CN201984958U - Ceramic capacitor - Google Patents
Ceramic capacitor Download PDFInfo
- Publication number
- CN201984958U CN201984958U CN201120004838XU CN201120004838U CN201984958U CN 201984958 U CN201984958 U CN 201984958U CN 201120004838X U CN201120004838X U CN 201120004838XU CN 201120004838 U CN201120004838 U CN 201120004838U CN 201984958 U CN201984958 U CN 201984958U
- Authority
- CN
- China
- Prior art keywords
- ceramic capacitor
- layer
- resin
- utility
- capacitor body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
The utility model relates to a ceramic capacitor, comprising a ceramic capacitor body and a resin encapsulating layer encapsulating outside the ceramic capacitor body, wherein a cushioning material layer is also arranged between the ceramic capacitor body and the resin encapsulating layer. Compared with the prior art, in the ceramic capacitor, since the cushioning material layer is also arranged between the ceramic capacitor body and the resin encapsulating layer, a manufactured product has excellent vibration absorption and cushioning performances, and further the damage of die pressing, transportation and use impact on the capacitor is avoided.
Description
Technical field
The utility model relates to a kind of ceramic capacitor.
Background technology
Ceramic capacitor is except that the general character characteristics that have capacitor " to hand over every straight-through ", and it also has, and volume is little, specific volume is big, the life-span is long, reliability is high, be fit to characteristics such as mounted on surface.Along with the develop rapidly of world's electron trade, as the base components of electron trade, ceramic capacitor also advances with surprising rapidity, and is annual with 10%~15% speed increase.At present, the demand of world's ceramic capacitor is more than 2,000 hundred million, and 70% comes from Japan, secondly is American-European and Southeast Asia (containing China).Along with sheet holds the raising of product reliability and integrated level, the scope of its use is more and more wider, is widely used in various military-civil complete electronic sets and electronic equipment, as computer, phone, stored-program control exchange, accurate tester, radar communication etc.
Ceramic capacitor often adopts resin-molded encapsulation, because the coefficient of expansion of resin is much higher than ceramic chip, with resin ceramic capacitor is encapsulated and the use meeting because the variation of vibration, temperature, humidity, the generation of various unstable situations such as cause that ceramic chip breaks, and the impact to ceramic chip when mold pressing is very big, cause product defective easily, cause production cost to improve.
The utility model content
Main purpose of the present utility model is to overcome the shortcoming of prior art, and a kind of ceramic capacitor with improved encapsulating structure is provided, and it has good weatherability and insulating properties.
The utility model adopts following technical scheme:
A kind of ceramic capacitor includes the ceramic capacitor body and is encapsulated in this external resin-encapsulate layer of this ceramic capacitor, also is provided with one deck cushioned material layer between this ceramic capacitor body and this resin-encapsulate layer.
Described resin-encapsulate layer is epoxy resin enclosed layer.
Described cushioned material layer is silicone, bonder or red glue.
By above-mentioned to description of the present utility model as can be known, compared with prior art, a kind of ceramic capacitor of the present utility model is owing to also be provided with one deck cushioned material layer between ceramic capacitor body and resin-encapsulate layer, make the product that makes have extremely excellent shock-absorbing and resiliency, avoided mold pressing and transportation, use to impact the damage that capacitor is caused; Have extremely excellent insulating properties and excellent moisture effect, for capacitor provides sufficient protection; Have splendid weatherability, can resist various bad weathers and extreme temperature, material can ageing hardening, split, peel off, and gives full play to the stability in use and the reliability of capacitor.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment.
Embodiment
Below the utility model will be further described by embodiment.
With reference to Fig. 1, a kind of ceramic capacitor of the present utility model, include ceramic capacitor body 10 and the epoxy resin enclosed layer 20 that is encapsulated in outside the ceramic capacitor body 10, between ceramic capacitor body 10 and epoxy resin enclosed layer 20, also be provided with one deck cushioned material layer 30.Ceramic capacitor body 10 is made up of multicore group ceramic chip capacitor, and cushioned material layer 30 can be selected padded coamings such as silicone, bonder or red glue for use.
