CN109494197A - Ceramic package shell - Google Patents
Ceramic package shell Download PDFInfo
- Publication number
- CN109494197A CN109494197A CN201811345534.2A CN201811345534A CN109494197A CN 109494197 A CN109494197 A CN 109494197A CN 201811345534 A CN201811345534 A CN 201811345534A CN 109494197 A CN109494197 A CN 109494197A
- Authority
- CN
- China
- Prior art keywords
- lead
- pad
- ceramic
- ceramic package
- package shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The present invention provides a kind of ceramic package shells, belong to ceramic package field, including ceramic member, the pad in the ceramic member circumferential lateral surface and set on the ceramic member bottom and to the ceramic member periphery extend lead；The pad and the lead correspond, and the pad and the lead weld, and weld the outside that cornerite is located at the pad.Ceramic package shell provided by the invention, pad is arranged in ceramic member circumferential lateral surface, make lead and pad solder on the outside of pad and forms solder cornerite, and then realize the reinforcing of lead, to guarantee the soldering strength of shell and lead, realize the soldering reliability of lead, the size that pad may be provided at is in 0.8mm or less, 0.2mm may be implemented in minimum, pad is away from ceramic member edge requirements 0mm, the outer dimension of shell reduces 0.5mm or more, effectively reduces the overall dimensions of ceramic package shell, meets the Miniaturization Design development trend of shell.
Description
Technical field
The invention belongs to ceramic packaging technology fields, are to be related to a kind of ceramic package shell more specifically.
Background technique
Traditional CQFP (Ceramic Quad Flat Pack) shell is four side pin flat packages of protection ring.Such
Shell is, using by way of bending, forming good " meniscus " solder cornerite, shape in the front-end and back-end of lead to lead
At three-dimensional braze-welded structure, alleviates impact of the external force to metalization layer, guarantee the reliability of lead weld strength.This mode requires
The length of bonding pad 1.0mm or more of lead and shell welding, and to guarantee reliability, generally require pad away from outline edge requirement
0.05mm or more cannot achieve miniaturising for housing profile size.
Summary of the invention
The purpose of the present invention is to provide a kind of ceramic package shells, to solve existing in the prior art be difficult to realize
CQFP housing profile technical problem compact in size.
To achieve the above object, the technical solution adopted by the present invention is that: a kind of ceramic package shell is provided, comprising: ceramics
Part, the pad in the ceramic member circumferential lateral surface and set on the ceramic member bottom and to the ceramic member periphery extend
Lead；The pad and the lead correspond, and the pad and the lead weld, and weld cornerite and be located at the pad
Outside.
Further, the lead positioned at described ceramic member the same side is parallel to each other.
Further, the lead includes welding section and the extraction section connecting with the outer end of the welding section, the welding
Section is parallel to the bottom surface of the ceramic member.
Further, described to draw the parallel flat member in ceramic member bottom surface described in Duan Weiyu.
Further, the extraction section is bending component.
Further, the outer end of the lead is linked together by connector, and the connector is rectangular elements.
Further, the quadrangle of the connector is respectively equipped with location hole.
Further, the width of the pad is 0.15~2.30mm, is highly 0.10~3.00mm.
Further, the width of the lead is 0.10mm~0.46mm, with a thickness of 0.10~0.30mm.
Further, the alignment mark for being aligned to chip is equipped in the core cavity of the ceramic member.
The beneficial effect of ceramic package shell provided by the invention is: compared with prior art, ceramic package of the present invention
Shell, pad are arranged in ceramic member circumferential lateral surface, and lead and pad solder are made on the outside of pad and forms solder cornerite, Jin Ershi
The reinforcing of existing lead realizes the soldering reliability of lead, the ruler that pad may be provided to guarantee the soldering strength of shell and lead
It is very little in 0.8mm hereinafter, minimum may be implemented 0.2mm, pad is reduced away from ceramic member edge requirements 0mm, the outer dimension of shell
0.5mm or more effectively reduces the overall dimensions of ceramic package shell, meets the Miniaturization Design development trend of shell.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only of the invention some
Embodiment for those of ordinary skill in the art without any creative labor, can also be according to these
Attached drawing obtains other attached drawings.
