CN201700114U - Colloid heat transfer structure - Google Patents
Colloid heat transfer structure Download PDFInfo
- Publication number
- CN201700114U CN201700114U CN2009202419692U CN200920241969U CN201700114U CN 201700114 U CN201700114 U CN 201700114U CN 2009202419692 U CN2009202419692 U CN 2009202419692U CN 200920241969 U CN200920241969 U CN 200920241969U CN 201700114 U CN201700114 U CN 201700114U
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- colloid
- heat transfer
- transfer structure
- structure according
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a colloid heat transfer structure which improves the heat transfer property of colloid and realizes better heat transfer effect. The colloid heat transfer structure comprises solid colloid, wherein heat transfer insert substance with higher heat conductivity than that of the colloid is embedded in the colloid, and the heat transfer insert substance is exposed out of the surface of the colloid. The colloid heat transfer structure has better heat conduction efficiency and greater heat transfer area.
Description
Technical field
The utility model relates to a kind of solid colloid, particularly relates to a kind of heat transfer structure that improves the colloid heat transfer efficiency.
Background technology
Behind soldering of electronic components, can with adhesive glue point below element, components and parts be fixed on the PCB firmly on the pcb board of a lot of electronic products, rock along with the PCB swing to prevent this element.Perhaps with adhesive glue point in the middle of winding displacement, they are bonded together, make winding displacement keep always the rule row's shape.
This is external also to have in order to give PCB or element waterproof, protection against the tide above the PCB, uses packaging plastic to seal PCB or parcel electronic component.
Because the colloid that above-mentioned situation is used is the bad body of heat, be coated in colloid on the electronic component or the part of overlay electronic element or be coated in the surface of heat dissipation conductor, the local temperature that makes this scribble colloid is higher, can influence the radiating effect of electronic component or heat dissipation conductor, and the easier aging sex change of colloid under the better state of temperature.
At above-mentioned situation, the most frequently used heat dissipation is exactly by fan at present, increases the gas flow of colloid surface, to take away the heat that colloid comes out as much as possible.
Summary of the invention
Technical problem to be solved in the utility model is: a kind of colloid heat transfer structure is provided, and this structure can promote colloid to conduct heat, and reaches better heat-transfer effect.
In order to solve the problems of the technologies described above, the utility model proposes a kind of colloid heat transfer structure, comprise solid-state colloid, described colloid is embedded with the big heat transfer insert of thermal conductivity ratio colloid, and described heat transfer insert exposes colloid surface.
Preferably: comprise amorphous in the described heat transfer insert with at least a profile in body, orbicule, column, spheroid, platform shape body, cone, triangle body or the rhombogen.The shape of heat transfer insert can exert an influence to the effect of conducting heat, and in the concrete application, can be combined into the shape of original selection heat transfer insert according to different heat transfer requirements.Amorphous can be that some are taken from natural rubble, the grains of sand with body, the material of spontaneous nucleation in the perhaps artificial production process, and this amorphously have advantage with low cost with body.
Preferably: described colloid is a packaging plastic.Described packaging plastic is preferably epoxy resin, silica gel or polyurethane.Packaging plastic mainly be used for waterproof or and external insulation, be usually used in dimensional packaged circuit board at electronic applications.
Preferably: described colloid is an adhesive.Adhesive can have same composition with packaging plastic sometimes.Electronic component on the circuit board except that surface mount elements, much all is that pin is welded on the circuit board after being welded on the circuit, and therefore the connected mode of this welding pin and insecure usually needs to use adhesive and fix electronic component on the circuit board.Adhesive also is used in the isolation between the adjacent very near electronic component on the circuit board, prevents the touching of element in the process of rocking.
Preferably: described heat transfer insert is an insulator.Preferred version is: comprise insulated particle at least a in aluminium oxide, zirconia, pottery, glass, rock or the heat conductive silicon grease material in the described heat transfer insert.Ceramic species is a lot, its composition more complicated, its Main Ingredients and Appearance is an aluminium oxide, also have and contain zirconic pottery, contain the conductive coefficient of particle simple glass that aluminium oxide, zirconic pottery be different from independent aluminium oxide and zirconia composition with suitable such as the conductive coefficient of the such colloid of epoxy resin, thus can't play good heat transfer effect, but a lot of specific glass, then have the conductive coefficient bigger than common colloid, more extensive for the selection face of glass.Rocks such as the granite in the rock, basalt have the conductive coefficient greater than 2w/mk, and their a lot of relatively colloids all have better heat-conducting effect, and drawing materials of they is abundant, and be cheap.
Preferably: described heat transfer insert is a metal.Wherein comprise silver, aluminium, copper, iron, at least a element of zinc in the metal.Do not need situation about insulating at some, can use metallics and their alloy like this such as silver, copper, aluminium, iron, can reach better heat-transfer effect.
The beneficial effects of the utility model are as follows:
Compared to existing technology, the utility model has been taked embedding thermal conductor mode to strengthen colloid and has been conducted heat at the not good situation of colloid heat transfer.Because thermal conductor is embedded, and must have than the bigger conductive coefficient of colloid, it can in time be derived the heat of colloid inside, and the heat-transfer area of giving prominence to colloid surface by embedded body passes to extraneous air with more heat; Perhaps the heat with the external world imports more efficiently.It is better to the utlity model has heat transfer efficiency, the characteristics that heat transfer area is bigger.
Description of drawings
Fig. 1 is the structural representation of embodiment one of the present utility model.
Fig. 2 is the structural representation of embodiment two.
Fig. 3 is the structural representation of embodiment three.
Fig. 4 is the structural representation of embodiment four.
Embodiment
The utility model provides a kind of colloid heat transfer structure, and wherein heat transfer type comprises heat radiation and two kinds of situations of intensification heat conduction of cooling.Below for example in mainly based on radiating mode.
Embodiment one:
What as shown in Figure 1, this structure showed is the part of power circuit.In the drawings, electric capacity 2 and transformer 3 are close to and are arranged on the PCB 1.Because the capacity of the electric capacity 2 in the power circuit is very big, if electric capacity 2 is liquid electric capacity, its volume usually can be very big; can be erected on the PCB 1 as pillar; in this case, the electric capacity pin can't provide the support of side direction, and electric capacity has the possibility that shakes.For fear of rocking of electric capacity 2, can promptly between transformer 3 and electric capacity 2, increase solid, shaped colloid 4 by means of contiguous transformer 3 as supporting usually.Colloid 4 requires insulation, is that the epoxy resin of 0.8w/mk is example with the conductive coefficient.On colloid 4, embedded conductive coefficient and be 3.2w/mk the granite indefinite form with the shape particle.A granite particle part embeds in the colloid 4, and a part is exposed colloid surface and formed radiating surface.Power supply in use can produce a large amount of heats, and solenoid and electric capacity all are thermals source.This moment is because colloid 4 is non-conductors of heat, accumulates in heat on the colloid and can cause the colloid sex change of wearing out, and influence the surface radiating of electric capacity and transformer.In this example, embedded the granular heat radiation insert 5 of granite on colloid 4, this heat radiation insert 5 can export to colloid surface with the heat in the colloid faster, the outstanding colloid surface in the surface of heat radiation insert 5, this has increased area of dissipation, helps improving radiating efficiency.Concerning colloid 4, played the effect of good radiating and cooling.
Embodiment two:
On PCB 6, be welded with triode 7.In order to reinforce the welding of triode 7 bottoms, prevent to get loose, increased colloid 8 in the bottom of triode 7.Embedding on colloid 8 has heat radiation insert 9, and heat radiation insert 9 is the column insulator, and its part is exposed colloid surface and formed radiating surface.Colloid is example with silica gel, and the conductive coefficient of silica gel is 2.45w/mk, and heat radiation insert 9 is an alumina particle, and its conductive coefficient is 10w/mk.In this example, because silica gel is enclosed in triode 7 bottoms, cause triode bottom radiating effect variation, after having adopted heat radiation insert 9, the heat that send triode 7 bottoms is in time derived, and has improved the heat dissipating state of colloid 8.
Similarly use, also have sealing on the inductance coil, promptly can embed the heat radiation insert in the sealing on the inductance coil, its part is exposed colloid surface and is formed radiating surface.
Embodiment three:
Be welded with public connector 11 on PCB 10, public connector 11 is connected with female connectors 12.For fear of becoming flexible of they, wrapped up one deck colloid 13 in their junction.Embedding on colloid 13 has heat radiation insert 14, and its part is exposed colloid surface and formed radiating surface.
Embodiment four:
The fluid 16 that heat is arranged in pipe 15.Fluid 16 can be that liquid also can be gas.In order to scrape for the antirust and anti-collision of body 15, on body 15, scribble one deck protecting colloid 17.The heats of hot fluid shed in but colloid 17 meeting obstruction pipes 15 in time will be managed.Embedding on colloid 17 has heat radiation insert 18, and its part is exposed colloid surface and formed radiating surface.The insert 18 that wherein dispels the heat can be that insulator also can be a metal.With the metal is example, and metal is a stainless steel, and heat radiation insert 18 is stainless steel particles.The heat radiation insert 18 that metal has been arranged, colloid can more in time be derived the heat in the pipe.
In addition, use for the intensification heat-conducting mode, this routine situation is applicable to that also tube fluid is the cold fluid situation, is about to the fluid that extraneous heat in time passes to low temperature in the pipe, and the temperature of fluid is raise faster, and effect is also very good.
Claims (10)
1. a colloid heat transfer structure comprises solid-state colloid, it is characterized in that: described colloid is embedded with the big heat transfer insert of thermal conductivity ratio colloid, and described heat transfer insert exposes colloid surface.
2. colloid heat transfer structure according to claim 1 is characterized in that: comprise at least a profile in orbicule, column, spheroid, platform shape body, cone, triangle body or the rhombogen in the described heat transfer insert.
3. colloid heat transfer structure according to claim 1 is characterized in that: described colloid is a packaging plastic.
4. colloid heat transfer structure according to claim 3 is characterized in that: described packaging plastic is epoxy resin, silica gel or polyurethane.
5. colloid heat transfer structure according to claim 1 is characterized in that: described colloid is an adhesive.
6. colloid heat transfer structure according to claim 1 is characterized in that: described heat transfer insert is an insulator.
7. colloid heat transfer structure according to claim 6 is characterized in that: described heat transfer insert is alumina insulation particle, zirconia insulated particle, ceramic insulation particle, glass insulation particle, rock insulated particle or heat-conducting silicone grease insulated particle.
8. colloid heat transfer structure according to claim 1 is characterized in that: described heat transfer insert is a metal.
9. colloid heat transfer structure according to claim 8 is characterized in that: described metal is argent, metallic aluminium, metallic copper, metallic iron or metallic zinc.
10. colloid heat transfer structure according to claim 1 is characterized in that: described heat transfer insert perhaps is the material of spontaneous nucleation in the artificial production process for being taken from natural rubble, the grains of sand.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202419692U CN201700114U (en) | 2009-12-30 | 2009-12-30 | Colloid heat transfer structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202419692U CN201700114U (en) | 2009-12-30 | 2009-12-30 | Colloid heat transfer structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201700114U true CN201700114U (en) | 2011-01-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202419692U Expired - Fee Related CN201700114U (en) | 2009-12-30 | 2009-12-30 | Colloid heat transfer structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201700114U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109439271A (en) * | 2017-09-05 | 2019-03-08 | 南京科矽新材料科技有限公司 | A kind of LED encapsulation heat conductive insulating organic siliconresin binder and preparation method thereof |
| CN110831401A (en) * | 2019-10-14 | 2020-02-21 | 珠海凯邦电机制造有限公司 | Heat conduction material, preparation process and product control method thereof, heat conduction glue, circuit board and motor |
| CN114675478A (en) * | 2020-12-24 | 2022-06-28 | 中强光电股份有限公司 | Wavelength conversion module and projector |
| CN114675480A (en) * | 2020-12-24 | 2022-06-28 | 中强光电股份有限公司 | Wavelength conversion module and projector |
-
2009
- 2009-12-30 CN CN2009202419692U patent/CN201700114U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109439271A (en) * | 2017-09-05 | 2019-03-08 | 南京科矽新材料科技有限公司 | A kind of LED encapsulation heat conductive insulating organic siliconresin binder and preparation method thereof |
| CN110831401A (en) * | 2019-10-14 | 2020-02-21 | 珠海凯邦电机制造有限公司 | Heat conduction material, preparation process and product control method thereof, heat conduction glue, circuit board and motor |
| CN114675478A (en) * | 2020-12-24 | 2022-06-28 | 中强光电股份有限公司 | Wavelength conversion module and projector |
| CN114675480A (en) * | 2020-12-24 | 2022-06-28 | 中强光电股份有限公司 | Wavelength conversion module and projector |
| US11714344B2 (en) | 2020-12-24 | 2023-08-01 | Coretronic Corporation | Wavelength conversion module and projector |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Jiangxi Latticebright Corporation Assignor: Lattice Power (Jiangxi) Co., Ltd. Contract record no.: 2013360000160 Denomination of utility model: Colloid heat transfer structure Granted publication date: 20110105 License type: Exclusive License Record date: 20131212 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110105 Termination date: 20181230 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |