CN204011390U - The ceramic packaging shell of chip is installed in a kind of upside-down mounting - Google Patents
The ceramic packaging shell of chip is installed in a kind of upside-down mounting Download PDFInfo
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- CN204011390U CN204011390U CN201420477572.4U CN201420477572U CN204011390U CN 204011390 U CN204011390 U CN 204011390U CN 201420477572 U CN201420477572 U CN 201420477572U CN 204011390 U CN204011390 U CN 204011390U
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Abstract
The utility model discloses a kind of upside-down mounting the ceramic packaging shell of chip is installed, comprise ceramic bases, lead-in wire and lead frame, ceramic bases is to be formed by stacking up and down by two ceramic wafers, the width of two ceramic wafers equates, the length of top ceramic wafer is slightly larger than the length of below ceramic wafer, both sides in ceramic bases form ledge structure, lead frame is frame structure, ceramic bases is placed in lead frame center, lead-in wire is placed on the step of ceramic bases both sides, and arrange uniformly, one end of lead-in wire contacts with top ceramic wafer side, the other end is connected with lead frame.Upside-down mounting mounting technique and the lead technology that bends are carried out combination by the utility model, possess the excellent electrical property of upside-down mounting shell and the exit mode of ceramic small-shape shell maturation simultaneously, when can reducing packaging technology step, have that electrical property is good, reliability high.
Description
Technical field
The utility model relates to microelectronic integrated circuit encapsulation technology field.
Background technology
Ceramic small-shape shell is as a class of semiconductor integrated circuit shell, its conventional structure is (if Fig. 1 is a) for metal lead wire coordinates the structure of aluminium oxide ceramics, be applicable to the chip mounting means of Bonding, Bonding is comparatively ripe by ceramic small-shape shell technology, this structure adopts biserial lead-in wire that bends, encapsulated device Installation And Test technology maturation.As seen from Figure 2, chip is installed in cavity, realizes by bonding the interconnection that chip and shell bonding refer to, finally realizes the interconnection of chip and external circuit.This kind of shell chip is embedded in enclosure, due to the existence of bonding wire, under high-speed high frequency applicable cases, may bring the decline of performance.
Upside-down mounting mounting technique is a kind of chip mounting means that last century, the nineties grew up, and flip-chip concentrates on several forms such as ceramic pin grid array, ceramic welded ball array, ceramic welding column array by shell exit mode, there is no at present other forms.This connected mode has the advantages such as interconnection line is short, parasitic parameter is little, and in high-frequency high-speed signal field, application is comparatively extensive.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of ceramic packaging shell of upside-down mounting installation chip, upside-down mounting mounting technique and the lead technology that bends are carried out combination by this structure, possess the excellent electrical property of upside-down mounting shell and the exit mode of ceramic small-shape shell maturation simultaneously, when can reducing packaging technology step, have that electrical property is good, reliability high.
For solving the problems of the technologies described above, technical solution adopted in the utility model is: the ceramic packaging shell of chip is installed in a kind of upside-down mounting, it is characterized in that comprising ceramic bases, lead-in wire and lead frame, described ceramic bases is to be formed by stacking up and down by two ceramic wafers, the width of two ceramic wafers equates, the length of top ceramic wafer is slightly larger than the length of below ceramic wafer, both sides in ceramic bases form ledge structure, described lead frame is frame structure, described ceramic bases is placed in lead frame center, described lead-in wire is placed on the step of ceramic bases both sides, and arrange uniformly, one end of lead-in wire contacts with top ceramic wafer side, the other end is connected with lead frame.
Said structure is described further, and described lead-in wire is the biserial lead-in wire that bends, and its place of bending contacts with the upper surface of below ceramic wafer, and the yardstick of sweep is less than the width of step.
Said structure is described further, and four jiaos of described lead frame are provided with fixing hole.
Said structure is described further, also comprises that index indicates, described index represents to be placed in one jiao of the bottom surface of ceramic bases.
The beneficial effect that adopts technique scheme to produce is: the utility model is to improve on the basis of original ceramic packaging shell, by two potsherds that are superimposed, form flip-over type chip package shell, this shell and original structure contrast, having removed chip installation cavity and bonding refers to, only need on chip, increase the bump pad of upside-down mounting installation chip, can realize chip installs and electrical interconnection simultaneously, the utility model has structurally been removed after ceramic cavity, porcelain piece changes boss structure into, ceramic segment thickness increases, improve the mechanical strength of shell.New construction overall dimension and original structure overall dimension are in full accord, can realize direct replacement, its advantage mainly contains following 2 points: 1, be applicable to flip-chip and install, chip is installed and electrical interconnection synchronously completes, when reducing packaging technology step, improve electrical property; 2, lead-in wire lead-out mode is identical with conventional Bonding ceramic small-shape shell, can realize same size and install alternative.
Brief description of the drawings
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Fig. 1 a is upward view of the present utility model;
Fig. 1 b is lead-in wire and the combination schematic diagram of ceramic bases in the utility model;
Fig. 1 c is vertical view of the present utility model;
Fig. 2 a is conventional Bonding ceramic packaging shell mechanism schematic diagram;
Fig. 2 b is the vertical view of Fig. 2 a;
Wherein: 1, lead-in wire, 2, ceramic bases, 3, index indicates, 4, lead frame.
