CN202097669U - Chemically mechanical polishing cushion finishing plate with coordinate marks - Google Patents
Chemically mechanical polishing cushion finishing plate with coordinate marks Download PDFInfo
- Publication number
- CN202097669U CN202097669U CN2011200229455U CN201120022945U CN202097669U CN 202097669 U CN202097669 U CN 202097669U CN 2011200229455 U CN2011200229455 U CN 2011200229455U CN 201120022945 U CN201120022945 U CN 201120022945U CN 202097669 U CN202097669 U CN 202097669U
- Authority
- CN
- China
- Prior art keywords
- mechanical polishing
- conditioner discs
- abrasive grain
- finishing plate
- mark
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
Disclosed is a chemically mechanical polishing cushion finishing plate with coordinate marks. At least one point of the outer edges of abrasive particle areas distributed on the finishing plate or a side surface of the finishing plate is provided with a mark incapable of being erased, abrasive particles on the total finishing plate are arrayed according to an ordered pattern, and accordingly all the abrasive particles can be marked and distinguished by unrepeated coordinate positions.
Description
Technical field
The utility model is a kind of conditioner discs that chemical mechanical polishing pads (Chemical Mechanical Polishing Pad, CMP Pad) is repaired of being used for.
Background technology
Chemically mechanical polishing (CMP) is the step operation during integrated circuit (IC, Integrated Circuit) is made.Polishing pad (Pad) is generally organic material (like polyurethanes), and the surface is fibrous or vesicular texture, is attached on the workbench of rotation.The chemical grinding liquid that contains abrasive grains during work continues to be added on the polishing pad.Workpiece contacts polishing pad with certain pressure and does relative motion, and under chemistry and mechanical double action, reaches polished purpose.
Because continuous accumulation from the grinding chip of workpiece, lapping liquid; Smooth (glazing) gradually hardens (hardening), becomes on the surface of chemical mechanical polishing pads; So that can not carry the abrasive grains in the lapping liquid, polishing efficiency is descended, the polishing effect that makes workpiece simultaneously is variation also.The chemical mechanical polishing pads conditioner discs is used for pad interface is carried out combing (combing) or cutting (cutting) exactly, reaches the effect of finishing (dressing) or adjustment (conditioning), to keep the performance of polishing pad.
At present, known chemical mechanical polishing pads conditioner discs normally adopts a plurality of superabrasive particles as the finishing sword.Superabrasive particles is coupled on the matrix surface, and matrix is generally disc.Coupling material between matrix and the superabrasive particles is metallic nickel, cobalt, titanium, iron, copper etc. and alloy thereof, also can be other bond, like organic type of bonds such as epoxy resin, polyurethane.Mostly the chemical mechanical polishing pads conditioner discs is monolithic devices, also has combinedly, as earlier abrasive grain being coupled on several little abrasive discs, littler abrasive disc is combined as a conditioner discs.Be the finishing performance and the dressing efficiency that are optimized, mostly the abrasive grain of chemical mechanical polishing pads conditioner discs is orderly arrangement.In the process of trimming polished pad, abrasive grain may come off, burst apart if any reasons such as defective coupling and wearing and tearing.The particle that comes off or burst apart or its chip can be stayed on the polishing pad, thereby polishing workpiece is caused unacceptable infringement.
The utility model content
For abrasive grain adhering state and finishing state of wear to conditioner discs carry out effective monitoring; Be convenient to simultaneously to contingent come off and burst apart carry out FEEDBACK CONTROL; The utility model provides a kind of chemical mechanical polishing pads conditioner discs that coordinates logo is arranged; Abrasive grain on the conditioner discs is arranged in order, the underlined coordinate object of reference that can be used as each superabrasive particles position on the dish.
The technical scheme that the utility model adopted is: be furnished with on the outer rim card in abrasive grain zone on the conditioner discs or the side of conditioner discs has the mark that can not wipe more than one more at least; All abrasive grains totally are with orderly pattern Boulez; The mark that can not wipe is as the coordinate object of reference of abrasive grain position, thereby each grain in whole abrasive grain all can be identified and distinguish by a unduplicated coordinate position.Abrasive grain on the conditioner discs is at least a of diamond, cubic boron nitride, polycrystalline diamond, polycrystal cubic boron nitride, CVD gas-phase grown diamond.Can not wipe mark and be wherein at least a by the cut that is processed to form, depression, protrusion, embedding object.
