, these reference datas show the structure being configured in electronic component aspect about applying radiator structure.Existing fin or fin structure often tend to apply the more complicated textural association such as axle or pipe, slot, multiple rank protuberance or fastener correspondence fastening.Consider this radiator structure if redesigned, make it construct and be different from existing radiator structure, its use form can be changed.Such as, make its structural design meet a condition of simplifying, or be convenient to combine, and there is proofing dust and protecting, prevention electromagnetic interference and improve the effects such as radiating efficiency; Particularly, layout one is coordinated can to produce the means such as the structure of the metal foil layer of quick conductive force, the area of dissipation increasing electronic component and/or efficiency further; And these contents are not all disclosed in above-mentioned prior art.
Utility model content
Main purpose of the present utility model is the conductive structure providing a kind of electronic component, its structure, combines easy, has and can meet cost conditions, improves heat transfer efficiency, improve radiating efficiency and reach the advantages such as samming.The conductive structure of the electronic component that the utility model provides comprises a heat-conducting unit, is configured on an electronic component.One lid this electronic component coated with opening, this heat-conducting unit is positioned at lid, and at least regional area of this heat-conducting unit is convexly equipped in this opening; Heat-conducting unit is bonded to a heat conduction layers of foil.The radiating efficiency of heat conduction layers of foil is more than or equal to the radiating efficiency of copper; And a heat pipe heat including cooling fluid unifies metal level, is co-located in this lid or heat conduction layers of foil.Therefore, the heat energy of this electronic component can be transmitted to heat conduction layers of foil and lid through heat-conducting unit, and conduction diffuses to rapidly large-area metal layer through heat pipe, exports heat radiation fast.
According to the conductive structure of the electronic component that the utility model provides, the area of this metal level is greater than the area of this lid.And metal level is provided with a thermal source district be positioned at above lid and is connected thermal source district with one and the region (or claiming non-thermal source region) forming cantilever kenel; This metal level is provided with at least one column; Described column between the non-thermal source region and a circuit board of this metal level, with the non-thermal source region making this column support this metal level.
According to the conductive structure of the electronic component that the utility model provides, this electronic component comprises the electronic component (being defined as thermal source element) that can produce used heat and the electronic component (being defined as nonthermal source element) that can not produce used heat.This heat-conducting unit, heat conduction layers of foil coordinate lid, are configured on thermal source element; The coated nonthermal source element of one secondary lid.And, arrange that heat pipe or metal level are by each lid and secondary lid; Therefore, the heat energy of this thermal source element can be transmitted to this lid and secondary lid through heat-conducting unit, heat conduction layers of foil, and exports through heat pipe and metal level rapid diffusion; In order to set up the position of a foundation thermal source element, nonthermal source element, arrange lid (and/or secondary lid), metal level and heat pipe path, in order to increase area of dissipation or heat radiation scope.
In order to achieve the above object, the conductive structure of the electronic component that the utility model provides comprises heat-conducting unit, lid, heat pipe, metal level and heat conduction layers of foil, wherein:
Heat-conducting unit is configured on an electronic component, and heat-conducting unit is the block structure be made up of the material that can conduct heat energy, comprises first end and the second end;
Lid has a rigid walls, lid forms an inner space, this inner space this electronic component coated, the opening that lid has an internal face, an outside wall surface and is formed between internal face and outside wall surface, heat-conducting unit is positioned at lid, and at least regional area of this heat-conducting unit is positioned at this opening part;
Heat pipe comprises cooling fluid, and heat pipe has the side of the first limit, Second Edge and connection first limit and Second Edge;
Metal level connects this heat pipe, and metal level comprises first surface and second, heat pipe and metal level one of them be arranged on this lid;
Heat conduction layers of foil connects heat-conducting unit, heat conduction layers of foil also the external wall of connection cover and internal face at least one of them, and it is closed to form electromagnetism to this opening, heat conduction layers of foil is the skim structure be made up of metal material, comprise first surface and second surface, the heat transfer efficiency of heat conduction layers of foil is more than or equal to the heat transfer efficiency of copper.
In an embodiment of the present utility model, the first end of this heat-conducting unit is arranged on electronic component, and the second end of heat-conducting unit connects the first surface of heat conduction layers of foil;
The second surface of heat conduction layers of foil engages the internal face of lid;
The outside wall surface of lid connects the first limit of heat pipe; And
The first surface of the Second Edge combination metal level of heat pipe.
In an embodiment of the present utility model, the first end of this heat-conducting unit is arranged on electronic component, and the second end of heat-conducting unit connects the first surface of heat conduction layers of foil;
The second surface of heat conduction layers of foil engages the internal face of lid;
The first surface of the outside wall surface bonding metallic layer of lid; And
First limit of second combination heat pipe of metal level.
In an embodiment of the present utility model, the first end of this heat-conducting unit is arranged on electronic component, and the second end of heat-conducting unit connects the internal face of lid;
The first surface of heat conduction layers of foil engages the outside wall surface of lid, and the second surface of heat conduction layers of foil engages the first limit of heat pipe; And
The first surface of the Second Edge combination metal level of heat pipe.
In an embodiment of the present utility model, the first end of this heat-conducting unit is arranged on electronic component, and the second end of heat-conducting unit connects the internal face of lid;
The first surface of heat conduction layers of foil engages the outside wall surface of lid, the first surface of the second surface bonding metallic layer of heat conduction layers of foil; And
First limit of second combination heat pipe of metal level.
In an embodiment of the present utility model, the first end of this heat-conducting unit is arranged on electronic component, and the second end projection of heat-conducting unit connects in lid opening and outwardly the first surface of heat conduction layers of foil.
