CN109802051B

CN109802051B - Anti-oxidation OLED packaging structure

Info

Publication number: CN109802051B
Application number: CN201910055409.6A
Authority: CN
Inventors: 申研
Original assignee: Shenzhen Yanhong Optoelectronic Technology Co ltd
Current assignee: Shenzhen Yanhong Optoelectronic Technology Co ltd
Priority date: 2019-01-21
Filing date: 2019-01-21
Publication date: 2021-04-02
Anticipated expiration: 2039-01-21
Also published as: CN109802051A

Abstract

An anti-oxidation OLED packaging structure comprises a substrate and a thin film packaging layer arranged on the substrate; the upper surface of the substrate is provided with an OLED working layer, the upper surface of the OLED working layer is provided with a plurality of absorbents, the middle of the film packaging layer is arched upwards and forms a filling gap with the substrate, a filling adhesive layer is filled in the filling gap, the side edge of the film packaging layer is coated with a first sealing adhesive layer, one side of the first sealing adhesive layer, which is far away from the edge of the film packaging layer, is provided with a second sealing adhesive layer, and one side of the second sealing adhesive layer, which is far away from the first sealing adhesive layer, is provided with a third sealing adhesive layer; compared with the prior art, the invention has the beneficial effects that: through setting up multilayer adhesive tape layer at base plate and film packaging layer edge, can effectively solve the problem that adhesive tape layer fracture and become fragile, improve OLED packaging structure's sealing performance, and inside sets up the absorbent, and the while removes water deoxidization prevents OLED working layer oxidation, further improves life.

Description

Anti-oxidation OLED packaging structure

[ technical field ] A method for producing a semiconductor device

The invention relates to the technical field of OLED devices, in particular to an anti-oxidation OLED packaging structure.

[ background of the invention ]

Organic Light-Emitting Diode (OLED) devices have the advantages of being Light and thin, low in power consumption, high in contrast, high in color gamut, flexible in display and the like, and are widely applied to the display industry. However, the components such as water vapor and oxygen in the air generally erode the OLED device, which seriously affects the performance of the OLED device and limits the service life of the OLED device, so that the OLED device is generally required to be encapsulated by an OLED encapsulation structure, so that the OLED device is isolated from the components such as water vapor and oxygen in the air, thereby reducing the influence of the components such as water vapor and oxygen in the air on the performance of the OLED device and prolonging the service life of the OLED device.

The existing OLED device is characterized in that an OLED working layer and various organic layers are manufactured on a substrate, the edges of the OLED working layer and the organic layers are coated with a layer of epoxy resin for sealing connection, a ring-shaped organic layer is additionally arranged on the periphery of the OLED device, a thin film packaging layer is tightly adhered to the substrate, but a three-dimensional net structure formed after the epoxy resin is cured and crosslinked easily generates large internal stress, and in the using process, the epoxy resin is easily embrittled and cracked to cause the reduction of the sealing property and greatly shorten the service life of the OLED device.

In view of the above, it is desirable to provide an oxidation-resistant OLED package structure to overcome the deficiencies of the prior art.

[ summary of the invention ]

The invention aims to provide an antioxidant OLED packaging structure, which aims to solve the problems of cracking and brittleness of a sealing adhesive layer, improve the sealing performance of the OLED packaging structure, prevent an OLED working layer from being oxidized and prolong the service life.

In order to achieve the above object, the present invention provides an antioxidant OLED packaging structure, which includes a substrate and a thin film packaging layer disposed on the substrate;

the upper surface of base plate is equipped with the OLED working layer, the upper surface of OLED working layer is equipped with a plurality of absorbents, upwards arch in the middle of the film packaging layer and with the base plate is formed with the packing clearance, it has the filling glue film to fill the clearance intussuseption, the side coating of film packaging layer has first sealing glue layer, first sealing glue layer deviates from one side at film packaging layer edge is equipped with second sealing glue layer, the second sealing glue layer deviates from one side of first sealing glue layer is equipped with the third sealing glue layer.

In a preferred embodiment, the first sealant layer, the second sealant layer and the third sealant layer have different densities and different materials.

In a preferred embodiment, the first sealant layer is made of bisphenol S type epoxy resin, the second sealant layer is made of epoxidized novolac type epoxy resin, and the third sealant layer is made of bisphenol a type epoxy resin.

