CN204088360U - Light emitting diode support structure - Google Patents
Light emitting diode support structure Download PDFInfo
- Publication number
- CN204088360U CN204088360U CN201420293023.1U CN201420293023U CN204088360U CN 204088360 U CN204088360 U CN 204088360U CN 201420293023 U CN201420293023 U CN 201420293023U CN 204088360 U CN204088360 U CN 204088360U
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- CN
- China
- Prior art keywords
- support
- groove
- insulating barrier
- intercell connector
- light emitting
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Abstract
The utility model discloses a kind of light emitting diode support structure, its support group that mainly punch forming has number to arrange on a metal substrate, each support group of arranging also is configured to by a plurality of, metal substrate is between each support, be formed with the intercell connector disconnected mutually with support again, this intercell connector is respectively provided with a groove in the alignment with two adjacent stents, at least one irregularly-shaped hole run through then is provided with in groove, when each support is coated with an insulating barrier at its foreign side's injecting glue, insulating barrier sizing material of this note that overflows can set up respectively with in an insulation adhesive tape and at least one Special-Shaped Column groove of being filled in this intercell connector and irregularly-shaped hole by groove, in order to do the cross-over connection utilizing insulation adhesive tape, two adjacent stents are allowed to produce link.
Description
Technical field
The utility model relates to a kind of light emitting diode support structure, and espespecially a kind of materials'use rate is high, and testing efficiency is good, is not easy to come off grain, and can avoid the light emitting diode support structure producing dust, fines.
Background technology
At present, a kind of known light emitting diode support structure, how as shown in Figure 5, its support group 41 that mainly punch forming has number to arrange on a metal substrate 40, each support group 41 of arranging also is made up of a plurality of support 42, metal substrate 40 links to several linkage sections 43 and each support 42 with one again, and this linkage section 43 is the clouts after punching press, each support 42 foreign side then injecting glue be coated with an insulating barrier 44.
So, known features as above still has following problem points in practical application: its each support 42 to produce to several linkage section 43 and metal substrate 40 with one to link, when after packaging, to directly carry out disposable survey to all supports 42 on metal substrate 40, can because each support 42 be all conducted and causes short circuit, this cannot perform relatively, and after packaging each support 42 must be removed separately detection, make the efficiency of test not good, and the process pulled down is carried out with cut mode, support 42 pin position is easily caused to pull broken string, this will cause not good yield.
Again, the known light emitting diode support structure of current another kind, how as shown in Figure 6, its support group 51 that mainly punch forming has number to arrange on a metal substrate 50, each support group 51 of arranging also is made up of a plurality of support 52, metal substrate 50 is between each support 52, be formed with the connecting plate 53 disconnected with support 52 phase again, this connecting plate 53 is the clouts after punching press, each support 52 foreign side then injecting glue be coated with an insulating barrier 54, contain to connecting plate 53 side with this insulating barrier 54, each support 52 slightly can be inserted with connecting plate 53 and embed insulating barrier 54, and produce coupler.
So, known features as above still has following problem points in practical application: one its utilize connecting plate 53 slightly to insert the insulating barrier 54 embedding support 52, so that each support 52 is linked, though make each support 52 can complete disposable survey on metal substrate 50, but because connecting plate 53 the quantity that significantly can reduce unit are medium-height trestle 52 is set, and make the misgivings that this structure has materials'use rate not good; Insulating barrier 54 deficiency embedding support 52 of inserting two connecting plates 53 easily causes and makes medium-height trestle 52 and depart from connecting plate 53 and the grain that drops bad; Three its utilize connecting plate 53 slightly to insert the insulating barrier 54 embedding support 52, the process that can be folded down from metal substrate 50 at support 52, with connecting plate 53 take advantage of a situation to insulating barrier 54 produce scrape, and form dust 60 and cover on packaged light-emittingdiode as shown in the 7th figure, this will have a strong impact on its make after qualification rate.