Fig. 1 is the front view structure cross-sectional view for the ceramic package shell that the embodiment of the present invention one provides；
Fig. 2 is the bottom view of Fig. 1；
Fig. 3 is the top view of Fig. 1；
Fig. 4 is the front view structure cross-sectional view of ceramic package shell provided by Embodiment 2 of the present invention；
Fig. 5 is the bottom view of Fig. 4；
Fig. 6 is the top view of Fig. 4；
Fig. 7 is the preparation method for preparing ceramic package shell of the present invention；
Wherein, each appended drawing reference in figure:
1- ceramic member；2- pad；3- lead；301- welding section；302- draws section；4- welds cornerite；5- seal mouth ring；7- connects
Fitting；8- location hole；9- alignment mark；10- aligns cavity
Specific embodiment
In order to which technical problems, technical solutions and advantages to be solved are more clearly understood, tie below
Accompanying drawings and embodiments are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
Also referring to Fig. 1 to Fig. 6, now ceramic package shell provided by the invention is illustrated.The ceramic package
Shell including ceramic member 1, the pad 2 in 1 circumferential lateral surface of ceramic member and is set to 1 bottom of ceramic member and to 1 periphery of ceramic member
The lead 3 of extension；Pad 2 and lead 3 correspond, and pad 2 and lead 3 weld, and weld the outside that cornerite 4 is located at pad 2.
Ceramic package shell provided by the invention, compared with prior art, the setting of pad 2 in 1 circumferential lateral surface of ceramic member,
So that lead 3 and pad 2 is welded and be formed solder cornerite 4 on the outside of pad 2, and then realize the reinforcing of lead 3, to guarantee shell and draw
The soldering strength of line realizes the soldering reliability of lead 3, and the size that pad 2 may be provided at is in 0.8mm hereinafter, minimum can be real
Existing 0.2mm, pad 2 reduce 0.5mm or more, effectively reduce ceramics away from 1 edge requirements 0mm of ceramic member, the outer dimension of shell
The overall dimensions of package casing meet the Miniaturization Design development trend of shell.
Wherein, ceramic member 1 can have 2 layers to 50 layers of wire structures, and having can multilayer wiring, high reliability, high airtight
Property, the features such as heat-sinking capability is strong.
Refering to fig. 1 and Fig. 4, as a kind of specific embodiment of ceramic package shell provided by the invention, ceramic member 1 is pushed up
Portion is equipped with seal mouth ring 5.
Specifically, the aluminium oxide that 1 material of ceramic member is 90%, using multilayer aluminium oxide ceramics tungsten metallization high temperature co-firing work
Skill production, seal mouth ring 5 and 3 material of lead are teleoseal or iron-nickel alloy, and ceramic member 1 and seal mouth ring 5 and lead 3 are using silver
Spelter solder welding.The seal mouth ring 5 of metal material is used for golden tin sealing, parallel seam welding or the sealing of laser seam weld.
Also referring to Fig. 1 to Fig. 6, as a kind of specific embodiment of ceramic package shell provided by the invention, position
Lead 3 in 1 the same side of ceramic member is parallel to each other.
Fig. 1 to Fig. 6 is please referred to, as a kind of specific embodiment of ceramic package shell provided by the invention, lead 3 is wrapped
The extraction section 302 for including welding section 301 and connecting with the outer end of welding section 301, welding section 301 are parallel to the bottom surface of ceramic member 1.Its
In, 3 weld strength of lead of ceramic member 1 is quite all larger than 7N, the lead 3 of welding position due to not carrying out processing and forming,
It is not affected by damage brought by forming machine processing of bending, the positive and negative both direction of times of fatigue is all larger than 5 times.
As a kind of specific embodiment of ceramic package shell provided by the invention, to reduce lead resistance, 2 table of pad
Layer is gold-plated.
