CN108232035A - Encapsulating structure with venthole - Google Patents
Encapsulating structure with venthole Download PDFInfo
- Publication number
- CN108232035A CN108232035A CN201810052338.XA CN201810052338A CN108232035A CN 108232035 A CN108232035 A CN 108232035A CN 201810052338 A CN201810052338 A CN 201810052338A CN 108232035 A CN108232035 A CN 108232035A
- Authority
- CN
- China
- Prior art keywords
- cover board
- venthole
- oled
- substrate
- encapsulating structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
Abstract
The present invention provides a kind of encapsulating structures with venthole, including the substrate for carrying OLED structure, the cover board being arranged on above OLED structure and are evenly distributed between the substrate and cover board, and around the encapsulation cushion rubber of OLED structure；Drier is provided on the downside of the cover board；Venthole is provided on the cover board.Structure of the present invention is during cover board encapsulation fitting; gas between substrate and cover board in cavity is discharged from the hole of cover board, and the protective gas in cavity is avoided to generate extruding to packaging plastic in compression process, washes sealant open; cause sealing not close, so as to improve the service life of OLED device.With traditional mode that vacuumizes, this method technological process is simple, at low cost without Special vacuum equipment.
Description
Technical field
The present invention relates to organic light-emitting diode packaging field more particularly to a kind of encapsulating structures with venthole.
Background technology
Organic Light Emitting Diode（Organic Light Emitting Display, abbreviation OLED）It is shown as a new generation
Technology has many advantages, such as that luminous active, fast response time, contrast are high, and most attractive is that it can realize flexibility, these
Feature makes it have wide practical use in illumination and display field.But luminous organic material is to chemical environment, physical environment
Sensitivity, especially to water oxygen sensitivity, device is easy to aging, and service life is short.Therefore, to realize that the scale of mass production of OLED devices must
It must solve the problems, such as its package reliability.
At present frequently with packaging method have（1）Traditional OLED encapsulation technologies are usually to add a cover board to device, and
Drier is attached on the inside of cover board, then is combined substrate and cover board by fluid sealants such as epoxy resin.（2）Thin-film package.When
The thin film encapsulation technology of preceding use overcomes the shortcomings that fluid sealant is poor to the barrier property of vapor and oxygen, preferably improves
Packaging effect, but device technology bothers, and trigger price stability needs to be further improved.
At present, the structure of the cover board encapsulation of use, when substrate and cover board are bonded, the cavity that is formed between substrate and cover board
It is compressed, intracavity gas, which generates surrounding package glue to squeeze, makes it generate stress deformation, may break through packaging plastic, cause to encapsulate
The adherency of glue and substrate and cover board is not close, and the interface between packaging plastic and substrate and cover board can form vapor channel, cause sky
Steam and oxygen in gas enter encapsulation cavity, extreme influence OLED device performance.Solution is to utilize vacuum in industry
Device is extracted into certain vacuum degree by system, then is packaged, it is therefore desirable to which vacuum system costly, technical process are also relatively more multiple
It is miscellaneous, it is of high cost.
Invention content
The present invention is directed to the deficiencies in the prior art, it is proposed that a kind of simpler, effective and inexpensive cover board envelope
Dress method.
In view of this, the object of the present invention is to provide the encapsulating structures with venthole, which is characterized in that including：Carrying
It the substrate of OLED structure, the cover board being arranged on above OLED structure and is evenly distributed between the substrate and cover board, and ring
Around the encapsulation cushion rubber of OLED structure；Drier is provided on the downside of the cover board；Venthole is provided on the cover board.
Preferably, the venthole only allows toward the air-flow on the upside of cover board to pass through on the downside of cover board.
Preferably, the material of the cover board is glass or metal.
Preferably, the rectangular flat of OLED structure can be completely covered for area for the cover board.
Preferably, the perforated area of the venthole is less than 2mm2.
Preferably, the quantity of the venthole is one or more.
Preferably, the venthole can fill up closed by packaging plastic.
Preferably, the material of the drier for metallic calcium powder and/or barium metal powder and/or metal oxide and/or
Metal carbonate object.
Preferably, the OLED structure replaces with：Quantum dot Organic Light Emitting Diode（QLED）Structure or light emitting diode
（LED）Structure.
The present invention and the structure of preferred embodiment are during cover board encapsulation fitting, the gas between substrate and cover board in cavity
It is discharged from the hole of cover board, the protective gas in cavity is avoided to generate extruding to packaging plastic in compression process, washes sealant open,
Cause sealing not close, so as to improve the service life of OLED device.With traditional mode that vacuumizes, this method technological process letter
It is single, it is at low cost without extras such as Special vacuum equipment.
Description of the drawings
Fig. 1 is the cross section structure schematic diagram of the embodiment of the present invention；
Fig. 2 is the surface structure schematic diagram 1 of the embodiment of the present invention；
Fig. 3 is the surface structure schematic diagram 2 of the embodiment of the present invention；
In figure：101- substrates, 102-OLED structures, 103- encapsulation cushion rubbers, 104- cover boards, 105- ventholes, 106- drier.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention more comprehensible, specific embodiment and phase will be passed through below
Attached drawing is closed, the present invention is described in further detail.
As shown in Figure 1, the embodiment of the present invention includes：Substrate 101, setting OLED structure 102 on the substrate 101, encapsulation
Cushion rubber 103, cover board 104, venthole 105 and drier 106, wherein, cover board 104 is face of the band there are one 105 structure of venthole
The rectangular flat of OLED structure 102 can be completely covered in product, be arranged on 102 top of OLED structure, encapsulation cushion rubber 103 is along rectangle
Substrate 101 and 104 edge of cover board be uniformly distributed, and be looped around the periphery of OLED structure 102, the contact of 103 upper surface of encapsulation cushion rubber
Cover board 104, lower surface contact substrate 101.104 downside of cover board is provided with drier 106.
In the present embodiment, substrate 101 selects gular transparent glass, and cover board 104 selects the rectangle with venthole 105 saturating
Bright glass, encapsulation cushion rubber 103 select UV glue, and OLED structure 102 is used to illuminate or show.
In the present embodiment, before encapsulation, substrate 101 and cover board 104 need to pass through acetone, alcohol and deionization respectively
Water is cleaned by ultrasonic processing and drying.
The coated drier 106 of 104 inner surface of cover board uses solid patch drier, and material is metallic calcium powder, barium metal
It is one or more in powder, metal oxide, metal carbonate object.106 thickness of drier is uniform and does not cover going out on cover board 104
Stomata 105.
In the present embodiment, venthole 105 may be designed as only allowing the air-flow from 104 downside of cover board toward 104 upside of cover board
By single-pass stomata, the discharge of intracavity gas is sealed during being more advantageous to encapsulation operation.
The perforated area of venthole 105 is less than 2mm2, in favor of the sealing subsequently to venthole 105.
As shown in Fig. 2, venthole 105 can be designed as the circular hole of diameter 0.5-2.0mm.
As shown in figure 3, venthole 105 may be designed in the slit of width 0.5-1.0mm.
According to the actual demand of encapsulation, the quantity of venthole 105 may be arranged as multiple, ensure single venthole 105
In the case that capacity is limited, better exhaust effect.
During the realization of structure of the embodiment of the present invention, the packaging plastic painting first between substrate 101 and cover board 104 is needed
Cloth simultaneously cures, and after forming encapsulation cushion rubber 103, then is packaged glue to the venthole 105 on cover board 104 and fills up curing.
Wherein, the width of encapsulation cushion rubber 103 should be as wide as possible, so as to extend annular seal space and the extraneous vapor channel formed.
When filling up the packaging plastic of venthole 105, need circular hole or wide seam filling is full.
In the present embodiment, each functional layer preparation process of OLED structure 102 uses vapor deposition mode in high vacuum environment
It carries out, and is encapsulated in equipped with High Purity Nitrogen glove box, ensure that OLED structure 102 is not destroyed by steam and oxygen.
When being packaged operation using the present embodiment structure, it is ensured that encapsulation cushion rubber 103 and substrate 101 and cover board 104
Fitting does not generate stress deformation completely, and the interface between packaging plastic and substrate 101 and cover board 104 is avoided to form steam as far as possible
Channel effectively raises the service life of OLED device.
The encapsulation to OLED structure 102 is only embodied in the present embodiment, but under the mentality of designing of the present invention, OLED is tied
Structure 102 replaces with：Quantum dot Organic Light Emitting Diode（QLED）Structure or light emitting diode（LED）Structure can't also influence this
Invention provides the realization of the effect of apparatus structure and goal of the invention.
It should be noted that the present embodiment attached drawing is exaggerated the thickness of layer and region, but as signal to represent clear
Figure should not be considered as strictly reflecting the proportionate relationship of geometric dimension.Idealized embodiments of the Figure of description as the present invention
Schematic diagram, the embodiment shown in the present invention should not be considered limited to the specific shape in region shown in figure, but wrap
Include obtained shape（Such as deviation caused by manufacture）.As in the present embodiment with rectangle carry out represent, be it is schematical,
This should not be construed so as to limit the scope of the present.
Claims (9)
1. a kind of encapsulating structure with venthole, which is characterized in that including：It carries the substrate of OLED structure, be arranged on OLED
It the cover board of superstructure and is evenly distributed between the substrate and cover board, and around the encapsulation cushion rubber of OLED structure；It is described
Drier is provided on the downside of cover board；Venthole is provided on the cover board.
2. the encapsulating structure with venthole according to claims 1, it is characterised in that：The venthole only allow from
Pass through on the downside of cover board toward the air-flow on the upside of cover board.
3. the encapsulating structure with venthole according to claims 1, it is characterised in that：The material of the cover board is glass
Glass or metal.
4. the encapsulating structure with venthole according to claims 1, it is characterised in that：The cover board can for area
The rectangular flat of OLED structure is completely covered.
5. the encapsulating structure with venthole according to claims 1, it is characterised in that：The trepanning face of the venthole
Product is less than 2mm2.
6. the encapsulating structure with venthole according to claims 1, it is characterised in that：The quantity of the venthole is
It is one or more.
7. the encapsulating structure with venthole according to claims 1, it is characterised in that：The venthole can be by encapsulating
Glue fills up closed.
8. the encapsulating structure with venthole according to claims 1, it is characterised in that：The material of the drier
For metallic calcium powder and/or barium metal powder and/or metal oxide and/or metal carbonate object.
9. the encapsulating structure with venthole according to claims 1, it is characterised in that：The OLED structure is replaced
For：Quantum dot Organic Light Emitting Diode（QLED）Structure or light emitting diode（LED）Structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810052338.XA CN108232035A (en) | 2018-01-19 | 2018-01-19 | Encapsulating structure with venthole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810052338.XA CN108232035A (en) | 2018-01-19 | 2018-01-19 | Encapsulating structure with venthole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108232035A true CN108232035A (en) | 2018-06-29 |
Family
ID=62667891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810052338.XA Pending CN108232035A (en) | 2018-01-19 | 2018-01-19 | Encapsulating structure with venthole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108232035A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109585701A (en) * | 2018-12-17 | 2019-04-05 | 合肥鑫晟光电科技有限公司 | A kind of packaging tool and packaging method |
| CN114709354A (en) * | 2022-06-08 | 2022-07-05 | 北京热刺激光技术有限责任公司 | Laser micro-nano structure and packaging method of OLED device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5239228A (en) * | 1990-07-02 | 1993-08-24 | Sharp Kabushiki Kaisha | Thin-film electroluminescence device for displaying multiple colors with groove for capturing adhesive |
| KR20020028032A (en) * | 2000-10-06 | 2002-04-15 | 구자홍 | Seal cover plate and sealing mehtod of organic electroluminescence display device |
| CN1409391A (en) * | 2001-09-21 | 2003-04-09 | 伊斯曼柯达公司 | High wet sensitive electronic device part using air ventilation hole and gap and its producing method |
| JP2010135213A (en) * | 2008-12-05 | 2010-06-17 | Seiko Epson Corp | Organic el device and electronic equipment |
| CN206877999U (en) * | 2017-07-12 | 2018-01-12 | 信利（惠州）智能显示有限公司 | AMOLED display screens |
-
2018
- 2018-01-19 CN CN201810052338.XA patent/CN108232035A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5239228A (en) * | 1990-07-02 | 1993-08-24 | Sharp Kabushiki Kaisha | Thin-film electroluminescence device for displaying multiple colors with groove for capturing adhesive |
| KR20020028032A (en) * | 2000-10-06 | 2002-04-15 | 구자홍 | Seal cover plate and sealing mehtod of organic electroluminescence display device |
| CN1409391A (en) * | 2001-09-21 | 2003-04-09 | 伊斯曼柯达公司 | High wet sensitive electronic device part using air ventilation hole and gap and its producing method |
| JP2010135213A (en) * | 2008-12-05 | 2010-06-17 | Seiko Epson Corp | Organic el device and electronic equipment |
| CN206877999U (en) * | 2017-07-12 | 2018-01-12 | 信利（惠州）智能显示有限公司 | AMOLED display screens |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109585701A (en) * | 2018-12-17 | 2019-04-05 | 合肥鑫晟光电科技有限公司 | A kind of packaging tool and packaging method |
| CN109585701B (en) * | 2018-12-17 | 2021-01-15 | 合肥鑫晟光电科技有限公司 | Packaging jig and packaging method |
| CN114709354A (en) * | 2022-06-08 | 2022-07-05 | 北京热刺激光技术有限责任公司 | Laser micro-nano structure and packaging method of OLED device |
| CN114709354B (en) * | 2022-06-08 | 2022-09-09 | 北京热刺激光技术有限责任公司 | Laser micro-nano structure and packaging method of OLED device |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180629 |