Utility model content
In view of this, the technical problems to be solved in the utility model is to provide a kind of light emitting diode support structure, the non-overdistension of its intercell connector, with in the insulating barrier of slotting embedding support, make this structure unexpected because the setting of intercell connector just significantly reduces the quantity of unit are medium-height trestle, its problem relatively not having materials'use rate not good
For solving the problems of the technologies described above, the technical solution of the utility model is achieved in that a kind of light emitting diode support structure, its support group that mainly punch forming has number to arrange on a metal substrate, each support group of arranging also is configured to by a plurality of, metal substrate is between each support, be formed with the intercell connector disconnected mutually with support, this intercell connector is respectively provided with a groove in the alignment with two adjacent stents, when each support is coated with an insulating barrier at its foreign side's injecting glue, this insulating barrier sizing material overflowing note can by the setting of groove, be filled in the groove of this intercell connector with an insulation adhesive tape, by the cross-over connection of the adhesive tape that insulate, two adjacent stents are allowed to produce link.
Further, intercell connector is the clout after punching press.
Further, be provided with at least one irregularly-shaped hole run through in groove, when each support is coated with an insulating barrier at its foreign side's injecting glue, this insulating barrier sizing material overflowing note also by the setting of groove, can be filled in the irregularly-shaped hole of this intercell connector with at least one Special-Shaped Column.
Further, irregularly-shaped hole and Special-Shaped Column are coordinating of geometry.
The technique effect that the utility model reaches is as follows:
(1) the utility model provides light emitting diode support structure, the non-overdistension of its intercell connector, with in the insulating barrier of slotting embedding support, make this structure unexpected because the setting of intercell connector just significantly reduces the quantity of unit are medium-height trestle, its problem relatively not having materials'use rate not good.
(2) the utility model provides light emitting diode support structure, and it utilizes the cross-over connection of insulation adhesive tape, is linked by each support, makes each support can complete disposable survey on metallic substrates, and encapsulation, the efficiency of testing can be reentried lifting.
(3) the utility model provides light emitting diode support structure, its intercell connector is not inserted and is embedded insulating barrier, scrape so can not produce insulating barrier when support is folded down, coordinated insulation adhesive tape, Special-Shaped Column are filled in the consolidation of groove, irregularly-shaped hole, effectively can stop the generation of dust, allow the finished product after making maintain certain qualification rate.
(4) the utility model provides light emitting diode support structure, and it utilizes the cross-over connection of insulation adhesive tape, is linked by each support, can avoid the problem on the make falling grain.
(5) the utility model provides light emitting diode support structure, can directly peel off after its support and metal substrate encapsulate, and does not have metal linkage section to shear, pull support and the bad situation that arrives.
Accompanying drawing explanation
Fig. 1 is stereogram of the present utility model.
Fig. 2 is plane graph of the present utility model.
Fig. 3 is profile of the present utility model.
Fig. 4 is the state diagram that the utility model support is snapped away from from metal substrate.
Fig. 5 is a kind of plane graph of known features.
Fig. 6 is the plane graph of another kind of known features.
Fig. 7 is the view that another kind of known features dust produces.
Metal substrate---10
Support group----20 supports-----21
Intercell connector----22 grooves-----23
Irregularly-shaped hole----24
Insulating barrier----30 insulation adhesive tape---31
Special-Shaped Column----32
Metal substrate---40 support group----41
Support-----(42) linkage section---(43)
Insulating barrier----(44)
Metal substrate---50 support group----51
Support-----52 connecting plate----53
Insulating barrier----54
Dust-----60.
Embodiment
In order to have a better understanding and awareness the purpose of this utility model, feature and effect, accompanying drawing below please be coordinated to enumerate embodiment, and detailed description is as rear:
First, please see it by shown in Fig. 1 to Fig. 3, its support group 20 that mainly punch forming has number to arrange on a metal substrate 10, each support group 20 of arranging also is made up of a plurality of support 21, metal substrate 10 is between each support 21, be formed with the intercell connector 22 disconnected with support 21 phase again, this intercell connector 22 is the clouts after punching press, intercell connector 22 is respectively provided with a groove 23 in the alignment with two adjacent stents 21, at least one irregularly-shaped hole 24 run through then is provided with in groove 23, when each support 21 is coated with an insulating barrier 30 at its foreign side's injecting glue, insulating barrier 30 sizing material of this note that overflows can be filled in the groove 23 of this intercell connector 22 with irregularly-shaped hole 24 with an insulation adhesive tape 31 and at least one Special-Shaped Column 32 respectively by setting up of groove 23, by utilizing the cross-over connection of insulation adhesive tape 31, two adjacent stents 21 are allowed to produce link.
