CN111816642A - Anti-static sensor - Google Patents
Anti-static sensor Download PDFInfo
- Publication number
- CN111816642A CN111816642A CN202010661460.4A CN202010661460A CN111816642A CN 111816642 A CN111816642 A CN 111816642A CN 202010661460 A CN202010661460 A CN 202010661460A CN 111816642 A CN111816642 A CN 111816642A
- Authority
- CN
- China
- Prior art keywords
- pad
- lead
- sensor chip
- fingerprint sensor
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Image Input (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The invention provides an anti-static sensor, which prevents static electricity by utilizing static electricity leading-out of a first lead wire, particularly adopts the first lead wire to be exposed out of an insulating protective layer and is electrically connected with a sensing plate through a conductive supporting piece, and when a finger touches the sensing plate, the static electricity is released through the path. In addition, the invention also introduces the electrostatic protection by utilizing the protruding part, and the contact is simpler and more convenient, and the cost is lower.
Description
Technical Field
The invention relates to the field of semiconductor device packaging test, in particular to an anti-static sensor.
Background
Fingerprints have become almost the pronoun of biometric identification due to their lifetime invariance, uniqueness and convenience. Many anti-theft systems and attendance systems are provided with fingerprint identification devices to verify whether the identity of a visitor meets the requirements of a database in the system. However, the conventional fingerprint recognition machine using the optical recognition method can only scan the skin surface, and if more dust is stained on the user's finger, a recognition error may occur. The most common capacitive fingerprint recognizer forms a fingerprint image through the concave-convex parts between the valleys and ridges of the fingerprint, and can carry static electricity on a person due to various reasons, and at the moment, when a finger contacts a fingerprint recognition area, the static electricity can be instantly discharged, so that the fingerprint recognition sensor chip is not favorable, and the accuracy of fingerprint recognition can be influenced.
Disclosure of Invention
In order to solve the above problems, the present invention provides an anti-static sensor, including:
a wiring board having a first pad and a second pad on an upper surface thereof, wherein the first pad is grounded;
the fingerprint sensor chip is fixed on the upper surface and comprises a third bonding pad and a fourth bonding pad;
a first lead electrically connecting the first pad and the third pad and having an arc shape;
a second lead electrically connecting the second pad and the fourth pad and having an arc shape;
an insulating protective layer wrapping the first to fourth pads, the first lead and the second lead, wherein the first lead has a contact portion exposed from a top of the insulating protective layer;
at least four conductive support members including a first conductive support member, wherein the first conductive support member is in direct contact with the contact portion;
the induction plates are arranged on the at least four conductive supporting pieces;
a sealing layer covering the upper surface and having a surface flush with the sensing plate.
According to the above embodiment, the fingerprint sensor further comprises an elastic filling layer filled between the sensing plate and the fingerprint sensor chip.
According to the above embodiment, the height of the first lead is larger than the height of the second lead.
According to the above embodiment, the at least four conductive support members are symmetrically distributed about the center of the fingerprint sensor chip.
According to the above embodiment, the at least four conductive supports are metal balls, solder balls, or solidified silver paste masses.
The present invention also provides another anti-static sensor, comprising:
a wiring board having a first pad and a second pad on an upper surface thereof, wherein the first pad is grounded;
the fingerprint sensor chip is fixed on the upper surface and comprises a third bonding pad and a fourth bonding pad;
a first lead electrically connecting the first pad and the third pad and having an arc shape;
a second lead electrically connecting the second pad and the fourth pad and having an arc shape;
an insulating protective layer wrapping a bonding portion of the first lead and the third pad and a bonding portion of the second lead and the fourth pad;
the induction plate is arranged on the insulating protection layer and provided with a protruding part facing the upper surface, and the protruding part is directly contacted with the first lead;
a sealing layer covering the upper surface and having a surface flush with the sensing plate.
According to the above embodiment, the fingerprint sensor further comprises an elastic filling layer filled between the sensing plate and the fingerprint sensor chip.
