CN204966492U - Packaging structure of miniature SD card - Google Patents
Packaging structure of miniature SD card Download PDFInfo
- Publication number
- CN204966492U CN204966492U CN201520267856.5U CN201520267856U CN204966492U CN 204966492 U CN204966492 U CN 204966492U CN 201520267856 U CN201520267856 U CN 201520267856U CN 204966492 U CN204966492 U CN 204966492U
- Authority
- CN
- China
- Prior art keywords
- substrate
- miniature
- control chip
- chip
- storage chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004806 packaging method and process Methods 0.000 title abstract 2
- 239000002184 metal Substances 0.000 claims abstract description 14
- 230000017525 heat dissipation Effects 0.000 claims abstract description 8
- 239000004033 plastic Substances 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 43
- 101100095075 Arabidopsis thaliana SBT1.2 gene Proteins 0.000 claims description 7
- 101100532804 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) SDD1 gene Proteins 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 abstract description 4
- 239000004593 Epoxy Substances 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
The utility model provides a packaging structure of miniature SD card, it is main including a base plate, the centre is provided with naked metal heat dissipation dish, both sides respectively set up four current potential pins, memory chip arranges in on the base plate heat dissipation dish, control chip piles up on memory chip, many wire electric connection are between base plate and memory chip, between memory chip and the control chip, between control chip and the base plate, the base plate is together with memory chip, wire and control chip are wrapped up by epoxy, form the plastic body. The utility model provides an occupation space that the circuit had not only been saved to miniature SD card has also improved the degree of integrating of encapsulation simultaneously, and it is little to have satisfied cell size, with low costs, advantages such as low power dissipation.
Description
Technical field
The utility model relates to a kind of SD card, particularly relates to a kind of encapsulating structure of miniature SD card.
Background technology
SD card is as a kind of memory device of new generation of based semiconductor fast-flash memory device, it is widely used on mancarried device, along with electronic device integration degree is constantly deepened and electronic product is tending towards miniaturization, this also means that the miniaturization of memory device is development trend, and this not only requires that the miniaturization of single product is also had higher requirement to the encapsulation technology of electronic device.
Summary of the invention
The utility model provides a kind of encapsulating structure of miniature SD card, utilizes NandFlash as storage medium, and carry out space compression to traditional SD card encapsulation, meet cell size little, cost is low, low in energy consumption, demand capacious.
The utility model is achieved in that a kind of encapsulating structure of miniature SD card, mainly comprises a substrate, storage chip, control chip, multiple conducting wires and plastic body.Described substrate, centre is provided with exposed heat dissipation metal dish, and both sides respectively arrange four current potential pins; Described storage chip is placed on substrate heat dissipation plate; Described control chip is stacked on storage chip; Described wire is electrically connected between substrate and storage chip, between storage chip and control chip, between control chip and substrate; Described substrate is together with storage chip, and control chip and wire are wrapped up by epoxy resin, forms plastic body;
Described substrate is QFN lead frame and Substrate printed circuit board (PCB);
Described storage chip is Nandflashmemory;
Described substrate is while go up metal pad SDD2, SDD3, CLK, VSS Nb corresponding with on storage chip ... .. be electrically connected by wire, pin position corresponding with metal pad CMD, SDD0, SDD1, VCC on substrate another side on storage chip is first electrically connected by wire with the pad on control chip, and control chip is electrically connected with metal pad CMD, SDD0, SDD1, the VCC on substrate by wire again;
Between described substrate and storage chip, between storage chip and control chip, the electric connection between control chip with substrate is straight line and is connected, and wire is non-intersect;
Described SD card is micro-volume, and the length and width of body, thickness are respectively 8 ~ 20mm, 7 ~ 20mm, 0.8 ~ 1mm.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is described in further detail, in accompanying drawing:
Fig. 1 is the utility model encapsulating structure schematic diagram;
Fig. 2 is the utility model encapsulation vertical view;
Fig. 3 is that the utility model stores card base position connection definition figure.
Embodiment
Below in conjunction with accompanying drawing shownschematically preferred embodiment be described in further detail.
The utility model provides a kind of encapsulating structure of miniature SD card, mainly comprises a substrate 1, storage chip 2, control chip 3, multiple conducting wires 4 and plastic body 5.As Fig. 2, described substrate 1, centre is provided with exposed heat dissipation metal dish 6, and both sides respectively arrange four current potential pins 7(SSD2, SDD3, CLK, VSS, CMD, SDD0, SDD1, VCC); Described storage chip 2 is placed on substrate 1 heat dissipation plate 6; Described control chip 3 is stacked on storage chip 2; As Fig. 3, described wire 4 is electrically connected between substrate 1 and storage chip 2, between storage chip 2 and control chip 3, between control chip 3 and substrate 1; As Fig. 1, described substrate 1 is together with storage chip 2, and control chip 3 and wire 4 are wrapped up by epoxy resin, forms plastic body 5;
Described substrate 1 is QFN lead frame and Substrate printed circuit board (PCB);
Described storage chip 2 is Nandflashmemory;
Described substrate 1 is while go up metal pad SDD2, SDD3, CLK, VSS Nb corresponding with on storage chip 2 ... .. be electrically connected by wire 4, pin position corresponding with metal pad CMD, SDD0, SDD1, VCC on substrate 1 another side on storage chip 2 is first electrically connected by wire 4 with the pad on control chip 3, and control chip 3 is electrically connected with metal pad CMD, SDD0, SDD1, the VCC on substrate 1 by wire 4 again;
Between described substrate 1 and storage chip 2, between storage chip 2 and control chip 3, the electric connection between control chip 3 with substrate 1 is straight line and is connected, and wire 4 is non-intersect;
Described SD card is micro-volume, and the length and width of body, thickness are respectively 8 ~ 20mm, 7 ~ 20mm, 0.8 ~ 1mm.
