CN203973387U - A kind of grinding pad cleaning device - Google Patents
A kind of grinding pad cleaning device Download PDFInfo
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- CN203973387U CN203973387U CN201420390677.6U CN201420390677U CN203973387U CN 203973387 U CN203973387 U CN 203973387U CN 201420390677 U CN201420390677 U CN 201420390677U CN 203973387 U CN203973387 U CN 203973387U
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- grinding pad
- abrasive disk
- abrasive
- cleaning device
- arm
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Abstract
The utility model provides a kind of grinding pad cleaning device, and described device at least comprises: at least two abrasive disks; The back side of each abrasive disk is equipped with one end is fixed on the axle of this abrasive disk; The other end of described axle is connected in one end of an arm jointly by a hubbing structure; Described each abrasive disk front has respectively different roughness.Described grinding pad cleaning device of the present utility model adopts the abrasive disk with different stock removal rates to clean to the grinding pad after grinding, the abrasive disk of different stock removal rates is in time switched to use, change in prior art the mode of after an abrasive disk finishes service life, it being changed, therefore, grinding pad cleaning device of the present utility model has carried out repairing timely to grinding pad, avoid the cleaning wafer bad and that cause bringing to grinding pad because of the restriction in abrasive disk service life to damage, improved the yield of product.
Description
Technical field
The utility model relates to a kind of semi-conductor processing equipment, particularly relates to a kind of grinding pad cleaning device.
Background technology
In manufacture of semiconductor technique, at the bottom of chemical mechanical milling tech makes to comprise semiconductor crystal wafer, glass, hard disk base on different materials, sapphire wafer and window, plastics produce even curface.Typically, such as, thereby chemical mechanical milling tech comprises and uses a kind of polymer grinding pad and a kind of slurry of comprising loose abrasive grain and other chemical addition agents the two removes size, geometry and the surface characteristics that material reaches design, flatness, surface roughness etc. by chemical action and mechanism.
During a typical chemical mechanical milling tech, when the wafer that uses grinding head that needs are ground is pressed in while grinding on grinding pad, owing to having and grinding lapping liquid used in the surface of grinding pad and groove, this just makes to have filled up remaining residue in the grinding pad groove after cmp.If this grinding pad is not treated, in next process of lapping, these residues probably scratch wafer and cause wafer defect, simultaneously because these residues are filled and led up the groove of described grinding pad, the lapping liquid that makes again to grind can not well enter in the groove of grinding pad and reduce the effect of grinding, and the reason of above several respects will cause wafer lost efficacy or scrapped.
Therefore after grinding last time, be necessary effectively to remove last time grinding pad surface after grinding and the residue in groove thereof with a kind of device.And being generally a kind of surface in current technology, this cleaning device there are some adamantine abrasive disks, also be called diamond cleaning deskitte, as shown in Figure 1, what represent is after grinding finishes, the process that grinding pad 10 on grinding table 11 is cleaned, in this process, abrasive disk 12 is placed in described grinding pad 10 upper surfaces and moves around the residue of described grinding pad upper surface groove 101 is removed.
What Fig. 2 represented is the top view that surface distributed has the abrasive disk 12 of some diamond particles 121, and the central authorities of described abrasive disk are useful on the rotating shaft 13 of this diamond cleaning deskitte rotation use.In the time that described grinding pad is cleaned, described abrasive disk 12 is pressed on the surface of grinding pad and transfers the residue in surface and the groove of constantly removing described grinding pad at the drive backspin of rotating shaft 12.
Owing to only using an abrasive disk successively described grinding pad to be cleaned in grinding pad cleaning device of the prior art, until finish the service life of this abrasive disk, the abrasive disk more renewing again, its corner angle of diamond particles on a new abrasive disk surface are sharp, and this abrasive disk has good stock removal rate concerning described grinding pad; Described stock removal rate refers to the thickness in this abrasive disk unit interval, the residue on described grinding pad surface being cleaned; When a new abrasive disk used after a period of time, it is stable that described stock removal rate maintains within the scope of certain hour; Along with diamond particles is by wearing and tearing gradually, the cutting aluminium of described abrasive disk can decline gradually, until reach the abrasive disk that again more renew the service life of this abrasive disk again.And abrasive disk of the prior art generally can not be changed in the cleaning process of carrying out grinding pad, until the end-of-life of this abrasive disk, grinding pad of the prior art is along with the prolongation of service time, its stock removal rate constantly declines, residue in described grinding pad surface and groove can not be cleaned completely, thereby easily cause the scuffing of wafer in process of lapping and even scrap, the yield of product is had a great impact.
