CN209425259U - A kind of grinding wafer polissoir - Google Patents
A kind of grinding wafer polissoir Download PDFInfo
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- CN209425259U CN209425259U CN201920038412.2U CN201920038412U CN209425259U CN 209425259 U CN209425259 U CN 209425259U CN 201920038412 U CN201920038412 U CN 201920038412U CN 209425259 U CN209425259 U CN 209425259U
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Abstract
The utility model discloses a kind of grinding wafer polissoirs in field of semiconductor manufacture, including base, turntable has been rotatably coupled on base, scratch diskette is fixedly installed on turntable, the circular groove to match with wafer is offered on scratch diskette, wafer is placed in groove, the grinding base connecting with robotic transfer is correspondingly provided with above the scratch diskette, grinding stone is installed on grinding base, polishing fluid spray head is correspondingly equipped with the scratch diskette, the base is arranged in outer collection tank, outer collection tank is successively by front side board, left plate, back side panel and right side plate surround, front side board bottom is equipped with bottom plate, sliding slot is offered on each side plate, lifter plate is slidably connected in sliding slot, vertical cylinder is correspondingly provided with by lifter plate, the piston rod extension end of cylinder is sequentially connected by driver plate with corresponding lifter plate.When the utility model can prevent grinding and polishing wafer, polishing fluid around is splashed, to influence working environment.
Description
Technical field
The utility model belongs to field of semiconductor manufacture, in particular to a kind of grinding wafer polissoir.
Background technique
In the prior art, wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle,
Therefore referred to as wafer；It can be processed on silicon and is fabricated to various circuit component structures, and becoming has the integrated of specific electrical functionality
Circuit product.Wafer production includes that crystal bar manufacture and chip manufacture two big steps, it can be subdivided into following a few road master operations again,
Wherein crystal bar manufacture only includes the first following procedure, remaining all belongs to chip manufacture, so being referred to as them again sometimes and being
Crystal column is sliced postprocessing working procedures, which includes that crystal bar is grown up, crystal bar cuts and detects, outer diameter grinding, slice, round edge, surface layer
It grinds, etch, defect, polishing, cleaning is gone to examine, pack.It is generated when the purpose of grinding wafer is to remove cutting in wafer surface
Kerf and breakage, so that wafer surface is reached required finish.Disadvantage is that: current technique to wafer into
When row grinding, polishing fluid can disorderly splash everywhere, cause to pollute working environment, and polishing fluid can not be recycled,
Cause to grind increased costs.
Utility model content
The purpose of the utility model is to provide a kind of grinding wafer polissoirs, when can prevent grinding and polishing wafer, throw
Light liquid around is splashed, to influence working environment.
Purpose of the utility model is realized as follows: a kind of grinding wafer polissoir, including base, can turn on base
It is connected with turntable dynamicly, turntable is horizontally disposed, and scratch diskette is fixedly installed on turntable, offers on scratch diskette and wafer
The circular groove to match is placed with wafer in groove, and grinding of connecting with robotic transfer is correspondingly provided with above the scratch diskette
Seat is ground, grinding stone is installed on grinding base, is correspondingly equipped with polishing fluid spray head with the scratch diskette, the base setting is outside
In collection tank, outer collection tank is successively surrounded by front side board, left plate, back side panel and right side plate, front side board, left plate, after
The bottom of side plate and right side plate is equipped with bottom plate, and there are gap, the front side board, left plate, rear sides between base bottom and bottom plate
Sliding slot is offered on plate and right side plate, and lifter plate is slidably connected in sliding slot, is correspondingly provided with vertical cylinder by lifter plate,
Cylinder is located at outside outer collection tank, and the piston rod extension end of cylinder is sequentially connected by driver plate with corresponding lifter plate.
When utility model works, turntable drives wafer rotation, and mechanical hand-motion grinding stone is moved on the upside of wafer, throws
Light liquid spray head sprays polishing fluid towards wafer and grinding stone, and grinding stone grinds wafer；In grinding and polishing, cylinder is driven
Each lifter plate rises, and polishing fluid around is splashed when lifter plate can prevent turntable from rotating, and polishing fluid is blocked, so that polishing fluid
It flows back into outer collection tank.Compared with prior art, the utility model has the beneficial effects that: turntable rotation is ground
When polishing, lifter plate rises, and when can prevent grinding and polishing wafer, polishing fluid around is splashed；When turntable does not rotate, lifter plate
Decline avoids lifter plate prominent outside.
The bottom on the outside of the outer collection tank is connected with recovery tube as a further improvement of the utility model, recycling
It is connected inside pipe one end and outer collection tank, the other end of recovery tube is connected with polishing liquid case, and recovery tube is equipped with recycling
Pump polishes in liquid case and is contained with polishing fluid, and the upside for polishing liquid case is equipped with adding mouth, and the downside for polishing liquid case is equipped with drain；
Be connected with vertical liquid supply pipe on the upside of polishing liquid case, liquid supply pipe is equipped with solution feed pump, and feed flow tube end is connected with bleed pipe, spray head with
Tube end is sprayed to be connected.The polishing fluid collected in outer collection tank is recovered in polishing liquid case by recovery tube, polishes liquid case
Interior polishing fluid enters bleed pipe by liquid supply pipe, then sprays to wafer, grinding stone by spray head；It can be to polishing liquid case by adding mouth
Polishing fluid is added, polishing fluid can be vented by drain.
At least 2 springs are symmetrically arranged between the grinding base and grinding stone as a further improvement of the utility model,
The both ends of spring are connected with grinding base, grinding stone respectively.When grinding stone is to grinding wafer, spring can play buffer function, protect
Protect wafer.
The base inner is equipped with motor as a further improvement of the utility model, and the output end of motor is through shaft coupling
It is connect with the rotating shaft transmission of turntable.Motor drives turntable rotation.
It is set as round table-like on the upside of the base as a further improvement of the utility model, the rotary table Duan Heng of base
Sectional area is incremented by from top to bottom.Polishing fluid, toward when flowing down, can slide, finally down from scratch diskette along the rotary table section of base
It is collected by outer collection tank.
Detailed description of the invention
Fig. 1 is the cross-sectional view of the utility model left and right directions.
Fig. 2 is the utility model cross-sectional view in the front-back direction.
Fig. 3 is the top view of the utility model.
Wherein, 1 base, 2 turntables, 3 scratch diskettes, 4 wafers, 5 grinding bases, 5a grinding stone, 6 polishing fluid spray heads, 7 collect outside
Cabinet, 7a left plate, 7b right side plate, 7c front side board, 7d back side panel, 8 lifter plates, 9 cylinders, 10 driver plates, 11 recovery tubes, 11a
Recovery pump, 12 polishing liquid cases, 12a adding mouth, 12b drain, 13 liquid supply pipes, 13a solution feed pump, 14 bleed pipes, 15 springs, 16 electricity
Machine, 17 shaft couplings, 18 manipulators.
Specific embodiment
As shown in Figure 1-3, being a kind of grinding wafer polissoir, including base 1, rotation has been rotatably coupled on base 1
Turntable 2, turntable 2 is horizontally disposed, and scratch diskette 3 is fixedly installed on turntable 2, offers on scratch diskette 3 and matches with wafer 4
Circular groove, be placed with wafer 4 in groove, the grinding base 5 being sequentially connected with manipulator 18 be correspondingly provided with above scratch diskette 3,
Grinding stone 5a is installed on grinding base 5, is correspondingly equipped with polishing fluid spray head 6 with scratch diskette 3, base 1 is arranged in outer collecting box
In body 7, outer collection tank 7 is successively surrounded by front side board 7c, left plate 7a, back side panel 7d and right side plate 7b, front side board 7c, left side
The bottom of plate 7a, back side panel 7d and right side plate 7b are equipped with bottom plate, and there are gap, front side board 7c, a left side between 1 bottom of base and bottom plate
Sliding slot is offered on side plate 7a, back side panel 7d and right side plate 7b, slidably connects lifter plate 8 in sliding slot, it is right by lifter plate 8
Vertical cylinder 9 should be equipped with, cylinder 9 be located at outside outer collection tank 7, the piston rod extension end of cylinder 9 pass through driver plate 10 with it is right
Lifter plate 8 is answered to be sequentially connected.The bottom in outer 7 outside of collection tank is connected with recovery tube 11,11 one end of recovery tube and outer collecting box
It is connected inside body 7, the other end of recovery tube 11 is connected with polishing liquid case 12, and recovery tube 11 is equipped with recovery pump 11a, polishing
Polishing fluid is contained in liquid case 12, the upside of polishing liquid case 12 is equipped with adding mouth 12a, and the downside of polishing liquid case 12 is equipped with drain
12b；Vertical liquid supply pipe 13 is connected on the upside of polishing liquid case 12, liquid supply pipe 13 is equipped with solution feed pump 13a, the connection of 13 end of liquid supply pipe
There is bleed pipe 14, spray head is connected with 14 end of bleed pipe.At least 2 springs are symmetrically arranged between grinding base 5 and grinding stone 5a
15, the both ends of spring 15 are connected with grinding base 5, grinding stone 5a respectively.Motor 16, the output end of motor 16 are equipped with inside base 1
It is connect through shaft coupling 17 with the rotating shaft transmission of turntable 2.The upside of base 1 is set as round table-like, the rotary table section cross section of base 1
Product is incremented by from top to bottom.
