CN206961868U - LED encapsulating moulds - Google Patents
LED encapsulating moulds Download PDFInfo
- Publication number
- CN206961868U CN206961868U CN201720859219.6U CN201720859219U CN206961868U CN 206961868 U CN206961868 U CN 206961868U CN 201720859219 U CN201720859219 U CN 201720859219U CN 206961868 U CN206961868 U CN 206961868U
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- driven gear
- pole
- frame
- frame support
- support
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Abstract
It the utility model is related to LED technology field, specially LED encapsulating moulds, location-plate is also equipped with base, dip mold is arranged on location-plate, frame support one end is connected with driven gear, driven gear is enclosed on vertical pole, frame support is located above dip mold, it is top die above frame support, driven gear engages with drive gear, drive gear is arranged on column, back-moving spring is also covered on pole, back-moving spring is located at below driven gear, the lower end of back-moving spring is provided with height adjusting nut, cylinder is provided with above driven gear, cylinder is used to drive driven gear along pole slide downward.LED encapsulating moulds provided by the utility model, are positioned by location-plate, improve precision, and bonnet is placed into place, pushed by top die by frame support, whole process automation mechanized operation, and precision is high, and efficiency is low.
Description
Technical field
It the utility model is related to LED technology field, specially LED encapsulating moulds.
Background technology
Existing LED encapsulation technologies, are mostly packaged using metal die, and bonnet is encapsulated into main body to be packaged,
Encapsulation process generally comprise chip inspection, spread sheet, dispensing, standby glue, manual film-making, shelve, sinter automatically, pressure welding, glue dispensing and packaging,
The techniques such as encapsulating encapsulation, moulded package, solidification and solidify afterwards.Using above-mentioned metal die, in the encapsulation process of LED chip,
Positioning, matched moulds are all more complicated, are much manual operations, precision is low, and efficiency is slow.
Utility model content
In view of the above-mentioned problems, the utility model provides a kind of simple LED encapsulating moulds of the high matched moulds of positioning precision.
Concrete technical scheme is：
LED encapsulating moulds, including base, frame support, top die, dip mold and column；
Described column is arranged on base side, and location-plate is also equipped with base, and described dip mold is arranged on positioning
On plate, described frame support one end is connected with driven gear, and driven gear is enclosed on vertical pole, can be along on pole
Lower slider, described pole are arranged on base, and frame support be located above dip mold, and frame support top is top die, institute
The top die stated is driven by elevating mechanism and moved up and down；Described driven gear engages with drive gear, described drive gear
On column, described drive gear is connected by transmission device with servomotor, and drive gear is driven by servomotor
Rotate；Back-moving spring is also covered on described pole, described back-moving spring is located at below driven gear, and the lower end of back-moving spring is set
Height adjusting nut is equipped with, described height adjusting nut is by being threadably mounted on pole, in the regulation of height adjusting nut
In stroke, pole is provided with screw thread；
It is provided with cylinder above described driven gear, described cylinder is used to driving driven gear along pole to downslide
It is dynamic.
The frame-shaped construction that described frame support forms for four edges frame, inner hollow, for placing bonnet, described side
The flexible support of installation in fluted, described groove is set on frame, and described elasticity support front half section protrusion is outside frame, for propping up
Bonnet is supportted, the second half section is located in groove, and spring is provided between described elasticity support and groove, described elasticity support front half section
Upper surface is domatic.
LED encapsulating moulds provided by the utility model, are positioned by location-plate, improve precision, frame support is by after
Lid is placed into place, is pushed by top die, whole process automation mechanized operation, and precision is high, and efficiency is low.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model；
Fig. 2 is frame supporting structure schematic diagram of the present utility model；
Fig. 3 is elastic holder structure schematic diagram of the present utility model.
Embodiment
Specific embodiment of the present utility model is described with reference to the drawings, as shown in figure 1, LED encapsulating moulds, including base 5,
Frame support 2, top die 1, dip mold 3 and column 15；
Described column 15 is arranged on the side of base 5, is also equipped with location-plate 4 on base 5, described dip mold 3 is installed
On location-plate 4, described one end of frame support 2 is connected with driven gear 7, and driven gear 7 is enclosed on vertical pole 9, can
To be slided up and down along pole 9, described pole 9 is arranged on base 5, and frame support 2 is located at the top of dip mold 3, frame branch
The top of frame 2 is top die 1, and described top die 1 is driven by elevating mechanism and moved up and down；Described driven gear 7 and sliding tooth
The engagement of wheel 11, described drive gear 11 are arranged on column 15, and described drive gear 11 passes through transmission device and servo electricity
Machine connects, and drives drive gear 11 to rotate by servomotor；Back-moving spring 8, described back-moving spring are also covered on described pole 9
8 are provided with height adjusting nut 10 positioned at the lower section of driven gear 7, the lower end of back-moving spring 8, and described height adjusting nut 10 is logical
Cross and be threadably mounted on pole 9, in the regulation stroke of height adjusting nut 10, pole 9 is provided with screw thread；
The described top of driven gear 7 is provided with cylinder 6, and described cylinder 6 is used to drive driven gear 7 along pole 9
Slide downward.
