CN203999792U - 电子束蒸镀装置 - Google Patents

电子束蒸镀装置 Download PDF

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Publication number
CN203999792U
CN203999792U CN201420405903.3U CN201420405903U CN203999792U CN 203999792 U CN203999792 U CN 203999792U CN 201420405903 U CN201420405903 U CN 201420405903U CN 203999792 U CN203999792 U CN 203999792U
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CN
China
Prior art keywords
magnet
substrate
evaporation
electron beam
accepting container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201420405903.3U
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English (en)
Chinese (zh)
Inventor
清水祐辅
山成淳一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Zosen Corp
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Hitachi Zosen Corp
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Publication date
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/18—Metallic material, boron or silicon on other inorganic substrates

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Inorganic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
CN201420405903.3U 2013-07-31 2014-07-22 电子束蒸镀装置 Active CN203999792U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013159623A JP6216177B2 (ja) 2013-07-31 2013-07-31 電子ビーム蒸着装置
JP2013-159623 2013-07-31

Publications (1)

Publication Number Publication Date
CN203999792U true CN203999792U (zh) 2014-12-10

Family

ID=52039821

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420405903.3U Active CN203999792U (zh) 2013-07-31 2014-07-22 电子束蒸镀装置

Country Status (4)

Country Link
JP (1) JP6216177B2 (ko)
KR (1) KR102240886B1 (ko)
CN (1) CN203999792U (ko)
TW (1) TWM491672U (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109698102A (zh) * 2017-10-20 2019-04-30 中芯国际集成电路制造(上海)有限公司 电子枪、掩膜版制备方法及半导体装置
CN117448750A (zh) * 2023-10-25 2024-01-26 南京萃智激光应用技术研究院有限公司 基于激光转移技术的超疏水玻璃制备用蒸镀方法及设备

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6304389B2 (ja) * 2014-10-03 2018-04-04 株式会社村田製作所 電子ビーム蒸着装置および薄膜作製方法
SG10201510101XA (en) 2015-12-09 2017-07-28 Au Optronics Corp Evaporation apparatus and evaporation method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05156428A (ja) * 1991-11-29 1993-06-22 Anelva Corp 真空蒸着装置
JPH11241158A (ja) * 1998-02-27 1999-09-07 Applied Materials Inc 電子線を用いた真空蒸着装置
JP3568189B2 (ja) * 1999-04-21 2004-09-22 東北パイオニア株式会社 有機ｅｌディスプレイの製造方法および装置
KR100462046B1 (ko) * 2001-11-05 2004-12-16 네오뷰코오롱 주식회사 유기물 디스플레이의 무기물막 증착 장치
JP2004217962A (ja) * 2003-01-10 2004-08-05 Jeol Ltd 多層膜形成方法及び成膜装置
JP2008280579A (ja) 2007-05-10 2008-11-20 Sodick Co Ltd 電子ビームスパッタリング装置
JP2012112002A (ja) * 2010-11-25 2012-06-14 Mitsubishi Heavy Ind Ltd 蒸着装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109698102A (zh) * 2017-10-20 2019-04-30 中芯国际集成电路制造(上海)有限公司 电子枪、掩膜版制备方法及半导体装置
CN109698102B (zh) * 2017-10-20 2021-03-09 中芯国际集成电路制造(上海)有限公司 电子枪、掩膜版制备方法及半导体装置
CN117448750A (zh) * 2023-10-25 2024-01-26 南京萃智激光应用技术研究院有限公司 基于激光转移技术的超疏水玻璃制备用蒸镀方法及设备
CN117448750B (zh) * 2023-10-25 2024-04-19 南京萃智激光应用技术研究院有限公司 基于激光转移技术的超疏水玻璃制备用蒸镀方法及设备

Also Published As

Publication number Publication date
KR20150015359A (ko) 2015-02-10
JP2015030862A (ja) 2015-02-16
JP6216177B2 (ja) 2017-10-18
KR102240886B1 (ko) 2021-04-14
TWM491672U (zh) 2014-12-11

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