The beneficial effect of the utility model is: because all there is more than one fixedly reference point the position of each abrasive grain on the conditioner discs; Therefore can write down easily and search; To inspection, the monitoring of the abrasion condition and the bonding phase erosion state of abrasive grain, method efficiently and effectively is provided simultaneously.
Description of drawings
Fig. 1 is an example of the utility model, and 1 is the disk body of conditioner discs among the figure, the 2nd, and the abrasive grain of fixing on the conditioner discs, the 3rd, the mark that can not wipe that is provided with, mark is to be made up of a del.
Fig. 2 is another example of the utility model; 1 is the disk body of conditioner discs among the figure; The 2nd, the abrasive grain of fixing on the conditioner discs, the 3rd, the mark that can not wipe that is provided with, mark is made up of the round dot of 4 symmetrical distributions; Wherein 3-1 is solid in reference mark, and three 3-2,3-3,3-4 are hollow as aid mark in addition.
Fig. 3 is another example of the utility model, and 1 is the disk body of conditioner discs among the figure, the 2nd, and fixing abrasive grain on the conditioner discs, the 3rd, the mark that can not wipe that is provided with, mark are that 12 groups of slide-rule dials and the corresponding numeral by circle distribution constitutes.
Fig. 4 is another example of the utility model, and this conditioner discs is to be assembled to the combined type conditioner discs that forms on the basal disc by a plurality of abrasive discs.1 is the disk body of conditioner discs among the figure, the 2nd, and the abrasive grain of fixing on the conditioner discs, the 3rd, the mark that can not wipe that is provided with.
Fig. 5 is another example of the utility model, and this conditioner discs also is to be assembled to the combined type conditioner discs that forms on the basal disc by a plurality of abrasive discs.1 is the disk body of conditioner discs among the figure, the 2nd, and the abrasive grain of fixing on the conditioner discs, the 3rd, the mark that can not wipe that is provided with, mark is arranged on the cylindrical side of basal disc.
The specific embodiment
Be examples of implementation of the utility model below:
As shown in Figure 2; On the stainless steel circular base plate that 1 diameter is 108mm evenly the Boulez granularity be the diamond abrasive particle of 100/120#, abrasive particle is fixed on the card with the soldering of Ni base solder, it is arranged by spacing is that the equilateral triangle of 0.7mm is covered with the card central region that diameter is 100mm; Near the outer rim that is furnished with diamond abrasive particle zone; Align with an abrasive particle of outermost edge, beat with laser marking note and carve a circular point shape mark, press again with this point to the centrosymmetric rule of card; Beat and carve other 3 one-tenth open circles marks, promptly become the described chemical mechanical polishing pads conditioner discs that coordinates logo is arranged of the utility model.Each abrasive grain on the card all can basis be write down and is searched according to row, row sequence number with the relative position of first mark.
Claims (3)
1. chemical mechanical polishing pads conditioner discs that coordinates logo is arranged, with finishing face that polishing pad contacts on be fixed with abrasive grain; It is characterized in that: its abrasive grain is to arrange in order, and there is the more than one coordinate object of reference that can not wipe mark as the abrasive grain position side of card or dish.
2. according to the said chemical mechanical polishing pads conditioner discs that coordinates logo is arranged of claim 1, it is characterized in that: the abrasive grain on it is at least a of diamond, cubic boron nitride, polycrystalline diamond, polycrystal cubic boron nitride, CVD gas-phase grown diamond.
3. according to the said chemical mechanical polishing pads conditioner discs that coordinates logo is arranged of claim 1, it is characterized in that: can not wipe mark and be wherein at least a by the cut that is processed to form, depression, protrusion, embedding object.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200229455U CN202097669U (en) | 2011-01-25 | 2011-01-25 | Chemically mechanical polishing cushion finishing plate with coordinate marks |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200229455U CN202097669U (en) | 2011-01-25 | 2011-01-25 | Chemically mechanical polishing cushion finishing plate with coordinate marks |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202097669U true CN202097669U (en) | 2012-01-04 |
Family
ID=45383702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200229455U Expired - Fee Related CN202097669U (en) | 2011-01-25 | 2011-01-25 | Chemically mechanical polishing cushion finishing plate with coordinate marks |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202097669U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103962974A (en) * | 2013-01-31 | 2014-08-06 | 盖茨优霓塔传动系统(苏州)有限公司 | Grinding wheel |
| CN104070454A (en) * | 2013-03-25 | 2014-10-01 | 鑫晶鑽科技股份有限公司 | Method for manufacturing sapphire polishing pad dresser |
| CN108327102A (en) * | 2017-01-17 | 2018-07-27 | 株式会社迪思科 | The dressing method and cutting apparatus of finishing board, cutting tool |
| CN109153106A (en) * | 2016-04-06 | 2019-01-04 | M丘比德技术公司 | Diamond composites CMP pad adjuster |
| CN109262481A (en) * | 2018-01-22 | 2019-01-25 | 深圳西斯特科技有限公司 | A kind of abrasive material arrangement mode of Novel rolling wheel |
-
2011
- 2011-01-25 CN CN2011200229455U patent/CN202097669U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103962974A (en) * | 2013-01-31 | 2014-08-06 | 盖茨优霓塔传动系统(苏州)有限公司 | Grinding wheel |
| CN104070454A (en) * | 2013-03-25 | 2014-10-01 | 鑫晶鑽科技股份有限公司 | Method for manufacturing sapphire polishing pad dresser |
| CN104070454B (en) * | 2013-03-25 | 2016-06-01 | 鑫晶鑽科技股份有限公司 | Method for manufacturing sapphire polishing pad dresser |
| CN109153106A (en) * | 2016-04-06 | 2019-01-04 | M丘比德技术公司 | Diamond composites CMP pad adjuster |
| CN109153106B (en) * | 2016-04-06 | 2022-05-13 | M丘比德技术公司 | Diamond compound CMP pad conditioner |
| CN108327102A (en) * | 2017-01-17 | 2018-07-27 | 株式会社迪思科 | The dressing method and cutting apparatus of finishing board, cutting tool |
| CN108327102B (en) * | 2017-01-17 | 2021-09-14 | 株式会社迪思科 | Trimming plate, trimming method of cutting tool, and cutting apparatus |
| CN109262481A (en) * | 2018-01-22 | 2019-01-25 | 深圳西斯特科技有限公司 | A kind of abrasive material arrangement mode of Novel rolling wheel |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202097669U (en) | Chemically mechanical polishing cushion finishing plate with coordinate marks | |
| US7201645B2 (en) | Contoured CMP pad dresser and associated methods | |
| US20200156215A1 (en) | Placement of abrasive particles for achieving orientation independent scratches and minimizing observable manufacturing defects | |
| US20180222009A1 (en) | Cmp pad dresser having leveled tips and associated methods | |
| US6884155B2 (en) | Diamond grid CMP pad dresser | |
| US20140308883A1 (en) | Chemical mechanical polishing conditioner | |
| US9825000B1 (en) | Semiconductor wire bonding machine cleaning device and method | |
| US20090090066A1 (en) | Grinding tool and manufacturing method thereof | |
| JPWO2007023949A1 (en) | Tool having sintered body polishing portion and method for manufacturing the same | |
| CN102049737A (en) | Polishing pad conditioner | |
| CN105451938A (en) | Polishing tool and processing method for member | |
| JP2003305644A (en) | Dresser for cmp work | |
| CN202952160U (en) | Chemical-mechanical polishing finisher | |
| CN202180415U (en) | Finisher for chemical mechanical polishing pad | |
| JP2006218577A (en) | Dresser for polishing cloth | |
| CN113199400A (en) | Chemical mechanical grinding polishing pad dressing device and preparation method thereof | |
| CN103009273A (en) | Pyramid grinding plate | |
| TW562719B (en) | Conditioning pad allowing individual tuning of particles | |
| CN203509931U (en) | Chemical mechanical polishing dresser | |
| CN102990529A (en) | Two-sided repairing disc of chemical-mechanical polishing pad | |
| KR100869934B1 (en) | Manufacturing method of diamond grinder with a inclined grinding plane | |
| KR101147149B1 (en) | Polishing pad dresser | |
| CN220555077U (en) | Annular sleeve belt of diamond polishing wheel | |
| CN215394689U (en) | Polishing disc for metallographic grinding | |
| JP2011020182A (en) | Polishing tool suitable for pad conditioning, and polishing method using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice |
Addressee: Shenzhen Songyang Microelectronic Technology Co., Ltd. Document name: Notification to Pay the Fees |
|
| DD01 | Delivery of document by public notice |
Addressee: Shenzhen Songyang Microelectronic Technology Co., Ltd. Document name: Notification of Termination of Patent Right |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120104 Termination date: 20140125 |