In an embodiment of the present utility model, the area of this metal level is greater than the area of the outside wall surface of lid, and metal level is provided with a thermal source district is connected thermal source district non-thermal source region with one; And
Metal level is provided with at least one column, described column between the non-thermal source region and a circuit board of metal level, to make the non-thermal source region of this column support metal layer.
In an embodiment of the present utility model, the area of this metal level is greater than the area of lid outside wall surface, and metal level is provided with a thermal source district is connected thermal source district non-thermal source region with one; And
Metal level is provided with at least one column, described column between the non-thermal source region and a circuit board of metal level, to make the non-thermal source region of this column support metal layer.
In an embodiment of the present utility model, this electronic component comprises the thermal source element that can produce heat energy and the nonthermal source element that can not produce heat energy; Nonthermal source element is coated by a secondary lid;
Secondary lid has a rigid walls, and this secondary lid forms an inner space, this inner space this nonthermal source element coated, and secondary lid has an internal face and an outside wall surface; And
The second surface of heat pipe and one of them joint heat conduction layers of foil of metal level and the rigid walls of secondary lid.
In an embodiment of the present utility model, this electronic component comprises the thermal source element that can produce heat energy and the nonthermal source element that can not produce heat energy; Nonthermal source element is coated by a secondary lid;
Secondary lid has a rigid walls, and this secondary lid forms an inner space, this inner space this nonthermal source element coated, and secondary lid has an internal face and an outside wall surface; And
The second surface of heat pipe and one of them joint heat conduction layers of foil of metal level and the rigid walls of secondary lid.
In an embodiment of the present utility model, this electronic component comprises the thermal source element that can produce heat energy and the nonthermal source element that can not produce heat energy; Nonthermal source element is coated by a secondary lid;
Secondary lid has a rigid walls, and this secondary lid forms an inner space, this inner space this nonthermal source element coated; Secondary lid has an internal face and an outside wall surface; And
At least one of them is engaged between the rigid walls of lid and the rigid walls of secondary lid for heat pipe and metal level.
In an embodiment of the present utility model, this electronic component comprises the thermal source element that can produce heat energy and the nonthermal source element that can not produce heat energy; Nonthermal source element is coated by a secondary lid;
Secondary lid has a rigid walls, and this secondary lid forms an inner space, this nonthermal source element coated; Secondary lid has an internal face and an outside wall surface; And
At least one of them is engaged between the rigid walls of lid and the rigid walls of secondary lid for heat pipe and metal level.
In an embodiment of the present utility model, this metal level at least regional area is furnished with a coating be made up of thermal radiation material.
In an embodiment of the present utility model, this metal level at least regional area is furnished with a coating be made up of thermal radiation material.
In an embodiment of the present utility model, this metal level at least regional area is furnished with a coating be made up of thermal radiation material.
In an embodiment of the present utility model, this metal level at least regional area is furnished with a coating be made up of thermal radiation material.
In an embodiment of the present utility model, this metal level at least regional area is furnished with a coating be made up of thermal radiation material.
Accompanying drawing explanation
Fig. 1 is example structure of the present utility model combination schematic diagram;
Fig. 2 is the STRUCTURE DECOMPOSITION schematic diagram of Fig. 1;
Fig. 3 is the textural association cross-sectional schematic of Fig. 1;
Fig. 4 is a textural association cross-sectional schematic of the present utility model;
Fig. 5 is another textural association cross-sectional schematic of the present utility model;
Fig. 6 is another textural association cross-sectional schematic of the present utility model;
Fig. 7 is a textural association cross-sectional schematic more of the present utility model;
Fig. 8 is a textural association cross-sectional schematic of the present utility model;
Fig. 9 is a correction example structure combination schematic diagram of the present utility model;
Figure 10 is the STRUCTURE DECOMPOSITION schematic diagram of Fig. 9;
Figure 11 is the textural association cross-sectional schematic of Fig. 9;
Figure 12 is a textural association cross-sectional schematic of the present utility model;
Figure 13 another textural association cross-sectional schematic of the present utility model;
Figure 14 is another textural association cross-sectional schematic of the present utility model;
Figure 15 is an example structure combination schematic diagram more of the present utility model;
Figure 16 is an example structure combination schematic diagram of the present utility model;
Figure 17 is a possible embodiments textural association schematic diagram of the present utility model;
Figure 18 is the STRUCTURE DECOMPOSITION schematic diagram of Figure 17;
Figure 19 is the STRUCTURE DECOMPOSITION schematic diagram of Figure 17;
Figure 20 is a textural association cross-sectional schematic of the present utility model;
Figure 21 is a textural association cross-sectional schematic of the present utility model;
Figure 22 is another textural association cross-sectional schematic of the present utility model;
Figure 23 is another textural association cross-sectional schematic of the present utility model;
Figure 24 is a textural association cross-sectional schematic more of the present utility model.
Description of reference numerals: 10-heat-conducting unit; 11-first end; 12-second end; 20-electronic component; 20A-thermal source element; 20B-nonthermal source element; 30-lid; The secondary lid of 30B-; 31,36-rigid walls; 32,37-inner space; 33,38-internal face; 34,39-outside wall surface; 35-opening; 40-circuit board; 50-heat pipe; 51-first limit; 52-Second Edge; 53-side; 55-cooling fluid; 59-pars arcuata; 60-metal level; 61-first surface; 62-second; 90-heat conduction layers of foil; 91-first surface; 92-second surface.
Embodiment
As shown in Figure 1, Figure 2 and Figure 3, Fig. 1 is example structure of the present utility model combination schematic diagram, the parts such as Fig. 2 and Fig. 3 shows electronic component, heat-conducting unit protrudes that lid, heat conduction layers of foil are arranged between heat-conducting unit and heat pipe, heat pipe and metal level; The conductive structure of the electronic component that the utility model provides comprises a heat-conducting unit 10, is configured on an electronic component 20.Substantially, electronic component 20 is arranged on a circuit board 40.In adopted embodiment, this heat-conducting unit 10 selects the material that can conduct heat energy to make a block structure, thus has first end 11 and one second end 12; This first end 11 and the second end 12 form the structure kenel of a plane respectively, and this first end 11 is overlapped on this electronic component 20, the used heat (or heat energy) produced when working with conduction electron element 20.