According to the above embodiment, the protruding portion is located outside the fingerprint sensor chip projected on the wiring board.
According to the above embodiment, the portion of the protruding portion that is in direct contact with the first lead is not covered with the insulating protective layer.
The invention has the following advantages: the invention prevents static electricity by utilizing the static electricity leading-out of the first lead wire, particularly, the first lead wire is exposed out of the insulating protective layer and is electrically connected with the induction plate through the conductive supporting piece, and when a finger touches the induction plate, the static electricity is released through the path. In addition, the invention also introduces the electrostatic protection by utilizing the protruding part, and the contact is simpler and more convenient, and the cost is lower.
Drawings
FIG. 1 is a sectional view of an antistatic sensor of a first embodiment
Fig. 2 is a plan view of the electrostatic prevention sensor of the first embodiment;
fig. 3 is a sectional view of an antistatic sensor of the second embodiment;
fig. 4 is a plan view of the electrostatic prevention sensor of the second embodiment.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The anti-static sensor aims to overcome the problem of fingerprint static in the prior art.
First embodiment
Fig. 1 and 2 show a semiconductor device for fingerprint recognition (hereinafter, the semiconductor device for fingerprint recognition is simply referred to as a fingerprint sensor) as a first embodiment of the present invention.
The fingerprint sensor includes a fingerprint sensor chip 4 and a wiring board 1. The fingerprint sensor chip 4 includes a fingerprint identification area for realizing fingerprint identification, which is provided on the active surface of the fingerprint sensor chip 4.
The wiring board 1 is a glass epoxy substrate or a DBC substrate. The upper surface of which has a plurality of pads and includes at least a first pad 3 and a second pad 2. Of course, these pads should be electrically connected to a wiring layer (not shown) on the wiring board 1, wherein the first pads 3 are ground pads.
The active surface of the fingerprint sensor chip 4 is disposed on the upper surface of the wiring board 1 facing upward, and the active surface of the fingerprint sensor chip 4 has a plurality of pads, and includes at least a third pad 5 and a fourth pad 6. Wherein the third pad 5 is used for discharging the static electricity of the fingerprint sensor chip 4.
Further, solder balls are provided on the lower surface of the wiring board 1 as external connection terminals.
Referring to fig. 1, the fingerprint sensor chip 4 is bonded to the wiring board 1 by a wire. Wherein a first lead 7 electrically connects the first pad 3 and the third pad 5, which have an arc shape, and a second lead 9 electrically connects the second pad 2 and the fourth pad 6, which also have an arc shape. The arcuate shape is a shape formed by a wire bonding tool having at least one bonding portion where a wire is bonded to a pad.
In order to protect the reliability of the wire bonding, an insulating protective layer 10 is point-coated on the edge and the side wall of the fingerprint sensor chip 4, the insulating protective layer 10 exposes the fingerprint identification area of the fingerprint sensor chip 4 and wraps the first to fourth pads, the first lead 7 and the second lead 9, wherein the first lead 7 has a contact portion 8 exposed from the top of the insulating protective layer 10.
The above-mentioned contact portion 8 is essential in the present invention, and it is possible to easily realize the electrostatic conduction. Wherein the height of the first lead 7 should be larger than that of the second lead 9 in order to achieve partial exposure of the first lead 7 to form the contact portion 8, while ensuring that other leads, such as the second lead 9, are completely covered and protected. The above-mentioned different degrees of wrapping can be achieved by spot coating and appropriate grinding.
A plurality of conductive supporting members 12 are arranged on the top of the insulating protection layer 10, the number of the plurality of conductive supporting members 12 is even and at least 4, and the plurality of conductive supporting members 12 are symmetrically distributed on the center of the fingerprint sensor chip 4, so that uneven stress of the sensing plate 14 on the plurality of conductive supporting members 12 is prevented. The conductive support 12 is preferably a rigid material to support the sensing pads 14, preferably metal balls, solder balls, or cured silver paste.
Wherein the plurality of conductive support members 12 includes a first conductive support member 11, wherein the first conductive support member 11 is in direct contact and electrically connected with the contact portion 8.
