CN204810788U - Heat conducting structure for electronic component - Google Patents
Heat conducting structure for electronic component Download PDFInfo
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- CN204810788U CN204810788U CN201520437644.7U CN201520437644U CN204810788U CN 204810788 U CN204810788 U CN 204810788U CN 201520437644 U CN201520437644 U CN 201520437644U CN 204810788 U CN204810788 U CN 204810788U
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- heat
- foil
- lid
- conduction layers
- heat pipe
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- 239000011888 foil Substances 0.000 claims abstract description 147
- 229910052751 metal Inorganic materials 0.000 claims abstract description 103
- 239000002184 metal Substances 0.000 claims abstract description 103
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims abstract description 6
- 230000005855 radiation Effects 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 238000012546 transfer Methods 0.000 claims description 5
- 239000012530 fluid Substances 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 16
- 238000013461 design Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000011469 building brick Substances 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 230000002277 temperature effect Effects 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000009640 blood culture Methods 0.000 description 1
- 239000002772 conduction electron Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000011534 incubation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat conducting structure for electronic elements is simple in structure and combination, meets cost conditions, improves heat conducting and radiating efficiency, achieves temperature equalization and the like. Comprises an electronic element and a cover body with an opening, and the cover body covers the electronic element; the electronic component is optionally provided with a heat conducting unit. A heat conductive foil layer or heat pipe is disposed on the cover body, forming an arcuate portion along the opening to form a connection or access opening into the cover body to create a clearance space to increase the applicable margin of component assembly. The heat dissipation efficiency of the heat conduction foil layer is more than or equal to that of copper; and the heat conduction foil layer or the heat pipe is combined with a metal layer and is arranged on the cover body together. Therefore, the heat energy of the electronic component can be conducted to the cover body and the heat conductive foil layer and rapidly output through the heat pipe and the metal layer.
Description
Technical field
The utility model has the design about a kind of heat conduction/radiator structure for electronic component; Refer to a kind of application heat conduction layers of foil, lid, heat pipe and metal level especially, selective incubation heat-conducting unit, the utility model that the heat carrying out an auxiliary electronic component is discharged.
Background technology
Apply fin or the fin tissue of multiple arrangement, the used heat produced when discharging those electronic components or computer cpu work, to keep their operating efficiency or to avoid causing the situation when machine, has been prior art.Prior art has disclosed the fin that a kind of integrated aluminium extruded type cuts off processing, or radiation panel and radiating fin is separated and manufacture, in the means of interlocking assembling or the tissue that is welded into a whole.Such as, TaiWan, China No. 86116954 " heat abstractor fin assemble method and goods thereof " Patent Case, provides a typical embodiment.The people haveing the knack of this skill just as those known, this skill is cumbersome in manufacture, processing operation and difficulty.
Prior art has also disclosed and a kind of on fin or fin, has arranged axis hole, combined axis or pipe through this axis hole, to be assembled the means of tissue in aggregates.Such as, TaiWan, China No. 91209087 " combined structure of fin " or TaiWan, China No. 94205324 " radiating fin improved structure " Patent Case etc., provide typical embodiment.
Prior art has also disclosed a kind of at fin or fin side or upper and lower end arranges groove or slot, multiple rank protuberance or fastener correspondence fasten, to be assembled the means concept of tissue in aggregates.Such as, No. 91213373rd, TaiWan, China " blood culture bottle improvement ", No. 86221373rd, TaiWan, China " Assembled radiator structure ", TaiWan, China No. 93218949 " groups of fins fastening structure " or TaiWan, China No. 91208823 " combining structure of radiating fin " Patent Case etc., also provided feasible embodiment.
Representational, these references show the structure skill being configured in electronic building brick aspect about applying radiator structure.Existing fin or fin structure often tend to apply the more complicated textural association such as axle or pipe, slot, multiple rank protuberance or fastener correspondence fastening.If redesign and consider this radiator structure, make it construct and be different from prior art, its use form can be changed, and be different from old law.Such as, make its structural design meet a condition of simplifying, or be convenient to combine, and there is proofing dust and protecting, prevention electromagnetic interference and improve the effects such as radiating efficiency; Particularly, coordinate layout one can produce the structure of the metal foil layer of quick conductive force further, according to the configuration space of electronic building brick, a space application nargin can be set up, and the means such as the area of dissipation of increase electronic component and/or efficiency; And these problems are not all disclosed in above-mentioned reference.
Utility model content
Namely main purpose of the present utility model is to provide a kind of conductive structure for electronic component, provides a structure, combines easy, meet cost conditions, improve heat conduction, radiating efficiency and reach the effects such as samming.
For reaching above-mentioned purpose, the utility model provides a kind of conductive structure for electronic component, and it comprises: lid, and this lid has a rigid walls, defines lid and forms an inner space, a coated electronic component; The opening that lid has an internal face, an outside wall surface and is formed between internal face and outside wall surface;
One of them of heat conduction layers of foil and heat pipe is arranged on this lid, and coordinates this opening to be provided with pars arcuata;
Heat conduction layers of foil selects metal material to make skim structure, has first surface and second surface; The heat transfer efficiency of heat conduction layers of foil is more than or equal to the heat transfer efficiency of copper;
Heat conduction layers of foil engages heat pipe; Heat-exchange fluid is comprised in heat pipe; And
One metal level is fitted and connected one of them of heat pipe and heat conduction layers of foil according to shape; Metal level comprises first surface, second and the metal level pars arcuata that coordinates above-mentioned pars arcuata and establish.
