CN203984765U - A kind of pcb board having for the identification mark of paster - Google Patents
A kind of pcb board having for the identification mark of paster Download PDFInfo
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- CN203984765U CN203984765U CN201420319012.6U CN201420319012U CN203984765U CN 203984765 U CN203984765 U CN 203984765U CN 201420319012 U CN201420319012 U CN 201420319012U CN 203984765 U CN203984765 U CN 203984765U
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- identification mark
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- identification
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Abstract
The utility model relates to pcb board technical field, relate in particular to a kind of pcb board having for the identification mark of paster, it comprises substrate, on substrate, be provided with electronic circuit and identification mark that etching forms, identification mark comprises the first identification mark bar and the second identification mark bar, the first identification mark bar and the second identification mark bar intersect vertically and form cross identification mark, the point that the first identification mark bar and the second identification mark bar intersect vertically is intersection point, is provided with the paste soldering material clamping ring taking intersection point as round dot in cross identification mark.The utility model is simple in structure, and cross identification mark is more clear with respect to traditional circular point shape identification mark, taking pictures the recognition accuracy of when identification higher, placement equipment can be fast to pcb board location, paster, and precision promotes, production efficiency is high; In addition, paste soldering material clamping ring has strengthened the identification of identification mark, has further improved the recognition accuracy of identification mark.
Description
Technical field
The utility model relates to pcb board technical field, relates in particular to a kind of pcb board having for the identification mark of paster.
Background technology
Be accompanied by the high speed development of electronic technology, product design miniaturization, pocketing trend is more and more obvious, and electronic component is more and more accurate, and corresponding surface mounting technology (SMT) is also more and more ripe.Surface mounting technology (SMT) refers to various types of surface-assembled chips such as SMC/SMD is placed with to the process on the assigned address of PCB, and it is high that its feature is mainly reflected in packaging density, and welding point defect is low, shock resistance is strong, reliability is high, easily is automated, and enhances productivity etc.Follow the development of unleaded high density Electronic Assemblies technology, it is more and more important that Design Process for printed circuit board (PCB) becomes, and correspondingly the requirements such as base material selection, components and parts layout, pad design and wiring also become to more and more higher.Therefore, display screen just must, taking surface mounting technology as benchmark, meet high accuracy, high efficiency, high reliability, the requirement easily being automated with the design and production of PCB plate as far as possible.
At present in SMT, in order to mount these microminiaturized devices such as 01005 components and parts and CSP device, on pcb board, be typically provided with Mark point, Mark point is also gauge point (datum mark or characteristic point), be PCB lip-deep for providing in steps in surface mount process common can measurement point, be used for revising PCB mismachining tolerance, before paster, to deposit in image library according to a standard picture to Mark point, and in the coordinate typing paster program that Mark is ordered, every lastblock PCB when paster, first according to Mark point, compare with the standard picture in image library: the one, whether more every Mark dot image is correct, if image is incorrect, placement equipment is thought the model mistake of PCB, can report to the police and not work, the 2nd, whether the centre coordinate that more every Mark is ordered is consistent with the coordinate of standard picture, if there is skew, when paster, placement equipment can be revised each position that mounts that mounts components and parts according to side-play amount (△ X, △ Y) automatically, to ensure accurately to mount components and parts.Therefore, Mark promise SMT equipment can locate accurately pcb board element, Mark point to SMT produce most important.
Current Mark point comprises Mark point and spacious district; Mark spot diameter is the filled circles of 1mm; material is that naked copper (also can zinc-plated, nickel plating; gold-plated and add OSP(Organic Solderability Preservatives; have organizational security weldering film, diaphragm etc.), spacious district radius of circle r >=2R(R is Mark point radius).But, in the time utilizing traditional Mark point paster, there will be the tin cream Incomplete matching phenomenon of micro element and steel plate printing, after refluxing, strengthen the probability that various defects produce.For this reason, above problem is urgently to be resolved hurrily.
Utility model content
The purpose of this utility model is for the deficiencies in the prior art, and a kind of pcb board for the identification mark of paster that has of the accuracy that improves surface mount device is provided.
The utility model is achieved through the following technical solutions.
A kind of pcb board having for the identification mark of paster, comprise substrate, on substrate, be provided with electronic circuit and identification mark that etching forms, identification mark comprises the first identification mark bar and the second identification mark bar, the first identification mark bar and the second identification mark bar intersect vertically and form cross identification mark, the point that the first identification mark bar and the second identification mark bar intersect vertically is intersection point, is provided with the paste soldering material clamping ring taking intersection point as round dot in cross identification mark.