A kind of ceramic capacitor of the present utility model is coated in padded coamings such as thick silicone, bonder or red glue outside the ceramic capacitor body 10 earlier during fabrication, adopts epoxy resin to carry out mold pressing then and seals and can finish encapsulation.
Above-mentioned only is an embodiment of the present utility model, but design concept of the present utility model is not limited thereto, and allly utilizes this design that the utility model is carried out the change of unsubstantiality, all should belong to the behavior of invading the utility model protection range.
Claims (3)
1. a ceramic capacitor includes the ceramic capacitor body and is encapsulated in this external resin-encapsulate layer of this ceramic capacitor, it is characterized in that: also be provided with one deck cushioned material layer between this ceramic capacitor body and this resin-encapsulate layer.
2. a kind of ceramic capacitor as claimed in claim 1 is characterized in that: described resin-encapsulate layer is epoxy resin enclosed layer.
3. a kind of ceramic capacitor as claimed in claim 1 or 2 is characterized in that: described cushioned material layer is silicone, bonder or red glue.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201120004838XU CN201984958U (en) | 2011-01-10 | 2011-01-10 | Ceramic capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201120004838XU CN201984958U (en) | 2011-01-10 | 2011-01-10 | Ceramic capacitor |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201984958U true CN201984958U (en) | 2011-09-21 |
Family
ID=44612414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201120004838XU Expired - Lifetime CN201984958U (en) | 2011-01-10 | 2011-01-10 | Ceramic capacitor |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201984958U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102592825A (en) * | 2011-01-10 | 2012-07-18 | 福建火炬电子科技股份有限公司 | Ceramic capacitor and preparation method of the ceramic capacitor |
-
2011
- 2011-01-10 CN CN201120004838XU patent/CN201984958U/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102592825A (en) * | 2011-01-10 | 2012-07-18 | 福建火炬电子科技股份有限公司 | Ceramic capacitor and preparation method of the ceramic capacitor |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200721424A (en) | Semiconductor device | |
JP2011517125A5 (en) | ||
CN102543899B (en) | Flexible encapsulating substrate and preparation method thereof | |
SG10201406428QA (en) | Semiconductor device | |
CN201984958U (en) | Ceramic capacitor | |
CN101980345A (en) | Packaging process of solid electrolytic capacitor | |
CN201150132Y (en) | PCB flexible plate integrated encapsulation silicon microphone | |
CN205751528U (en) | Mobile solid state hard disc | |
CN102592825A (en) | Ceramic capacitor and preparation method of the ceramic capacitor | |
CN207150829U (en) | A kind of improved microphone hybrid package structure and digital microphone | |
CN208062024U (en) | A kind of silicon substrate waterproof membrane and microphone packaging scheme | |
CN201681936U (en) | Passive component packaging structure without substrate | |
CN201298832Y (en) | A small surface mount quartz crystal resonator | |
CN203085642U (en) | Novel integrated circuit package structure | |
CN103228100A (en) | Moisture-proof printed circuit board | |
CN102738009A (en) | Manufacturing process of flat packaging piece of AAQFN framework product based on brushing | |
CN202633373U (en) | LED packaging device having local isolating structure | |
CN102931319A (en) | Manufacturing method for LED (Light-Emitting Diode) package substrate with high thermal conductivity | |
CN102738018A (en) | Framework carrier pore opening and solder ball film sticking based AAQFN (quad flat no-lead) product secondary plastic packaging manufacturing technology | |
CN204348705U (en) | A kind of capsulation body of semiconductor ship of high reliability and low cost | |
CN201781464U (en) | Wafer type quartz crystal resonator | |
CN204927270U (en) | Smart card packaging structure based on electrified pond and display screen | |
CN204668291U (en) | A kind of encapsulating structure of integrated circuit | |
CN203055892U (en) | Double row lead quad flat non-leaded package through insulation by green paint | |
CN202651089U (en) | Flexible packaging substrate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term |
Granted publication date: 20110921 |
|
CX01 | Expiry of patent term |