CN203639538U - 具有阳极壳体的磁控管溅射刻蚀设备 - Google Patents
具有阳极壳体的磁控管溅射刻蚀设备 Download PDFInfo
- Publication number
- CN203639538U CN203639538U CN201320509601.6U CN201320509601U CN203639538U CN 203639538 U CN203639538 U CN 203639538U CN 201320509601 U CN201320509601 U CN 201320509601U CN 203639538 U CN203639538 U CN 203639538U
- Authority
- CN
- China
- Prior art keywords
- substrate
- equipment
- shielding
- dialogues
- told
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201210107630 DE102012107630B3 (de) | 2012-08-20 | 2012-08-20 | Magnetronsputterätzvorrichtung mit Anodengehäuse und Anlage zur Vakuumbehandlung von bandförmigen Substraten |
DE102012107630.8 | 2012-08-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN203639538U true CN203639538U (zh) | 2014-06-11 |
Family
ID=49880081
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201320509601.6U Expired - Fee Related CN203639538U (zh) | 2012-08-20 | 2013-08-20 | 具有阳极壳体的磁控管溅射刻蚀设备 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN203639538U (zh) |
DE (1) | DE102012107630B3 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013114118B4 (de) | 2013-12-16 | 2018-09-06 | VON ARDENNE Asset GmbH & Co. KG | Plasmabehandlungsvorrichtung |
WO2021160337A1 (en) * | 2020-02-11 | 2021-08-19 | Oerlikon Surface Solutions Ag, Pfäffikon | Method of surface smoothening of additive manufactured metal components |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007004760A1 (de) * | 2007-01-31 | 2008-08-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung und Verfahren zum Beschichten von plattenförmigen oder bandförmigen metallischen Substraten |
-
2012
- 2012-08-20 DE DE201210107630 patent/DE102012107630B3/de not_active Expired - Fee Related
-
2013
- 2013-08-20 CN CN201320509601.6U patent/CN203639538U/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE102012107630B3 (de) | 2014-01-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9133540B2 (en) | Apparatus for removing pollutant source from snout of galvanizing line | |
US9404176B2 (en) | Substrate support with radio frequency (RF) return path | |
JP4889957B2 (ja) | プラズマ生成装置におけるドロップレット除去装置及びドロップレット除去方法 | |
US20030173217A1 (en) | High-power ion sputtering magnetron | |
CN203639538U (zh) | 具有阳极壳体的磁控管溅射刻蚀设备 | |
CN101641765A (zh) | 具有电绝缘的托板和阳极组件的沉积系统 | |
CN104024471B (zh) | 溅射装置 | |
EP1212785B1 (en) | Apparatus for forming polymer continuously on the surface of metal by dc plasma polymerization | |
JPH06503855A (ja) | 回転マグネトロンスパッタリングシステムにおけるアーク抑制のためのシールディング | |
CN1896300A (zh) | 用于大面积衬底的低压溅射 | |
EP1978127A1 (en) | Spattering device and film forming method | |
JPS6184371A (ja) | 陰極スパツタリング装置のスパツタリング装置 | |
US20130068614A1 (en) | Sputter deposition apparatus | |
US9340866B2 (en) | Substrate support with radio frequency (RF) return path | |
CN1977353B (zh) | 利用可运动的平坦的中间电极进行雾化的装置和方法 | |
US5540823A (en) | Magnetron cathode | |
CN201495278U (zh) | 电动引弧间接冷却式阴极电弧离子源 | |
JP2008501863A5 (ja) | 可動な平らなターゲットを用いて材料を飛散させるためのスパッタ装置及び方法 | |
US20190252161A1 (en) | Method and reactor design for large-area vhf plasma processing with improved uniformity | |
CN111417741B (zh) | 溅射成膜装置 | |
RU110088U1 (ru) | Устройство для нанесения покрытий в вакууме | |
TWI659445B (zh) | 射頻(rf)-濺鍍沉積源、沉積設備及其之組裝方法 | |
JP2012035302A (ja) | 電子ビーム照射装置 | |
CN117355921A (zh) | 用于等离子体处理的方法和设备 | |
CN1653203A (zh) | 涂覆设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Dresden Patentee after: VON ARDENNE GmbH Address before: Dresden Patentee before: Feng Adenauer Vacuum Technology Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20181224 Address after: Dresden Patentee after: VON ARDENNE GmbH Address before: Dresden Patentee before: VON ARDENNE GMBH |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140611 Termination date: 20180820 |