CN204046948U - 一种高阶高密度电路板蚀刻装置 - Google Patents
一种高阶高密度电路板蚀刻装置 Download PDFInfo
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- CN204046948U CN204046948U CN201420530927.1U CN201420530927U CN204046948U CN 204046948 U CN204046948 U CN 204046948U CN 201420530927 U CN201420530927 U CN 201420530927U CN 204046948 U CN204046948 U CN 204046948U
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- Prior art keywords
- jet system
- air jet
- circuit board
- spray equipment
- conveying device
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- 238000005530 etching Methods 0.000 claims abstract description 47
- 239000007921 spray Substances 0.000 claims abstract description 32
- 230000009467 reduction Effects 0.000 claims abstract description 8
- 230000005540 biological transmission Effects 0.000 claims description 3
- 230000004907 flux Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 230000000994 depressogenic effect Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
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- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
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Priority Applications (1)
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CN201420530927.1U CN204046948U (zh) | 2014-09-16 | 2014-09-16 | 一种高阶高密度电路板蚀刻装置 |
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CN201420530927.1U CN204046948U (zh) | 2014-09-16 | 2014-09-16 | 一种高阶高密度电路板蚀刻装置 |
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CN204046948U true CN204046948U (zh) | 2014-12-24 |
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CN201420530927.1U Expired - Fee Related CN204046948U (zh) | 2014-09-16 | 2014-09-16 | 一种高阶高密度电路板蚀刻装置 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107579024A (zh) * | 2017-08-26 | 2018-01-12 | 华天恒芯半导体(厦门)有限公司 | 一种用于芯片表面的蚀刻装置 |
CN111465203A (zh) * | 2020-04-22 | 2020-07-28 | 郑振华 | 一种电路板的蚀刻装置 |
-
2014
- 2014-09-16 CN CN201420530927.1U patent/CN204046948U/zh not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107579024A (zh) * | 2017-08-26 | 2018-01-12 | 华天恒芯半导体(厦门)有限公司 | 一种用于芯片表面的蚀刻装置 |
CN111465203A (zh) * | 2020-04-22 | 2020-07-28 | 郑振华 | 一种电路板的蚀刻装置 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Higher-order high-density circuit board etching apparatus Effective date of registration: 20181026 Granted publication date: 20141224 Pledgee: China Postal Savings Bank Limited by Share Ltd. Suining Sui branch Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: 2018510000108 |
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Date of cancellation: 20201125 Granted publication date: 20141224 Pledgee: China Postal Savings Bank Limited by Share Ltd. Suining Sui branch Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: 2018510000108 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A high order high density circuit board etching device Effective date of registration: 20210127 Granted publication date: 20141224 Pledgee: Suining branch of Bank of China Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021980000674 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220120 Granted publication date: 20141224 Pledgee: Suining branch of Bank of China Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021980000674 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A high-order high-density circuit board etching device Effective date of registration: 20220402 Granted publication date: 20141224 Pledgee: Suining Fengfa Modern Agricultural Financing Guarantee Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980003717 |
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Date of cancellation: 20221227 Granted publication date: 20141224 Pledgee: Suining Fengfa Modern Agricultural Financing Guarantee Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980003717 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: An etching device for high order and high density circuit board Effective date of registration: 20230105 Granted publication date: 20141224 Pledgee: Suining Fengfa Financing Guarantee Group Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980029897 |
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