The described conductive structure for electronic component, wherein, this electronic component is provided with a heat-conducting unit;
Heat-conducting unit selects the material that can conduct heat energy to make a block structure, and has a first end and the second end; Heat-conducting unit first end is arranged on electronic component, and the second end of heat-conducting unit connects the internal face of lid and the first surface of heat conduction layers of foil;
Heat conduction layers of foil, along the second end of heat-conducting unit and the outside wall surface of lid, the position of opening, forms its pars arcuata, and allows that heat conduction layers of foil pars arcuata enters opening; The second surface of heat conduction layers of foil engages the first limit of heat pipe;
The pars arcuata of corresponding heat conduction layers of foil, heat pipe is formed with a pars arcuata; And
The first surface of the Second Edge combination metal level of heat pipe.
The described conductive structure for electronic component, wherein, this electronic component is provided with a heat-conducting unit;
Heat-conducting unit selects the material that can conduct heat energy to make a block structure, and has a first end and the second end; Heat-conducting unit first end is arranged on electronic component, and heat-conducting unit second end connects the internal face of lid and the first limit of heat pipe;
Heat pipe, along the position of heat-conducting unit second end and lid outside wall surface, opening, forms electromagnetism and closes, and heat pipe pars arcuata is allowed and entered opening; Heat pipe Second Edge engages the first surface of heat conduction layers of foil;
The pars arcuata correspondence of heat conduction layers of foil engages the pars arcuata of heat pipe; And
The first surface of the second surface combination metal level of heat conduction layers of foil.
The described conductive structure for electronic component, wherein, this heat conduction layers of foil first surface is arranged in the outside wall surface of lid;
The outside wall surface of heat conduction layers of foil along lid, the position of opening, form its pars arcuata, and allow that heat conduction layers of foil pars arcuata enters opening;
The second surface of heat conduction layers of foil engages the first limit of heat pipe;
The pars arcuata of corresponding heat conduction layers of foil, heat pipe is formed with a pars arcuata; And
The first surface of the Second Edge combination metal level of heat pipe.
The described conductive structure for electronic component, wherein, the first limit of this heat pipe is arranged in the outside wall surface of lid, and it is closed to form electromagnetism to this opening;
Heat pipe, along the position of lid outside wall surface, opening, forms its pars arcuata, and allows that heat pipe pars arcuata enters opening;
The Second Edge of heat pipe engages the first surface of heat conduction layers of foil;
The pars arcuata correspondence of heat conduction layers of foil engages the pars arcuata of heat pipe; And
The first surface of the second surface combination metal level of heat conduction layers of foil.
The described conductive structure for electronic component, wherein, the area of this metal level is greater than the area of the outside wall surface of lid, and metal level definition has a thermal source district to be connected the non-thermal source region in thermal source district with one; And
Metal level is provided with at least one column; Described column position, between the non-thermal source region and a circuit board of metal level, makes the non-thermal source region of this column support metal layer.
The described conductive structure for electronic component, wherein, this electronic component comprises the thermal source element that can produce heat energy and the nonthermal source element that can not produce heat energy; Nonthermal source element is coated by a secondary lid;
Secondary lid has a rigid walls, defines secondary lid and forms an inner space, this nonthermal source element coated; Secondary lid has an internal face and an outside wall surface; And
One of them of heat conduction layers of foil and heat pipe engages lid rigid walls and secondary lid rigid walls.
The described conductive structure for electronic component, wherein, this metal level at least regional area is furnished with the coating of a thermal radiation material formation.
The utility model comprises the lid that an electronic component and has opening, this electronic component coated; Described electronic component is optionally provided with a heat-conducting unit.Heat conduction layers of foil or the heat pipe of one geometric form profile are arranged on lid, form the pars arcuata that is recessed towards opening along aperture position, and connect or enter opening, to dodge space to set up one in overthe openings region, to increase applicable nargin in assembly.The radiating efficiency of heat conduction layers of foil is more than or equal to the radiating efficiency of copper; And heat conduction layers of foil or heat pipe heat unification metal level, be co-located on this lid.Therefore, the heat energy of this electronic component can be transmitted to lid and heat conduction layers of foil, and exports heat radiation fast through heat pipe and metal level.
Be used for the conductive structure of electronic component according to the utility model, this metal level forms the structure kenel of a geometric form profile; Further, the area of metal level is greater than the area of this lid.And metal level definition has a thermal source district above lid to be connected thermal source district with one, forms the region (or claiming non-thermal source region) of cantilever kenel; This metal level is provided with at least one column; Described column position, between the non-thermal source region and a circuit board of this metal level, makes this column support the non-thermal source region of this metal level.
Be used for the conductive structure of electronic component according to the utility model, this electronic component comprises the electronic component (being defined as thermal source element) that can produce used heat and the electronic component (being defined as nonthermal source element) that can not produce used heat.This heat-conducting unit and/or heat conduction layers of foil coordinate lid, are configured on thermal source element; The coated nonthermal source element of one secondary lid.And, arrange that heat pipe or heat conduction layers of foil are by each lid and secondary lid; Therefore, the heat energy of this thermal source element can be transmitted to this lid and secondary lid, and export fast through heat pipe and metal level through heat-conducting unit, heat conduction layers of foil; In order to set up the position of a foundation thermal source element, nonthermal source element, arrange lid (and/or secondary lid), heat conduction layers of foil and heat pipe path, in order to set up the effect of an increase area of dissipation or heat radiation scope.
Accompanying drawing explanation
Fig. 1 is example structure of the present utility model combination schematic diagram;
Fig. 2 is the STRUCTURE DECOMPOSITION schematic diagram of Fig. 1; Show electronic component, architectural scenarios that heat-conducting unit, lid, heat conduction layers of foil form the parts such as pars arcuata is arranged between heat-conducting unit and heat pipe, heat pipe and metal level;
Fig. 3 is the textural association cross-sectional schematic of Fig. 1; Depict electronic component, combination situations that heat-conducting unit, lid, heat conduction layers of foil form the parts such as pars arcuata is arranged between heat-conducting unit and heat pipe, heat pipe and metal level;
Fig. 4 is a textural association cross-sectional schematic of the present utility model; Show electronic component, the combination situations of the part such as heat-conducting unit, lid, heat pipe are arranged between lid and heat conduction layers of foil, heat conduction layers of foil bonding metallic layer;
Fig. 5 is the perspective exploded view of the structure of Fig. 4;
Fig. 6 is another textural association cross-sectional schematic of the present utility model; Depict electronic component, combination situations that lid, heat conduction layers of foil form the parts such as pars arcuata is arranged between lid and heat pipe, heat pipe and metal level;
Fig. 7 is another textural association cross-sectional schematic of the present utility model; Depict electronic component, lid, heat pipe form that pars arcuata is arranged between lid and heat conduction layers of foil, the combination situations of the part such as heat conduction layers of foil bonding metallic layer;
Fig. 8 is a correction example structure combination schematic diagram of the present utility model; Depict electronic component, heat-conducting unit, lid, heat conduction layers of foil form pars arcuata and be arranged on the combination situations configuring the parts such as column between lid and heat pipe, between metal level and circuit board;
Fig. 9 is the STRUCTURE DECOMPOSITION schematic diagram of Fig. 8;
Figure 10 is the textural association cross-sectional schematic of Fig. 8;
Figure 11 is a textural association cross-sectional schematic of the present utility model; Show electronic component, heat-conducting unit, lid, heat pipe form pars arcuata and be arranged on the combination situations configuring the parts such as column between lid and heat conduction layers of foil, between metal level and circuit board;
Figure 12 is another textural association cross-sectional schematic of the present utility model; Depict electronic component, lid, heat conduction layers of foil form pars arcuata and be arranged on the combination situations configuring the parts such as column between lid and heat pipe, between metal level and circuit board;
Figure 13 is another textural association cross-sectional schematic of the present utility model; Show electronic component, lid, heat pipe form pars arcuata and be arranged on the combination situations configuring the parts such as column between lid and heat conduction layers of foil, between metal level and circuit board;
Figure 14 is a possible embodiments textural association schematic diagram of the present utility model; Show the textural association situation of thermal source element, heat-conducting unit, lid, the part such as heat conduction layers of foil is arranged on heat-conducting unit and lid, nonthermal source element arranges secondary lid, heat pipe and metal level, and the deposition path of heat pipe connects the situation of heat conduction layers of foil and secondary lid;
Figure 15 is the STRUCTURE DECOMPOSITION schematic diagram of Figure 14;
Figure 16 is the textural association cross-sectional schematic of Figure 14;
Figure 17 is a textural association cross-sectional schematic of the present utility model; Depict thermal source element, heat-conducting unit, lid, heat pipe connects heat-conducting unit and lid, nonthermal source element arrange the textural association situation partly such as secondary lid, heat conduction layers of foil and metal level, and the deposition path of heat pipe connects the situation of lid and secondary lid;
Figure 18 is a textural association cross-sectional schematic of the present utility model; Show the textural association situation of thermal source element, lid, the heat conduction layers of foil formation parts such as pars arcuata is arranged on lid, nonthermal source element arranges secondary lid, heat pipe and metal level, and the deposition path of heat pipe connects the situation of heat conduction layers of foil and secondary lid;
Figure 19 is another textural association cross-sectional schematic of the present utility model; Depict thermal source element, textural association situation that lid, heat pipe form the parts such as pars arcuata is arranged on lid, nonthermal source element arranges secondary lid, heat conduction layers of foil and metal level, and the deposition path of heat pipe connects the situation of lid and secondary lid.
Description of reference numerals: 10-heat-conducting unit; 11-first end; 12-second end; 20-electronic component; 20A-thermal source element; 20B-nonthermal source element; 30-lid; The secondary lid of 30B-; 31,36-rigid walls; 32,37-inner space; 33,38-internal face; 34,39-outside wall surface; 35-opening; 40-circuit board; 50-heat pipe; 51-first limit; 52-Second Edge; 53-side; 55-heat-exchange fluid; 59,63,93-pars arcuata; 60-metal level; 61-first surface; 62-second; 90-heat conduction layers of foil; 91-first surface; 92-second surface.
Embodiment
Refer to Fig. 1, Fig. 2 and Fig. 3, the conductive structure that the utility model is used for electronic component comprises a heat-conducting unit 10, is configured on an electronic component 20.Substantially, electronic component 20 is arranged on a circuit board 40.In adopted embodiment, this heat-conducting unit 10 selects the material that can conduct heat energy to make the block structure of a geometric form profile, and has first end 11 and one second end 12; This first end 11 and the second end 12 form the structure kenel of a plane respectively, and this first end 11 is stacked on this electronic component 20, the used heat (or heat energy) produced when working with conduction electron element 20.
Fig. 1, Fig. 2 and Fig. 3 show this conductive structure and also comprise a lid 30, this electronic component 20 coated and heat-conducting unit 10.Specifically, this lid 30 has a rigid walls 31, defines lid 30 and forms box body (or plate body) the structure kenel that has inner space 32; Lid 30 (or rigid walls 31) has an internal face 33, outside wall surface 34 and is formed in opening 35 in internal face 33, outside wall surface 34.And the second end 12 of heat-conducting unit 10 connects lid internal face 33, and engages a heat conduction layers of foil 90.
Fig. 1, Fig. 2 and Fig. 3 depict heat conduction layers of foil 90 and are arranged on heat-conducting unit 10 and lid 30; Further, along the position of heat-conducting unit second end 12 and lid outside wall surface 34, opening 35, in lid 30, depression or pars arcuata 93 (section) structure is formed; And, allow that pars arcuata 93 connects or enters opening 35.Specifically, heat conduction layers of foil 90 selects a metal material (such as, gold, silver, copper or its analog) make the laminate structure of a geometric form profile, and have the conduction better compared with common metal, heat conduction and even temperature effect, or the heat conduction of heat conduction layers of foil 90 (or conduction) efficiency is made to be more than or equal to the heat transfer efficiency of copper; And heat conduction layers of foil 90 comprises or defines first surface 91 and second surface 92.In the second end 12 that first surface 91 is arranged on heat-conducting unit 10 and lid outside wall surface 34, second surface 92 connects or engages a heat pipe 50.Therefore, heat conduction layers of foil 90 can auxiliary heat conduction unit 10, the heat energy produce or used heat rapid diffusion, is transmitted to lid 30 and heat pipe 50 by electronic component 20.
Apprehensible, the structure kenel of this lid 30 significantly increases the area of dissipation of this electronic component 20; This lid 30 also provides ground connection to electronic component 20 and produces proofing dust and protecting, magnetic conduction or stop the effects such as electromagnetic interference.And, heat-conducting unit 10 engages the structural design of lid and heat conduction layers of foil 90, the kenel that the used heat (or heat energy) produced when electronic component 20 can be worked by heat-conducting unit 10 is directly delivered to heat pipe 50 and exports fast, obviously can obtain the effect reducing thermal resistance.And the textural association kenel of this heat-conducting unit 10, lid 30 and heat conduction layers of foil 90, significantly increases the area of dissipation of this electronic component 20.
Fig. 1, Fig. 2 and Fig. 3 also show the heat pipe 50 including heat-exchange fluid 55 and are combined in this heat conduction layers of foil 90, and pars arcuata 93 structure of foundation heat conduction layers of foil 90, form a pars arcuata 59, engage heat conduction layers of foil 90.The imaginary line part of Fig. 3 depicts heat pipe 50 and also can form straight tube structure, engages heat conduction thin layer 90.Heat pipe 50 adopts welding or binds operation, combination heat conduction layers of foil second surface 92.Therefore, the used heat (or heat energy) that the work of this electronic component 20 produces can conduct, be diffused into this lid 30 through heat-conducting unit 10, heat conduction layers of foil 90, and cools exchange through heat pipe 50, export.That is, heat pipe 50 can be guided heat energy fast and be left heat source region; Or according to graphic heat energy of more can guiding to a metal level established according to shape 60 or other comparatively low-temperature regions, prevent hot concentration phenomenon.
What must be illustrated is, the textural association kenel of lid opening 35, heat conduction layers of foil pars arcuata 93 and heat pipe pars arcuata 59, an extra space of dodging is established above opening 35, to increase the nargin applied of part assembly, allow personnel according to the configuration kenel of electronic building brick, and larger configuration scope and the effect of configuration space can be retained in body.
In feasible embodiment, this heat pipe 50 has one first limit 51, Second Edge 52 and at least one side 53, connects this first limit 51, Second Edge 52.First limit 51 of heat pipe 50 connects heat conduction thin layer second surface 92; And the Second Edge 52 of heat pipe 50 is provided with metal level 60.Show metal level 60 in figure and be set as film or flake structure, in order to form larger contact area or area of dissipation with the external world; Metal level 60 has first surface 61 and the second face 62; First surface 61 can be fitted and connected the Second Edge 52 of heat pipe 50 according to the curve of heat pipe 50 and be provided with pars arcuata 63, and coordinates the quick conduction of heat pipe 50, above-mentioned heat energy or heat is discharged fast.
In an embodiment revised, the local of this metal level 60 or Zone Full can arrange the coating that a thermal radiation material is formed, to set up the effect of a radial-type heat dissipating.