In a preferred embodiment, the thin film encapsulation layer includes a first inorganic barrier layer, an organic buffer layer, and a second inorganic barrier layer, the first inorganic barrier layer is in contact with the underfill layer, the organic buffer layer is located on a side of the first inorganic barrier layer facing away from the underfill layer, and the second inorganic barrier layer is located on a side of the organic buffer layer facing away from the first inorganic barrier layer.

In a preferred embodiment, the first inorganic barrier layer and the second inorganic barrier layer are made of silicon nitride, and the organic buffer layer is made of organic resin.

In a preferred embodiment, the absorbent is a silica gel desiccant, and a plurality of silica gel desiccants are distributed in a matrix.

In a preferred embodiment, the absorbent is a Fe antioxidant, and several Fe antioxidants are distributed in a matrix.

In a preferred embodiment, the absorbent comprises a plurality of silica gel drying agents and a plurality of Fe antioxidants, and each silica gel drying agent and each Fe antioxidant are uniformly spaced and distributed in a matrix.

Compared with the prior art, the antioxidant OLED packaging structure provided by the invention has the beneficial effects that: through set up first sealing glue layer, second sealing glue layer and third sealing glue layer at base plate and film packaging layer edge, can effectively solve the problem that the sealing glue layer ftractures and becomes fragile, improve OLED packaging structure's sealing performance, and inside sets up the absorbent, and the while dewatering deoxidization prevents OLED working layer oxidation, further improves life.

[ description of the drawings ]

Fig. 1 is a schematic structural diagram of an OLED encapsulation structure with oxidation resistance according to the present invention.

Fig. 2 is a schematic view of the distribution of the absorbent shown in fig. 1.

Fig. 3 is a schematic view of the distribution of another embodiment of the absorbent shown in fig. 2.

[ detailed description ] embodiments

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

Referring to fig. 1, the present invention provides an OLED package structure 100 with oxidation resistance.

In an embodiment of the present invention, the oxidation-resistant OLED encapsulation structure 100 includes a substrate 10 and a thin film encapsulation layer 20 disposed on the substrate 10.

Specifically, the upper surface of base plate 10 is equipped with OLED working layer 30, the upper surface of OLED working layer 30 is equipped with a plurality of absorbents 40, upwards arch up in the middle of the film packaging layer 20 and with base plate 10 is formed with the packing clearance, the packing clearance intussuseption is filled with filling adhesive layer 50, the side coating of film packaging layer 20 has first sealing adhesive layer 60, first sealing adhesive layer 60 deviates from one side at film packaging layer 20 edge is equipped with first sealing adhesive layer 70, first sealing adhesive layer 70 deviates from one side of first sealing adhesive layer 60 is equipped with third sealing adhesive layer 80.

It should be noted that the first sealant layer 60, the first sealant layer 70 and the third sealant layer 80 have different densities and materials. When the glue is sealed, firstly, the glue is dispensed by a glue dispenser or manually by using the material of the first sealing glue layer 60, then the first sealing glue layer is placed into a thermal cycle oven to be baked for a certain time, when the first sealing glue layer 60 is shaped but not completely cured, the glue is dispensed by the glue dispenser or manually by using the material of the first sealing glue layer 70, the first sealing glue layer is placed into the thermal cycle oven again to be baked for a certain time, when the first sealing glue layer 70 is shaped but not completely cured, the glue is dispensed by the glue dispenser or manually by using the material of the third sealing glue layer 80 again, and the third sealing glue layer 80 is obtained after the glue is completely cured. It should be noted that, when dispensing the first sealant layer 60 and the first sealant layer 70, a natural curing method is not suitable, and most sealant materials are cured for a long time, so that the OLED working layer 30 and the absorber 40 are exposed in the air for a long time and are easily oxidized or enter dust, which affects the product quality.

The structure and the process have the advantages that the problem that the traditional sealing adhesive layer is easy to generate large internal stress due to the three-dimensional net-shaped structure formed after curing and crosslinking is solved, the sealing adhesive layer is cracked and becomes brittle is solved, the sealing performance is prevented from being reduced, the service life of the OLED is prolonged, and the compactness among the first sealing adhesive layer 60, the first sealing adhesive layer 70 and the third sealing adhesive layer 80 can be increased.