Fig. 1, Fig. 2 and Fig. 3 show this conductive structure and also comprise a lid 30, this electronic component 20 coated, and combine with this heat-conducting unit 10.Specifically, this lid 30 has a rigid walls 31, and lid 30 forms box body (or plate body) the structure kenel that has inner space 32; Lid 30 (or rigid walls 31) has an internal face 33, outside wall surface 34 and is formed in opening 35 in internal face 33, outside wall surface 34.And, heat-conducting unit 10 at least regional area projection at this opening 35.Show the second end 12 projection of heat-conducting unit 10 in figure at opening 35 place, and engage a heat conduction layers of foil 90.
Fig. 1, Fig. 2 and Fig. 3 depict heat conduction layers of foil 90 and are arranged on heat-conducting unit 10 and lid 30, and form electromagnetism to this opening 35 and close, and along the position of heat-conducting unit second end 12 and lid outside wall surface 34, form arciform (section) structure.Specifically, heat conduction layers of foil 90 selects a metal material (such as, gold, silver, copper or its analog) make skim structure, thus have that comparatively common metal better conducts electricity, heat conduction and even temperature effect, or make the heat conduction of heat conduction layers of foil 90 (or conduction) efficiency be more than or equal to the heat transfer efficiency of copper; And heat conduction layers of foil 90 comprises or is provided with first surface 91 and second surface 92.In the second end 12 that first surface 91 is arranged on heat-conducting unit 10 and lid outside wall surface 34, and form electromagnetism to this opening 35 and close, second surface 92 connects or engages a heat pipe 50.Therefore, heat conduction layers of foil 90 can auxiliary heat conduction unit 10, the heat energy produce or used heat rapid diffusion, is transmitted to lid 30 and heat pipe 50 by electronic component 20.
From said structure, the structure kenel of this lid 30 significantly increases the area of dissipation of this electronic component 20; This lid 30 also provides ground connection to electronic component 20 and produces proofing dust and protecting, magnetic conduction or stop the effects such as electromagnetic interference.And, heat-conducting unit 10 projection directly engages the structural design of heat conduction layers of foil 90 at opening 35, the used heat (or heat energy) produced when electronic component 20 can be worked by heat-conducting unit 10 is directly delivered to heat pipe 50, thus export used heat (or heat energy) fast, obviously there is the effect reducing thermal resistance.And the textural association kenel of this heat-conducting unit 10, lid 30 and heat conduction layers of foil 90, significantly increases the area of dissipation of this electronic component 20.
Fig. 1, Fig. 2 and Fig. 3 also show the heat pipe 50 including cooling fluid 55 and are combined in this heat conduction layers of foil 90, and the arching of foundation heat conduction layers of foil 90, form a pars arcuata 59, engage heat conduction layers of foil 90.The imaginary line part of Fig. 3 depicts heat pipe 50 and also can form straight tube structure, engages heat conduction layers of foil 90.Heat pipe 50 adopts welding or binds operation, combination heat conduction layers of foil second surface 92.Therefore, the used heat (or heat energy) that the work of this electronic component 20 produces can conduct, be diffused into this lid 30 through heat-conducting unit 10, heat conduction layers of foil 90, and cools exchange through heat pipe 50, export.That is, heat pipe 50 can be guided heat energy fast and be left heat source region and guiding heat energy to a metal level 60 or other comparatively low-temperature regions, prevents hot concentration phenomenon.
In feasible embodiment, this heat pipe 50 has one first limit 51, Second Edge 52 and at least one side 53, connects this first limit 51, Second Edge 52.First limit 51 of heat pipe 50 connects heat conduction layers of foil second surface 92; And the Second Edge 52 of heat pipe 50 is provided with metal level 60.Show metal level 60 in figure and be set as film or flake structure, in order to form larger contact area or area of dissipation with the external world; Metal level 60 has first surface 61 and the second face 62; First surface 61 connects heat pipe Second Edge 52, and coordinates the quick conduction function of heat pipe 50, above-mentioned heat energy or heat is discharged fast.
In a preferred embodiment, the local of this metal level 60 or Zone Full can arrange a coating be made up of thermal radiation material, to set up the effect of a radial-type heat dissipating.
Show a derivative embodiment as shown in Figure 4, wherein electronic component, heat-conducting unit protrude lid, heat conduction layers of foil, metal level be arranged between heat conduction layers of foil and heat pipe.This heat-conducting unit second end 12 projection, at lid opening 35, in the second end 12 that heat conduction layers of foil 90 is bonded on heat-conducting unit and lid outside wall surface 34, and forms electromagnetism to opening 35 and closes; And metal level 60 is arranged between heat conduction layers of foil 90 and heat pipe 50, makes metal level first surface 61 engage heat conduction layers of foil second surface 92, metal level second face 62 connects heat pipe first limit 51.
Depict a preferred embodiment as shown in Figure 5, wherein electronic component, heat-conducting unit, heat conduction layers of foil be arranged between heat-conducting unit and lid, the part such as heat pipe is arranged on lid, metal level.This heat-conducting unit 10, heat conduction layers of foil 90 and electronic component 20 are covered by lid 30; Heat conduction layers of foil 90 is arranged on the position between heat-conducting unit 10 and lid 30.That is, heat-conducting unit first end 11 connecting electronic component 20, second end 12 engages heat conduction layers of foil first surface 91, and heat conduction layers of foil second surface 92 connects lid internal face 33, forms electromagnetism close this opening 35.And heat pipe 50 is arranged on the position between lid 30 and metal level 60.That is, the external wall 34 of heat pipe first limit 51 connection cover, heat pipe Second Edge 52 arranges connection metal layer first surface 61.