Please refer to Fig. 4 and Fig. 5, show a derivative embodiment.This heat-conducting unit first end 11 is arranged on electronic component 20, second end 12 connects lid internal face 33, and the pars arcuata 59 of heat pipe 50 connects or enters opening 35, to be bonded on heat-conducting unit second end 12, engage the part in lid outside wall surface 34, electromagnetism is formed to opening 35 and closes; And have heat conduction thin layer 90 and/or the metal level 60 of pars arcuata 93,63, corresponding heat pipe pars arcuata 59, is sequentially arranged on the position above heat pipe 50, heat conduction layers of foil first surface 91 is made to engage heat pipe Second Edge 52; Second surface 92 combines the structure kenel of metal level first surface 61.
Refer to Fig. 6, depict an embodiment revised.This lid 30 coated electric components 20; Heat conduction layers of foil 90 is arranged on the position between lid 30 and heat pipe 50.That is, heat conduction layers of foil first surface 91 is arranged in lid outside wall surface 34, pars arcuata 93 is connected or enters opening 35; The corresponding heat pipe pars arcuata 59 of pars arcuata 63 of heat conduction layers of foil pars arcuata 93 and/or metal level 60, makes heat conduction layers of foil 90 second surface 92 engage heat pipe first limit 51.And heat pipe 50 is arranged on the position between heat conduction layers of foil 90 and metal level 60, form the structure kenel that heat pipe Second Edge 52 combines metal level first surface 61.
Fig. 7 shows a feasible embodiment.This lid 30 coated electric components 20; Heat pipe 50 is arranged on the position between lid 30 and heat conduction layers of foil 90.That is, heat pipe first limit 51 is arranged in lid outside wall surface 34, makes pars arcuata 59 connect in lid 30 or enter opening 35; The corresponding heat pipe pars arcuata 59 of heat conduction layers of foil pars arcuata 93, makes heat conduction layers of foil 90 first surface 91 engage heat pipe Second Edge 52.And heat conduction layers of foil 90 is arranged on the position between heat pipe 50 and metal level 60, form the structure kenel that heat conduction layers of foil second surface 92 combines metal level first surface 61.
Please refer to Fig. 8, Fig. 9 and Figure 10, depict a specific embodiment.Electronic component 20 is configured on circuit board 40; Lid 30, this electronic component 20 coated and heat-conducting unit 10, make heat-conducting unit first end 11 be arranged on electronic component 20, the second end 12 connects lid internal face 33, engages heat conduction layers of foil first surface 91.
The upper position that heat conduction layers of foil 90 is arranged on heat-conducting unit 10 and lid 30 is depicted in figure, this opening 35 is closed with electromagnetism, and make the pars arcuata 93 of heat conduction layers of foil 90 connect in lid 30 or enter opening 35, in the second end 12 allowing first surface 91 engage heat-conducting unit 10 and lid outside wall surface 34, the corresponding heat pipe pars arcuata 59 of heat conduction layers of foil pars arcuata 93, makes heat conduction layers of foil second surface 92 connect or engages heat pipe first limit 51.Therefore, heat conduction layers of foil 90 can auxiliary heat conduction unit 10, the heat energy produce or used heat rapid diffusion, is transmitted to lid 30 and heat pipe 50 by electronic component 20.The imaginary line part of the 9th figure depicts heat pipe 50 and forms straight tube structure, engages the structure kenel of heat conduction thin layer 90.
The structure kenel of heat pipe Second Edge 52 bonding metallic layer first surface 61 is also show in figure; Further, the area of metal level 60 is greater than the area of this lid 30 (outside wall surface 34).In adopted embodiment, metal level 60 is plate bodys of a rectangular profile, and definition has a thermal source district 63 be stacked on heat pipe 50 to be connected thermal source district 63 with one, forms the region (or claiming non-thermal source region 64) of cantilever kenel.And metal level 60 is provided with at least one column 70; Described column 70, between the non-thermal source region 64 and circuit board 40 of metal level 60, makes this column 70 support the non-thermal source region 64 of this metal level 60, after allowing metal level 60 and heat pipe 50 combine, can not produce sagging situation.
In feasible embodiment, the local of this metal level 60 or Zone Full are furnished with a coating (figure does not show); Described coating selects a thermal radiation material to form, and makes this metal level 60 have the effect of the radial-type heat dissipating that more known physics is thought.
Suppose that this coating is arranged in the non-thermal source region 64 of metal level 60; When the used heat (or heat energy) of electronic component 20 work generation is behind the thermal source district 63 that heat-conducting unit 10 is transmitted to this lid 30, heat conduction layers of foil 90, heat pipe 50 and metal level 60, this heat energy can be transmitted to non-thermal source region 64 from thermal source district 63, thermal radiation material through coating dispels the heat with radiation mode, and coordinate heat pipe 50 to conduct fast, cool exchange, right effect of waiting output, obviously can obtain a comparatively old law more preferably radiating efficiency.Specifically, the area of this metal level 60 is obviously greater than the area of this lid 30 (outside wall surface 34), makes this conductive structure have the radiating effect better than prior art.
Please refer to Figure 11, show a derivative embodiment.This heat-conducting unit first end 11 is arranged on electronic component 20, second end 12 connects lid internal face 33, and the pars arcuata 59 of heat pipe 50 connects or enters opening 35, to be bonded on heat-conducting unit second end 12, engage the part in lid outside wall surface 34, electromagnetism is formed to opening 35 and closes; Further, have pars arcuata 93,63 heat conduction thin layer 90 and or metal level 60, corresponding heat pipe pars arcuata 59, is sequentially arranged on the position above heat pipe 50, makes heat conduction layers of foil first surface 91 engage heat pipe Second Edge 52; Second surface 92 combines the structure kenel of metal level first surface 61.And, the structure kenel of column 70 support metal layer 60 (or non-thermal source region 64).