Wherein, the part that the first identification mark bar is positioned at paste soldering material clamping ring is provided with two the first sub-mark lines that all intersect vertically with the first identification mark bar, and two the first sub-mark lines lay respectively at the both sides of intersection point and symmetrical mutually; The part that the second identification mark bar is positioned at paste soldering material clamping ring is provided with two the first sub-mark lines that all intersect vertically with the second identification mark bar, and two the first sub-mark lines lay respectively at the both sides of intersection point and symmetrical mutually.
Wherein, two intersections of the first identification mark bar and paste soldering material clamping ring are provided with two the second sub-mark lines, and two the second sub-mark lines all intersect vertically with the first identification mark bar and be all tangent with paste soldering material clamping ring; Two intersections of the second identification mark bar and paste soldering material clamping ring are provided with two the second sub-mark lines, and two the second sub-mark lines all intersect vertically with the second identification mark bar and be all tangent with paste soldering material clamping ring.
Wherein, the two ends of the first identification mark article are provided with two the 3rd sub-mark lines, and two the 3rd sub-mark lines are respectively perpendicular to the two ends of the first identification mark article and symmetrical mutually; The two ends of the second identification mark article are provided with two the 3rd sub-mark lines, and two the 3rd sub-mark lines are respectively perpendicular to the two ends of the second identification mark article and symmetrical mutually.
Wherein, in cross identification mark, be provided with the first sub-mark circle concentric with paste soldering material clamping ring, the second sub-mark circle and the 3rd sub-mark circle, the first sub-mark circle is arranged at the inside of paste soldering material clamping ring, the second sub-mark circle and the 3rd sub-mark circle are all arranged at the outside of paste soldering material clamping ring, and the second sub-mark circle is between paste soldering material clamping ring and the 3rd sub-mark circle.
Wherein, the diameter of paste soldering material clamping ring is 1.4-2.4mm.
Wherein, the periphery of cross identification mark is provided with guard circle.
Wherein, the width of guard circle is 8-12mil.
The beneficial effects of the utility model are: the utility model is simple in structure, because identification mark is cross, cross identification mark is more clear with respect to traditional circular point shape identification mark, in the time taking pictures identification, recognition accuracy is higher, placement equipment can be fast to pcb board location, paster, and precision promotes, and production efficiency is high; In addition, owing to being provided with paste soldering material clamping ring in cross identification mark, paste soldering material clamping ring has strengthened the identification of identification mark, has further improved the recognition accuracy of identification mark.
Brief description of the drawings
Fig. 1 is the structural representation of embodiment 1 of the present utility model.
Fig. 2 is the identification mark of embodiment 1 of the present utility model and the structural representation of paste soldering material clamping ring.
Fig. 3 is the structural representation of embodiment 2 of the present utility model.
Fig. 4 is the identification mark of embodiment 2 of the present utility model and the structural representation of paste soldering material clamping ring.
Fig. 5 is the structural representation of embodiment 3 of the present utility model.
Fig. 6 is the identification mark of embodiment 3 of the present utility model and the structural representation of paste soldering material clamping ring.
Reference numeral comprises:
1-substrate, 2-identification mark, the 21-the first identification mark bar, the 22-the second identification mark bar, the 23-the first sub-mark line, the 24-the second sub-mark line, the 25-the three sub-mark line, the 26-the first sub-mark circle, the 27-the second sub-mark circle, the 28-the three sub-mark circle, 3-paste soldering material clamping ring.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further described.
embodiment mono-.
As shown in Figure 1 and Figure 2, a kind of pcb board having for the identification mark of paster of the present embodiment, comprise substrate 1, on substrate 1, be provided with electronic circuit and identification mark 2 that etching forms, identification mark 2 comprises the first identification mark bar 21 and the second identification mark bar 22, the first identification mark bar 21 and the second identification mark bar 22 intersect vertically and form cross identification mark, the point that the first identification mark bar 21 and the second identification mark bar 22 intersect vertically is intersection point, is provided with the paste soldering material clamping ring 3 taking intersection point as round dot in cross identification mark.
The utility model is simple in structure, and because identification mark 2 is cross, cross identification mark is more clear with respect to traditional circular point shape identification mark, in the time taking pictures identification, recognition accuracy is higher, can be fast to pcb board location, paster, and precision promotes, production efficiency is high; In addition, owing to being provided with paste soldering material clamping ring 3 in cross identification mark, paste soldering material clamping ring 3 has strengthened the identification of identification mark 2, has further improved the recognition accuracy of identification mark 2.
In the present embodiment, the diameter of paste soldering material clamping ring 3 is 1.4-2.4mm.Diameter is that paste soldering material clamping ring 3 discriminations of 1.4-2.4mm are high, and guarantee placement equipment can precisely be identified, so that solder cream accurately puts on pcb board.
embodiment bis-.
As shown in Figure 3, Figure 4, the difference of the present embodiment and embodiment mono-is: in the present embodiment, the part that the first identification mark bar 21 is positioned at paste soldering material clamping ring 3 is provided with two 23, two the first sub-mark lines 23 of the first sub-mark line that all intersect vertically with the first identification mark bar 21 and lays respectively at the both sides of intersection point and symmetrical mutually; The part that the second identification mark bar 22 is positioned at paste soldering material clamping ring 3 is provided with two 23, two the first sub-mark lines 23 of the first sub-mark line that all intersect vertically with the second identification mark bar 22 and lays respectively at the both sides of intersection point and symmetrical mutually.
In the present embodiment, the first identification mark bar 21 and two intersections of paste soldering material clamping ring 3 are provided with that 24, two the second sub-mark lines 24 of two the second sub-mark lines all intersect vertically with the first identification mark bar 21 and are all tangent with paste soldering material clamping ring 3; The second identification mark bar 22 and two intersections of paste soldering material clamping ring 3 are provided with that 24, two the second sub-mark lines 24 of two the second sub-mark lines all intersect vertically with the second identification mark bar 22 and are all tangent with paste soldering material clamping ring 3.
In the present embodiment, the two ends of the first identification mark articles 21 are provided with 25, two the 3rd sub-mark lines 25 of two the 3rd sub-mark lines respectively perpendicular to the two ends of the first identification mark articles 21 and symmetrical mutually; The two ends of the second identification mark articles 22 are provided with 25, two the 3rd sub-mark lines 25 of two the 3rd sub-mark lines respectively perpendicular to the two ends of the second identification mark articles 22 and symmetrical mutually.
First identification mark of the present embodiment articles 21 or the second identification mark articles 22 all has the first sub-mark line 23, the second sub-mark line 24 and the 3rd sub-mark line 25 that intersect vertically with it, form the miniature sub-cross identification mark of several spaces, make whole cross identification mark be latticed, discrimination further improves, make placement equipment in the time taking pictures more Accurate align in cross identification mark.
Other structure of the present embodiment is identical with embodiment mono-, does not repeat them here.
embodiment tri-.
As shown in Figure 5, Figure 6, the difference of the present embodiment and embodiment mono-is: in the present embodiment, in cross identification mark, be provided with first sub-mark circle 26, second sub-mark circle 27 and the three sub-mark circle 28 concentric with paste soldering material clamping ring 3, the first sub-mark circle 26 is arranged at the inside of paste soldering material clamping ring 3, the second sub-mark circle 27 and the 3rd sub-mark circle 28 are all arranged at the outside of paste soldering material clamping ring 3, and the second sub-mark circle 27 is between paste soldering material clamping ring 3 and the 3rd sub-mark circle 28.Whole cross identification mark has been set up the first sub-mark circle 26, the second sub-mark circle 27 and 28 3 concentric rings of the 3rd sub-mark circle, and discrimination further improves, make placement equipment in the time taking pictures more Accurate align in cross identification mark.
Other structure of the present embodiment is identical with embodiment mono-, does not repeat them here.
embodiment tetra-.
The difference of the present embodiment and embodiment mono-is: in the present embodiment, the periphery of cross identification mark is provided with guard circle.Guard circle can effectively prevent the damage because pool effect, alkaline etching liquid flow, identification mark 2 being caused in the alkali etching technique of pcb board making; and then ensure in seal cover board mask exposure process; identification mark 2 contraposition marks are clear, complete; reduce that pcb board is unnecessary to be scrapped, reduced enterprise's production cost.
In the present embodiment, the width of guard circle is 8-12mil.The guard circle width of 8-10mil is enough tackled the pool effect in alkali etching technique; also being unlikely to increases more cost, though like this in alkali etching process pool effect, alkaline etching liquid flow, can only guard circle be produced and be damaged;, can avoid identification mark 2 impaired completely.
Other structure of the present embodiment is identical with embodiment mono-, does not repeat them here.
The above execution mode, it is preferred embodiments of the present utility model, be not to limit the utility model practical range, the equivalence of doing according to structure, feature and principle described in the utility model claim therefore all changes or modifies, and all should comprise in the utility model patent claim.
Claims (8)
1. the pcb board having for the identification mark of paster, comprise substrate, it is characterized in that: on substrate, be provided with electronic circuit and identification mark that etching forms, identification mark comprises the first identification mark bar and the second identification mark bar, the first identification mark bar and the second identification mark bar intersect vertically and form cross identification mark, the point that the first identification mark bar and the second identification mark bar intersect vertically is intersection point, is provided with the paste soldering material clamping ring taking intersection point as round dot in cross identification mark.
2. a kind of pcb board having for the identification mark of paster according to claim 1, it is characterized in that: the part that the first identification mark bar is positioned at paste soldering material clamping ring is provided with two the first sub-mark lines that all intersect vertically with the first identification mark bar, and two the first sub-mark lines lay respectively at the both sides of intersection point and symmetrical mutually; The part that the second identification mark bar is positioned at paste soldering material clamping ring is provided with two the first sub-mark lines that all intersect vertically with the second identification mark bar, and two the first sub-mark lines lay respectively at the both sides of intersection point and symmetrical mutually.
3. a kind of pcb board having for the identification mark of paster according to claim 2, it is characterized in that: two intersections of the first identification mark bar and paste soldering material clamping ring are provided with two the second sub-mark lines, two the second sub-mark lines all intersect vertically with the first identification mark bar and are all tangent with paste soldering material clamping ring; Two intersections of the second identification mark bar and paste soldering material clamping ring are provided with two the second sub-mark lines, and two the second sub-mark lines all intersect vertically with the second identification mark bar and be all tangent with paste soldering material clamping ring.
4. a kind of pcb board having for the identification mark of paster according to claim 3, it is characterized in that: the two ends of the first identification mark article are provided with two the 3rd sub-mark lines, two the 3rd sub-mark lines are respectively perpendicular to the two ends of the first identification mark article and symmetrical mutually; The two ends of the second identification mark article are provided with two the 3rd sub-mark lines, and two the 3rd sub-mark lines are respectively perpendicular to the two ends of the second identification mark article and symmetrical mutually.
5. a kind of pcb board having for the identification mark of paster according to claim 1, it is characterized in that: in cross identification mark, be provided with the first sub-mark circle concentric with paste soldering material clamping ring, the second sub-mark circle and the 3rd sub-mark circle, the first sub-mark circle is arranged at the inside of paste soldering material clamping ring, the second sub-mark circle and the 3rd sub-mark circle are all arranged at the outside of paste soldering material clamping ring, and the second sub-mark circle is between paste soldering material clamping ring and the 3rd sub-mark circle.
6. a kind of pcb board having for the identification mark of paster according to claim 1, is characterized in that: the diameter of paste soldering material clamping ring is 1.4-2.4mm.
7. a kind of pcb board having for the identification mark of paster according to claim 1, is characterized in that: the periphery of cross identification mark is provided with guard circle.
8. a kind of pcb board having for the identification mark of paster according to claim 7, is characterized in that: the width of guard circle is 8-12mil.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20130109090 | 2013-09-11 | ||
| KR10-2013-0109090 | 2013-09-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203984765U true CN203984765U (en) | 2014-12-03 |
Family
ID=51982180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420319012.6U Expired - Fee Related CN203984765U (en) | 2013-09-11 | 2014-06-16 | A kind of pcb board having for the identification mark of paster |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203984765U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211558A (en) * | 2016-08-09 | 2016-12-07 | 深圳崇达多层线路板有限公司 | Mark structure and printed circuit board |
| CN108617164A (en) * | 2018-04-16 | 2018-10-02 | 上海望友信息科技有限公司 | Selection method, system, readable storage medium storing program for executing and the electronic equipment of optical reference point |
| CN108899299A (en) * | 2018-06-22 | 2018-11-27 | 上海世禹精密机械有限公司 | Chip attachment method |
-
2014
- 2014-06-16 CN CN201420319012.6U patent/CN203984765U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211558A (en) * | 2016-08-09 | 2016-12-07 | 深圳崇达多层线路板有限公司 | Mark structure and printed circuit board |
| CN108617164A (en) * | 2018-04-16 | 2018-10-02 | 上海望友信息科技有限公司 | Selection method, system, readable storage medium storing program for executing and the electronic equipment of optical reference point |
| CN108899299A (en) * | 2018-06-22 | 2018-11-27 | 上海世禹精密机械有限公司 | Chip attachment method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141203 Termination date: 20170616 |