Therefore, the utility model is necessary to propose a kind of new grinding pad cleaning device and reduces in prior art and produce the phenomenon of scrapping because the impact of abrasive disk stock removal rate makes wafer.
Utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of grinding pad cleaning device, can not clean the wafer defect thoroughly causing and even the problem of scrapping for solving prior art because the decline of abrasive disk stock removal rate makes the residue in grinding pad surface and groove thereof.
For achieving the above object and other relevant objects, the utility model provides a kind of grinding pad cleaning device, it is characterized in that, described device at least comprises:
At least two abrasive disks; The back side of each abrasive disk is equipped with one end is fixed on the axle of this abrasive disk; The other end of described axle is connected in one end of an arm jointly by a hubbing structure; Described each abrasive disk front has respectively different roughness.
As a kind of preferred version of grinding pad cleaning device of the present utility model, described device also comprises the support of the fixing described arm other end and is contacted with the grinding pad in described abrasive disk front; Described grinding pad surface uniform is distributed with groove.
As a kind of preferred version of grinding pad cleaning device of the present utility model, described each abrasive disk be shaped as circle, its front is respectively equipped with some equally distributed diamond particles; Described each abrasive disk has different stock removal rates to described grinding pad.
As a kind of preferred version of grinding pad cleaning device of the present utility model, the axle that is fixed on the described abrasive disk back side is vertical with this abrasive disk surface; Described hubbing structure is provided with and makes each axle and described arm centered by the tie point of described axle and arm, rotate and make relatively-stationary lock between described each axle and arm in any direction.
As a kind of preferred version of grinding pad cleaning device of the present utility model, described abrasive disk has two, and these two described abrasive disks and described arm are fixed relative to one another; One of them abrasive disk surface is vertical with described arm, and this abrasive disk is contacted with described grinding pad and for removing the grinding accessory substance on described grinding pad surface.
As a kind of preferred version of grinding pad cleaning device of the present utility model, described abrasive disk has three, and these three abrasive disks relatively fix and abrasive disc is mutually 60 degree angles each other; And these three abrasive disks are relative with described arm fixing; The surface of one of them abrasive disk is vertical with described arm, and this abrasive disk is contacted with described grinding pad and for removing the grinding accessory substance on described grinding pad surface.
As a kind of preferred version of grinding pad cleaning device of the present utility model, described abrasive disk has five, these five abrasive disks and described arm are fixed relative to one another, these five abrasive disks surround a square with opening, its surface of abrasive disk in the square basal surface position relative with described opening is vertical with described arm, and this abrasive disk is contacted with described grinding pad and for removing the grinding accessory substance on described grinding pad surface.
As a kind of preferred version of grinding pad cleaning device of the present utility model, described grinding pad cleaning device also comprises and drives the motor of described each abrasive disk work and for gathering each abrasive disk controller in service life; Described controller is connected in described motor.
As mentioned above, grinding pad cleaning device of the present utility model, there is following beneficial effect: in the process that uses described abrasive disk of the present utility model to clean the grinding pad after grinding, thereby the abrasive disk that can in time more renew according to the situation of abrasive disk stock removal rate guarantees effectively the residue on grinding pad surface to be removed thoroughly, thereby be unlikely to make wafer to be scratched in process of lapping and produce and scrap, improving the yield of production.
Brief description of the drawings
Fig. 1 is grinding pad cleaning device schematic diagram of the prior art.
Fig. 2 is the schematic diagram of abrasive disk surface diamond distribution of particles of the prior art.
In Fig. 3 grinding pad cleaning device of the present utility model, include the structural representation of three abrasive disks.
In Fig. 4 grinding pad cleaning device of the present utility model, include the structural representation of five abrasive disks.
Element numbers explanation
10,25 grinding pads
101 grooves
11 grinding tables
12,20 abrasive disks
121 diamond particles
13 rotating shafts
21 axles
22 arms
23 hubbing structures
24 supports
Detailed description of the invention
By specific instantiation, embodiment of the present utility model is described below, those skilled in the art can understand other advantages of the present utility model and effect easily by the disclosed content of this description.The utility model can also be implemented or be applied by other different detailed description of the invention, and the every details in this description also can be based on different viewpoints and application, carries out various modifications or change not deviating under spirit of the present utility model.
Refer to Fig. 3 to Fig. 4.It should be noted that, the diagram providing in the present embodiment only illustrates basic conception of the present utility model in a schematic way, satisfy and only show with assembly relevant in the utility model in graphic but not component count, shape and size drafting while implementing according to reality, when its actual enforcement, kenel, quantity and the ratio of each assembly can be a kind of random change, and its assembly layout kenel also may be more complicated.
As shown in the figure, the utility model provides a kind of grinding pad cleaning device, and described grinding pad cleaning device of the present utility model at least comprises: at least two abrasive disks; Grinding pad cleaning device as shown in Figure 3, comprises three abrasive disks; And the grinding pad cleaning device shown in Fig. 4 comprises 5 abrasive disks.Described each abrasive disk of the present utility model is equipped with one end and is fixed on the axle of this abrasive disk, and axle 21 is as shown in Figure 3 and Figure 4 connected in the back side of each abrasive disk.In described grinding pad cleaning device of the present utility model, the other end of described axle is connected in one end of an arm jointly by a hubbing structure, and as shown in Figure 3 and Figure 4, the other end of described axle 21 is connected to one end of an arm 22 together by a hubbing structure 23.The front of described each abrasive disk of the present utility model has respectively different roughness, that is to say, each abrasive disk front is provided with some diamond particles, the corner angle sharpness difference of the diamond particles on described different abrasive disks surface, thereby make each abrasive disk have different stock removal rates, described stock removal rate refers to the thickness of removing the residue on grinding pad surface in the unit interval with this abrasive disk.The diamond particles that corner angle are sharper is also larger to the stock removal rate contribution of abrasive disk.Therefore, the roughness of described abrasive disk also refers to the efficiency of cutting of this abrasive disk.
Embodiment mono-
The described grinding pad cleaning device of the present embodiment as shown in Figure 3, this device at least comprises: three abrasive disks 20, the back side of these three abrasive disks is respectively equipped with axle 21, preferably, abrasive disk described in the present embodiment be shaped as circle, one end of described three axles 21 is individually fixed in the center at the back side of three described abrasive disks.Preferably, the surface of described abrasive disk is perpendicular to the axle fixing with it; As shown in Figure 3, in the present embodiment, the other end of the each axle 21 in described three axles is connected with an arm 22, that is to say, the other end of described each axle is connected in one end of an arm 22 jointly by a hubbing structure 23; Preferably, in the present embodiment, described hubbing structure 23 is provided with and makes each axle 21 and described arm 22 centered by the tie point of described axle 21 and arm, rotate and make relatively-stationary lock between described each axle and arm in any direction.That is to say, between described three axles 21 and described arm 22, be connected by a hubbing structure 23, and, can there is the rotation of different directions arbitrarily around its link in described each axle and described arm, the center of this rotation is the tie point of described each axle and arm, and the rotation of any direction can occur centered by this tie point for described axle and described arm; In the time that the position between described arm and described each axle need to be fixed, the described hubbing structure of this device is also provided with and makes described each axle and described arm lock fixed relative to one another; By the effect of described lock, any one in described three axles or several axle can be fixed relative to one another, and described arm also can be relative fixing by the position between the effect of described lock and described axle; Described lockset has the function of opening and closing, and in the time that described lock cuts out, described three axles are relative fixing with the position of arm; In the time that described lock is opened, described axle and described arm can rotate around described tie point.
The front of described three abrasive disks in the described grinding pad cleaning device in the present embodiment has respectively different roughness, and the front of these three abrasive disks is provided with equally distributed diamond particles; The corner angle sharpness difference of the diamond particles on described three abrasive disk surfaces, the diamond particles that corner angle are sharper is distributed in the surface of abrasive disk, and the stock removal rate of this abrasive disk is higher.Therefore, these three abrasive disks have respectively different stock removal rates, and also these three abrasive disk fronts have respectively different roughness.
As shown in Figure 3, the described device in the present embodiment also comprises the support 24 of the other end described in fixing described arm 22 and is contacted with the grinding pad 25 in described abrasive disk front; Described grinding pad surface uniform is distributed with groove, described groove be used for the distributing lapping liquid of grinding crystal wafer.
As a kind of preferred version of grinding pad cleaning device of the present utility model, as shown in Figure 3, when described three abrasive disks 21 are fixed relatively by described hubbing structure, each abrasive disc is mutually 60 degree angles each other; And these three abrasive disks are relative fixing with described arm 22; The surface of one of them abrasive disk 21 is vertical with described arm, and this abrasive disk is contacted with described grinding pad 25 and for removing the grinding accessory substance of described grinding pad surface groove.Described grinding accessory substance comes from the grinding residue in the process of lapping of wafer.
Preferably, the described grinding pad cleaning device in the present embodiment also comprises and drives the motor of described three abrasive disk work and for gathering each abrasive disk controller in service life; Described controller is connected with described motor.Described motor is by the rotation of each abrasive disk on grinding pad described in described controller control simultaneously.
The operation principle of the grinding pad cleaning device of the present embodiment is as follows: after described wafer grinds and finishes on described grinding pad, as shown in Figure 3 formed by three abrasive disks can start working and on grinding pad, grind accessory substance for removing for grinding pad cleaning device.
First, because described three abrasive disks have different stock removal rates, therefore, clean grinding pad is selected the abrasive disk of different stock removal rates as required, open the lock that is provided with in described hubbing structure need to abrasive disk turn to the upper surface of described grinding pad, other two abrasive disks are separately fixed at the both sides of described this abrasive disk that needs use, become plane to be each other as shown in Figure 3 mutually the position of 60 degree the position adjustments of three abrasive disks, the axle at the abrasive disk back side of described arm and required use point-blank simultaneously, then closing described lock fixes the position of described three abrasive disks and described arm.
Then, start described motor, control the described abrasive disk running in grinding pad upper surface by the controller being connected with described motor, and other two abrasive disks do not rotate.
When the described abrasive disk in described grinding pad upper surface in this embodiment used after a period of time, its stock removal rate can decline, cleaning effect also can decline, therefore, in the time reusing, the position of two other abrasive disk in this device is regulated, these three abrasive disks interchangeable use, preferably, in the time that the stock removal rate of these three abrasive disks all drops to the service life that reaches himself, in use procedure afterwards, out of use abrasive disk dismounting can be changed, new abrasive disk or the high abrasive disk of stock removal rate are arranged in this device and are reused.
Embodiment bis-
The described grinding pad cleaning device of the present embodiment as shown in Figure 4, this device at least comprises: five abrasive disks 20, the back side of these five each and every one abrasive disks is respectively equipped with axle 21, preferably, abrasive disk described in the present embodiment be shaped as circle, one end of described five axles 21 is individually fixed in the center at the back side of five described abrasive disks.Preferably, the surface of described abrasive disk is perpendicular to the axle fixing with it; As shown in Figure 4, in the present embodiment, the other end of the each axle 21 in described five axles is connected with an arm 22, that is to say, the other end of described each axle is connected in one end of an arm 22 jointly by a hubbing structure 23; Preferably, in the present embodiment, described hubbing structure 23 is provided with and makes each axle 21 and described arm 22 centered by the tie point of described axle 21 and arm, rotate and make relatively-stationary lock between described each axle and arm in any direction.That is to say, between described three axles 21 and described arm 22, be connected by a hubbing structure 23, and, can there is the rotation of different directions arbitrarily around its link in described each axle and described arm, the center of this rotation is the tie point of described each axle and arm, and the rotation of any direction can occur centered by this tie point for described axle and described arm; In the time that the position between described arm and described each axle need to be fixed, the described hubbing structure of this device is also provided with and makes described each axle and described arm lock fixed relative to one another; By the effect of described lock, any one in described five axles or several axle can be fixed relative to one another, and described arm also can be relative fixing by the position between the effect of described lock and described axle; Described lockset has the function of opening and closing, and in the time that described lock cuts out, described five axles are relative fixing with the position of arm; In the time that described lock is opened, described axle and described arm can rotate around described tie point.
The front of described five abrasive disks in the described grinding pad cleaning device in the present embodiment has respectively different roughness, and the front of these five abrasive disks is provided with equally distributed diamond particles; The corner angle sharpness difference of the diamond particles on described five abrasive disk surfaces, the diamond particles that corner angle are sharper is distributed in the surface of abrasive disk, and the stock removal rate of this abrasive disk is higher.Therefore, these five abrasive disks have respectively different stock removal rates, and also these five abrasive disk fronts have respectively different roughness.
As shown in Figure 4, the described device in the present embodiment also comprises the support 24 of the other end described in fixing described arm 22 and is contacted with the grinding pad 25 in described abrasive disk front; Described grinding pad surface uniform is distributed with groove, described groove be used for the distributing lapping liquid of grinding crystal wafer.
As a kind of preferred version of grinding pad cleaning device of the present utility model, as shown in Figure 4, when described five abrasive disks 21 are fixed relatively by described hubbing structure, these five abrasive disks surround a square with opening, its surface of abrasive disk in the square basal surface position relative with described opening is vertical with described arm, this abrasive disk that is positioned at described square basal surface position is contacted with described grinding pad and for removing the grinding accessory substance on described grinding pad surface, and described grinding accessory substance comes from the grinding residue in the process of lapping of wafer.
Preferably, the described grinding pad cleaning device in the present embodiment also comprises and drives the motor of described five abrasive disk work and for gathering each abrasive disk controller in service life; Described controller is connected with described motor.Described motor is by the rotation of each abrasive disk on grinding pad described in described controller control simultaneously.
The operation principle of the grinding pad cleaning device of the present embodiment is as follows: after described wafer grinds and finishes on described grinding pad, as shown in Figure 4 formed by five abrasive disks can start working and on grinding pad, grind accessory substance for removing for grinding pad cleaning device.
First, because described five abrasive disks have different stock removal rates, therefore, clean grinding pad is selected the abrasive disk of different stock removal rates as required, open the lock that is provided with in described hubbing structure need to abrasive disk turn to the upper surface of described grinding pad, other four abrasive disks are four faces of fixing composition square as shown in Figure 4 respectively, the axle at the abrasive disk back side of described arm and required use point-blank, is then closed described lock the position of described five abrasive disks and described arm is fixed simultaneously.
Then, start described motor, control the described abrasive disk running in grinding pad upper surface by the controller being connected with described motor, and other four abrasive disks do not rotate.
When the described abrasive disk in described grinding pad upper surface in this embodiment used after a period of time, its stock removal rate can decline, cleaning effect also can decline, therefore, in the time reusing, the position of other four abrasive disks in this device is regulated, these five abrasive disks interchangeable use, preferably, in the time that the stock removal rate of these five abrasive disks all drops to the service life that reaches himself, in use procedure afterwards, out of use abrasive disk dismounting can be changed, new abrasive disk or the high abrasive disk of stock removal rate are arranged in this device and are reused.
Described grinding pad cleaning device of the present utility model can also be the device that is provided with two abrasive disks, and preferably, in the time that described device is started working, these two described abrasive disks and described arm are fixed relative to one another; One of them abrasive disk surface is vertical with described arm, and this abrasive disk is contacted with described grinding pad and for removing the grinding accessory substance on described grinding pad surface.And arbitrarily put the position of another abrasive disk, only otherwise touch the described abrasive disk contacting with described grinding pad, its operation principle is identical with the cleaning device in embodiment mono-and embodiment bis-.
In sum, in the process that grinding pad after using described grinding pad cleaning device of the present utility model to grinding cleans, thereby the abrasive disk that can in time more renew according to the situation of abrasive disk stock removal rate guarantees effectively the residue on grinding pad surface to be removed thoroughly, thereby be unlikely to make wafer to be scratched in process of lapping and produce and scrap, improving the yield of production.So the utility model has effectively overcome various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all can, under spirit of the present utility model and category, modify or change above-described embodiment.Therefore, have in technical field under such as and conventionally know that the knowledgeable modifies or changes not departing from all equivalences that complete under spirit that the utility model discloses and technological thought, must be contained by claim of the present utility model.
Claims (8)
1. a grinding pad cleaning device, is characterized in that, described device at least comprises:
At least two abrasive disks; The back side of each abrasive disk is equipped with one end is fixed on the axle of this abrasive disk; The other end of described axle is connected in one end of an arm jointly by a hubbing structure; Described each abrasive disk front has respectively different roughness.
2. grinding pad cleaning device according to claim 1, is characterized in that: described device also comprises the support of the fixing described arm other end and is contacted with the grinding pad in described abrasive disk front; Described grinding pad surface uniform is distributed with groove.
3. grinding pad cleaning device according to claim 2, is characterized in that: described each abrasive disk be shaped as circle, its front is respectively equipped with some equally distributed diamond particles; Described each abrasive disk has different stock removal rates to described grinding pad.
4. grinding pad cleaning device according to claim 3, is characterized in that: the axle that is fixed on the described abrasive disk back side is vertical with this abrasive disk surface; Described hubbing structure is provided with and makes each axle and described arm centered by the tie point of described axle and arm, rotate and make relatively-stationary lock between described each axle and arm in any direction.
5. grinding pad cleaning device according to claim 4, is characterized in that: described abrasive disk has two, and these two described abrasive disks and described arm are fixed relative to one another; One of them abrasive disk surface is vertical with described arm, and this abrasive disk is contacted with described grinding pad and for removing the grinding accessory substance on described grinding pad surface.
6. grinding pad cleaning device according to claim 4, is characterized in that: described abrasive disk has three, and these three abrasive disks relatively fix and abrasive disc is mutually 60 degree angles each other; And these three abrasive disks are relative with described arm fixing; The surface of one of them abrasive disk is vertical with described arm, and this abrasive disk is contacted with described grinding pad and for removing the grinding accessory substance on described grinding pad surface.
7. grinding pad cleaning device according to claim 4, it is characterized in that: described abrasive disk has five, these five abrasive disks and described arm are fixed relative to one another, these five abrasive disks surround a square with opening, its surface of abrasive disk in the square basal surface position relative with described opening is vertical with described arm, and this abrasive disk is contacted with described grinding pad and for removing described grinding pad surface grinding accessory substance.
8. grinding pad cleaning device according to claim 1, is characterized in that: described grinding pad cleaning device also comprises and drives the motor of described each abrasive disk work and for gathering each abrasive disk controller in service life; Described controller is connected in described motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420390677.6U CN203973387U (en) | 2014-07-15 | 2014-07-15 | A kind of grinding pad cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420390677.6U CN203973387U (en) | 2014-07-15 | 2014-07-15 | A kind of grinding pad cleaning device |
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| CN203973387U true CN203973387U (en) | 2014-12-03 |
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| CN201420390677.6U Expired - Fee Related CN203973387U (en) | 2014-07-15 | 2014-07-15 | A kind of grinding pad cleaning device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111283537A (en) * | 2020-03-30 | 2020-06-16 | 芜湖恒信汽车内饰制造有限公司 | Burnishing device is used in auto parts production |
| CN113752146A (en) * | 2021-09-08 | 2021-12-07 | 武汉新芯集成电路制造有限公司 | Chuck cleaning device, chuck bearing surface detection method and bonding equipment |
-
2014
- 2014-07-15 CN CN201420390677.6U patent/CN203973387U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111283537A (en) * | 2020-03-30 | 2020-06-16 | 芜湖恒信汽车内饰制造有限公司 | Burnishing device is used in auto parts production |
| CN113752146A (en) * | 2021-09-08 | 2021-12-07 | 武汉新芯集成电路制造有限公司 | Chuck cleaning device, chuck bearing surface detection method and bonding equipment |
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Granted publication date: 20141203 Termination date: 20190715 |