CN203553155U - Integrated circuit package with antistatic protection - Google Patents
Integrated circuit package with antistatic protection Download PDFInfo
- Publication number
- CN203553155U CN203553155U CN201320739991.6U CN201320739991U CN203553155U CN 203553155 U CN203553155 U CN 203553155U CN 201320739991 U CN201320739991 U CN 201320739991U CN 203553155 U CN203553155 U CN 203553155U
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- CN
- China
- Prior art keywords
- lead frame
- antistatic
- integrated circuit
- polyvinyl chloride
- chloride film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model relates to integrated circuit package with antistatic protection, which comprises a lead frame, a chip carrying board, a chip and a pin. The bottom of the lead frame is provided with two insertion holes; the inner side wall of the insertion hole is provided with hook grooves; the bottom of the lead frame is provided with a ceramic base; the surface of the ceramic base is provided with two insertion blocks; the upper opening edge of the insertion block is provided with a hook strip matched with the hook groove; an antistatic polyvinyl chloride film covers the outer surface of the lead frame; an organosilicone pressure-sensitive adhesive layer is arranged between the antistatic polyvinyl chloride film and the outer surface of the lead frame; a plurality of tilting cooling holes are transversely arranged on the bottom surface of the ceramic base; and the tilting angle of the cooling hole is 30 DEG to 40 DEG. When the integrated circuit package with antistatic protection is adopted, the integrated circuit after package is antistatic during the use process, and the phenomenon that the integrated circuit is damaged can be avoided.
Description
Technical field
The utility model relates to the field of integrated circuit, especially a kind of integrated antenna package with antistatic protection.
Background technology
Integrated antenna package not only plays bonding point and the outside effect being electrically connected in integrated circuit (IC) chip; also for integrated circuit (IC) chip provides a reliable and stable operational environment; integrated circuit (IC) chip is played to the effect of machinery or environmental protection; thereby the function that integrated circuit (IC) chip can be brought into normal play, and guarantee that it has high stability and reliability.In a word, the quality of integrated antenna package quality is very large to the good and bad relation of the overall performance of integrated circuit.Therefore, encapsulation should have stronger mechanical performance, good electric property, heat dispersion and chemical stability.
The integrated circuit using at present does not possess the function destaticing, because static is for integrated circuit, the damage causing is often but to restore permanent being difficult to, the energy that static discharge produces is conventionally even as big as destroying the circuit of integrated circuit, cause the complete failure of integrated circuit, or cause integrated circuit to operate in immesurable mode, or in integrated circuit, produce defect and cause the lost of life of integrated circuit.
Summary of the invention
The technical problems to be solved in the utility model is: in order to overcome the problem of above-mentioned middle existence, provide a kind of integrated antenna package with antistatic protection, its project organization rationally and in use can avoid occurring static.
The utility model solves the technical scheme that its technical problem adopts: a kind of integrated antenna package with antistatic protection, comprise lead frame, be located at slide glass plate and the lead-in wire that is stacked in the chip on slide glass plate and is connected with chip on lead frame, described lead frame bottom offers two jacks, on the madial wall of jack, offer hook groove, described lead frame bottom is provided with base of ceramic, the surface of base of ceramic is provided with two inserted blocks, the edge suitable for reading of inserted block is provided with the hook bar matching with hook groove, on the outer surface of described lead frame, be coated with antistatic polyvinyl chloride film, between antistatic polyvinyl chloride film and the outer surface of lead frame, be provided with organic pressure-sensitive gel layer, on described base of ceramic bottom surface, laterally offer a plurality of tilting louvres, the angle of inclination of its louvre is 30～40 °.
Further, the thickness of described antistatic polyvinyl chloride film is 0.2mm.
In order to realize better radiating effect, the angle of inclination of described louvre is 35 °.
Further, the thickness of described organic pressure-sensitive gel layer is 0.1mm.
The beneficial effects of the utility model are: described a kind of integrated antenna package with antistatic protection; adopt the integrated antenna package of this kind of design; in use, can the integrated circuit after encapsulation finishes possess the object of antistatic, avoid occurring the damage phenomenon of integrated circuit.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is a kind of overall structure schematic diagram with the integrated antenna package of antistatic protection described in the utility model;
Fig. 2 is a kind of front view with the integrated antenna package of antistatic protection described in the utility model.
Accompanying drawing acceptance of the bid note is described below: 1, lead frame, 2, slide glass plate, 3, chip, 4, lead-in wire, 5, jack, 6, hook groove, 7, base of ceramic, 8, inserted block, 9, hook bar, 10, antistatic polyvinyl chloride film, 11, organic pressure-sensitive gel layer, 12, louvre.