An induction plate 14 is disposed on the conductive supporting members 12 and disposed on the conductive supporting members 11. The sensing plate 14 should include a wire mesh structure electrically connected to the plurality of conductive supports 11 to form a discharge circuit. The induction plate 14 includes a glass plate, a resin plate, a sapphire plate, and the like.
An elastic filling layer 13 is further included between the sensing plate 14 and the fingerprint sensor chip 4, the elastic filling layer 13 buffers the pressing force and protects the fingerprint sensor chip 4, and the elastic filling layer is preferably made of a rubber material or a porous flexible material.
The sealing layer 15 is formed by using an injection molding method. The sealing layer 15 covers the upper surface of the wiring layer 1 and has a top surface flush with the sensing plate 14. This protects the entire package and ensures that the sensor board 14 is not easily peeled off.
The embodiment prevents static electricity by using the static electricity extraction of the first lead 7, and particularly, the first lead 7 is exposed from the insulating protective layer 10 and electrically connected with the sensing plate 14 through the conductive supporting member 11, and when a finger touches the sensing plate 14, the static electricity is discharged through the above path.
Second embodiment
Fig. 3 and 4 show a semiconductor device for fingerprint recognition as a second embodiment of the present invention.
The fingerprint sensor includes a fingerprint sensor chip 4 and a wiring board 1. The fingerprint sensor chip 4 includes a fingerprint identification area for realizing fingerprint identification, which is provided on the active surface of the fingerprint sensor chip 4.
The wiring board 1 is a glass epoxy substrate or a DBC substrate. The upper surface of which has a plurality of pads and includes at least a first pad 3 and a second pad 2. Of course, these pads should be electrically connected to a wiring layer (not shown) on the wiring board 1, wherein the first pads 3 are ground pads.
The active surface of the fingerprint sensor chip 4 is disposed on the upper surface of the wiring board 1 facing upward, and the active surface of the fingerprint sensor chip 4 has a plurality of pads, and includes at least a third pad 5 and a fourth pad 6. Wherein the third pad 5 is used for discharging the static electricity of the fingerprint sensor chip 4.
Further, solder balls are provided on the lower surface of the wiring board 1 as external connection terminals.
Referring to fig. 3, the fingerprint sensor chip 4 is bonded to the wiring board 1 by a wire. Wherein a first lead 7 electrically connects the first pad 3 and the third pad 5, which have an arc shape, and a second lead 9 electrically connects the second pad 2 and the fourth pad 6, which also have an arc shape. The arcuate shape is a shape formed by a wire bonding tool having at least one bonding portion where a wire is bonded to a pad.
In order to protect the reliability of the wire bonding, an insulating protective layer 16 is provided at the bonding portion of the third pad 5 and the fourth pad 6 of the fingerprint sensor chip 4, and the insulating protective layer 16 is a rigid material such as cured resin, adhesive, or the like in this embodiment. The insulating protective layer 16 may be in the form of dots or stripes that completely seal all the pads on the active surface of the fingerprint sensor chip 4 but do not extend to the side walls of the fingerprint sensor chip 4, whereby some of the leads are exposed.
On top of the insulating protective layer 16 a sensing plate 14 is arranged. The sensing plate 14 should include a wire mesh structure electrically connected to the plurality of conductive supports 11 to form a discharge circuit. The induction plate 14 includes a glass plate, a resin plate, a sapphire plate, and the like.
A protrusion 17 is formed on the lower surface of the sensing board 14, and the protrusion 17 is press-fitted to the first lead 7 so that the first lead 7 has a bent portion 18, and in order to ensure the reliability of the bonding, a conductive adhesive layer may be provided on the bent portion so that the protrusion 17 is electrically connected to the first lead 7.
An elastic filling layer 13 is further included between the sensing plate 14 and the fingerprint sensor chip 4, the elastic filling layer 13 buffers the pressing force and protects the fingerprint sensor chip 4, and the elastic filling layer is preferably made of a rubber material or a porous flexible material.