Refer to Figure 12, depict an embodiment revised.This lid 30 coated electric components 20; Heat conduction layers of foil 90 is arranged on the position between lid 30 and heat pipe 50.That is, heat conduction layers of foil first surface 91 is arranged in lid outside wall surface 34, pars arcuata 93 is connected or enters opening 35; The corresponding heat pipe pars arcuata 59 of pars arcuata 63 of heat conduction layers of foil pars arcuata 93 and/or metal level 60, makes heat conduction layers of foil 90 second surface 92 engage heat pipe first limit 51.Further, heat pipe 50 is arranged on the position between heat conduction layers of foil 90 and metal level 60, forms the structure kenel that heat pipe Second Edge 52 combines metal level first surface 61.And, the structure kenel of column 70 support metal layer 60 (or non-thermal source region 64).
Please refer to Figure 13, show the embodiment that another is derivative.This lid 30 coated electric components 20; Heat pipe 50 is arranged on the position between lid 30 and heat conduction layers of foil 90.That is, heat pipe first limit 51 is arranged in lid outside wall surface 34, makes pars arcuata 59 connect in lid 30 or enter opening 35; The corresponding heat pipe pars arcuata 59 of heat conduction layers of foil pars arcuata 93, makes heat conduction layers of foil 90 first surface 91 engage heat pipe Second Edge 52.Further, heat conduction layers of foil 90 is arranged on the position between heat pipe 50 and metal level 60, forms the structure kenel that heat conduction layers of foil second surface 92 combines metal level first surface 61.And, the structure kenel of column 70 support metal layer 60 (or non-thermal source region 64).
Refer to Figure 14, Figure 15 and Figure 16, suppose that the electronic component 20 of configuration on circuit board 40 comprises the electronic component (being defined as thermal source element 20A) that can produce used heat and the electronic component (being defined as nonthermal source element 20B) that can not produce used heat.This lid 30 coated thermal source element 20A and heat-conducting unit 10; Heat conduction layers of foil pars arcuata 93 connects or enters opening 35, first surface 91 is arranged in heat-conducting unit second end 12 and lid outside wall surface 34, and electromagnetism closes this opening 35; Make heat pipe pars arcuata 59 corresponding heat conduction layers of foil pars arcuata 93, allow heat conduction layers of foil second surface 92 engage heat pipe first limit 51.One secondary lid 30B coated nonthermal source element 20B is provided.And, arrange that heat pipe 50 passes through or connects each lid 30 (or heat conduction layers of foil 90) and secondary lid 30B; Therefore, the heat energy of this thermal source element 20A can be transmitted to this lid 30 and secondary lid 30B, and export fast through heat pipe 50 and metal level 60 through heat-conducting unit 10, heat conduction layers of foil 90; In order to set up the position of a foundation thermal source element 20A, nonthermal source element 20B, arrange lid 30 (and/or secondary lid 30B), heat conduction layers of foil 90 and heat pipe 50 path, in order to set up the effect of an increase area of dissipation or heat radiation scope.
The imaginary line part of Figure 16 depicts heat pipe 50 and forms straight tube structure, engages the structure kenel of heat conduction thin layer 90.
In adopted embodiment, secondary lid 35 also has a rigid walls 36, defines secondary lid 30B and forms box body (or plate body) structure that has inner space 37; Secondary lid 30B has internal face 38 and an outside wall surface 39; And secondary lid outside wall surface 39 arranges and engages this heat pipe 50.In adopted embodiment, the internal face 38 of secondary lid 30B, outside wall surface 39 are also the structure kenels of formation one plane.
Show heat pipe 50 in figure and be arranged on position between heat conduction layers of foil 90 (and/or secondary lid 30B) and metal level 60.Therefore, heat pipe first limit 51 connects heat conduction layers of foil first surface 91 (or side 53 can connect lid rigid walls 31) and secondary lid outside wall surface 39; Further, the structure kenel of heat pipe Second Edge 52 connection metal layer first surface 61 is made.
Apprehensible, the structure kenel of secondary lid 30B assists the area of dissipation adding this thermal source element 20A; Further, secondary lid 30B also provides ground connection to nonthermal source element 20B and produces proofing dust and protecting, magnetic conduction or stop the effects such as electromagnetic interference.
What must be illustrated is, this heat conduction layers of foil 90, lid 30 (and/or secondary lid 30B) and heat pipe 50 path arrange according to the position of thermal source element 20A and/or nonthermal source element 20B, the used heat that thermal source element 20A is produced or heat energy can be transmitted to this lid 30 and secondary lid 30B through heat-conducting unit 10 and heat conduction layers of foil 90, and coordinate heat pipe 50 path and metal level 60 to export, to increase area of dissipation and the even temperature effect of this heat-conducting system.That is, the used heat (or heat energy) that this thermal source element 20A produces not only is discharged through connection its heat-conducting unit 10, heat conduction layers of foil 90 and lid 30, secondary lid 30B, heat pipe 50; Also comprise heat pipe 50 Lu ?arrange connect metal level 60.Therefore, the area of dissipation of this conductive structure is obviously increased; Further, coordinate the diffusion conductive force of heat conduction layers of foil 90, can obtain than prior art more preferably even temperature effect.
