CN203561934U

CN203561934U - 3U high-speed back board based on VPX bus

Info

Publication number: CN203561934U
Application number: CN201320766635.3U
Authority: CN
Inventors: 不公告发明人
Original assignee: BEIJING HUA KEBO BOCHUANG TECHNOLOGY Co Ltd
Current assignee: BEIJING HUA KEBO BOCHUANG TECHNOLOGY Co Ltd
Priority date: 2013-11-29
Filing date: 2013-11-29
Publication date: 2014-04-23
Anticipated expiration: 2023-11-29

Abstract

The utility model provides a 3U high-speed back board based on VPX bus and aims to solve the problem that traditional parallel bus in the aerospace aviation field cannot satisfy the requirements of large band width and high speed and the miniaturization and high reliability requirements of spaceborne computers. The 3U high-speed back board adopts the VPX bus technology and utilizes modern industrial standard serial switching structures such as RapidIO and Advanced Switching Interconnect. The 3U high-speed back board comprises seven slots and is compatible with one master control board, one power supply board and five functional boards, wherein the first slot is the master control board slot, the seventh slot is the power supply board slot, the rest slots are functional board slots, and the distance between every two slots is 21.59mm. Each functional plate is provided with an interconnect PCIeX4 differential line interface. The functional slots are externally respectively connected to four XMC connector and one FMC connector. The 3U high-speed back board has the advantages that back board bending can be prevented effectively, and the problem that high-speed connectors are damages easily during compression joint is solved.

Description

A kind of 3U High speed rear panel based on VPX bus

Technical field

The utility model relates to a kind of 3U High speed rear panel based on VPX bus, belongs to computer realm, provide a VPX of meeting standard, can compatible difference in functionality board High speed rear panel.

Background technology

Along with the develop rapidly of integrated circuit, computing machine treatment technology and software engineering, the data handling system platform of field of aerospace presents following development trend: communication bandwidth is more and more wider, transfer rate is more and more higher, real-time handling property is also had higher requirement to the performance of processing platform.Therefore, need data processing platform (DPP) to there is higher bus transfer bandwidth, stronger arithmetic capability and data exchange capability more flexibly.And processing platform (as CPCI(Compact Peripheral Component Interconnect), VME(Versa Module Eurocard based on the shared parallel bus of traditional classification) platform such as), Bus Clock Rate and bus interface width have determined that the key property of processing platform is doomed to meet these new demands.

VPX is the senior computing platform standard of the next generation requiring in order to meet high reliability under rugged surroundings, high bandwidth of being organized to set up by VITA, intermodule has defined the high-speed serial bus such as Serial RapidIO, PCI Express, Fibre Channel, InfiniBand, Hyper-transport, 10GB Ethernet, transfer rate can be up to 30Gbps, and there are superpower data and go out Ali's ability, can fully solve above new demand, therefore, the general ruggedized computer based on VPX framework is the developing direction of following field of aerospace data handling system.

Summary of the invention

The purpose of this utility model is to provide a kind of 3U High speed rear panel based on VPX bus for the deficiencies in the prior art, and it is a kind of High speed rear panel that is applicable to master control borad, power panel and meets the feature board of VITA46 standard.

Its technical scheme is as follows: a kind of 3U High speed rear panel based on VPX bus, this High speed rear panel comprises 7 groove positions, compatible 1 master control borad, 1 block power supply plate and 5 feature boards, the first groove position on described High speed rear panel is master control board slot position, the 7th groove position is power supply board slot position, second and third, four, five, six groove positions are function board slot position, distance between plates is 21.59mm; Between each feature board, there is interconnected PCIe X4 differential lines interface; On described backboard, 5 function board slot positions are externally connected respectively on 4 XMC connectors and 1 FMC connector.

In 5 described feature boards, maximum 2 feature boards are for storing plate.

Described backboard is a kind of passive backplane, can improve stability and the reliability of backboard.

The FMC connector that described backboard adopts is high number of pins (HPC) connector with 400 pins; Externally the high energy of output speed reaches 30Gbps, can effectively prevent that backboard is crooked, and holds flimsy problem while having solved high speed connector crimping.

The beneficial effects of the utility model are as follows: the external the highest 30Gbps of output speed theory, and added Design of Reinforcement between each groove position, can effectively prevent that backboard is crooked, and hold flimsy problem while having solved high speed connector crimping.

Accompanying drawing explanation

Fig. 1 is the PCB schematic diagram of the utility model design;

Fig. 2 is the connector front elevation that the utility model is used;

Fig. 3 is the connector vertical view that the utility model is used;

Fig. 4 is the register pin that the utility model is used;

Fig. 5 is the XMC connector that the utility model is used;

Fig. 6 is that XMC connector is from the cut-open view of A-A face;

Fig. 7 is the FMC connector that the utility model is used.

Specific implementation

As shown in Figure 1, the groove position 1 on backboard is defined as master control board slot position, and groove position 7 is defined as power supply board slot position, and

groove position

2,3,4,5,6 is defined as feature board, and maximum two of this feature board is memory board, consider wiring and the impact of dispelling the heat, distance between plates designs according to 21.59mm, 9, 10, 11, with 12 be 4 XMC connectors, 8 is FMC connector, on backboard, function board slot position is externally connected respectively on 4 XMC and 1 FMC connector, wherein, FMC connector is responsible for

groove position

4, 5, the IO signal wire of 6 three groove positions, wherein, FMC connector need to be supported LPC(Low Pin Count) the FMC daughter board of interface, therefore the signal of LPC must all be drawn from a feature board, in multi-purpose computer, adopt groove position 4 to support the FMC of LPC, therefore groove position 4 need to be according to LPC interface requirement, draw 39 pairs of differential signals, 7 single-ended signals and, between each feature board, there is interconnected PCIe X4 differential lines interface, .

The compatible OpenVPX 3U standard in

groove position

1,2,3,4,5,6 of the backboard in the utility model, groove position 7 meets VITA 62 standards, and for power panel, wherein, master control borad and power panel are positioned at both sides, are easy to heat radiation, and feature board slot can be general.

Backboard of the present utility model adopts passive design, improves backboard reliability, outlet after realizing by 4 XMC connectors, 1 FMC connector.

It is interconnected that backboard function board slot of the present utility model adopts LVDS signal wire to carry out between plate signal, and this backboard high-speed data communication bus comprises: 6 road X4 PCI-Express, 2 road GE electrical interfaces and 4 road SATA 3.

Claims

1. the 3U High speed rear panel based on VPX bus, it is characterized in that: this High speed rear panel comprises 7 groove positions, compatible 1 master control borad, 1 block power supply plate and 5 feature boards, the first groove position on described High speed rear panel is master control board slot position, the 7th groove position is power supply board slot position, second and third, four, five, six groove positions are function board slot position, separation is 21.59mm, has interconnected PCIe X4 differential lines interface between each feature board; On described backboard, 5 function board slot positions are externally connected respectively on 4 XMC connectors and 1 FMC connector.

2. a kind of 3U High speed rear panel based on VPX bus as claimed in claim 1, is characterized in that: in 5 described feature boards, maximum 2 feature boards are for storing plate.

3. a kind of 3U High speed rear panel based on VPX bus as claimed in claim 1, is characterized in that: backboard is a kind of passive backplane.

4. a kind of 3U High speed rear panel based on VPX bus as claimed in claim 1, is characterized in that: FMC connector is high number of pins (HPC) connector with 400 pins.