As shown in Figures 2 and 3, described frame support 2 is the frame-shaped construction of four edges frame composition, inner hollow, is used for
Bonnet is placed, fluted 12 are set on described frame, flexible support 14, described elastic support 14 are installed in described groove 12
Front half section protrusion is outside frame, and for supporting rear cover, the second half section is located in groove 12, between described elastic support 14 and groove 12
Spring 13 is provided with, the upper surface of the described front half section of elastic support 14 is domatic.
Main body to be packaged is placed on dip mold 3, is positioned by location-plate 4, and bonnet is placed on frame support 2.
Top die 1 is descending, and when top die 1 is pressed downward bonnet, bonnet and frame support 2 overcome the elastic force of back-moving spring 8,
Descending together, until frame support 2 is run on dip mold 3, top die 1 continues traveling downwardly, and frame support 2 stops descending, bonnet
Edge be attached to elastic support 14 it is domatic on, elastic support 14 is extruded into groove 12, overcomes the elastic force of spring 13, until bonnet is complete
Total detachment elasticity support 14, top die 1 is resetted, and frame support 2 also rises in the presence of back-moving spring 8 to be resetted.
Servomotor drives drive gear 11 to rotate, and drive gear 11 drives driven gear 7 to rotate, so as to drive frame branch
Frame 2 is rotated around pole 9, and frame support 2 turns to feeding station, and next bonnet is placed into frame branch at feeding station
In frame 2, the top of dip mold 3 is then rotated back into again, and the product processed on dip mold 3 is removed, and places next to be processed treat
Package main body.
Claims (2)
1. LED encapsulating moulds, it is characterised in that：Including base（5）, frame support（2）, top die（1）, dip mold（3）With it is vertical
Post（15）；
Described column（15）Installed in base（5）Side, base（5）On be also equipped with location-plate（4）, described dip mold
（3）Installed in location-plate（4）On, described frame support（2）One end is connected with driven gear（7）, driven gear（7）It is enclosed on vertical
Straight pole（9）On, can be along pole（9）Slide up and down, described pole（9）Installed in base（5）On, frame support
（2）Positioned at dip mold（3）Top, frame support（2）Top is top die（1）, described top die（1）Driven by elevating mechanism
Move up and down；Described driven gear（7）With drive gear（11）Engagement, described drive gear（11）Installed in column（15）
On, described drive gear（11）It is connected by transmission device with servomotor, drive gear is driven by servomotor（11）Turn
It is dynamic；Described pole（9）On also cover back-moving spring（8）, described back-moving spring（8）Positioned at driven gear（7）Lower section, reset bullet
Spring（8）Lower end be provided with height adjusting nut（10）, described height adjusting nut（10）By being threadably mounted at pole（9）
On, in height adjusting nut（10）Regulation stroke in, pole（9）It is provided with screw thread；
Described driven gear（7）Top is provided with cylinder（6）, described cylinder（6）For driving driven gear（7）Along branch
Bar（9）Slide downward.
2. LED encapsulating moulds according to claim 1, it is characterised in that：Described frame support（2）For four edges frame group
Into frame-shaped construction, inner hollow, for placing bonnet, set on described frame fluted（12）, described groove（12）
The interior flexible support of installation（14）, described elasticity support（14）Front half section protrusion is outside frame, and for supporting rear cover, the second half section is located at
Groove（12）Interior, described elasticity support（14）With groove（12）Between be provided with spring（13）, described elasticity support（14）First half
The upper surface of section is domatic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720859219.6U CN206961868U (en) | 2017-07-17 | 2017-07-17 | LED encapsulating moulds |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720859219.6U CN206961868U (en) | 2017-07-17 | 2017-07-17 | LED encapsulating moulds |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206961868U true CN206961868U (en) | 2018-02-02 |
Family
ID=61384059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720859219.6U Active CN206961868U (en) | 2017-07-17 | 2017-07-17 | LED encapsulating moulds |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206961868U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109066260A (en) * | 2018-10-19 | 2018-12-21 | 资阳中车电气科技有限公司 | A kind of terminal crimping mold |
| CN109177008A (en) * | 2018-09-30 | 2019-01-11 | 深圳市华夏光彩股份有限公司 | A kind of encapsulating die and its glue-pouring method for LED module |
-
2017
- 2017-07-17 CN CN201720859219.6U patent/CN206961868U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109177008A (en) * | 2018-09-30 | 2019-01-11 | 深圳市华夏光彩股份有限公司 | A kind of encapsulating die and its glue-pouring method for LED module |
| CN109066260A (en) * | 2018-10-19 | 2018-12-21 | 资阳中车电气科技有限公司 | A kind of terminal crimping mold |
| CN109066260B (en) * | 2018-10-19 | 2024-04-12 | 资阳中车电气科技有限公司 | Terminal crimping die |
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