The sealing layer 15 is formed by using an injection molding method. The sealing layer 15 covers the upper surface of the wiring layer 1 and has a top surface flush with the sensing plate 14. This protects the entire package and ensures that the sensor board 14 is not easily peeled off.
The embodiment uses the protrusion 17 for electrostatic protection, and the contact is simpler and more convenient, and the cost is lower. And this arrangement can secure the reliability of the bonding position of the first lead 7 and prevent cold joint due to the pressure of the sensing pad 14.
The expressions "exemplary embodiment," "example," and the like, as used herein, do not refer to the same embodiment, but are provided to emphasize different particular features. However, the above examples and exemplary embodiments do not preclude their implementation in combination with features of other examples. For example, even in a case where a description of a specific example is not provided in another example, unless otherwise stated or contrary to the description in the other example, the description may be understood as an explanation relating to the other example.
The terminology used in the present invention is for the purpose of illustrating examples only and is not intended to be limiting of the invention. Unless the context clearly dictates otherwise, singular expressions include plural expressions.
While example embodiments have been shown and described, it will be apparent to those skilled in the art that modifications and changes may be made without departing from the scope of the invention as defined by the claims.
Claims (9)
1. An anti-static sensor comprising:
a wiring board having a first pad and a second pad on an upper surface thereof, wherein the first pad is grounded;
the fingerprint sensor chip is fixed on the upper surface and comprises a third bonding pad and a fourth bonding pad;
a first lead electrically connecting the first pad and the third pad and having an arc shape;
a second lead electrically connecting the second pad and the fourth pad and having an arc shape;
an insulating protective layer wrapping the first to fourth pads, the first lead and the second lead, wherein the first lead has a contact portion exposed from a top of the insulating protective layer;
at least four conductive support members including a first conductive support member, wherein the first conductive support member is in direct contact with the contact portion;
the induction plates are arranged on the at least four conductive supporting pieces;
a sealing layer covering the upper surface and having a surface flush with the sensing plate.
2. The anti-static sensor according to claim 1, further comprising an elastic filling layer filled between the sensing plate and the fingerprint sensor chip.
3. The electrostatic prevention sensor according to claim 1 or 2, wherein the height of the first lead is larger than the height of the second lead.
4. The anti-static sensor according to any one of claims 1 to 3, wherein the at least four conductive supports are symmetrically distributed about the center of the fingerprint sensor chip.
5. The anti-static sensor of claim 4, wherein the at least four conductive supports are metal balls, solder balls, or cured silver paste masses.
6. An anti-static sensor comprising:
a wiring board having a first pad and a second pad on an upper surface thereof, wherein the first pad is grounded;
the fingerprint sensor chip is fixed on the upper surface and comprises a third bonding pad and a fourth bonding pad;
a first lead electrically connecting the first pad and the third pad and having an arc shape;
a second lead electrically connecting the second pad and the fourth pad and having an arc shape;
an insulating protective layer wrapping a bonding portion of the first lead and the third pad and a bonding portion of the second lead and the fourth pad;
the induction plate is arranged on the insulating protection layer and provided with a protruding part facing the upper surface, and the protruding part is directly contacted with the first lead;
a sealing layer covering the upper surface and having a surface flush with the sensing plate.
7. The anti-static sensor according to claim 6, further comprising an elastic filling layer filled between the sensing plate and the fingerprint sensor chip.
8. The electrostatic prevention sensor according to claim 6, wherein the protruding portion is located outside a projection of the fingerprint sensor chip on the wiring board.
9. The electrostatic prevention sensor according to claim 6, wherein a portion of the protruding portion that is in direct contact with the first lead is not covered with the insulating protective layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010661460.4A CN111816642A (en) | 2020-07-10 | 2020-07-10 | Anti-static sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010661460.4A CN111816642A (en) | 2020-07-10 | 2020-07-10 | Anti-static sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111816642A true CN111816642A (en) | 2020-10-23 |
Family
ID=72841803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010661460.4A Withdrawn CN111816642A (en) | 2020-07-10 | 2020-07-10 | Anti-static sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111816642A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204167290U (en) * | 2014-09-15 | 2015-02-18 | 江苏长电科技股份有限公司 | Fingerprint Identification sensor encapsulating structure |
| CN104851853A (en) * | 2015-05-19 | 2015-08-19 | 苏州晶方半导体科技股份有限公司 | Fingerprint identification chip packaging structure and packaging method |
| CN107785330A (en) * | 2016-08-31 | 2018-03-09 | 矽品精密工业股份有限公司 | Package structure and method for fabricating the same |
| CN109994431A (en) * | 2017-12-29 | 2019-07-09 | 矽品精密工业股份有限公司 | Encapsulating structure |
| CN110399863A (en) * | 2019-08-07 | 2019-11-01 | 武汉芯盈科技有限公司 | Fingerprint sensor structure with electrostatic protection function |
| CN110582779A (en) * | 2017-05-08 | 2019-12-17 | 指纹卡有限公司 | fingerprint sensor package |
-
2020
- 2020-07-10 CN CN202010661460.4A patent/CN111816642A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204167290U (en) * | 2014-09-15 | 2015-02-18 | 江苏长电科技股份有限公司 | Fingerprint Identification sensor encapsulating structure |
| CN104851853A (en) * | 2015-05-19 | 2015-08-19 | 苏州晶方半导体科技股份有限公司 | Fingerprint identification chip packaging structure and packaging method |
| CN107785330A (en) * | 2016-08-31 | 2018-03-09 | 矽品精密工业股份有限公司 | Package structure and method for fabricating the same |
| CN110582779A (en) * | 2017-05-08 | 2019-12-17 | 指纹卡有限公司 | fingerprint sensor package |
| CN109994431A (en) * | 2017-12-29 | 2019-07-09 | 矽品精密工业股份有限公司 | Encapsulating structure |
| CN110399863A (en) * | 2019-08-07 | 2019-11-01 | 武汉芯盈科技有限公司 | Fingerprint sensor structure with electrostatic protection function |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101868859B1 (en) | Fingerprint sensing device | |
| JP4160851B2 (en) | Semiconductor device for fingerprint recognition | |
| KR101503183B1 (en) | Finger sensor including encapsulating layer over sensing area and related methods | |
| US8183873B2 (en) | Contact sensor unit, electronic device, and method for producing a contact sensor unit | |
| US6804121B2 (en) | Housing for biometric sensor chips and method for producing the housing | |
| KR101011572B1 (en) | Finger sensor including flexible circuit and associated methods | |
| TWI325618B (en) | Film type package for fingerprint sensor | |
| TWI462193B (en) | Fingerprint sensor chip package method and its package structure | |
| US8701267B2 (en) | Method of making a finger sensor package | |
| US6525412B2 (en) | Semiconductor device having chip scale package | |
| KR100922529B1 (en) | Semiconductor device having a built-in contact-type sensor and manufacturing method of such a semiconductor device | |
| CN111816642A (en) | Anti-static sensor | |
| CN111816643A (en) | Touch sensor | |
| KR102071490B1 (en) | Fingerprint sensor package and fingerprint sensor module comprising the same | |
| US7193282B2 (en) | Contact sensor package | |
| KR20170126337A (en) | Fingerprint recognition sensor package and method of manufacturing the same | |
| JP4374028B2 (en) | Electronics | |
| KR102452631B1 (en) | Semiconductor package comprising electrostatic discharge and impact protecting structure | |
| JPH06106887A (en) | Ic card and manufacture thereof | |
| JP2004172467A (en) | Semiconductor package and its mounting structure | |
| JPH0512513A (en) | Ic card | |
| CN115273682A (en) | Display panel and display device | |
| JP4374029B2 (en) | Semiconductor device with built-in contact sensor | |
| JPH03290298A (en) | Portable electronic device | |
| JPH10270636A (en) | Structure of semiconductor device having integrated circuit chips |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20201023 |
|
| WW01 | Invention patent application withdrawn after publication |