When the present apparatus works, turntable 2 drives wafer 4 to rotate, and manipulator 18 drives grinding stone 5a to be moved on wafer 4
Side, polishing fluid spray head 6 spray polishing fluid towards wafer 4 and grinding stone 5a, and grinding stone 5a grinds wafer 4；It is thrown in grinding
Light time, cylinder 9 drive each lifter plate 8 to rise, and polishing fluid around is splashed when lifter plate 8 can prevent turntable 2 from rotating, and will polish
Liquid blocks, so that polishing fluid flows back into outer collection tank 7, the polishing fluid collected in outer collection tank 7 is returned by recovery tube 11
It receives in polishing liquid case 12, the polishing fluid polished in liquid case 12 enters bleed pipe 14 by liquid supply pipe 13, then sprays to crystalline substance by spray head
Circle 4, grinding stone 5a.The advantages of present apparatus is: when the rotation of turntable 2 is polished directly, lifter plate 8 rises, and can prevent
When grinding and polishing wafer 4, polishing fluid around is splashed；When turntable 2 does not rotate, lifter plate 8 declines, and lifter plate 8 is avoided to protrude
Outside.
The utility model is not limited to above-described embodiment, on the basis of technical solution disclosed by the utility model, this
For the technical staff in field according to disclosed technology contents, not needing creative labor can be special to some of which technology
Sign makes some replacements and deformation, these replacements and deformation are within the protection scope of the present utility model.
Claims (5)
1. a kind of grinding wafer polissoir, which is characterized in that including base, turntable has been rotatably coupled on base, has been revolved
Turntable is horizontally disposed, and scratch diskette is fixedly installed on turntable, the circular groove to match with wafer is offered on scratch diskette, recessed
It is placed with wafer in slot, is correspondingly provided with the grinding base connecting with robotic transfer above the scratch diskette, is equipped on grinding base
Grinding stone is correspondingly equipped with polishing fluid spray head with the scratch diskette, and the base is arranged in outer collection tank, outer collecting box
Body is successively surrounded by front side board, left plate, back side panel and right side plate, front side board, left plate, back side panel and right side plate bottom set
There is bottom plate, there are gap between base bottom and bottom plate, is offered on the front side board, left plate, back side panel and right side plate
Sliding slot slidably connects lifter plate in sliding slot, vertical cylinder is correspondingly provided with by lifter plate, cylinder is located at outer collection tank
Outside, the piston rod extension end of cylinder is sequentially connected by driver plate with corresponding lifter plate.
2. a kind of grinding wafer polissoir according to claim 1, which is characterized in that on the outside of the outer collection tank
Bottom is connected with recovery tube, is connected inside recovery tube one end and outer collection tank, the other end and the polishing liquid case phase of recovery tube
Connection, recovery tube are equipped with recovery pump, polish in liquid case and are contained with polishing fluid, and the upside for polishing liquid case is equipped with adding mouth, polishing
The downside of liquid case is equipped with drain；Vertical liquid supply pipe is connected on the upside of polishing liquid case, liquid supply pipe is equipped with solution feed pump, feed flow pipe end
Portion is connected with bleed pipe, and spray head is connected with tube end is sprayed.
3. a kind of grinding wafer polissoir according to claim 1 or 2, which is characterized in that the grinding base and grinding
At least 2 springs, the both ends of spring are symmetrically arranged between stone to be connected with grinding base, grinding stone respectively.
4. a kind of grinding wafer polissoir according to claim 1 or 2, which is characterized in that the base inner is equipped with
The output end of motor, motor is connected through the rotating shaft transmission of shaft coupling and turntable.
5. a kind of grinding wafer polissoir according to claim 1 or 2, which is characterized in that set on the upside of the base
It is set to round table-like, the rotary table section cross-sectional area of base is incremented by from top to bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920038412.2U CN209425259U (en) | 2019-01-10 | 2019-01-10 | A kind of grinding wafer polissoir |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920038412.2U CN209425259U (en) | 2019-01-10 | 2019-01-10 | A kind of grinding wafer polissoir |
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| Publication Number | Publication Date |
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| CN209425259U true CN209425259U (en) | 2019-09-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920038412.2U Active CN209425259U (en) | 2019-01-10 | 2019-01-10 | A kind of grinding wafer polissoir |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110640623A (en) * | 2019-09-27 | 2020-01-03 | 武汉新芯集成电路制造有限公司 | Splash guard and chemical mechanical polishing machine |
| CN112621558A (en) * | 2020-12-17 | 2021-04-09 | 寻瀚之 | Grinding and polishing device and polishing process |
| CN118060983A (en) * | 2024-04-19 | 2024-05-24 | 福建兴翼智能装备股份有限公司 | Grinding polisher and use method thereof |
-
2019
- 2019-01-10 CN CN201920038412.2U patent/CN209425259U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110640623A (en) * | 2019-09-27 | 2020-01-03 | 武汉新芯集成电路制造有限公司 | Splash guard and chemical mechanical polishing machine |
| CN112621558A (en) * | 2020-12-17 | 2021-04-09 | 寻瀚之 | Grinding and polishing device and polishing process |
| CN118060983A (en) * | 2024-04-19 | 2024-05-24 | 福建兴翼智能装备股份有限公司 | Grinding polisher and use method thereof |
| CN118060983B (en) * | 2024-04-19 | 2024-06-21 | 福建兴翼智能装备股份有限公司 | Grinding polisher and use method thereof |
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