Embodiment
By reference to the accompanying drawings the utility model is described in further detail now.These accompanying drawings are the schematic diagram of simplification, basic structure of the present utility model is only described in a schematic way, so it only show the formation relevant with the utility model.
A kind of integrated antenna package with antistatic protection as depicted in figs. 1 and 2, comprise lead frame 1, be located at slide glass plate and the lead-in wire 4 that is stacked in the chip 3 on slide glass plate 2 and is connected with chip 3 on lead frame 1, lead frame 1 bottom offers two jacks 5, on the madial wall of jack 5, offer hook groove 6, lead frame 1 bottom is provided with base of ceramic 7, the surface of base of ceramic 7 is provided with two inserted blocks 8, the edge suitable for reading of inserted block 8 is provided with the hook bar 9 matching with hook groove 6, on the outer surface of lead frame 1, be coated with antistatic polyvinyl chloride film 10, the thickness of antistatic polyvinyl chloride film 10 is 0.2mm, between the outer surface of antistatic polyvinyl chloride film 10 and lead frame 1, be provided with organic pressure-sensitive gel layer 11, the thickness of organic pressure-sensitive gel layer 11 is 0.1mm, on base of ceramic 7 bottom surfaces, laterally offer a plurality of tilting louvres 12, the angle of inclination of its louvre 12 is 35 °.
A kind of integrated antenna package with antistatic protection of the present utility model; the effect matching with inserted block 8 by jack 5 in the bottom of lead frame 1; base of ceramic 7 is combined with lead frame 1; base of ceramic 7 can be realized the object of insulation; and play the effect of antistatic; at the peripheral coated antistatic polyvinyl chloride film 10 of lead frame 1, thereby in use, can more reduce the generation of static.
The above-mentioned foundation desirable embodiment of the present utility model of take is enlightenment, and by above-mentioned description, relevant staff can, within not departing from the scope of this utility model technological thought, carry out various change and modification completely.The technical scope of this utility model is not limited to the content on specification, must determine its technical scope according to claim scope.
Claims (4)
1. an integrated antenna package with antistatic protection, comprise lead frame (1), be located at slide glass plate and the lead-in wire (4) that is stacked in the chip (3) on slide glass plate (2) and is connected with chip (3) on lead frame (1), it is characterized in that: described lead frame (1) bottom offers two jacks (5), on the madial wall of jack (5), offer hook groove (6), described lead frame (1) bottom is provided with base of ceramic (7), the surface of base of ceramic (7) is provided with two inserted blocks (8), the edge suitable for reading of inserted block (8) is provided with the hook bar (9) matching with hook groove (6), on the outer surface of described lead frame (1), be coated with antistatic polyvinyl chloride film (10), between the outer surface of antistatic polyvinyl chloride film (10) and lead frame (1), be provided with organic pressure-sensitive gel layer (11), described base of ceramic (7) laterally offers a plurality of tilting louvres (12) on bottom surface, the angle of inclination of its louvre (12) is 30～40 °.
2. a kind of integrated antenna package with antistatic protection according to claim 1, is characterized in that: the thickness of described antistatic polyvinyl chloride film (10) is 0.2mm.
3. a kind of integrated antenna package with antistatic protection according to claim 1, is characterized in that: the angle of inclination of described louvre (12) is 35 °.
4. a kind of integrated antenna package with antistatic protection according to claim 1, is characterized in that: the thickness of described organic pressure-sensitive gel layer (11) is 0.1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320739991.6U CN203553155U (en) | 2013-11-20 | 2013-11-20 | Integrated circuit package with antistatic protection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320739991.6U CN203553155U (en) | 2013-11-20 | 2013-11-20 | Integrated circuit package with antistatic protection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203553155U true CN203553155U (en) | 2014-04-16 |
Family
ID=50471235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320739991.6U Expired - Fee Related CN203553155U (en) | 2013-11-20 | 2013-11-20 | Integrated circuit package with antistatic protection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203553155U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106057741A (en) * | 2016-07-21 | 2016-10-26 | 柳州首光科技有限公司 | Multifunctional protection structure of integrated circuit |
-
2013
- 2013-11-20 CN CN201320739991.6U patent/CN203553155U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106057741A (en) * | 2016-07-21 | 2016-10-26 | 柳州首光科技有限公司 | Multifunctional protection structure of integrated circuit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140416 Termination date: 20171120 |