Refer to Figure 17, show a derivative embodiment.This heat-conducting unit first end 11 is arranged on thermal source element 20A, and the second end 12 connects lid internal face 33, and the pars arcuata 59 of heat pipe 50 connects or enters opening 35, is bonded in heat-conducting unit second end 12, lid outside wall surface 34 and secondary lid outside wall surface 39; Further, have pars arcuata 93,63 heat conduction thin layer 90 and or the corresponding heat pipe pars arcuata 59 of metal level 60, be arranged on the position above heat pipe 50, make heat conduction layers of foil first surface 91 engage heat pipe Second Edge 52; Second surface 92 combines the structure kenel of metal level first surface 61.
Please refer to Figure 18, this lid 30 coated thermal source element 20A; Heat conduction layers of foil 90 is arranged on the position between lid 30 and heat pipe 50.That is, heat conduction layers of foil first surface 91 is arranged in lid outside wall surface 34, makes pars arcuata 93 connect in lid 30 or enter opening 35; The corresponding heat pipe pars arcuata 59 of heat conduction layers of foil pars arcuata 93, makes heat conduction layers of foil 90 second surface 92 engage heat pipe first limit 51, and heat pipe first limit 51 also connects and is arranged in secondary lid rigid walls 36 or outside wall surface 39.Further, heat pipe 50 is arranged on the position between heat conduction layers of foil 90 and metal level 60, forms the structure kenel that heat pipe Second Edge 52 combines metal level first surface 61.
Please refer to Figure 19, show the embodiment that another is derivative.This lid 30 coated thermal source element 20A; Heat pipe 50 is arranged on the position between lid 30 and heat conduction layers of foil 90.That is, heat pipe first limit 51 is arranged in lid outside wall surface 34, and electromagnetism closes this opening 35, and makes pars arcuata 59 connect in lid 30 or enter opening 35; The corresponding heat pipe pars arcuata 59 of heat conduction layers of foil pars arcuata 93, makes heat conduction layers of foil 90 first surface 91 engage heat pipe Second Edge 52, and heat pipe first limit 51 also connects and is arranged in secondary lid rigid walls 36 or outside wall surface 39.Further, heat conduction layers of foil 90 is arranged on the position between heat pipe 50 and metal level 60, forms the structure kenel that heat conduction layers of foil second surface 92 combines metal level first surface 61.
Representational, this conductive structure for electronic component is under the condition having proofing dust and protecting, stop electromagnetic interference and meet manufacturing cost, and compared to old law, cording has following condition of considering and advantage:
1. this conductive structure and associated component structure, operation use situation etc., have been redesigned and have considered, and be different from prior art; Further, change its use kenel, and be different from old law.Such as, this electronic component 20 is made to coordinate heat-conducting unit 10, heat conduction layers of foil 90, lid 30, or this heat-conducting unit 10 comprises first end 11 and the second end 12, heat conduction layers of foil 90 comprise first surface 91 and second surface 92, coordinate internal face 33, the outside wall surface 34 of lid 30, or combination heat pipe 50, metal level 60; Or coordinate heat conduction layers of foil 90 to form pars arcuata 93 structure, heat pipe 50 correspondence is made to be provided with the structural design of part such as pars arcuata 59 grade, obviously remove known radiator structure to tend to apply axle or pipe, slot, multiple rank protuberance or fastener correspondence and the more complicated textural association kenel such as to fasten, and provided one and to simplify and be convenient to the structural design combined than prior art.
2. this metal foil layer 90 arranges the structure organization connecting heat-conducting unit 10, lid 30, heat pipe 50 or metal level 60, produce one can rapid diffusion, heat conduction effect, relatively improve the radiating efficiency of electronic component 20, also obtain than prior art more preferably even temperature effect.And, make lid 30 (and/or secondary lid 30B) and heat pipe 50 path, structural design that metal level 60 is arranged according to the position of thermal source element 20A, nonthermal source element 20B, the area of dissipation of this conductive structure is obviously increased, and forming the contact kenel of larger area, the heat radiation or the used heat that also improve it discharge effect.
3. particularly, the textural association kenel of this lid opening 35, heat conduction layers of foil pars arcuata 93, metal level pars arcuata 63 and heat pipe pars arcuata 59, establishing one is having both under the condition having good heat-radiating effect, have more extra space of dodging, to increase the nargin applied of part assembly, allow personnel according to the configuration kenel of electronic building brick, and larger configuration scope and the effect of configuration space can be had.
Therefore the utility model provides one effectively for the conductive structure of electronic component, and its space kenel is different from prior art, and has advantage incomparable in old law, presents sizable progress, has really filled the important document that part meets utility model patent.
But, the foregoing is only possible embodiments of the present utility model, be not used for limiting the scope that the utility model is implemented, namely all equalization changes done according to the utility model claim with modify, be all the utility model the scope of the claims and contain.