Above-mentioned implementation procedure is preferential implementation procedure of the present utility model, and the usual change that those skilled in the art carries out on the basis that this is practical and replacement are included within protection range of the present utility model.
Claims (11)
1. an encapsulating structure for miniature SD card, is characterized in that mainly comprising a substrate, storage chip, control chip, multiple conducting wires and plastic body, storage chip is placed on substrate, and control chip is stacked on storage chip, multiple conducting wires is electrically connected between substrate and storage chip, between storage chip and control chip, between control chip and substrate, substrate is together with storage chip, wire and control chip are wrapped up by epoxy resin, form plastic body.。
2. the encapsulating structure of miniature SD card according to claim 1, is characterized in that, described substrate, and centre is provided with exposed heat dissipation metal dish, and both sides respectively arrange four metal pads and current potential pin.
3. the encapsulating structure of miniature SD card according to claim 1, is characterized in that, described storage chip is placed on substrate heat dissipation plate.
4. the encapsulating structure of miniature SD card according to claim 1, is characterized in that, described control chip is stacked on storage chip.
5. the encapsulating structure of miniature SD card according to claim 1, is characterized in that, described wire is electrically connected between substrate and storage chip, between storage chip and control chip, between control chip and substrate.
6. the encapsulating structure of miniature SD card according to claim 1, is characterized in that, described substrate is together with storage chip, and wire and control chip are wrapped up by epoxy resin, forms plastic body.
7. the encapsulating structure of miniature SD card according to claim 1, is characterized in that, described SD card is micro-volume, and the length and width of body, thickness are respectively 8 ~ 20mm, 7 ~ 20mm, 0.8 ~ 1mm.
8. miniature SD card encapsulating structure according to claim 2, is characterized in that, described substrate is QFN lead frame and Substrate printed circuit board (PCB).
9. miniature SD card encapsulating structure according to claim 3, is characterized in that, described storage chip is Nandflashmemory.
10. the encapsulating structure of miniature SD card according to claim 5, it is characterized in that, described substrate is while go up metal pad SDD2, SDD3, CLK, VSS Nb corresponding with on storage chip ... .. be electrically connected by wire, pin position corresponding with metal pad CMD, SDD0, SDD1, VCC on substrate another side on storage chip is first electrically connected by wire with the pad on control chip, and control chip is electrically connected with metal pad CMD, SDD0, SDD1, the VCC on substrate by wire again.
The encapsulating structure of 11. miniature SD cards according to claim 5, is characterized in that, between described substrate and storage chip, between storage chip and control chip, the electric connection between control chip with substrate is straight line and is connected, and wire is non-intersect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520267856.5U CN204966492U (en) | 2015-04-29 | 2015-04-29 | Packaging structure of miniature SD card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520267856.5U CN204966492U (en) | 2015-04-29 | 2015-04-29 | Packaging structure of miniature SD card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204966492U true CN204966492U (en) | 2016-01-13 |
Family
ID=55061540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520267856.5U Active CN204966492U (en) | 2015-04-29 | 2015-04-29 | Packaging structure of miniature SD card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204966492U (en) |
-
2015
- 2015-04-29 CN CN201520267856.5U patent/CN204966492U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200819 Address after: B203, building of Shenzhen industry university research base, Huazhong University of science and technology, No.9, Yuexing Third Road, high tech Zone community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Xintan Technology Co.,Ltd. Address before: Room 3A401 building A 518000 Guangdong Tairan industry of Shenzhen Province, Futian District City, Che Kung Temple Patentee before: DTT TECHNOLOGY CHINA Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220720 Address after: 518000 303, Sichuang science and technology building, No. 021, Gaoxin South 1st Road, high tech Zone community, Yuehai street, Nanshan District, Shenzhen, Guangdong Province Patentee after: Shenzhen Xinfu Technology Co.,Ltd. Address before: B203, Shenzhen industry university research base building, Huazhong University of science and technology, No.9, Yuexing Third Road, high tech Zone community, Yuehai street, Nanshan District, Shenzhen, Guangdong 518000 Patentee before: Shenzhen Xintan Technology Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240510 Address after: 518000, 10th floor, Building 3, Changyi Industrial Plant, No.1 Lirong Road, Xinshi Community, Dalang Street, Longhua District, Shenzhen City, Guangdong Province Patentee after: Xintetong (Shenzhen) Semiconductor Co.,Ltd. Country or region after: China Address before: 518000 303, Sichuang science and technology building, No. 021, Gaoxin South 1st Road, high tech Zone community, Yuehai street, Nanshan District, Shenzhen, Guangdong Province Patentee before: Shenzhen Xinfu Technology Co.,Ltd. Country or region before: China |
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| TR01 | Transfer of patent right |