CN214898490U

CN214898490U - LED packaging mold with multiple positioning structures

Info

Publication number: CN214898490U
Application number: CN202121084241.0U
Authority: CN
Inventors: 代仕明
Original assignee: Shenzhen Jinfengsheng Plastics Products Co ltd
Current assignee: Shenzhen Jinfengsheng Plastics Products Co ltd
Priority date: 2021-05-20
Filing date: 2021-05-20
Publication date: 2021-11-26
Anticipated expiration: 2031-05-20

Abstract

The utility model discloses a LED packaging mold with a multiple positioning structure, which comprises a lower mold body, wherein an upper mold body is arranged above the lower mold body, and mold inner cavities are arranged inside the lower mold body and the upper mold body; the encapsulation lead screw, it sets up the left and right sides of mould inner chamber, the junction of die body and encapsulation lead screw is embedded to have the bearing that matches with the encapsulation lead screw down, go up the die body and the junction of encapsulation lead screw is embedded to have the nut that matches with the encapsulation lead screw, the lower extreme key-type connection of encapsulation lead screw has lead screw driving motor. Compared with the existing device, the LED packaging mold with the multiple positioning structure has the advantages that the upper mold body can be guided through the arranged packaging screw rod, so that the upper mold body and the lower mold body are convenient to use; the lower die body and the upper die body are mutually attached, the operation is simple, the positioning lug can be observed whether to completely enter the positioning groove through the marked line, and the attaching condition of the lower die body and the upper die body can be displayed.

Description

LED packaging mold with multiple positioning structures

Technical Field

The utility model relates to a LED packaging mold technical field specifically is LED packaging mold with multiple location structure.

Background

The LED package has the functions of providing enough protection for the chip and preventing the chip from being exposed in air for a long time or being damaged mechanically to fail so as to improve the stability of the chip; for LED packaging, it is also necessary to have good light extraction efficiency and good heat dissipation, and good packaging can make the LED have better luminous efficiency and heat dissipation environment, thereby improving the life of the LED.

Chinese patent authorizes bulletin No. CN206961868U, the bulletin day is 2018, 02 month 02 day, LED packaging mold is disclosed, relate to LED technical field, specifically, LED packaging mold, still install the locating plate on the base, the bed die is installed on the locating plate down, frame support one end is connected with driven gear, driven gear overlaps on vertically branch, frame support is located the bed die top, frame support top is last moulding-die, driven gear and drive gear meshing, drive gear installs on the stand, still overlap reset spring on the branch, reset spring is located the driven gear below, reset spring's lower extreme is provided with height-adjusting nut, the driven gear top is provided with the cylinder, the cylinder is used for driving driven gear and slides downwards along branch. The utility model provides a LED packaging mold fixes a position through the locating plate, improves the precision, and the frame support is placed the back lid and is targetting in place, is pushed down by last moulding-die, whole process automation operation, and the precision is high, and is inefficient

The above prior art has the following disadvantages: the technical scheme is complex in operation and cannot directly observe whether the die main bodies are attached to each other, so that the LED packaging die with the multi-positioning structure is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a LED packaging mold with multiple location structure to it is complicated to provide the operation in solving above-mentioned background art, the unable problem of laminating each other of direct observation mould main part.

In order to achieve the above object, the utility model provides a following technical scheme: LED packaging mold with multiple positioning structures comprises:

the die comprises a lower die body, an upper die body and a lower die body, wherein an inner cavity of the die is formed in the lower die body and the upper die body;

the packaging screw rods are arranged on the left side and the right side of the inner cavity of the mold, bearings matched with the packaging screw rods are embedded in the joints of the lower mold body and the packaging screw rods, nuts matched with the packaging screw rods are embedded in the joints of the upper mold body and the packaging screw rods, and the lower end keys of the packaging screw rods are connected with screw rod driving motors;

the positioning lugs are fixed on the front side and the rear side of the inner cavity of the mold, and positioning grooves are formed above the positioning lugs;

and the marked line is arranged on the outer surface of the positioning lug.

Preferably, the lower die body is further provided with:

the packaging holes are formed in the four corners of the lower die body, a buffer plate is arranged inside each packaging hole, a buffer elastic piece is mounted at the lower end of each buffer plate, and packaging columns corresponding to the packaging holes are arranged above the packaging holes;

and the positioning holes are arranged on two sides of the packaging hole, and positioning columns are arranged above the positioning holes and are connected with the positioning holes.

Preferably, the distance between the marked line and the lower die body is equal to the thickness of the upper die body, and the positioning groove penetrates through the inner part of the upper die body.

Preferably, the buffer plate is in threaded connection with the packaging hole through the buffer elastic piece, a triangular structure is formed between the positioning hole and the packaging hole, the positioning column and the packaging column are both fixedly connected with the upper die body, and the height of the positioning column is lower than that of the packaging column.

Preferably, the upper die body is further provided with:

and the glue injection hole is formed in the upper end surface of the upper die body and communicated with the upper die body.