Embodiment
1 is known with reference to the accompanying drawings, the utility model is specifically related to a kind of ceramic packaging shell of upside-down mounting installation chip, specifically comprise ceramic bases 2, lead-in wire 1 and lead frame 4, ceramic bases 2 is to be formed by stacking up and down by two ceramic wafers, the width of two ceramic wafers equates, the length of top ceramic wafer is slightly larger than the length of below ceramic wafer, both sides in ceramic bases 2 form ledge structure, lead frame 4 is frame structure, four jiaos of lead frame 4 are provided with fixing hole, ceramic bases 2 is placed in lead frame 4 centers, lead-in wire 1 is placed on the step of ceramic bases 2 both sides, and arrange uniformly, one end of lead-in wire 1 contacts with top ceramic wafer side, the other end is connected with lead frame 4.Lead-in wire 1 is the biserial lead-in wire that bends, and it bends and locates to contact with the upper surface of below ceramic wafer, and the yardstick of sweep is less than the width of step.
Said structure is that upside-down mounting mounting technique and the lead-in wire ceramic small-shape shell technology of bending are combined, can possess the excellent electrical property of upside-down mounting shell and the exit mode of ceramic small-shape shell maturation simultaneously, structurally remove after the ceramic cavity of chip installation, porcelain piece changes boss structure into, chip is realized and being connected of ceramic bases 2 by bump pad, the obvious thickness of ceramic segment increases, and has improved the mechanical strength of shell, can have the contrast of Fig. 1 b and Fig. 2 a to find out.
New construction overall dimension and original structure overall dimension are in full accord, can realize direct replacement, and its advantage mainly contains following 2 points:
1, be applicable to flip-chip and install, chip is installed and electrical interconnection synchronously completes, and when reducing packaging technology step, has improved electrical property;
2, lead-in wire lead-out mode is identical with conventional Bonding ceramic small-shape shell, can realize same size and install alternative.
In addition, in the utility model, in order to represent the model of its packaged chip, can increase index in the bottom surface of ceramic bases 2 and indicate 3.
Due to packaging shell structure is improved, its production technology can adopt the production procedure of conventional multilayer co-firing aluminium oxide ceramics shell to produce, and idiographic flow is:
The aluminium oxide porcelain piece technological process of production:
The shell technological process of production:
The utility model is for the installation of flip-chip, and its inverted structure has that electrical property is good, reliability high, is one of main way of installing of semiconductor integrated circuit chip, and being suitable for upside-down mounting, the ceramic package of chip is installed is the basis of realizing highly reliable encapsulation.Be widely used in the every field such as microwave communication system, telemetry system, radar, navigation, biomedicine, electronic countermeasures, artificial satellite, spaceship.
Claims (4)
1. the ceramic packaging shell of a upside-down mounting installation chip, it is characterized in that comprising ceramic bases (2), lead-in wire (1) and lead frame (4), described ceramic bases (2) is to be formed by stacking up and down by two ceramic wafers, the width of two ceramic wafers equates, the length of top ceramic wafer is slightly larger than the length of below ceramic wafer, both sides in ceramic bases (2) form ledge structure, described lead frame (4) is frame structure, described ceramic bases (2) is placed in lead frame (4) center, described lead-in wire (1) is placed on the step of ceramic bases (2) both sides, and arrange uniformly, one end of lead-in wire (1) contacts with top ceramic wafer side, the other end is connected with lead frame (4).
2. the ceramic packaging shell of chip is installed in a kind of upside-down mounting according to claim 1, it is characterized in that described lead-in wire (1) is for the biserial lead-in wire that bends, and it bends and locates to contact with the upper surface of below ceramic wafer, and the yardstick of sweep is less than the width of step.
3. the ceramic packaging shell of chip is installed in a kind of upside-down mounting according to claim 1, it is characterized in that four jiaos of described lead frame (4) are provided with fixing hole.
4. the ceramic packaging shell of chip is installed according to a kind of upside-down mounting described in any one in claim 1～3, is characterized by further comprising index and indicate (3), described index represents that (3) are placed in one jiao of the bottom surface of ceramic bases (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420477572.4U CN204011390U (en) | 2014-08-22 | 2014-08-22 | The ceramic packaging shell of chip is installed in a kind of upside-down mounting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420477572.4U CN204011390U (en) | 2014-08-22 | 2014-08-22 | The ceramic packaging shell of chip is installed in a kind of upside-down mounting |
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| Publication Number | Publication Date |
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| CN204011390U true CN204011390U (en) | 2014-12-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420477572.4U Active CN204011390U (en) | 2014-08-22 | 2014-08-22 | The ceramic packaging shell of chip is installed in a kind of upside-down mounting |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105845581A (en) * | 2016-03-30 | 2016-08-10 | 中国电子科技集团公司第十三研究所 | Ceramic member for high-frequency and high-speed ceramic packaging housing, housing, lamination mold and sintering mold |
| CN109494197A (en) * | 2018-11-13 | 2019-03-19 | 中国电子科技集团公司第十三研究所 | Ceramic package shell |
-
2014
- 2014-08-22 CN CN201420477572.4U patent/CN204011390U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105845581A (en) * | 2016-03-30 | 2016-08-10 | 中国电子科技集团公司第十三研究所 | Ceramic member for high-frequency and high-speed ceramic packaging housing, housing, lamination mold and sintering mold |
| CN105845581B (en) * | 2016-03-30 | 2018-05-08 | 中国电子科技集团公司第十三研究所 | High-frequency high-speed ceramic package shell ceramic member, shell, laminated mould and sintering mold |
| CN109494197A (en) * | 2018-11-13 | 2019-03-19 | 中国电子科技集团公司第十三研究所 | Ceramic package shell |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |