CN203984768U - A kind of composite circuit board - Google Patents
A kind of composite circuit board Download PDFInfo
- Publication number
- CN203984768U CN203984768U CN201420351278.9U CN201420351278U CN203984768U CN 203984768 U CN203984768 U CN 203984768U CN 201420351278 U CN201420351278 U CN 201420351278U CN 203984768 U CN203984768 U CN 203984768U
- Authority
- CN
- China
- Prior art keywords
- base material
- circuit board
- composite circuit
- layer
- utility
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Structure Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The utility model relates to wiring board field, particularly a kind of composite circuit board.The utility model discloses a kind of composite circuit board, comprise solder mask, line layer, base material and aluminum base layer, be followed successively by from outside to inside solder mask, line layer and base material, wherein said base material is epoxy resin board, local location lamination in described base material bottom embeds aluminium foil, forms aluminum base layer.A kind of composite circuit board that the utility model provides, can effectively improve wiring board high load region heat-sinking capability and also production technology simple, wiring board load capacity is strong, uses reliable and stable.
Description
Technical field
The utility model relates to wiring board technical field, particularly a kind of composite circuit board.
Background technology
Along with the continuous progress of society and scientific and technological development, the field relating to of wiring board is more and more, and more and more higher to the load request of wiring board.When traditional wiring board load capacity improves, also there is high capacity line areas, dispel the heat not prompt enough, cause dispelling the heat bad, easily occur the problems such as circuit burns.
Summary of the invention
The deficiency existing for prior art, the utility model provides a kind of composite circuit board, can effectively improve wiring board high load region heat-sinking capability and production technology simple, wiring board load capacity is strong, uses reliable and stable.
For achieving the above object, the utility model provides following technical scheme: a kind of composite circuit board, comprise solder mask, line layer, base material and aluminum base layer, be followed successively by from outside to inside solder mask, line layer and base material, wherein said base material is epoxy resin board, thickness 1-2mm, the local location lamination in described base material bottom embeds aluminium foil, forms aluminum base layer.
A kind of composite circuit board described in the utility model, wherein the aluminium foil of aluminum base layer laterally or is longitudinally being provided with more than one clearance groove, prevents that the internal stress between aluminum base layer and described base material from causing wiring board warpage; Wherein the insulation thickness between aluminum base layer and described line layer is greater than 100 μ m.
Adopt the technical scheme that the utility model provides to produce following beneficial effect: described a kind of composite circuit board, local location lamination in described base material bottom embeds aluminium foil, form aluminum base layer, because aluminium foil easily dispels the heat, the heat that can in time wiring board be produced conducts, and avoids the overheated hot scaling loss circuit of wiring board; Because the thermal coefficient of expansion of aluminium foil and epoxy resin is different, for changing, adaptive temperature needs, the aluminium foil of wherein said aluminum base layer laterally or is longitudinally being provided with more than one clearance groove, prevents that the internal stress between described aluminum base layer and described base material from causing wiring board warpage; Wherein said base material is epoxy resin board, thickness 1-2mm, and the local location lamination in described base material bottom embeds described aluminum base layer, and the base material insulation thickness between described aluminum base layer and described line layer is greater than 100 μ m, and this has just fully ensured the insulating properties of circuit.
For more clear, describe and make the utility model accurately, with instantiation, the utility model is described in detail by reference to the accompanying drawings.
Accompanying drawing explanation
Fig. 1 is a kind of composite circuit board structural representation of the utility model embodiment.
In figure: 1 solder mask, 2 line layers, 3 base materials, 4 aluminum base layer, 41 clearance grooves.
Embodiment
The utility model embodiment provides a kind of composite circuit board, can effectively improve load capacity, damage resistant ability, insulation property and the stability of wiring board, effectively simplifies technique simultaneously.
Fig. 1 is a kind of composite circuit board structural representation of the utility model embodiment, comprise solder mask 1, line layer 2, base material 3 and aluminum base layer 4, be followed successively by from outside to inside solder mask 1, line layer 2 and base material 3, wherein said base material 3 is epoxy resin board, thickness 1.5mm, and the local location lamination in described base material 3 bottoms embeds aluminium foil, form aluminum base layer 4, because aluminium foil easily dispels the heat, the heat that can in time wiring board be produced conducts, and avoids the overheated hot scaling loss circuit of wiring board.
A kind of composite circuit board described in the utility model embodiment, wherein the aluminium foil of aluminum base layer 4 laterally or is longitudinally being provided with more than one clearance groove 41, prevents that the internal stress between aluminum base layer 4 and described base material 3 from causing wiring board warpage, can change by adaptive temperature; Wherein the insulation thickness between aluminum base layer 4 and described line layer 2 is greater than 100 μ m, can fully ensure the insulating properties of circuit.
The above is the embodiment of the utility model embodiment; should be understood that; application of the present utility model is not limited to above-mentioned giving an example; for those skilled in the art; can improve according to the above description or convert, all these improvement and conversion all should belong to the protection range of the utility model claims.
Claims (2)
1. a composite circuit board, comprise solder mask, line layer, base material and aluminum base layer, it is characterized in that: described a kind of composite circuit board, be followed successively by from outside to inside solder mask, line layer and base material, wherein base material is epoxy resin board, thickness 1-2mm, in base material bottom, local location lamination embeds aluminium foil, forms aluminum base layer.
2. according to a kind of composite circuit board described in right 1, it is characterized in that: wherein the aluminium foil of aluminum base layer laterally or is longitudinally being provided with more than one clearance groove, prevent that the internal stress between aluminum base layer and described base material from causing wiring board warpage; Wherein the insulation thickness between aluminum base layer and described line layer is greater than 100 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420351278.9U CN203984768U (en) | 2014-06-27 | 2014-06-27 | A kind of composite circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420351278.9U CN203984768U (en) | 2014-06-27 | 2014-06-27 | A kind of composite circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203984768U true CN203984768U (en) | 2014-12-03 |
Family
ID=51982183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420351278.9U Expired - Fee Related CN203984768U (en) | 2014-06-27 | 2014-06-27 | A kind of composite circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203984768U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105050317A (en) * | 2015-06-18 | 2015-11-11 | 镇江华印电路板有限公司 | High-precision printed circuit board |
-
2014
- 2014-06-27 CN CN201420351278.9U patent/CN203984768U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105050317A (en) * | 2015-06-18 | 2015-11-11 | 镇江华印电路板有限公司 | High-precision printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141203 Termination date: 20160627 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |