CN203509931U

CN203509931U - Chemical mechanical polishing dresser

Info

Publication number: CN203509931U
Application number: CN201320385493.6U
Authority: CN
Inventors: 唐强
Original assignee: Semiconductor Manufacturing International Beijing Corp
Current assignee: Semiconductor Manufacturing International Beijing Corp
Priority date: 2013-07-01
Filing date: 2013-07-01
Publication date: 2014-04-02
Anticipated expiration: 2023-07-01

Abstract

The utility model provides a chemical mechanical polishing dresser. The chemical mechanical polishing dresser at least comprises a disc and abrasive particles. The center of the disc is provided with a through hole. The abrasive particles are arranged on the disc and comprise large abrasive particles and small abrasive particles, the large abrasive particles are arranged on the surface of the inner circle of the disc, and the small abrasive particles are arranged on the surface of the outer circle of the disc. According to the dresser, the abrasive particles on the disc are arranged again, the large abrasive particles are arranged on the surface of the inner circle of the disc, the small abrasive particles are arranged on the surface of the outer circle of the disc, the disc hardware structure is optimized, the abrasive particles are not prone to disengaging or fracturing during the polishing process, the service life of the dresser is prolonged, the removing rate of dirt is improved, a wafer can be prevented from being scratched, and the wafer yield is improved. The chemical mechanical polishing dresser is simple in structure, convenient to operate and suitable for industrial production.

Description

A kind of chemically mechanical polishing trimmer

Technical field

The utility model relates to field of semiconductor manufacture, particularly relates to a kind of chemically mechanical polishing trimmer.

Background technology

In semiconductor process flow, chemically mechanical polishing (Chemical Mechanical Polishing, CMP) is a very important procedure, is sometimes also referred to as chemical-mechanical planarization (Chemical Mechanical Planarization, CMP).So-called chemically mechanical polishing, it is to adopt chemistry and mechanical integrated effect to remove excess stock from semi-conductor silicon chip, and makes it obtain the technical process of flat surfaces.Specifically, this finishing method is normally pressed on chip on the polishing pad of one High Rotation Speed, and under the effect of polishing slurries that includes chemical polishing agent and abrasive grains, by polishing pad and the phase mutual friction of wafer, reaches the object of planarization.In view of this, the quality of pad interface performance directly can affect the quality of polishing.In CMP process, the polishing slurries of the polished chip getting off and pad interface can be inserted in polishing pad at leisure, and the time one is long, and pad interface will be hardened shinny, form glaze, become and skid, and cannot carry out polishing again.Thereby, to the maintenance of pad interface, be requisite step in glossing, otherwise can affect the quality of wafer polishing.

Existing chemical mechanical polishing dresser as shown in Figure 1, for pad interface is carried out to reconditioning adjustment, this trimmer comprises a rotating circular disk 1A, on its surface, be fixed with the superabrasive particles 2A---diamond of size homogeneous, disk 1A with this with diamond particles carries out mechanical type friction combing to pad interface, chip on polishing pad is removed, thereby made polishing pad recover good polishing performance.But the abrasive grain size homogeneous on existing chemical mechanical polishing dresser, on the one hand, the abrasive grain of size homogeneous can not be removed the dirt on polishing pad effectively; In addition, in dressing process, diamond, because friction can be subject to very large active force, is easy to rupture or drop on polishing pad from disk 1A, so not only shortened the life-span of trimmer, also will cause the scratch of wafer, reduce the productive rate of wafer, increase cost payout.

Therefore, providing a kind of modified chemically mechanical polishing trimmer is the problem that those skilled in the art need to solve.

Utility model content

The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of chemically mechanical polishing trimmer, for solve that diamond particles on prior art chemically mechanical polishing trimmer is easy to come off or fracture, polishing pad on low etc. the problem of dirt clearance.

For achieving the above object and other relevant objects, the utility model provides a kind of chemically mechanical polishing trimmer, and described trimmer at least comprises:

Disk, central authorities are provided with a through hole;

Abrasive grain, is located on described disk.

Preferably, described abrasive grain comprises large abrasive grain and little abrasive grain.

Preferably, described large abrasive grain is located in the inner peripheral surface of disk, and described little abrasive grain is located on the surface, outer ring of disk.

Preferably, the size range of described little abrasive grain is 5～7 μ m, and the size range of described large abrasive grain is 7～9 μ m.

Preferably, on described disk, be provided with for accommodating described abrasive grain and there is the grid of predetermined pattern.

Preferably, described predetermined pattern is circular.

Preferably, described disc surfaces is also provided with from disk inward flange and extends to outer peripheral at least two the equally distributed isolation strip of disk.

Preferably, described abrasive grain is diamond particles.

Preferably, described disc material is stainless steel.

Preferably, described trimmer also comprises and being connected with described disk and for the power arm of described disk motion active force is provided.

As mentioned above, chemically mechanical polishing trimmer of the present utility model, there is following beneficial effect: by the abrasive grain on disk, rearrange, large abrasive grain is located in the inner peripheral surface of disk, little abrasive grain is located on the surface, outer ring of disk, optimized disk hardware configuration, make abrasive grain difficult drop-off or fracture in polishing process, extend the life-span of trimmer, strengthen the clearance of dirt, and avoid wafer scratch, increase wafer yield.This chemically mechanical polishing trimmer is simple in structure, easy to operate, is applicable to suitability for industrialized production.

Accompanying drawing explanation

Fig. 1 is chemically mechanical polishing trimmer schematic diagram of the prior art.

Fig. 2 is chemically mechanical polishing trimmer schematic diagram of the present utility model.

Fig. 3 is the reeded polishing pad of tool of the present utility model.

Element numbers explanation

1,1A disk

2,2A abrasive grain

21 little abrasive grains

22 large abrasive grains

3 through holes

4 isolation strip

5 polishing pads

6 polishing fluid dirts

The specific embodiment

By particular specific embodiment, embodiment of the present utility model is described below, person skilled in the art scholar can understand other advantages of the present utility model and effect easily by the disclosed content of this description.

Refer to accompanying drawing.Notice, appended graphic the illustrated structure of this description, ratio, size etc., equal contents in order to coordinate description to disclose only, for person skilled in the art scholar, understand and read, not in order to limit the enforceable qualifications of the utility model, therefore the technical essential meaning of tool not, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under the effect that the utility model can produce and the object that can reach, all should still drop on the technology contents that the utility model discloses and obtain in the scope that can contain.Simultaneously, in this description, quote as " on ", the term of D score, " left side ", " right side ", " centre " and " " etc., also only for ease of understanding of narrating, but not in order to limit the enforceable scope of the utility model, the change of its relativeness or adjustment, under without essence change technology contents, when being also considered as the enforceable category of the utility model.

As shown in Figure 2, the utility model provides a kind of chemically mechanical polishing trimmer, and this chemically mechanical polishing trimmer at least comprises: disk 1 and abrasive grain 2.

Described disk 1 central authorities are provided with a through hole 3, and the setting of this through hole 3 has reduced the effective radius of disk 1, and in the process of trimming polished pad, the dirt on polishing pad is just not easy to be attached on disk 1 surface of trimmer, is convenient to cleaning and the cleaning of polishing fluid dirt.

Preferably, be provided with for accommodating abrasive grain 2 and have the grid (diagram) of predetermined pattern on described disk 1, the shape of described predetermined pattern is determined according to the shape of cross section of accommodating abrasive grain 2, includes but not limited to circular or square etc.In the present embodiment, described predetermined pattern is circular.The spacing of described grid is as the criterion for making 2 of abrasive grains produce required spacing distance.

Described disk 1 is made by metal material.In the present embodiment, the material of described disk 1 is stainless steel.

Described abrasive grain 2 is located on described disk 1, and particularly, described abrasive grain 2 is arranged in the grid on disk 1.Further, described abrasive grain 2 is fixed in the grid on disk 1 in the mode of welding, and certainly, the mode of fixed-abrasive particle 2 is not limited to welding, comprises that any abrasive grain 2 that can make firmly adheres to the fixed form on disk 1.

Described abrasive grain 2 comprises large abrasive grain 22 and little abrasive grain 21, as the structure of a kind of optimization of the present utility model, described large abrasive grain 22 is located in the inner peripheral surface of disk 1, and described little abrasive grain 21 is located on the surface, outer ring of disk 1.More preferably, each grid only can hold an abrasive grain 2, and the size range of described little abrasive grain 21 is 5～7 μ m, and the size range of described large abrasive grain 22 is 7～9 μ m.

It should be noted that, described abrasive grain 2 comprises any shape, and as the present embodiment preferred embodiment, abrasive grain 2 has the cusp of disk 1 dorsad, so that more effectively to the pad interface adjustment that places under repair.Described abrasive grain 2 is superhard material, and in the present embodiment, described abrasive grain 2 is diamond particles.

In addition, the surface of described disk 1 is also provided with from disk 1 inward flange and extends to outer peripheral at least two the equally distributed isolation strip 4 of disk 1.In the present embodiment, on disk 1, be evenly distributed with six isolation strip 4.Described isolation strip 4 is divided into a plurality of sectors by abrasive grain 2, and these isolation strip 4 can help trimmer to discharge dirt when trimming polished pad, avoids dirt to adhere to 2 of abrasive grains, extends the working life of trimmer.

Described trimmer also comprises a power arm (diagram), and described power arm is connected with aforementioned disk 1 and the active force for providing disk 1 to move.

As a kind of structure of more optimizing, can apply on the surface of abrasive grain 2 anticorrosive coat (diagram), for preventing that abrasive grain 2 surfaces from being polluted, easy to clean, the service life of prolongation abrasive grain.

The operation principle of the chemically mechanical polishing trimmer that the utility model provides is: first, disk 1 is pressed on eligible for repair polishing pad 5, makes diamond abrasive grains 2 and polishing pad 5 close contacts.Described polishing pad 5 has groove, and as shown in Figure 3, the polishing fluid that carries out polishing wafer in glossing forms the surface that polishing fluid dirt 6 is packed in described groove and polishing pad 5.Trimmer of the present utility model has two kinds of diamond abrasive grains of size 2 and arranges, large abrasive grain 22 is located in the inner peripheral surface of disk 1, little abrasive grain 21 is located on the surface, outer ring of disk 1, and large abrasive grain 22 can stretch in the groove of polishing pad 5, the polishing fluid dirt 6 in cleaning groove; 21 of little abrasive grains can be used for the polishing fluid dirt 6 on combing polishing pad 5 surfaces, thereby make the evenly smooth of polishing pad 5 surfaces, and then reach good dirt clearance.

In sum, the chemically mechanical polishing trimmer that the utility model provides rearranges by the abrasive grain on disk, large abrasive grain is located in the inner peripheral surface of disk, little abrasive grain is located on the surface, outer ring of disk, has optimized disk hardware configuration, makes abrasive grain difficult drop-off or fracture in polishing process, extend the life-span of trimmer, strengthen the clearance of dirt, and avoid wafer scratch, increase wafer yield.This chemically mechanical polishing trimmer is simple in structure, easy to operate, is applicable to suitability for industrialized production.

So the utility model has effectively overcome various shortcoming of the prior art and tool high industrial utilization.

Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all can, under spirit of the present utility model and category, modify or change above-described embodiment.Therefore, have in technical field under such as and conventionally know that the knowledgeable modifies or changes not departing from all equivalences that complete under spirit that the utility model discloses and technological thought, must be contained by claim of the present utility model.

Claims

1. a chemically mechanical polishing trimmer, is characterized in that, described trimmer at least comprises:

Disk, central authorities are provided with a through hole;

Abrasive grain, is located on described disk; Described abrasive grain comprises large abrasive grain and little abrasive grain; Described large abrasive grain is located in the inner peripheral surface of disk, and described little abrasive grain is located on the surface, outer ring of disk.

2. chemically mechanical polishing trimmer according to claim 1, is characterized in that: the size range of described little abrasive grain is 5～7 μ m, and the size range of described large abrasive grain is 7～9 μ m.

3. chemically mechanical polishing trimmer according to claim 1, is characterized in that: on described disk, be provided with for accommodating described abrasive grain and have the grid of predetermined pattern.

4. chemically mechanical polishing trimmer according to claim 3, is characterized in that: described predetermined pattern is for circular.

5. chemically mechanical polishing trimmer according to claim 1, is characterized in that: described disc surfaces is also provided with from disk inward flange and extends to outer peripheral at least two the equally distributed isolation strip of disk.

6. chemically mechanical polishing trimmer according to claim 1, is characterized in that: described abrasive grain is diamond particles.

7. chemically mechanical polishing trimmer according to claim 1, is characterized in that: described disc material is stainless steel.

8. chemically mechanical polishing trimmer according to claim 1, is characterized in that: described trimmer also comprises and being connected with described disk and for the power arm of described disk motion active force is provided.