Fig. 6 shows a feasible embodiment, wherein electronic component, heat-conducting unit, heat conduction layers of foil be arranged between heat-conducting unit and lid, the part such as metal level is arranged on lid, heat pipe.This heat-conducting unit 10, heat conduction layers of foil 90 and electronic component 20 are covered by lid 30; Heat conduction layers of foil 90 is arranged on the position between heat-conducting unit 10 and lid 30.That is, heat-conducting unit first end 11 connecting electronic component 20, second end 12 engages heat conduction layers of foil first surface 91, and heat conduction layers of foil second surface 92 connects lid internal face 33, and it is closed to form electromagnetism to opening 35.And metal level 60 is arranged on the position between lid 30 and heat pipe 50.That is, metal level first surface 61 engages lid outside wall surface 34, and metal level second face 62 arranges combination heat pipe first limit 51.
Depict another preferred embodiment as shown in Figure 7, wherein electronic component, heat-conducting unit, lid, heat conduction layers of foil be arranged between lid and heat pipe, the part such as metal level.This heat-conducting unit 10 and electronic component 20 are covered by lid 30; Heat conduction layers of foil 90 is arranged on the position between heat-conducting unit 10 and lid 30.That is, heat-conducting unit first end 11 connecting electronic component 20, second end 12 engages lid internal face 33.And heat conduction layers of foil 90 is arranged on the position between lid 30 and heat pipe 50.That is, heat conduction layers of foil first surface 91 engages lid outside wall surface 34, and be recessed in opening 35 at lid opening 35 place, fit with this heat-conducting unit 10 second end 12, heat conduction layers of foil second surface 92 arranges and connects heat pipe first limit 51, and heat pipe Second Edge 52 combines the structure kenel of metal level first surface 61.
Fig. 8 shows a derivative embodiment, wherein electronic component, heat-conducting unit, lid, heat conduction layers of foil be arranged between lid and metal level, the part such as heat pipe.This heat-conducting unit 10 and electronic component 20 are covered by lid 30; Heat-conducting unit first end 11 connecting electronic component 20, second end 12 engages lid internal face 33.And heat conduction layers of foil 90 is arranged on the position between lid 30 and metal level 60.That is, heat conduction layers of foil first surface 91 engages lid outside wall surface 34, and is recessed in opening 35 at lid opening 35 place, fits with this heat-conducting unit 10 second end 12, heat conduction layers of foil second surface 92 arranges connection metal layer first surface 61, and heat pipe first limit 51 is combined in metal level second face 62.
As Fig. 9, Figure 10 and Figure 11 depict another specific embodiment, Fig. 9 shows between metal level and circuit board and is configured with column; Figure 10 shows electronic component, heat-conducting unit, lid, heat conduction layers of foil are arranged on heat-conducting unit, lid, heat pipe and metal layer part; Figure 11 depicts electronic component, heat-conducting unit protrudes that lid, heat conduction layers of foil are arranged on heat-conducting unit, lid, heat pipe and metal layer part.Electronic component 20 is configured on circuit board 40; Lid 30 this electronic component 20 coated, and combine with this heat-conducting unit 10, make the projection of heat-conducting unit second end 12 at opening 35, engage heat conduction layers of foil first surface 91.
Depicting heat conduction layers of foil 90 in figure is arranged on heat-conducting unit 10 and lid 30; Further, along the position of heat-conducting unit second end 12 and lid outside wall surface 34, arciform (section) structure is formed.That is, in the second end 12 that heat conduction layers of foil first surface 91 is arranged on heat-conducting unit 10 and lid outside wall surface 34, and electromagnetism closes this opening 35, and second surface 92 connects or engages heat pipe 50.Therefore, heat conduction layers of foil 90 can auxiliary heat conduction unit 10, the heat energy produce or used heat rapid diffusion, is transmitted to lid 30 and heat pipe 50 by electronic component 20.Heat pipe first limit 51 is combined in heat conduction layers of foil 90, and the arching of foundation heat conduction layers of foil 90, form pars arcuata 59, engage heat conduction layers of foil second surface 92.The imaginary line part of Figure 11 depicts heat pipe 50 and forms straight tube structure, engages the structure kenel of heat conduction layers of foil 90.
The structure kenel of heat pipe Second Edge 52 bonding metallic layer first surface 61 is also show in figure; Further, the area of metal level 60 is greater than the area of this lid 30 (outside wall surface 34).In adopted embodiment, metal level 60 is the plate body of a rectangular profile, is provided with an overlapped thermal source district 63 on heat pipe 50 and is connected thermal source district 63 with one, forms the region (or claiming non-thermal source region 64) of cantilever kenel.And metal level 60 is provided with at least one column 70; Described column 70, between the non-thermal source region 64 and circuit board 40 of metal level 60, makes this column 70 support the non-thermal source region 64 of this metal level 60, after allowing metal level 60 and heat pipe 50 combine, can not produce sagging.
In feasible embodiment, the local of this metal level 60 or Zone Full are furnished with a coating (figure does not show); Described coating is made up of thermal radiation material, has more more preferably radial-type heat dissipating effect to make this metal level 60.
Suppose that this coating is arranged in the non-thermal source region 64 of metal level 60; When the used heat (or heat energy) of electronic component 20 work generation is behind the thermal source district 63 that heat-conducting unit 10 is transmitted to this lid 30 and metal level 60, this heat energy can be transmitted to non-thermal source region 64 from thermal source district 63, thermal radiation material through coating dispels the heat with radiation mode, and coordinate heat pipe 50 to conduct fast, cool exchange, then export, obviously can improve radiating efficiency.Specifically, the area of this metal level 60 is obviously greater than the area of this lid 30 (outside wall surface 34), makes conductive structure have better radiating effect.