Preferably, the inner cavity of the mold is further provided with:

and the cooling cavity is arranged around the inner cavity of the mold, one end of the cooling cavity is provided with water outlets, and the other end of the cooling cavity is provided with water inlets.

Preferably, the water outlet hole is communicated with the water inlet hole through the cooling cavity.

Compared with the prior art, the utility model provides a LED packaging mold with multiple location structure possesses following beneficial effect: according to the LED packaging mold with the multiple positioning structures, the upper mold body can be guided through the arranged packaging screw rod, so that the upper mold body and the lower mold body are convenient to operate; the lower die body and the upper die body are mutually attached, the operation is simple, the positioning lug can be observed whether to completely enter the positioning groove through the marked line, and the attaching condition of the lower die body and the upper die body can be displayed.

1. The utility model discloses a height of the marking that sets up is unanimous with the thickness of last die body, when the marking lies in the coplanar with the up end of last die body, proves die body and last die body closely laminate down to show die body and last die body laminating condition down, drive the height of die body can be adjusted to the encapsulation lead screw, adjust it; through the arranged packaging holes, the packaging columns can go deep into the packaging holes to fix the upper die body, so that the LED packaging process is completed;

2. the utility model can perform multiple positioning to the lower die body and the upper die body through the arranged positioning holes and the matched positioning columns, thereby improving the precision of the die body, and the arranged buffering elastic piece can jack the upper die body upwards, thereby being convenient for separating the upper die body while playing a buffering role; the upper die body can be subjected to injection molding through the arranged injection molding holes;

3. the utility model discloses a cooling chamber that sets up can utilize physics to keep away from the heat transfer and cool down the product to the inside injection cooling water of inlet opening to can carry out rapid prototyping, the drawing of patterns of being convenient for.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic top view of the lower mold body of the present invention;

FIG. 3 is a schematic view of the three-dimensional structure of the upper mold body of the present invention;

fig. 4 is a schematic view of the three-dimensional structure of the packaging hole of the present invention.

In the figure: 1. a lower die body; 2. feeding a mold body; 3. positioning the bump; 4. marking lines; 5. an inner cavity of the mold; 6. a water outlet hole; 7. a water inlet hole; 8. packaging the lead screw; 9. injecting glue holes; 10. a positioning groove; 11. a positioning column; 12. packaging the column; 13. positioning holes; 14. a packaging hole; 15. a buffer plate; 16. a cooling chamber; 17. buffer elastic piece.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1, the LED package mold with multiple positioning structures includes: the die comprises a lower die body 1, an upper die body 2 is arranged above the lower die body 1, and die inner cavities 5 are formed in the lower die body 1 and the upper die body 2; the packaging screw rods 8 are arranged on the left side and the right side of the inner cavity 5 of the mold, bearings matched with the packaging screw rods 8 are embedded in the joints of the lower mold body 1 and the packaging screw rods 8, nuts matched with the packaging screw rods 8 are embedded in the joints of the upper mold body 2 and the packaging screw rods 8, and the lower end keys of the packaging screw rods 8 are connected with screw rod driving motors; the positioning lugs 3 are fixed on the front side and the rear side of the inner cavity 5 of the mold, and positioning grooves 10 are arranged above the positioning lugs 3; marking 4, its setting is at the surface of locating convex block 3, distance between marking 4 and the lower mould body 1 equals the thickness of last mould body 2, positioning groove 10 runs through in the inside of last mould body 2, height through the marking 4 that sets up is unanimous with the thickness of last mould body 2, when marking 4 and the up end of last mould body 2 lie in the coplanar, mould body 1 closely laminates with last mould body 2 under the certificate, thereby show lower mould body 1 and the laminating condition of last mould body 2, drive encapsulation lead screw 8 can adjust the height of last mould body 2, adjust it, injecting glue hole 9, its up end at last mould body 2 is seted up, injecting glue hole 9 is linked together with last mould body 2, through injecting glue hole 9 that sets up, can make progress the injection molding in the mould body 2 inside.

As shown in fig. 3 to 4, the LED package mold having the multi-positioning structure includes: the packaging holes 14 are formed in four corners of the lower die body 1, the buffer plates 15 are arranged inside the packaging holes 14, the buffer elastic pieces 17 are arranged at the lower ends of the buffer plates 15, the packaging columns 12 corresponding to the packaging holes 14 are arranged above the packaging holes 14, the packaging columns 12 can penetrate into the packaging holes 14 through the arranged packaging holes 14, the upper die body 2 is fixed, and therefore the LED packaging process is completed; locating hole 13, it sets up the both sides at encapsulation hole 14, the top of locating hole 13 is equipped with the reference column 11 with locating hole 13, buffer board 15 is threaded connection through buffering elastic component 17 and encapsulation hole 14, constitute the triangle-shaped structure between locating hole 13 and the encapsulation hole 14, reference column 11 and encapsulation post 12 all with last mould 2 fixed connection, reference column 11 highly is less than the height of encapsulation post 12, locating hole 13 through setting up, supporting reference column 11 of accessible carries out multiple positioning to lower mould 1 and last mould 2, thereby improve the precision of mould body, and the buffering elastic component 17 that sets up can upwards jack-up last mould 2, when playing the cushioning effect, be convenient for go up mould 2 separation.