The utility model provides a kind of light emitting diode support structure, and wherein, irregularly-shaped hole 24 and Special-Shaped Column 32 establish coordinating of the geometry such as rounded.
By the structure of above-mentioned specific embodiment, following benefit can be obtained: 1, the non-overdistension of its intercell connector 22, with in the insulating barrier 30 of slotting embedding support 21, make this structure unexpected because the setting of intercell connector 22 just significantly reduces the quantity of unit are medium-height trestle 21, its problem relatively not having materials'use rate not good; 2, it utilizes the cross-over connection of insulation adhesive tape 31, is linked by each support 21, makes each support 21 can complete disposable survey on metal substrate 10, and encapsulation, the efficiency of testing can be reentried premter; 3, its intercell connector 22 is not inserted and is embedded insulating barrier 30, scrape please see it as shown in Figure 4 simultaneously so can not produce insulating barrier 30 when support 21 is folded down, coordinated insulation adhesive tape 31, Special-Shaped Column 32 are filled in the consolidation of groove 23, irregularly-shaped hole 24, effectively can stop the generation of dust, allow the finished product after making maintain certain qualification rate; 4, it utilizes the cross-over connection of insulation adhesive tape 31, is linked by each support 21, can avoid the problem on the make falling grain; 5, its support 21 and metal substrate 10 can directly be peeled off after encapsulate, do not have the shearing of metal linkage section, pull support 21 and the bad situation that arrives.
The above, be only preferred embodiment of the present utility model, is not intended to limit protection range of the present utility model.
Claims (4)
1. a light emitting diode support structure, its support group that mainly punch forming has number to arrange on a metal substrate, the support group of each row is also configured to by a plurality of, it is characterized in that:
Metal substrate is between each support, be formed with the intercell connector disconnected mutually with support, this intercell connector is respectively provided with a groove in the alignment with two adjacent stents, when each support is coated with an insulating barrier at its foreign side's injecting glue, overflowing this insulating barrier sizing material noted can by the setting of groove, be filled in the groove of this intercell connector with an insulation adhesive tape, by the cross-over connection of the adhesive tape that insulate, two adjacent stents are allowed to produce link.
2. light emitting diode support structure as claimed in claim 1, it is characterized in that, intercell connector is the clout after punching press.
3. light emitting diode support structure as claimed in claim 1, it is characterized in that, at least one irregularly-shaped hole run through is provided with in groove, when each support is coated with an insulating barrier at its foreign side's injecting glue, this insulating barrier sizing material overflowing note also by the setting of groove, can be filled in the irregularly-shaped hole of this intercell connector with at least one Special-Shaped Column.
4. light emitting diode support structure as claimed in claim 3, it is characterized in that, irregularly-shaped hole and Special-Shaped Column are coordinating of geometry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420293023.1U CN204088360U (en) | 2014-06-03 | 2014-06-03 | Light emitting diode support structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420293023.1U CN204088360U (en) | 2014-06-03 | 2014-06-03 | Light emitting diode support structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204088360U true CN204088360U (en) | 2015-01-07 |
Family
ID=52181037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420293023.1U Expired - Fee Related CN204088360U (en) | 2014-06-03 | 2014-06-03 | Light emitting diode support structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204088360U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200490907Y1 (en) * | 2017-02-24 | 2020-02-11 | 티티오피 코퍼레이션 | Light source sensor wire frame base module |
-
2014
- 2014-06-03 CN CN201420293023.1U patent/CN204088360U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200490907Y1 (en) * | 2017-02-24 | 2020-02-11 | 티티오피 코퍼레이션 | Light source sensor wire frame base module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150107 Termination date: 20210603 |