Section 302 is drawn as a kind of specific embodiment of ceramic package shell provided by the invention refering to fig. 4 to fig. 6
For the flat member parallel with 1 bottom surface of ceramic member.
It please refers to Fig.1 to Fig.3, as a kind of specific embodiment of ceramic package shell provided by the invention, draws section
302 be bending component.On the whole, drawing section 302 can make straight or bend, but welding section 301 must be straight.
Fig. 1 to Fig. 6 is please referred to, as a kind of specific embodiment of ceramic package shell provided by the invention, lead 3
Outer end connects 7 by connector and is integrated, and connector 7 is rectangular elements.
Refering to Fig. 2, Fig. 3, Fig. 5 and Fig. 6, as a kind of specific embodiment of ceramic package shell provided by the invention,
It positions in order to facilitate processing, the quadrangle of connector 7 is respectively equipped with location hole 8.
As a kind of specific embodiment of ceramic package shell provided by the invention, the width of pad 2 is 0.15~
2.30mm is highly 0.10~3.00mm.
As a kind of specific embodiment of ceramic package shell provided by the invention, the width of lead 3 be 0.10mm~
0.46mm, with a thickness of 0.10~0.30mm.
Referring to Fig. 3, a kind of specific embodiment as ceramic package shell provided by the invention, the core cavity of ceramic member
The interior alignment mark 9 being equipped with for being aligned to chip.
Referring to Fig. 3, a kind of specific embodiment as ceramic package shell provided by the invention, alignment mark 9 are
Round or triangular structure figure.Contraposition cavity 10 can also be set, and contraposition cavity 10 is cross or L-shaped structure positioning cavity
Structure is accurately installed convenient for chip.
As a kind of specific embodiment of ceramic package shell provided by the invention, the quantity of lead 3 is 4-352, pottery
Porcelain package casing overall dimension minimum is up to 3mm × 3mm.
Referring to Fig. 7, when manufacture, using Al2O3, AlN, the multilayer co-firings technology such as opal glass, detailed process are as follows: shell warp
Curtain coating, earnestly after, after rushing chamber and punching, hole metallization, through printing, positioning, lamination, earnestly at single green part, then pass through side
The single ceramic shell of face printing, sintering, soldering, nickel plating, gold-plated rear formation.
Ceramic package shell provided by the invention has one or more cavitys (at most up to 10), internal mountable more
A chip and various passive elements meet the encapsulation of user's high integration and require；Packaging air tightness is high, and air-tightness meets≤1 × 10- 3Pa·cm3/ s, A4；High reliablity, can meet temperature cycles: -65 DEG C~175 DEG C, 200 times, and constant acceleration: 30000g, Y1
Direction, 1min；Being bonded finger widths minimum can be achieved 0.06mm, and bonding refers to that 0.06mm can be achieved in spacing minimum.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. ceramic package shell, it is characterised in that: including ceramic member, the pad in the ceramic member circumferential lateral surface and be set to
The ceramic member bottom and the lead extended to the ceramic member periphery；The pad and the lead correspond, the weldering
Disk and the lead weld, and weld the outside that cornerite is located at the pad.
2. ceramic package shell as described in claim 1, it is characterised in that: the lead positioned at described ceramic member the same side
It is parallel to each other.
3. ceramic package shell as described in claim 1, it is characterised in that: the lead include welding section and with the welding
The extraction section of the outer end connection of section, the welding section are parallel to the bottom surface of the ceramic member.
4. ceramic package shell as claimed in claim 3, it is characterised in that: ceramic member bottom surface described in the extraction Duan Weiyu is flat
Capable flat member.
5. ceramic package shell as claimed in claim 3, it is characterised in that: the extraction section is bending component.
6. ceramic package shell as described in claim 1, it is characterised in that: the outer end of the lead is linked as one by connector
Body, the connector are rectangular elements.
7. ceramic package shell as claimed in claim 6, it is characterised in that: the quadrangle of the connector is respectively equipped with positioning
Hole.