For example, in practical applications, the first sealant layer 60 is made of bisphenol S epoxy resin, which is collectively called "4, 4' -dihydroxy diphenyl diglycidyl ether epoxy resin", and is a high temperature resistant epoxy resin obtained by polycondensation of bisphenol S and excess epichlorohydrin under an alkaline condition, and a cured product thereof has the characteristics of high thermal deformation temperature and good thermal stability; the first sealant layer 70 is made of epoxidized novolac resin, the epoxy novolac resin is formed by condensing low molecular weight novolac resin and epoxy chloropropane under the action of an acid catalyst, the epoxy novolac resin is a high-viscosity semisolid, has an average functionality of 2.5-6.0, a softening point of less than or equal to 28 ℃ and an epoxy value of 0.53-0.57, and has the advantages of both the novolac resin and the bisphenol A epoxy resin; the third sealant layer 80 is made of bisphenol a epoxy resin, the bisphenol a epoxy resin contains hydroxyl and ether bonds in a molecular structure, and new hydroxyl and ether bonds are further generated in a curing process, so that a cured product has high cohesive force and adhesive force.

Further, the thin film encapsulation layer 20 includes a first inorganic barrier layer 21, an organic buffer layer 22 and a second inorganic barrier layer 23, the first inorganic barrier layer 21 is in contact with the underfill layer 50, the organic buffer layer 22 is located on a side of the first inorganic barrier layer 21 facing away from the underfill layer 50, and the second inorganic barrier layer 23 is located on a side of the organic buffer layer 22 facing away from the first inorganic barrier layer 21.

Further, the first inorganic barrier layer 21 and the second inorganic barrier layer 23 are made of silicon nitride, and the organic buffer layer 22 is made of organic resin.

In one embodiment, referring to fig. 2, the absorbent 40 is a silica gel desiccant, and a plurality of silica gel desiccants are distributed in a matrix. It can be understood that the silica gel desiccant can not cause secondary pollution after absorbing water, is white in appearance, is a semitransparent glass body, has a chemical molecular formula of mSiO 2. nH2O, is mainly used for drying and moisture prevention, and has the characteristics of high bulk density and obvious moisture absorption effect under low humidity.

In one embodiment, the absorber 40 is a Fe antioxidant, and a number of Fe antioxidants are distributed in a matrix. It is understood that the Fe antioxidant can reduce oxygen, avoiding the oxygen from negatively affecting the organic light emitting material in the OLED working layer 30.

In one embodiment, referring to fig. 3, the absorbent 40 includes a plurality of silica gel drying agents 41 and a plurality of Fe antioxidants 42, and each silica gel drying agent 41 and each Fe antioxidant 42 are uniformly spaced and distributed in a matrix. It will be appreciated that the silica gel desiccant 41 is formulated with the Fe antioxidant 42 to remove water and oxygen simultaneously, with the best antioxidant effect.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The utility model provides an anti-oxidant OLED packaging structure, includes the base plate and locates film packaging layer on the base plate, the upper surface of base plate is equipped with OLED working layer, its characterized in that: the upper surface of the OLED working layer is provided with a plurality of absorbents, the middle of the film packaging layer is arched upwards, a filling gap is formed between the film packaging layer and the substrate, a filling adhesive layer is filled in the filling gap, the side edge of the film packaging layer is coated and sealed with a first sealing adhesive layer, one side of the first sealing adhesive layer, which is far away from the edge of the film packaging layer, is provided with a second sealing adhesive layer, and one side of the second sealing adhesive layer, which is far away from the first sealing adhesive layer, is provided with a third sealing adhesive layer; the first sealing adhesive layer, the second sealing adhesive layer and the third sealing adhesive layer are different in density and material; the first sealing adhesive layer is made of bisphenol S type epoxy resin, the second sealing adhesive layer is made of epoxidized novolac type phenolic resin, and the third sealing adhesive layer is made of bisphenol A type epoxy resin; the thin film packaging layer comprises a first inorganic barrier layer, an organic buffer layer and a second inorganic barrier layer, the first inorganic barrier layer is in contact with the filling adhesive layer, the organic buffer layer is positioned on one surface, deviating from the filling adhesive layer, of the first inorganic barrier layer, and the second inorganic barrier layer is positioned on one surface, deviating from the first inorganic barrier layer, of the organic buffer layer; the first inorganic barrier layer and the second inorganic barrier layer are made of silicon nitride materials, and the organic buffer layer is made of organic resin materials; the absorbent is a silica gel desiccant, and a plurality of silica gel desiccants are distributed in a matrix; the absorbent is a Fe antioxidant, and a plurality of Fe antioxidants are distributed in a matrix; the absorbent comprises a plurality of silica gel drying agents and a plurality of Fe antioxidants, and each silica gel drying agent and each Fe antioxidant are uniformly arranged at intervals and distributed in a matrix.