Claims (10)
1. for a conductive structure for electronic component, it is characterized in that, comprising: lid, this lid has a rigid walls, defines lid and forms an inner space, a coated electronic component; The opening that lid has an internal face, an outside wall surface and is formed between internal face and outside wall surface;
One of them of heat conduction layers of foil and heat pipe is arranged on this lid, and coordinates this opening to be provided with pars arcuata;
Heat conduction layers of foil selects metal material to make skim structure, has first surface and second surface; The heat transfer efficiency of heat conduction layers of foil is more than or equal to the heat transfer efficiency of copper;
Heat conduction layers of foil engages heat pipe; Heat-exchange fluid is comprised in heat pipe; And
One metal level is fitted and connected one of them of heat pipe and heat conduction layers of foil according to shape; Metal level comprises first surface, second and the metal level pars arcuata that coordinates above-mentioned pars arcuata and establish.
2., as claimed in claim 1 for the conductive structure of electronic component, it is characterized in that, this electronic component is provided with a heat-conducting unit;
Heat-conducting unit selects the material that can conduct heat energy to make a block structure, and has a first end and the second end; Heat-conducting unit first end is arranged on electronic component, and the second end of heat-conducting unit connects the internal face of lid and the first surface of heat conduction layers of foil;
Heat conduction layers of foil, along the second end of heat-conducting unit and the outside wall surface of lid, the position of opening, forms its pars arcuata, and allows that heat conduction layers of foil pars arcuata enters opening; The second surface of heat conduction layers of foil engages the first limit of heat pipe;
The pars arcuata of corresponding heat conduction layers of foil, heat pipe is formed with a pars arcuata; And
The first surface of the Second Edge combination metal level of heat pipe.
3., as claimed in claim 1 for the conductive structure of electronic component, it is characterized in that, this electronic component is provided with a heat-conducting unit;
Heat-conducting unit selects the material that can conduct heat energy to make a block structure, and has a first end and the second end; Heat-conducting unit first end is arranged on electronic component, and heat-conducting unit second end connects the internal face of lid and the first limit of heat pipe;
Heat pipe, along the position of heat-conducting unit second end and lid outside wall surface, opening, forms electromagnetism and closes, and heat pipe pars arcuata is allowed and entered opening; Heat pipe Second Edge engages the first surface of heat conduction layers of foil;
The pars arcuata correspondence of heat conduction layers of foil engages the pars arcuata of heat pipe; And
The first surface of the second surface combination metal level of heat conduction layers of foil.
4., as claimed in claim 1 for the conductive structure of electronic component, it is characterized in that, this heat conduction layers of foil first surface is arranged in the outside wall surface of lid;
The outside wall surface of heat conduction layers of foil along lid, the position of opening, form its pars arcuata, and allow that heat conduction layers of foil pars arcuata enters opening;
The second surface of heat conduction layers of foil engages the first limit of heat pipe;
The pars arcuata of corresponding heat conduction layers of foil, heat pipe is formed with a pars arcuata; And
The first surface of the Second Edge combination metal level of heat pipe.
5. as claimed in claim 1 for the conductive structure of electronic component, it is characterized in that, the first limit of this heat pipe is arranged in the outside wall surface of lid, and it is closed to form electromagnetism to this opening;
Heat pipe, along the position of lid outside wall surface, opening, forms its pars arcuata, and allows that heat pipe pars arcuata enters opening;
The Second Edge of heat pipe engages the first surface of heat conduction layers of foil;
The pars arcuata correspondence of heat conduction layers of foil engages the pars arcuata of heat pipe; And
The first surface of the second surface combination metal level of heat conduction layers of foil.
6. the conductive structure for electronic component according to any one of claim 1 to 5, is characterized in that, the area of this metal level is greater than the area of the outside wall surface of lid, and metal level definition has a thermal source district to be connected the non-thermal source region in thermal source district with one; And
Metal level is provided with at least one column; Described column position, between the non-thermal source region and a circuit board of metal level, makes the non-thermal source region of this column support metal layer.
7. the conductive structure for electronic component according to any one of claim 1 to 5, is characterized in that, this electronic component comprises the thermal source element that can produce heat energy and the nonthermal source element that can not produce heat energy; Nonthermal source element is coated by a secondary lid;
Secondary lid has a rigid walls, defines secondary lid and forms an inner space, this nonthermal source element coated; Secondary lid has an internal face and an outside wall surface; And
One of them of heat conduction layers of foil and heat pipe engages lid rigid walls and secondary lid rigid walls.
8. the conductive structure for electronic component according to any one of claim 1 to 5, is characterized in that, this metal level at least regional area is furnished with the coating of a thermal radiation material formation.
9. as claimed in claim 6 for the conductive structure of electronic component, it is characterized in that, this metal level at least regional area is furnished with the coating of a thermal radiation material formation.
10. as claimed in claim 7 for the conductive structure of electronic component, it is characterized in that, this metal level at least regional area is furnished with the coating of a thermal radiation material formation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104202859 | 2015-02-17 | ||
| TW104202859 | 2015-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204810788U true CN204810788U (en) | 2015-11-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520437644.7U Expired - Fee Related CN204810788U (en) | 2015-02-17 | 2015-06-24 | Heat conducting structure for electronic component |
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| Country | Link |
|---|---|
| CN (1) | CN204810788U (en) |
| TW (1) | TWM513391U (en) |
-
2015
- 2015-06-22 TW TW104209946U patent/TWM513391U/en not_active IP Right Cessation
- 2015-06-24 CN CN201520437644.7U patent/CN204810788U/en not_active Expired - Fee Related
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| TWM513391U (en) | 2015-12-01 |
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