CN204167290U - Fingerprint Identification sensor encapsulating structure - Google Patents
Fingerprint Identification sensor encapsulating structure Download PDFInfo
- Publication number
- CN204167290U CN204167290U CN201420526888.8U CN201420526888U CN204167290U CN 204167290 U CN204167290 U CN 204167290U CN 201420526888 U CN201420526888 U CN 201420526888U CN 204167290 U CN204167290 U CN 204167290U
- Authority
- CN
- China
- Prior art keywords
- pin
- outer shroud
- packaging material
- plastic packaging
- metal outer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
The utility model relates to a kind of fingerprint Identification sensor encapsulating structure, it comprises interior pin (3) and outer pin (4), described interior pin (3) is positioned at outer pin (4) top, described interior pin (3) and outer pin (4) periphery are filled with the first plastic packaging material (5), described interior pin (3) front is provided with bonding wire metal level (6), described first plastic packaging material (5) is provided with metal outer shroud (1), described metal outer shroud (1) is positioned at pin (3) outside, described metal outer shroud (1) inside arranges induction chip (9), metal wire (10) is connected with between described induction chip (9) front and bonding wire metal level (6), described metal outer shroud (1) inside is filled with the second plastic packaging material (11).A kind of fingerprint Identification sensor encapsulating structure of the utility model, product adopts integral packaging, and structure is simple, and reliability is high, and production procedure is few, and production cost is low, can reach the function of static discharge simultaneously.
Description
Technical field
The utility model relates to a kind of fingerprint Identification sensor encapsulating structure, belongs to integrated antenna package technical field.
Background technology
Capacitive fingerprint sensing device is widely used on many electronic installations, the high-end electronic products such as such as computer screen, fingerprint identifier and mobile phone.Capacitive fingerprint sensing device package surface touching or rubbing with other object and produce electrostatic often due to user, electrostatic now in this capacitive fingerprint sensing device package surface may circuit internally or sensor chip electric discharge, and cause the circuit of this inside or the damage of sensor chip, therefore static discharge becomes the problem that sensor field desires most ardently solution.
In existing technology, realize Electro-static Driven Comb as apple patent AU2013100571A4, put a circle static release ring in the induction chip peripheral group installing of substrate front side.Static release ring is all that subsequent configuration arrives induction chip or substrate front side, may occur the problem that static release ring position offsets and affect chip senses district scope, thus affecting the recognition effect of whole fingerprint Identification sensor.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, provides a kind of fingerprint Identification sensor encapsulating structure, and product adopts integral packaging, and structure is simple, and reliability is high, and production procedure is few, and production cost is low, can reach the function of static discharge simultaneously.
The purpose of this utility model is achieved in that a kind of fingerprint Identification sensor encapsulating structure, it comprises interior pin and outer pin, described interior pin comprises a grounding leg, described interior pin is positioned at above outer pin, described interior pin and outer pin periphery are filled with the first plastic packaging material, described interior pin front is provided with bonding wire metal level, described first plastic packaging material is provided with metal outer shroud, described metal outer shroud is positioned at outside pin, described metal outer shroud and grounding leg are electrically connected, described metal outer shroud inside arranges induction chip, described induction chip is installed on the first plastic packaging material upper surface by load glued membrane, metal wire is connected with between described induction chip front and bonding wire metal level, described metal outer shroud top and outer bottom are provided with layers of copper, described metal outer shroud inside is filled with the second plastic packaging material, described second plastic packaging material upper surface is provided with plastic packaging material protective layer, protection against oxidation layer is provided with bottom described metal outer shroud top and outer pin.
Compared with prior art, the utility model has following beneficial effect:
A kind of fingerprint Identification sensor encapsulating structure of the utility model, product adopts integral packaging, and structure is simple, and reliability is high, and production procedure is few, and production cost is low.When finger contact is to metal outer shroud, induction chip ground connection, and be electrically connected to metal outer shroud, reach the function of static discharge.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of a kind of fingerprint Identification sensor encapsulating structure of the utility model.
Wherein:
Metal outer shroud 1
Layers of copper 2
Interior pin 3
Grounding leg 3a
Outer pin 4
First plastic packaging material 5
Bonding wire metal level 6
Protection against oxidation layer 7
Load glued membrane 8
Induction chip 9
Metal wire 10
Second plastic packaging material 11
Plastic packaging material protective layer 12.