Show a derivative embodiment as shown in figure 12, show electronic component, heat-conducting unit protrude that lid, heat conduction layers of foil are arranged on heat-conducting unit, lid, the architectural scenarios of the part such as metal level and heat pipe, and be configured with column between metal level and circuit board.This heat-conducting unit second end 12 projection is at lid opening 35, and heat conduction layers of foil 90 one-tenth archings, are bonded in heat-conducting unit second end 12 and lid outside wall surface 34, and it is closed to form electromagnetism to this opening 35; Metal level 60 is arranged on the position between heat conduction layers of foil 90 and heat pipe 50, makes metal level first surface 61 engage heat conduction layers of foil second surface 92, metal level second face 62 connects heat pipe first limit 51.And, the structure kenel of column 70 support metal layer 60 (or non-thermal source region 64).
Depict a preferred embodiment as shown in figure 13, wherein electronic component, heat-conducting unit, heat conduction layers of foil be arranged between heat-conducting unit and lid, the part such as heat pipe, metal level.This heat-conducting unit 10, heat conduction layers of foil 90 and electronic component 20 are covered by lid 30; Heat conduction layers of foil 90 is arranged on the position between heat-conducting unit 10 and lid 30.That is, heat-conducting unit first end 11 connecting electronic component 20, second end 12 engages heat conduction layers of foil first surface 91, and heat conduction layers of foil second surface 92 connects lid internal face 33, and is recessed in opening 35 at lid opening 35 place.Further, heat pipe 50 is arranged on the position between lid 30 and metal level 60.That is, the external wall 34 of heat pipe first limit 51 connection cover, and contact with heat conduction layers of foil second surface 92 at opening 35 place, heat pipe Second Edge 52 arranges the structure kenel of connection metal layer first surface 61.And, the structure kenel of column 70 support metal layer 60 (or non-thermal source region 64).
Show the embodiment that another is derivative as shown in figure 14, wherein electronic component, heat-conducting unit, heat conduction layers of foil be arranged between heat-conducting unit and lid, the combination situations of the part such as metal level, heat pipe, and be configured with column between metal level and circuit board.This heat-conducting unit 10, heat conduction layers of foil 90 and electronic component 20 are covered by lid 30; Heat conduction layers of foil 90 is arranged on the position between heat-conducting unit 10 and lid 30.That is, heat-conducting unit first end 11 connecting electronic component 20, second end 12 engages heat conduction layers of foil first surface 91, and heat conduction layers of foil second surface 92 connects lid internal face 33 and is recessed in opening 35 at lid opening 35 place.Further, metal level 60 is arranged on the position between lid 30 and heat pipe 50.That is, metal level first surface 61 engages lid outside wall surface 34 and is positioned at the heat conduction layers of foil second surface 92 at opening 35 place, and metal level second face 62 arranges the structure kenel on combination heat pipe first limit 51.And, the structure kenel of column 70 support metal layer 60 (or non-thermal source region 64).
Depict the embodiment that another is feasible as shown in figure 15, wherein electronic component, heat-conducting unit, lid, heat conduction layers of foil be arranged between lid and heat pipe, the combination situations of the part such as metal level, and be configured with column between metal level and circuit board.This heat-conducting unit 10 and electronic component 20 are covered by lid 30; Heat-conducting unit first end 11 connecting electronic component 20, second end 12 engages lid internal face 33.Further, heat conduction layers of foil 90 is arranged on the position between lid 30 and heat pipe 50.That is, heat conduction layers of foil first surface 91 engages lid outside wall surface 34, and forms recessed and electromagnetism at this opening 35 and close, and heat conduction layers of foil second surface 92 arranges and connects heat pipe first limit 51, and heat pipe Second Edge 52 combines the structure kenel of metal level first surface 61.And, the structure kenel of column 70 support metal layer 60 (or non-thermal source region 64).
Figure 16 shows a derivative embodiment, wherein electronic component, heat-conducting unit, lid, heat conduction layers of foil be arranged between lid and metal level, the part such as heat pipe, and be configured with column between metal level and circuit board.This heat-conducting unit 10 and electronic component 20 are covered by lid 30; Heat-conducting unit first end 11 connecting electronic component 20, second end 12 engages lid internal face 33.Further, heat conduction layers of foil 90 is arranged on the position between lid 30 and metal level 60.That is, heat conduction layers of foil first surface 91 engages lid outside wall surface 34 and forms recessed and electromagnetism to this opening 35 and closes, and heat conduction layers of foil second surface 92 arranges connection metal layer first surface 61, and heat pipe first limit 51 is combined in metal level second face 62.And, column 70 support metal layer 60 (or non-thermal source region 64).
As shown in Figure 17, Figure 18 and Figure 19, the deposition path of the heat pipe wherein in Figure 17 connects lid and secondary lid, and Figure 18 shows thermal source element, heat-conducting unit, lid, heat conduction layers of foil are arranged on heat-conducting unit and lid, nonthermal source element arranges the parts such as secondary lid, heat pipe and metal level; Figure 19 shows thermal source element, heat-conducting unit protrudes lid, heat conduction layers of foil is arranged on heat-conducting unit and lid, nonthermal source element arranges the parts such as secondary lid, heat pipe and metal level.Suppose that the electronic component 20 of configuration on circuit board 40 comprises the electronic component (being defined as thermal source element 20A) that can produce used heat and the electronic component (being defined as nonthermal source element 20B) that can not produce used heat.This heat-conducting unit 10, heat conduction layers of foil 90 coordinate lid 30, are configured on thermal source element 20A, make the projection of heat-conducting unit second end 12 at opening 35, engage heat conduction layers of foil first surface 91; One secondary lid 30B coated nonthermal source element 20B is provided.And, arrange that heat pipe 50 passes through or connects each lid 30 (or heat conduction layers of foil 90) and secondary lid 30B; Therefore, the heat energy of this thermal source element 20A can be transmitted to this lid 30 and secondary lid 30B, and export fast through heat pipe 50 and metal level 60 through heat-conducting unit 10, heat conduction layers of foil 90; In order to set up the position of a foundation thermal source element 20A, nonthermal source element 20B, arrange lid 30 (and/or secondary lid 30B), metal level 60 and heat pipe 50 path, in order to increase area of dissipation or heat radiation scope.
Depicting heat conduction layers of foil 90 in figure is arranged on heat-conducting unit 10 and lid 30; Further, along the position of heat-conducting unit second end 12 and lid outside wall surface 34, arciform (section) structure is formed.That is, in the second end 12 that heat conduction layers of foil first surface 91 is arranged on heat-conducting unit 10 and lid outside wall surface 34, and it is closed to form electromagnetism to this opening 35, second surface 92 connects or engages heat pipe first limit 51, and heat pipe 50 is according to the arching of heat conduction layers of foil 90, form pars arcuata 59, engage heat conduction layers of foil second surface 92.The imaginary line part of Figure 19 depicts heat pipe 50 and forms straight tube structure, engages the structure kenel of heat conduction layers of foil 90.
In adopted embodiment, secondary lid 35 also has a rigid walls 36, and secondary lid 30B forms box body (or plate body) structure that has inner space 37; Secondary lid 30B has internal face 38 and an outside wall surface 39; And secondary lid outside wall surface 39 arranges and engages this heat pipe 50.In adopted embodiment, the internal face 38 of secondary lid 30B, outside wall surface 39 also form the structure kenel of a plane.
Show heat pipe 50 in figure and be arranged on position between heat conduction layers of foil 90 (and/or secondary lid 30B) and metal level 60.Therefore, heat pipe first limit 51 connects heat conduction layers of foil first surface 91 (or side 53 can the external wall of connection cover 34) and secondary lid outside wall surface 39; Further, the structure kenel of heat pipe Second Edge 52 connection metal layer first surface 61 is made.
From said structure, the structure kenel of secondary lid 30B assists the area of dissipation adding this thermal source element 20A; Further, secondary lid 30B also provides ground connection to nonthermal source element 20B and produces proofing dust and protecting, magnetic conduction or stop the effects such as electromagnetic interference.
What must be illustrated is, this heat conduction layers of foil 90, lid 30 (and/or secondary lid 30B) and heat pipe 50 path are arranged according to the position of thermal source element 20A and/or nonthermal source element 20B, the used heat that thermal source element 20A is produced or heat energy can be transmitted to this lid 30 and secondary lid 30B through heat-conducting unit 10 and heat conduction layers of foil 90, and coordinate heat pipe 50 path and metal level 60 to export, to increase area of dissipation and the even temperature effect of this cooling system.That is, the used heat (or heat energy) that this thermal source element 20A produces not only is discharged through connection its heat-conducting unit 10, heat conduction layers of foil 90 and lid 30, secondary lid 30B, heat pipe 50; Also comprise heat pipe 50 Lu ?arrange connect metal level 60.Therefore, the area of dissipation of conductive structure obviously increases; Further, coordinate the diffusion conductive force of heat conduction layers of foil 90, more preferably even temperature effect can be obtained.
Show a derivative embodiment as shown in figure 20, wherein thermal source element, heat-conducting unit protrude that lid, heat conduction layers of foil are arranged on heat-conducting unit and lid, nonthermal source element arranges the parts such as secondary lid, metal level and heat pipe, and metal level is arranged and connected lid and secondary lid.The first end 11 of this heat-conducting unit engages thermal source element 20A, and the second end 12 of heat-conducting unit protrudes lid opening 35; Heat conduction layers of foil 90 one-tenth archings, are bonded in heat-conducting unit second end 12 and lid outside wall surface 34; Metal level 60 is arranged on the position between heat conduction layers of foil 90 (and/or secondary lid 30B) and heat pipe 50, and make metal level first surface 61 engage heat conduction layers of foil second surface 92 and secondary lid outside wall surface 39, the second face 62 of metal level connects heat pipe first limit 51.
As shown in figure 21, this heat-conducting unit 10, heat conduction layers of foil 90 and thermal source element 20A are covered by lid 30; Heat conduction layers of foil 90 is arranged on the position between heat-conducting unit 10 and lid 30.That is, heat-conducting unit first end 11 connects thermal source element 20A, and the second end 12 engages heat conduction layers of foil first surface 91, and heat conduction layers of foil second surface 92 connects in lid internal face 33 and recessed opening 35.Further, heat pipe 50 is arranged on the position between lid 30 (and/or secondary lid 30B) and metal level 60, makes heat pipe 50 path by lid 30 and secondary lid 30B.That is, the external wall of heat pipe first limit 51 connection cover 34, recessed heat conduction layers of foil second surface 92, secondary lid outside wall surface 39 in opening 35, heat pipe Second Edge 52 arranges the structure kenel of connection metal layer first surface 61.
As Figure 22 shows another derivative embodiment, wherein thermal source element, heat-conducting unit, heat conduction layers of foil is arranged between heat-conducting unit and lid, nonthermal source element arranges secondary lid, metal level is arranged on lid, between secondary lid and heat pipe, and metal level is arranged and connected lid and secondary lid.This heat-conducting unit 10, heat conduction layers of foil 90 and thermal source element 20A are covered by lid 30; Heat conduction layers of foil 90 is arranged on the position between heat-conducting unit 10 and lid 30.That is, heat-conducting unit first end 11 connects thermal source element 20A, and the second end 12 engages heat conduction layers of foil first surface 91, and heat conduction layers of foil second surface 92 connects in lid internal face 33 and recessed opening 35.Further, metal level 60 is arranged on the position between lid 30 (and/or secondary lid 30B) and heat pipe 50.That is, metal level first surface 61 engages lid outside wall surface 34, recessed heat conduction layers of foil second surface 92, secondary lid outside wall surface 39 in opening 35, and heat pipe first limit 51 is combined in metal level second face 62.
Depict the embodiment that another is feasible as shown in figure 23, wherein thermal source element, heat-conducting unit, lid, heat conduction layers of foil is arranged between lid and heat pipe, nonthermal source element arranges secondary lid, metal level is arranged on heat pipe, and the deposition path of heat pipe connects lid and secondary lid.This heat-conducting unit 10 and thermal source element 20A are covered by lid 30; Heat-conducting unit first end 11 connects thermal source element 20A, and the second end 12 engages lid internal face 33.Further, heat conduction layers of foil 90 is arranged on the position between lid 30 and heat pipe 50.That is, heat conduction layers of foil first surface 91 engages lid outside wall surface 34, and in this opening 35 recessed, and recessed portion contacts with this heat-conducting unit second end 12, heat conduction layers of foil second surface 92 arranges and connects heat pipe first limit 51, and make heat pipe 50 path through secondary lid 30B, auxiliary connection lid rigid walls 36; And heat pipe Second Edge 52 combines the structure kenel of metal level first surface 61.
Figure 24 shows a derivative embodiment, wherein thermal source element, heat-conducting unit, lid, heat conduction layers of foil is arranged between lid and metal level, nonthermal source element arranges secondary lid, heat pipe is arranged on the metal layer, and metal level is arranged and is connected lid and secondary lid.This heat-conducting unit 10 and thermal source element 20A are covered by lid 30; Heat-conducting unit first end 11 connects thermal source element 20A, and the second end 12 engages lid internal face 33.Further, heat conduction layers of foil 90 is arranged on the position between lid 30 and metal level 60.That is, heat conduction layers of foil first surface 91 engages in lid outside wall surface 34 and recessed opening 35, and contacting the second end 12 of this heat-conducting unit, heat conduction layers of foil second surface 92 arranges connection metal layer first surface 61, and makes metal level first surface 61 engage secondary lid rigid walls 36 or outside wall surface 39; And heat pipe first limit 51 is combined in metal level second face 62.
Representational, the conductive structure of the electronic component that the utility model provides, under the condition having proofing dust and protecting, stop electromagnetic interference and meet manufacturing cost, compared to existing technologies, has following advantages:
1. this conductive structure and related elements structure, operation use situation etc., have been redesigned consideration, and have changed its use kenel, thus be different from prior art.Such as, this electronic component 20 coordinates heat-conducting unit 10, heat conduction layers of foil 90, lid 30, or this heat-conducting unit 10 comprises first end 11 and the second end 12, heat conduction layers of foil 90 comprise first surface 91 and second surface 92, coordinate internal face 33, the outside wall surface 34 of lid 30, or combination heat pipe 50, metal level 60; Or coordinate heat conduction layers of foil 90 one-tenth archings, heat pipe 50 is made to be provided with the structural design of part such as pars arcuata 59 grade, obviously tend to apply axle or pipe, slot with existing radiator structure, answering rank protuberance or fastener, corresponding the more complicated textural association kenel such as to fasten different, thus provide one more to be simplified and be convenient to combination structural design than prior art.
2. particularly, this metal foil layer 90 arranges the structure organization connecting heat-conducting unit 10, lid 30, heat pipe 50 or metal level 60, produce one can rapid diffusion, heat conduction effect, relatively improve the radiating efficiency of electronic component 20, also obtain than prior art more preferably even temperature effect.And, make lid 30 (and/or secondary lid 30B) and heat pipe 50 path, structural design that metal level 60 is arranged according to the position of thermal source element 20A, nonthermal source element 20B, the area of dissipation of conductive structure is obviously increased, thus form the contact kenel of larger area, also improve heat radiation or used heat discharge effect.
The foregoing is only possible embodiments of the present utility model, be not used for limiting the scope that the utility model is implemented, namely all equalization changes done according to the utility model right with modify, be all the utility model protection range and contain.
Claims (17)
1. a conductive structure for electronic component, is characterized in that, comprises heat-conducting unit, lid, heat pipe, metal level and heat conduction layers of foil, wherein:
Heat-conducting unit is configured on an electronic component, and heat-conducting unit is the block structure be made up of the material that can conduct heat energy, comprises first end and the second end;
Lid has a rigid walls, lid forms an inner space, this inner space this electronic component coated, the opening that lid has an internal face, an outside wall surface and is formed between internal face and outside wall surface, heat-conducting unit is positioned at lid, and at least regional area of this heat-conducting unit is positioned at this opening part;
Heat pipe comprises cooling fluid, and heat pipe has the side of the first limit, Second Edge and connection first limit and Second Edge;
Metal level connects this heat pipe, and metal level comprises first surface and second, heat pipe and metal level one of them be arranged on this lid;
Heat conduction layers of foil connects heat-conducting unit, heat conduction layers of foil also the external wall of connection cover and internal face at least one of them, and it is closed to form electromagnetism to this opening, heat conduction layers of foil is the skim structure be made up of metal material, comprise first surface and second surface, the heat transfer efficiency of heat conduction layers of foil is more than or equal to the heat transfer efficiency of copper.
2. the conductive structure of electronic component according to claim 1, is characterized in that, the first end of this heat-conducting unit is arranged on electronic component, and the second end of heat-conducting unit connects the first surface of heat conduction layers of foil;
The second surface of heat conduction layers of foil engages the internal face of lid;
The outside wall surface of lid connects the first limit of heat pipe; And
The first surface of the Second Edge combination metal level of heat pipe.
3. the conductive structure of electronic component according to claim 1, is characterized in that, the first end of this heat-conducting unit is arranged on electronic component, and the second end of heat-conducting unit connects the first surface of heat conduction layers of foil;
The second surface of heat conduction layers of foil engages the internal face of lid;
The first surface of the outside wall surface bonding metallic layer of lid; And
First limit of second combination heat pipe of metal level.
4. the conductive structure of electronic component according to claim 1, is characterized in that, the first end of this heat-conducting unit is arranged on electronic component, and the second end of heat-conducting unit connects the internal face of lid;
The first surface of heat conduction layers of foil engages the outside wall surface of lid, and the second surface of heat conduction layers of foil engages the first limit of heat pipe; And
The first surface of the Second Edge combination metal level of heat pipe.
5. the conductive structure of electronic component according to claim 1, is characterized in that, the first end of this heat-conducting unit is arranged on electronic component, and the second end of heat-conducting unit connects the internal face of lid;
The first surface of heat conduction layers of foil engages the outside wall surface of lid, the first surface of the second surface bonding metallic layer of heat conduction layers of foil; And
First limit of second combination heat pipe of metal level.
6. the conductive structure of the electronic component according to claim 1 or 2 or 3 or 4 or 5, it is characterized in that, the first end of this heat-conducting unit is arranged on electronic component, and the second end projection of heat-conducting unit connects in lid opening and outwardly the first surface of heat conduction layers of foil.
7. the conductive structure of the electronic component according to claim 1 or 2 or 3 or 4 or 5, it is characterized in that, the area of this metal level is greater than the area of the outside wall surface of lid, and metal level is provided with a thermal source district is connected thermal source district non-thermal source region with one; And
Metal level is provided with at least one column, described column between the non-thermal source region and a circuit board of metal level, to make the non-thermal source region of this column support metal layer.
8. the conductive structure of electronic component according to claim 6, is characterized in that, the area of this metal level is greater than the area of lid outside wall surface, and metal level is provided with a thermal source district is connected thermal source district non-thermal source region with one; And
Metal level is provided with at least one column, described column between the non-thermal source region and a circuit board of metal level, to make the non-thermal source region of this column support metal layer.
9. the conductive structure of the electronic component according to claim 1 or 2 or 3 or 4 or 5, is characterized in that, this electronic component comprises the thermal source element that can produce heat energy and the nonthermal source element that can not produce heat energy; Nonthermal source element is coated by a secondary lid;
Secondary lid has a rigid walls, and this secondary lid forms an inner space, this inner space this nonthermal source element coated, and secondary lid has an internal face and an outside wall surface; And
The second surface of heat pipe and one of them joint heat conduction layers of foil of metal level and the rigid walls of secondary lid.
10. the conductive structure of electronic component according to claim 6, is characterized in that, this electronic component comprises the thermal source element that can produce heat energy and the nonthermal source element that can not produce heat energy; Nonthermal source element is coated by a secondary lid;
Secondary lid has a rigid walls, and this secondary lid forms an inner space, this inner space this nonthermal source element coated, and secondary lid has an internal face and an outside wall surface; And
The second surface of heat pipe and one of them joint heat conduction layers of foil of metal level and the rigid walls of secondary lid.
The conductive structure of 11. electronic components according to claim 1 or 2 or 3 or 4 or 5, is characterized in that, this electronic component comprises the thermal source element that can produce heat energy and the nonthermal source element that can not produce heat energy; Nonthermal source element is coated by a secondary lid;
Secondary lid has a rigid walls, and this secondary lid forms an inner space, this inner space this nonthermal source element coated; Secondary lid has an internal face and an outside wall surface; And
At least one of them is engaged between the rigid walls of lid and the rigid walls of secondary lid for heat pipe and metal level.
The conductive structure of 12. electronic components according to claim 6, is characterized in that, this electronic component comprises the thermal source element that can produce heat energy and the nonthermal source element that can not produce heat energy; Nonthermal source element is coated by a secondary lid;
Secondary lid has a rigid walls, and this secondary lid forms an inner space, this nonthermal source element coated; Secondary lid has an internal face and an outside wall surface; And
At least one of them is engaged between the rigid walls of lid and the rigid walls of secondary lid for heat pipe and metal level.
The conductive structure of 13. electronic components according to claim 1 or 2 or 3 or 4 or 5, it is characterized in that, this metal level at least regional area is furnished with a coating be made up of thermal radiation material.
The conductive structure of 14. electronic components according to claim 6, is characterized in that, this metal level at least regional area is furnished with a coating be made up of thermal radiation material.
The conductive structure of 15. electronic components according to claim 7, is characterized in that, this metal level at least regional area is furnished with a coating be made up of thermal radiation material.
The conductive structure of 16. electronic components according to claim 9, is characterized in that, this metal level at least regional area is furnished with a coating be made up of thermal radiation material.
The conductive structure of 17. electronic components according to claim 11, is characterized in that, this metal level at least regional area is furnished with a coating be made up of thermal radiation material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104202861 | 2015-02-17 | ||
| TW104202861 | 2015-02-17 |
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| Publication Number | Publication Date |
|---|---|
| CN204810791U true CN204810791U (en) | 2015-11-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520464552.8U Expired - Fee Related CN204810791U (en) | 2015-02-17 | 2015-07-01 | heat conducting structure of electronic element |
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|---|---|
| CN (1) | CN204810791U (en) |
| TW (1) | TWM513392U (en) |
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2015
- 2015-06-26 TW TW104210342U patent/TWM513392U/en not_active IP Right Cessation
- 2015-07-01 CN CN201520464552.8U patent/CN204810791U/en not_active Expired - Fee Related
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| TWM513392U (en) | 2015-12-01 |
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