CN202633373U - LED packaging device having local isolating structure - Google Patents
LED packaging device having local isolating structure Download PDFInfo
- Publication number
- CN202633373U CN202633373U CN 201220050581 CN201220050581U CN202633373U CN 202633373 U CN202633373 U CN 202633373U CN 201220050581 CN201220050581 CN 201220050581 CN 201220050581 U CN201220050581 U CN 201220050581U CN 202633373 U CN202633373 U CN 202633373U
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- led
- packaging
- bowl
- bowl cup
- expansion
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Abstract
The utility model provides an LED packaging device having a local isolating structure and relates to packaging structures of LED semiconductor lighting technology. The LED packaging device having the local isolating structure is used for solving a problem of corrosion of a bowl caused by expansion powder glue. The LED packaging device having the local isolating structure includes a bowl of a support. An LED chip is arranged in the bowl. The LED chip is provided with the expansion powder glue. The expansion powder glue includes material releasing water once being heated, water-absorbing resin and the fluorescent powder. Transparent packaging glue is packaged on the LED chip. The expansion powder glue is arranged above the packaging glue. A step plane is arranged in the bowl. The below of the step plane is filled with packaging glue while the above of the step plane is filled with the expansion powder glue. The step plane of the bowl and a wall face above the step plane are coated with carborundum films. The LED packaging device having the local isolating structure provided by the utility model is mainly applied to LED lighting devices.
Description
Technical field
The utility model relates to a kind of LED semiconductor lighting technology, particularly relates to the encapsulating structure of LED.
Background technology
The application's applicant has applied for that on June 24th, 2011 the Chinese patent name is called the patent application of " the LED method for packing that fluorescent material is carried out dispersion treatment ", and its application number is 201110173857.x, and the open date is on November 16th, 2011.This patent document discloses a kind of expansion arogel, and this expansion arogel comprises fluorescent material, is heated and releases multiple material composition such as water thing and water-absorbing resin.This expansion arogel can make fluorescent material be evenly distributed in the packaging plastic in the process of package curing, can improve the utilance of fluorescent material.Can be but being heated of contacting with the cup and bowl wall face released the low amounts of water molecule that the water thing discharges attached on the bowl cup.Device temperature during operation generally surpasses more than 60 ℃, and under such operational environment, the glued Heshui molecule of weakly alkaline expanding powder can form corrosion to the wall of bowl cup.Can present a circle metal rust on the appearance of device of seriously corroded, it is attractive in appearance that this had both influenced device, also reduced light emission rate simultaneously, influenced the performance of device.
The utility model content
The utility model technical problem to be solved is: a kind of LED packaging with local isolation structure is provided, is used to solve the etching problem of expansion arogel to the bowl cup.
In order to solve above-mentioned technical problem, the utility model proposes a kind of LED packaging with local isolation structure, comprises the bowl cup of support; Be provided with led chip at the bowl cup; The expansion arogel is arranged on led chip, and the expansion arogel comprises being heated releases water thing, water-absorbing resin and fluorescent material, and
On led chip, being packaged with transparent enclosure glue, is said expansion arogel above the packaging plastic;
In the said bowl cup step surface is arranged, the packaging plastic of step surface below for filling, the expansion arogel of step surface top for filling, on the step surface of bowl cup with and the wall of top on be coated with one deck carborundum coating.
Preferably: on the wall below the step surface of said bowl cup, be coated with one deck silvering.Because there is certain extinction phenomenon in carborundum, silver-platedly help to increase light emission rate, be used to remedy because the light loss that carborundum causes.
Preferably: the degree of depth of said carborundum coating accounts for sixth to four/one of the degree of depth of whole bowl cup.Because there is the extinction phenomenon in carborundum, so carborundum coating should not be too dark.
Preferably: the degree of depth of said carborundum coating accounts for the sixth, 1/5th or 1/4th of the degree of depth of whole bowl cup.
The beneficial effect of the utility model:
Compare prior art, the utility model is provided with one deck carborundum coating between the wall of expansion arogel and bowl cup, and this carborundum coating can be sprayed on the wall of bowl cup appointment through spraying method.Carborundum has good acid-fast alkali-proof performance, and has good thermal conductivity.Even discharging excessive hydrone, the expansion arogel that contacts with the bowl cup can not corrode the bowl cup yet.The bowl cup of this structure can be resisted more alkaline expansion arogel, makes device under the situation of bearing higher temperature and the phenomenon of bowl cup variable color does not take place, and also can not produce because the problem that the light emission rate that the wall corrosion causes reduces.
Description of drawings
Fig. 1 is the structure chart of first embodiment of the utility model.
Fig. 2 is the structure chart of second embodiment of the utility model.
Embodiment
The utility model proposes a kind of LED packaging with local isolation structure; The bowl cup that comprises support; Be provided with led chip at the bowl cup, the expansion arogel is arranged on led chip, the expansion arogel comprises being heated releases water thing, water-absorbing resin and fluorescent material; And on led chip, be packaged with transparent enclosure glue, above the packaging plastic said expansion arogel; In the said bowl cup step surface is arranged, the packaging plastic of step surface below for filling, the expansion arogel of step surface top for filling, on the step surface of bowl cup with and the wall of top on be coated with one deck carborundum coating.
Below through embodiment the utility model is elaborated, but the protection range of the utility model is not limited to following examples, any distortion that the utility model technical scheme is done that can know by inference is all in the protection range of the utility model.
The utility model embodiment one is as shown in Figure 1.
This LED packaging comprises support 5 and substrate 9.Support 5 is located on the substrate 9, and substrate 9 is generally aluminium base or copper base.
Bowl cup 1 is arranged on support 5.In bowl cup 1, be provided with led chip 7, on led chip 7, be packaged with transparent enclosure glue 11.On packaging plastic 11, be expansion arogel 10.Expansion arogel 10 comprises being heated releases water thing, water-absorbing resin and fluorescent material, can also comprise various compositions such as dispersant and stabilizer in it.
The material of packaging plastic 11 can adopt epoxy resin or silica gel.
The led chip of embodiment one is welded in bowl bottom of cup through flip chip bonding, and led chip is connected with lead 6, and lead 6 stretches out outside the support, is connected with electrode 8.
In the bowl cup 1 step surface 3 is arranged, the packaging plastic 11 of step surface 3 belows for filling, the expansion arogel 10 of step surface 3 tops for filling, on the step surface of bowl cup with and the wall of top on be coated with one deck carborundum coating 2.
On the wall below the step surface 3 of bowl cup, be coated with one deck silvering 4.The degree of depth of carborundum coating 2 accounts for the sixth of the degree of depth of whole bowl cup.
The embodiment two of the utility model is as shown in Figure 2, and different with embodiment one is, in bowl cup 12, is packaged with a plurality of led chips 13, is applicable to the chip on board packaged device, i.e. the COB packaged device.
Claims (4)
1. LED packaging with local isolation structure comprises the bowl cup of support being provided with led chip at the bowl cup, and the expansion arogel is arranged on led chip, it is characterized in that:
On led chip, being packaged with transparent enclosure glue, is said expansion arogel above the packaging plastic;
In the said bowl cup step surface is arranged, the packaging plastic of step surface below for filling, the expansion arogel of step surface top for filling, on the step surface of bowl cup with and the wall of top on be coated with one deck carborundum coating.
2. the LED packaging with local isolation structure according to claim 1 is characterized in that: on the wall below the step surface of said bowl cup, be coated with one deck silvering.
3. the LED packaging with local isolation structure according to claim 1 is characterized in that: the degree of depth of said carborundum coating accounts for sixth to four/one of the degree of depth of whole bowl cup.
4. the LED packaging with local isolation structure according to claim 3 is characterized in that: the degree of depth of said carborundum coating accounts for the sixth, 1/5th or 1/4th of the degree of depth of whole bowl cup.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220050581 CN202633373U (en) | 2012-02-16 | 2012-02-16 | LED packaging device having local isolating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220050581 CN202633373U (en) | 2012-02-16 | 2012-02-16 | LED packaging device having local isolating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202633373U true CN202633373U (en) | 2012-12-26 |
Family
ID=47386528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220050581 Expired - Fee Related CN202633373U (en) | 2012-02-16 | 2012-02-16 | LED packaging device having local isolating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202633373U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104518070A (en) * | 2014-11-17 | 2015-04-15 | 浙江英特来光电科技有限公司 | High-grayscale and high-contrast SMD (surface-mounted) LED (light emitting diode) and adhesive dispensing technology thereof |
| CN113871522A (en) * | 2021-12-02 | 2021-12-31 | 江西省兆驰光电有限公司 | Lamp bead module, backlight module and electronic equipment |
-
2012
- 2012-02-16 CN CN 201220050581 patent/CN202633373U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104518070A (en) * | 2014-11-17 | 2015-04-15 | 浙江英特来光电科技有限公司 | High-grayscale and high-contrast SMD (surface-mounted) LED (light emitting diode) and adhesive dispensing technology thereof |
| CN113871522A (en) * | 2021-12-02 | 2021-12-31 | 江西省兆驰光电有限公司 | Lamp bead module, backlight module and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000, 95, Fifth Industrial Zone, Mashan village, Gongming Town, Shenzhen, Guangdong, Baoan District Patentee after: SHENZHEN LIGHT ELECTRONICS CO., LTD. Address before: 518000, 95, Fifth Industrial Zone, Mashan village, Gongming Town, Shenzhen, Guangdong, Baoan District Patentee before: Shenzhen LIGHT Electronics Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121226 Termination date: 20160216 |