Embodiment
See Fig. 1, a kind of fingerprint Identification sensor encapsulating structure of the utility model, it comprises interior pin 3 and outer pin 4, described interior pin 3 comprises a grounding leg 3a, described interior pin 3 is positioned at above outer pin 4, described interior pin 3 and outer pin 4 periphery are filled with the first plastic packaging material 5, described interior pin 3 front is provided with bonding wire metal level 6, described first plastic packaging material 5 is provided with metal outer shroud 1, described metal outer shroud 1 is positioned at outside pin 3, described metal outer shroud 1 is electrically connected with grounding leg 3a, described metal outer shroud 1 inside arranges induction chip 9, described induction chip 9 is installed on the first plastic packaging material 5 upper surface by load glued membrane 8, metal wire 10 is connected with between described induction chip 9 front and bonding wire metal level 6, described metal outer shroud 1 top and bottom are provided with layers of copper 2, described metal outer shroud 1 inside is filled with the second plastic packaging material 11, described second plastic packaging material 11 upper surface is provided with plastic packaging material protective layer 12, protection against oxidation layer 7 is provided with bottom described metal outer shroud 1 top and outer pin 4.
Claims (3)
1. a fingerprint Identification sensor encapsulating structure, it is characterized in that: it comprises interior pin (3) and outer pin (4), described interior pin (3) comprises a grounding leg (3a), described interior pin (3) is positioned at outer pin (4) top, described interior pin (3) and outer pin (4) periphery are filled with the first plastic packaging material (5), described interior pin (3) front is provided with bonding wire metal level (6), described first plastic packaging material (5) is provided with metal outer shroud (1), described metal outer shroud (1) is positioned at pin (3) outside, described metal outer shroud (1) and grounding leg (3a) are electrically connected, described metal outer shroud (1) inside arranges induction chip (9), described induction chip (9) is installed on the first plastic packaging material (5) upper surface by load glued membrane (8), metal wire (10) is connected with between described induction chip (9) front and bonding wire metal level (6), described metal outer shroud (1) top and bottom are provided with layers of copper (2), described metal outer shroud (1) inside is filled with the second plastic packaging material (11), described second plastic packaging material (11) upper surface is provided with plastic packaging material protective layer (12).
2. a kind of fingerprint Identification sensor encapsulating structure according to claim 1, is characterized in that: described metal outer shroud (1) top and outer pin (4) bottom are provided with protection against oxidation layer (7).
3. a kind of fingerprint Identification sensor encapsulating structure according to claim 1, is characterized in that: described metal outer shroud (1) and grounding leg (3a) are electrically connected, and are connected with metal wire (10) between described induction chip (9) and grounding leg (3a).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420526888.8U CN204167290U (en) | 2014-09-15 | 2014-09-15 | Fingerprint Identification sensor encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420526888.8U CN204167290U (en) | 2014-09-15 | 2014-09-15 | Fingerprint Identification sensor encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204167290U true CN204167290U (en) | 2015-02-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420526888.8U Active CN204167290U (en) | 2014-09-15 | 2014-09-15 | Fingerprint Identification sensor encapsulating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204167290U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104779221A (en) * | 2015-04-08 | 2015-07-15 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module packaging structure, method for preparing fingerprint identification module packaging structure as well as electronic equipment |
| CN105990269A (en) * | 2015-03-06 | 2016-10-05 | 吴勇军 | Fingerprint identification chip packaging structure and packaging method thereof |
| TWI631632B (en) * | 2016-08-31 | 2018-08-01 | 矽品精密工業股份有限公司 | Package structure and method for fabricating the same |
| WO2019051710A1 (en) * | 2017-09-14 | 2019-03-21 | 深圳市汇顶科技股份有限公司 | Chip packaging structure and method, and electronic device |
| CN111816642A (en) * | 2020-07-10 | 2020-10-23 | 山东砚鼎电子科技有限公司 | Anti-static sensor |
-
2014
- 2014-09-15 CN CN201420526888.8U patent/CN204167290U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105990269A (en) * | 2015-03-06 | 2016-10-05 | 吴勇军 | Fingerprint identification chip packaging structure and packaging method thereof |
| CN104779221A (en) * | 2015-04-08 | 2015-07-15 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module packaging structure, method for preparing fingerprint identification module packaging structure as well as electronic equipment |
| TWI631632B (en) * | 2016-08-31 | 2018-08-01 | 矽品精密工業股份有限公司 | Package structure and method for fabricating the same |
| WO2019051710A1 (en) * | 2017-09-14 | 2019-03-21 | 深圳市汇顶科技股份有限公司 | Chip packaging structure and method, and electronic device |
| US10770413B2 (en) | 2017-09-14 | 2020-09-08 | Shenzhen GOODIX Technology Co., Ltd. | Chip packaging structure and method, and electronic device |
| CN111816642A (en) * | 2020-07-10 | 2020-10-23 | 山东砚鼎电子科技有限公司 | Anti-static sensor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |