CN204102860U - For the resin dust collection mechanism of semiconductor packaging device - Google Patents
For the resin dust collection mechanism of semiconductor packaging device Download PDFInfo
- Publication number
- CN204102860U CN204102860U CN201420542887.2U CN201420542887U CN204102860U CN 204102860 U CN204102860 U CN 204102860U CN 201420542887 U CN201420542887 U CN 201420542887U CN 204102860 U CN204102860 U CN 204102860U
- Authority
- CN
- China
- Prior art keywords
- mounting panel
- cylinder
- dust
- rectangle lead
- open slot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses the resin dust collection mechanism for semiconductor packaging device, it comprises base plate and is fixed in the hexagonal column of four rectangular arrangements on base plate, hexagonal column top is connected with rectangle lead mounting panel, two parallel short sides bottom surfaces of rectangle lead mounting panel are connected with the linear bearing coordinated with the axis of guide respectively, the middle part of rectangle lead mounting panel offers open slot, in open slot, adaptation has cylinder, the bottom of cylinder is connected with governing valve, the top of linear bearing is upward through rectangle lead mounting panel and its top is connected with guiding mounting panel, guiding mounting panel offers the open slot passed for cylinder, the top side detachable of cylinder is connected with floating junction, affixed with guiding mounting panel by caging bolt on the rectangle lead mounting panel on cylinder both sides, the side of guiding mounting panel is connected with dust collect plant.The beneficial effects of the utility model coordinate dust suction with feeding manipulator, simple structure convenient disassembly, effectively can remove the residual dust in barrel.
Description
Technical field
The utility model relates to field of semiconductor package, particularly relates to the resin dust collection mechanism for semiconductor packaging device.
Background technology
Semiconductor packages refers to the process wafer by test being obtained individual chips according to product type and functional requirement processing.Encapsulation process is: from the wafer of wafer front road technique by being cut into little wafer (Die) after scribing process, then the wafer glue of well cutting is mounted on the island of corresponding substrate (lead frame) frame, recycle ultra-fine metal (golden tin copper aluminium) wire or the bond pad (Bond Pad) of wafer is connected to the respective pins (Lead) of substrate by electroconductive resin, and the circuit required by forming; And then to independently wafer plastic casing in addition packaging protection, also will carrying out sequence of operations after plastic packaging, after having encapsulated, carry out finished product test, usually through entering to examine the operation such as Incoming, test Test and packaging Packing, finally putting shipment in storage.Semiconductor package is contained in resin automatic charging, the resin arranged is transported in feeding manipulator by feeding manipulator resin lifting mechanism, resin remains in resin seat by baffle plate mode of keeping off by the latter, and resin material will render in the resin cartridges in plastic semiconductor encapsulating mould by next step feeding manipulator.After feeding manipulator puts into mould resin, resin cartridges has residual dust, and a never procedure cleaning, the resin cartridges in feeding manipulator can be caused to be covered by dust after long-time use, impact uses.
Utility model content
Resin cartridges residual dust when the technical problems to be solved in the utility model is existing feeding manipulator material loading, impact uses, and provides a kind of resin dust collection mechanism for semiconductor packaging device for this reason.
The technical solution of the utility model is: for the resin dust collection mechanism of semiconductor packaging device, it comprises base plate and is fixed in the hexagonal column of four rectangular arrangements on base plate, described hexagonal column top is connected with rectangle lead mounting panel, two parallel short sides bottom surfaces of described rectangle lead mounting panel are connected with the linear bearing coordinated with the axis of guide respectively, the middle part of described rectangle lead mounting panel offers open slot, in described open slot, adaptation has cylinder, the bottom of described cylinder is connected with governing valve, the top of described linear bearing is upward through rectangle lead mounting panel and its top is connected with guiding mounting panel, described guiding mounting panel offers the open slot passed for cylinder, the top side detachable of described cylinder is connected with floating junction, affixed with guiding mounting panel by caging bolt on the rectangle lead mounting panel on described cylinder both sides, the side of described guiding mounting panel is connected with dust collect plant.
Dust collect plant described in such scheme comprises the dust-collecting box fixed head affixed with guiding mounting panel, described dust-collecting box fixed head is divided into horizontal part and vertical component effect, the axis of described horizontal part offers filter, the central authorities of described vertical component effect are provided with dust-collecting box, and the bottom of described filter is connected with dust-collecting box.
Rubber blanket is provided with immediately below the described filter of improvement of such scheme.
The further improvement of such scheme is that the side of described cylinder is connected with magnetic induction switch.
The beneficial effects of the utility model coordinate with feeding manipulator, and after feeding manipulator puts into mould resin, exit mould to resin dust suction position, governing valve is opened control cylinder and moved up and down, thus drive dust-collecting box fixed head and dust-collecting box to move up and down; Filter is to prevent lump from falling into, and rubber blanket is to seal, and increases pick-up performance; After being put in place by the decline of magnetic induction switch detection cylinder, feeding manipulator starts to get back to assigned address.Overall structure is simple, convenient disassembly, effectively can remove the residual dust in barrel.
Accompanying drawing explanation
Fig. 1 is shaft side figure such as just grade of the present utility model;
Fig. 2 is front view of the present utility model;
In figure, 1, base plate, 2, hexagonal post 3, rectangle lead mounting panel, 4, the axis of guide, 5, guiding mounting panel, 6, cylinder, 7, dust-collecting box fixed head, 8, dust-collecting box, 9, rubber blanket, 10, filter, 11, caging bolt, 12, linear bearing, 13, floating junction, 14, governing valve, 15, magnetic induction switch.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described further.
As Fig. 1, shown in Fig. 2, the utility model comprises base plate 1 and is fixed in the hexagonal column 2 of four rectangular arrangements on base plate, described hexagonal column top is connected with rectangle lead mounting panel 3, two parallel short sides bottom surfaces of described rectangle lead mounting panel are connected with the linear bearing 12 coordinated with the axis of guide 4 respectively, the middle part of described rectangle lead mounting panel offers open slot, in described open slot, adaptation has cylinder 6, the bottom of described cylinder is connected with governing valve 14, the top of described linear bearing is upward through rectangle lead mounting panel and its top is connected with guiding mounting panel 5, described guiding mounting panel offers the open slot passed for cylinder, the top side detachable of described cylinder is connected with floating junction 13, affixed with guiding mounting panel by caging bolt 11 on the rectangle lead mounting panel on described cylinder both sides, the side of described guiding mounting panel is connected with dust collect plant.
Concrete, dust collect plant can comprise the dust-collecting box fixed head 7 affixed with guiding mounting panel, described dust-collecting box fixed head is divided into horizontal part and vertical component effect, the axis of described horizontal part offers filter 10, the central authorities of described vertical component effect are provided with dust-collecting box 8, and the bottom of described filter is connected with dust-collecting box.
Installation steps of the present utility model are as follows: dust-collecting box 8 is connected with outside precipitron by flexible pipe; The horizontal part of dust-collecting box fixed head is arranged on guiding mounting panel, and locates with pin.Two axis of guides are fixed on by screw on the location hole of guiding mounting panel, and be connected with cylinder by floating junction in the middle of guiding mounting panel, the screwed hole of both sides installs two caging bolts.In open slot in the middle of rectangle lead mounting panel, a cylinder is installed, is fixed on rectangle lead mounting panel by the hold-down nut on cylinder, cylinder is provided with governing valve.Two linear bearings are installed in rectangle lead mounting panel both sides, and the axis of guide passes in the middle of linear bearing.Rectangle lead mounting panel surrounding installs four hexagonal posts by soket head cap screw, and below four hexagonal posts, the end of thread is through base plate via hole, has four nuts to be fixed on base plate.
In order to ensure sealing effectiveness during dust suction, rubber blanket 9 can being provided with immediately below filter, ensureing the vacuum environment of filter scope, avoiding the dust caused because leaking gas to overflow.
In order to make this device continuous operation, can be connected with magnetic induction switch 15 in cylinder side, it can detect cylinder and whether drop to original position, if so, then feeds back signal to feeding manipulator, and feeding manipulator starts to get back to assigned address and carries out next round operation.If not, then cylinder continues to decline until drop to original position.
In the utility model, floating junction and caging bolt can regulate floating junction and caging bolt from upper and lower to guiding mounting panel location respectively as required, guiding mounting panel are moved up and down to regulate and the relative position of manipulator.
Specific works process is as follows: after feeding manipulator puts into mould resin, exits mould and runs to resin dust suction position with barrel, and governing valve control cylinder upwards, thus drives dust-collecting box fixed head and dust-collecting box to move upward.After dust-collecting box fixed head upwards coordinates with the locating piece of feeding manipulator, precipitron is started working dust suction.After dust suction terminates, governing valve control cylinder declines, and detect after cylinder declines and put in place by magnetic induction switch, feeding manipulator starts to get back to assigned address.
By reference to the accompanying drawings the utility model is exemplarily described above; obvious the utility model specific implementation is not subject to the restrictions described above; as long as have employed the improvement of the various unsubstantialities that method of the present utility model is conceived and technical scheme is carried out; or design of the present utility model and technical scheme directly applied to other occasion, all within protection range of the present utility model without to improve.
Claims (4)
1. for the resin dust collection mechanism of semiconductor packaging device, it is characterized in that it comprises base plate (1) and is fixed in the hexagonal column (2) of four rectangular arrangements on base plate, described hexagonal column top is connected with rectangle lead mounting panel (3), two parallel short sides bottom surfaces of described rectangle lead mounting panel are connected with the linear bearing (12) coordinated with the axis of guide (4) respectively, the middle part of described rectangle lead mounting panel offers open slot, in described open slot, adaptation has cylinder (6), the bottom of described cylinder is connected with governing valve (14), the top of described linear bearing is upward through rectangle lead mounting panel and its top is connected with guiding mounting panel (5), described guiding mounting panel offers the open slot passed for cylinder, the top side detachable of described cylinder is connected with floating junction, affixed with guiding mounting panel by caging bolt on the rectangle lead mounting panel on described cylinder both sides, the side of described guiding mounting panel is connected with dust collect plant.
2. as claimed in claim 1 for the resin dust collection mechanism of semiconductor packaging device, it is characterized in that described dust collect plant comprises the dust-collecting box fixed head affixed with guiding mounting panel, described dust-collecting box fixed head is divided into horizontal part and vertical component effect, the axis of described horizontal part offers filter, the central authorities of described vertical component effect are provided with dust-collecting box, and the bottom of described filter is connected with dust-collecting box.
3., as claimed in claim 2 for the resin dust collection mechanism of semiconductor packaging device, it is characterized in that being provided with rubber blanket immediately below described filter.
4. the resin dust collection mechanism for semiconductor packaging device as described in as arbitrary in claim 1-3, is characterized in that described cylinder side is connected with magnetic induction switch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420542887.2U CN204102860U (en) | 2014-09-19 | 2014-09-19 | For the resin dust collection mechanism of semiconductor packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420542887.2U CN204102860U (en) | 2014-09-19 | 2014-09-19 | For the resin dust collection mechanism of semiconductor packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204102860U true CN204102860U (en) | 2015-01-14 |
Family
ID=52271266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420542887.2U Expired - Fee Related CN204102860U (en) | 2014-09-19 | 2014-09-19 | For the resin dust collection mechanism of semiconductor packaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204102860U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106040669A (en) * | 2016-07-15 | 2016-10-26 | 长春工业大学 | Vacuum adsorption type sealing ring dust removal device |
| CN111038983A (en) * | 2019-11-28 | 2020-04-21 | 铜陵富仕三佳机器有限公司 | Automatic resin arraying loader |
| CN111244002A (en) * | 2020-03-25 | 2020-06-05 | 铜陵富仕三佳机器有限公司 | A novel manipulator that snatchs for IC chip encapsulation |
-
2014
- 2014-09-19 CN CN201420542887.2U patent/CN204102860U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106040669A (en) * | 2016-07-15 | 2016-10-26 | 长春工业大学 | Vacuum adsorption type sealing ring dust removal device |
| CN111038983A (en) * | 2019-11-28 | 2020-04-21 | 铜陵富仕三佳机器有限公司 | Automatic resin arraying loader |
| CN111244002A (en) * | 2020-03-25 | 2020-06-05 | 铜陵富仕三佳机器有限公司 | A novel manipulator that snatchs for IC chip encapsulation |
| CN111244002B (en) * | 2020-03-25 | 2022-07-29 | 铜陵富仕三佳机器有限公司 | Grabbing manipulator for packaging IC chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204102860U (en) | For the resin dust collection mechanism of semiconductor packaging device | |
| CN204913248U (en) | Automatic installation mechanism of wave washer | |
| CN103358123A (en) | Automatic nozzle bottle cap assembling machine | |
| CN205035064U (en) | Can filling closing cap device | |
| CN203006890U (en) | Automatic medicine bottle capping machine | |
| CN105572147A (en) | Chip automatic detection method | |
| CN204045550U (en) | A kind of full-automatic package system | |
| CN204760432U (en) | Solid brilliant machine of encapsulation LED | |
| CN205396627U (en) | Semiconductor trade bulk cargo equipment for packing | |
| CN103159167A (en) | Sensor encapsulation equipment | |
| CN202479706U (en) | Automatic feeding device | |
| CN208200348U (en) | It is a kind of applied to the filling transportation system for sealing up equipment | |
| CN206961868U (en) | LED encapsulating moulds | |
| CN206244073U (en) | A kind of automatic stocker of pcb printed lines road automatic detecting machine | |
| CN201089647Y (en) | Bottle-distributing device for filling packing machine | |
| CN209804609U (en) | bare chip bonding device | |
| CN206569381U (en) | Automatic labeling machine | |
| CN105905321B (en) | The rotating-table apparatus of limit switch packing machine | |
| CN206590572U (en) | A kind of toolframe assembling device | |
| CN105328863B (en) | A kind of high-precision automatic assembling and packaging system for injecting products | |
| CN212710426U (en) | Full-automatic labeling machine | |
| CN102862811A (en) | Semi-conductor conveying device | |
| CN114279831A (en) | Test equipment of spacer for semiconductor packaging | |
| CN200962416Y (en) | Device for preventing the surface pasting semiconductor part pin from distortion | |
| CN105383929B (en) | A kind of semiconductor automatic feeding machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150114 Termination date: 20190919 |