As shown in fig. 2, the LED package mold having the multi-positioning structure includes: cooling chamber 16, it sets up around mold cavity 5, and the one end of cooling chamber 16 is provided with apopore 6, and the other end of cooling chamber 16 is provided with inlet opening 7, and apopore 6 is linked together with inlet opening 7 through cooling chamber 16, and through the cooling chamber 16 that sets up, can pour into the cooling water into to the inside of inlet opening 7, utilizes the physics to keep away from the heat transfer and carries out cooling to the product to can carry out rapid prototyping, the drawing of patterns of being convenient for.

The working principle is as follows: when the LED packaging mold with the multiple positioning structure is used, firstly, a product cover body is placed in the inner cavity 5 of the mold, a driving motor at the tail end of a packaging screw rod 8 is started, the packaging screw rod 8 rotates at the moment to drive an upper mold body 2 to move downwards, and at the moment, a positioning groove 10 on the upper mold body 2 is sleeved outside a positioning lug 3; secondly, adjusting the position of the upper die body 2 to enable the positioning column 11 to penetrate into the positioning hole 13, meanwhile, the packaging column 12 enters the packaging hole 14, the buffering plate 15 is pressed by the buffering elastic piece 17 to move downwards, and the marking 4 on the positioning lug 3 is observed; then, when the marked line 4 and the upper die body 2 are overlapped, the driving motor is closed, glue is injected into the glue injection hole 9, and therefore the product is packaged and fixed; finally, be connected external water pipe and inlet opening 7, pour into the cooling water into through inlet opening 7 to the inside of cooling chamber 16, the cooling water that the temperature rose after the heat transfer discharges through apopore 6, and after the design, can start driving motor and carry out reverse rotation to go up die body 2 under the promotion of buffering elastic component 17, can separate last die body 2 smoothly, this is exactly this work principle who has the LED packaging mold of multiple location structure.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. LED encapsulation mould with multiple location structure, its characterized in that includes:

the die comprises a lower die body (1), wherein an upper die body (2) is arranged above the lower die body (1), and die inner cavities (5) are formed in the lower die body (1) and the upper die body (2);

the die comprises a die cavity (5), a lower die body (2) and a die lead screw (8), wherein the die cavity is provided with a lower die body, the lower die body is provided with a lower die body, and the lower die body is provided with a lower die body;

the positioning lugs (3) are fixed on the front side and the rear side of the inner cavity (5) of the mold, and positioning grooves (10) are arranged above the positioning lugs (3);

and the marked line (4) is arranged on the outer surface of the positioning lug (3).

2. The LED packaging mold with the multi-positioning structure as claimed in claim 1, wherein the lower mold body (1) is further provided with:

the packaging structure comprises a lower die body (1), packaging holes (14) formed in four corners of the lower die body (1), a buffer plate (15) is arranged inside the packaging holes (14), a buffer elastic piece (17) is mounted at the lower end of the buffer plate (15), and packaging columns (12) corresponding to the packaging holes (14) are arranged above the packaging holes (14);

and the positioning holes (13) are arranged on two sides of the packaging hole (14), and positioning columns (11) which are connected with the positioning holes (13) are arranged above the positioning holes (13).

3. The LED packaging mold with the multi-positioning structure as claimed in claim 1, wherein the distance between the marked line (4) and the lower mold body (1) is equal to the thickness of the upper mold body (2), and the positioning groove (10) penetrates through the inside of the upper mold body (2).

4. The LED packaging mold with the multiple positioning structures as claimed in claim 2, wherein the buffer plate (15) is in threaded connection with the packaging hole (14) through a buffer elastic member (17), the positioning hole (13) and the packaging hole (14) form a triangular structure, the positioning pillar (11) and the packaging pillar (12) are both fixedly connected with the upper mold body (2), and the height of the positioning pillar (11) is lower than that of the packaging pillar (12).

5. The LED packaging mold with the multi-positioning structure as claimed in claim 1, wherein the upper mold body (2) is further provided with:

and the glue injection hole (9) is formed in the upper end face of the upper die body (2), and the glue injection hole (9) is communicated with the upper die body (2).

6. The LED packaging mold with the multi-positioning structure as claimed in claim 1, wherein the mold cavity (5) is further provided with:

the cooling cavity (16) is arranged around the inner cavity (5) of the mold, one end of the cooling cavity (16) is provided with a water outlet hole (6), and the other end of the cooling cavity (16) is provided with a water inlet hole (7).

7. The LED packaging mold with the multi-positioning structure as claimed in claim 6, wherein the water outlet hole (6) is communicated with the water inlet hole (7) through a cooling cavity (16).