8. ceramic package shell as described in claim 1, it is characterised in that: the width of the pad is 0.15~2.30mm,
Height is 0.10~3.00mm.
9. ceramic package shell as described in claim 1, it is characterised in that: the width of the lead be 0.10mm~
0.46mm, with a thickness of 0.10~0.30mm.
10. ceramic package shell as described in claim 1, it is characterised in that: be equipped in the core cavity of the ceramic member for pair
The alignment mark that chip is aligned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811345534.2A CN109494197A (en) | 2018-11-13 | 2018-11-13 | Ceramic package shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811345534.2A CN109494197A (en) | 2018-11-13 | 2018-11-13 | Ceramic package shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109494197A true CN109494197A (en) | 2019-03-19 |
Family
ID=65694843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811345534.2A Pending CN109494197A (en) | 2018-11-13 | 2018-11-13 | Ceramic package shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109494197A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110729252A (en) * | 2019-10-31 | 2020-01-24 | 中国电子科技集团公司第十三研究所 | 0.4 mm-pitch ceramic four-side lead flat shell and preparation method thereof |
| CN110783276A (en) * | 2019-11-12 | 2020-02-11 | 中国电子科技集团公司第十三研究所 | 0.4 mm-pitch main lead ceramic small-outline shell and power device |
| CN111599790A (en) * | 2020-05-13 | 2020-08-28 | 中国电子科技集团公司第十三研究所 | Ceramic leadless chip type packaging shell |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6365649A (en) * | 1986-09-05 | 1988-03-24 | Nec Corp | Pickage for semiconductor |
| JPH06268093A (en) * | 1992-03-02 | 1994-09-22 | Nec Corp | Ceramic package type semiconductor device |
| JP2002184932A (en) * | 2000-12-14 | 2002-06-28 | Hitachi Ltd | Semiconductor device and method for manufacturing the same |
| CN204011390U (en) * | 2014-08-22 | 2014-12-10 | 中国电子科技集团公司第十三研究所 | The ceramic packaging shell of chip is installed in a kind of upside-down mounting |
| CN204614771U (en) * | 2015-05-29 | 2015-09-02 | 中国电子科技集团公司第十三研究所 | Adopt the ceramic package of PowerPAD packing forms |
-
2018
- 2018-11-13 CN CN201811345534.2A patent/CN109494197A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6365649A (en) * | 1986-09-05 | 1988-03-24 | Nec Corp | Pickage for semiconductor |
| JPH06268093A (en) * | 1992-03-02 | 1994-09-22 | Nec Corp | Ceramic package type semiconductor device |
| JP2002184932A (en) * | 2000-12-14 | 2002-06-28 | Hitachi Ltd | Semiconductor device and method for manufacturing the same |
| CN204011390U (en) * | 2014-08-22 | 2014-12-10 | 中国电子科技集团公司第十三研究所 | The ceramic packaging shell of chip is installed in a kind of upside-down mounting |
| CN204614771U (en) * | 2015-05-29 | 2015-09-02 | 中国电子科技集团公司第十三研究所 | Adopt the ceramic package of PowerPAD packing forms |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110729252A (en) * | 2019-10-31 | 2020-01-24 | 中国电子科技集团公司第十三研究所 | 0.4 mm-pitch ceramic four-side lead flat shell and preparation method thereof |
| CN110729252B (en) * | 2019-10-31 | 2021-12-24 | 中国电子科技集团公司第十三研究所 | 0.4mm pitch ceramic quad flat package |
| CN110783276A (en) * | 2019-11-12 | 2020-02-11 | 中国电子科技集团公司第十三研究所 | 0.4 mm-pitch main lead ceramic small-outline shell and power device |
| CN111599790A (en) * | 2020-05-13 | 2020-08-28 | 中国电子科技集团公司第十三研究所 | Ceramic leadless chip type packaging shell |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190319 |
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| RJ01 | Rejection of invention patent application after publication |