CN204130552U - A kind of point-contact diode - Google Patents

A kind of point-contact diode Download PDF

Info

Publication number
CN204130552U
CN204130552U CN201420574470.4U CN201420574470U CN204130552U CN 204130552 U CN204130552 U CN 204130552U CN 201420574470 U CN201420574470 U CN 201420574470U CN 204130552 U CN204130552 U CN 204130552U
Authority
CN
China
Prior art keywords
junction
wafer
point
diode
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420574470.4U
Other languages
Chinese (zh)
Inventor
夏洪贵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201420574470.4U priority Critical patent/CN204130552U/en
Application granted granted Critical
Publication of CN204130552U publication Critical patent/CN204130552U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1203Rectifying Diode
    • H01L2924/12036PN diode

Abstract

The utility model relates to a kind of point-contact diode, comprise square shell, described square shell two ends are respectively arranged with anode tap, cathode leg, described anode tap is provided with support, described rack upper surface is provided with PN junction, described PN junction is fixed with wafer, and described wafer is connected with cathode leg by touching silk.The utility model structure is simple, easily encapsulation, cheap for manufacturing cost, the rectified current carried, repercussion voltage are comparatively large, not easily breakdown.

Description

A kind of point-contact diode
Technical field
The utility model relates to a kind of semiconductor device, particularly relates to a kind of point-contact diode.
Background technology
Diode, also known as crystal diode, is called for short diode (diode), in addition, also has early stage vacuum electronic diode; It is a kind of electronic device with unidirectional conduction current.Have a PN junction two lead terminals in semiconductor diode inside, this electronic device, according to the direction of applied voltage, possesses the transduction of unidirectional current.In general, crystal diode is one and sinters by p-type semiconductor and n-type semiconductor the p-n junction interface formed.Form space charge layer in the both sides at its interface, form built-in field.When applied voltage equals zero, to cause dissufion current equal with the drift current that caused by built-in field and be in electric equilibrium state for the concentration difference due to p-n junction both sides charge carrier, and this is also the diode characteristic under normality.
At present, diode manufacturing technology is quite ripe, but still there is complex structure, cost is high, encapsulation is difficult, the easy problem such as breakdown.
Utility model content
Technical problem to be solved in the utility model is to provide that a kind of structure is simple, easily encapsulation, cheap for manufacturing cost, the rectified current carried, repercussion voltage are comparatively large, not easily breakdown point-contact diode.
The technical scheme that the utility model solves the problems of the technologies described above is as follows: a kind of point-contact diode, comprise square shell, described square shell two ends are respectively arranged with anode tap, cathode leg, described anode tap is provided with support, described rack upper surface is provided with PN junction, described PN junction is fixed with wafer, and described wafer is connected with cathode leg by touching silk.
Semiconductor diode is one and sinters by p-type semiconductor and n-type semiconductor the PN junction interface formed.Form space charge layer in the both sides at its interface, form built-in field.When applied voltage equals zero, to cause dissufion current equal with the drift current that caused by built-in field and be in electric equilibrium state for concentration difference due to PN junction both sides charge carrier, described support and PN junction conducting are used for the transmission of charge carrier, and described tactile silk is used for the conducting between wafer and cathode leg.
On the basis of technique scheme, the utility model can also do following improvement.
Further, described square shell is metal shell, the as easy as rolling off a log impact being subject to ambient temperature, humidity, interference signal of described diode PN junction built-in field, and described metal shell can effectively shield external interference signal, and other influences factor, ensure the normal work of diode.
Further, described anode tap, cathode leg are filamentary silver lead-in wire, and described filamentary silver lead resistance is little, good conductivity, is conducive to the transmission of charge carrier, thus increase rectified current.
Further, described wafer is silicon wafer, and described silicon wafer changes its conductivity by doping, controls the rectified current size of diode with this.
Further, described wafer and PN junction ohmic contact, for the foundation of built-in field, and the cut-off of reverse voltage.
The beneficial effects of the utility model are: structure is simple, easily encapsulation, cheap for manufacturing cost, and the rectified current carried, repercussion voltage are comparatively large, not easily breakdown.
Accompanying drawing explanation
Fig. 1 is a kind of point-contact diode structural representation of the utility model;
In accompanying drawing, the list of parts representated by each label is as follows: 1, cathode leg, and 2, square shell, 3, wafer, 4, PN junction, 5, support, 6 anode taps, 7, touch silk.
Embodiment
Be described principle of the present utility model and feature below in conjunction with accompanying drawing, example, only for explaining the utility model, is not intended to limit scope of the present utility model.
As shown in Figure 1, a kind of point-contact diode, comprise square shell 2, described square shell 2 two ends are respectively arranged with anode tap 6, cathode leg 1, described anode tap 6 is provided with support 5, described support 5 upper surface is provided with PN junction 4, and described PN junction 4 is fixed with wafer 3, and described wafer 3 is connected with cathode leg 1 by touching silk 7.
Semiconductor diode is one and sinters by p-type semiconductor and n-type semiconductor PN junction 4 interface formed.Form space charge layer in the both sides at its interface, form built-in field.When applied voltage equals zero, to cause dissufion current equal with the drift current that caused by built-in field and be in electric equilibrium state for concentration difference due to PN junction 4 both sides charge carrier, described support and PN junction 4 conducting are used for the transmission of charge carrier, and described tactile silk 7 is for the conducting between wafer 3 and cathode leg 1.
Described square shell 2 is metal shell, the as easy as rolling off a log impact being subject to ambient temperature, humidity, interference signal of described diode PN junction 4 built-in field, described metal shell 1 can effectively shield external interference signal, and other influences factor, ensures the normal work of diode; Described anode tap 6, cathode leg 1 are filamentary silver lead-in wire, and described filamentary silver lead resistance is little, good conductivity, is conducive to the transmission of charge carrier, thus increases rectified current; Described wafer 3 is silicon wafer, and described silicon wafer changes its conductivity by doping, controls the rectified current size of diode with this; Described wafer 3 and PN junction 4 ohmic contact, for the foundation of built-in field, and the cut-off of reverse voltage.
The foregoing is only preferred embodiment of the present utility model, not in order to limit the utility model, all within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.

Claims (5)

1. a point-contact diode, it is characterized in that, comprise square shell, described square shell two ends are respectively arranged with anode tap, cathode leg, described anode tap is provided with support, described rack upper surface is provided with PN junction, and described PN junction is fixed with wafer, and described wafer is connected with cathode leg by touching silk.
2. a kind of point-contact diode according to claim 1, it is characterized in that, described square shell is metal shell.
3. a kind of point-contact diode according to claim 1, is characterized in that, described anode tap, cathode leg are filamentary silver lead-in wire.
4. a kind of point-contact diode according to claim 1, it is characterized in that, described wafer is silicon wafer.
5. a kind of point-contact diode according to claim 1, is characterized in that, described wafer and PN junction ohmic contact.
CN201420574470.4U 2014-09-30 2014-09-30 A kind of point-contact diode Expired - Fee Related CN204130552U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420574470.4U CN204130552U (en) 2014-09-30 2014-09-30 A kind of point-contact diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420574470.4U CN204130552U (en) 2014-09-30 2014-09-30 A kind of point-contact diode

Publications (1)

Publication Number Publication Date
CN204130552U true CN204130552U (en) 2015-01-28

Family

ID=52386877

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420574470.4U Expired - Fee Related CN204130552U (en) 2014-09-30 2014-09-30 A kind of point-contact diode

Country Status (1)

Country Link
CN (1) CN204130552U (en)

Similar Documents

Publication Publication Date Title
PH12016501141A1 (en) Solar cell emitter region fabrication with differentiated p-type and n-type region architectures
MY190470A (en) Main-gate-free and high-efficiency back-contact solar cell module, main-gate-free and high-efficiency back-contact assembly, and preparation process thereof
CN105679857A (en) Silicon quantum dot/graphene/silicon heterostructure-based photoelectric sensor
CN103746002B (en) A kind of step groove-field limiting ring composite terminal structure
CN103426910B (en) Power semiconductor element and edge termination structure thereof
CN104362198A (en) Transparent electrode grid-control transverse PIN blue and purple photo-detector and method for manufacturing same
CN202601620U (en) Fast recovery diode
CN203351612U (en) Schottky diode
CN203179900U (en) A fast recovery diode FRD chip
CN204130552U (en) A kind of point-contact diode
CN104916712A (en) Solar battery grid wire combination electrode
CN104241399A (en) Point-contact diode
CN103311278A (en) Fast recovery diode and method for manufacturing fast recovery diode
CN106449768B (en) A kind of JFET pipe
WO2011098069A3 (en) Back contact solar cell having an unstructured absorber layer
CN105448972B (en) Reverse-conducting insulated gate bipolar transistor npn npn
CN104218071A (en) Planar diode
CN205355056U (en) PN type diode
CN204130540U (en) A kind of face contact diode
CN203941903U (en) A kind of transient voltage suppresses semiconductor device
CN103311314A (en) Fast recovery diode and method for manufacturing fast recovery diode
CN204130541U (en) A kind of planar diode
CN104218072A (en) Surface contact type diode
CN203491262U (en) Unidirectional high-voltage silicon controlled rectifier
CN204102909U (en) A kind of rectifier diode device

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150128

Termination date: 20150930

EXPY Termination of patent right or utility model